JPS6245892U - - Google Patents
Info
- Publication number
- JPS6245892U JPS6245892U JP12561485U JP12561485U JPS6245892U JP S6245892 U JPS6245892 U JP S6245892U JP 12561485 U JP12561485 U JP 12561485U JP 12561485 U JP12561485 U JP 12561485U JP S6245892 U JPS6245892 U JP S6245892U
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- radiating device
- air passage
- heat
- inlet hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例を示す構成図で、Ａ
は斜視図、ＢはＡのＢ―Ｂ断面図、第２図は本考
案の他の実施例の構成図、第３図は第２図の装置
の放熱装置の説明図で、Ａは平面図、Ｂは正面図
、第４図は従来装置の構成斜視図である。
１……プリント基板、２……電子部品、３……
ヒートシンク、３１……本体、３３……放熱フイ
ン、４……フロントプレート、５，５３，５４…
…凹溝条、５１……入口孔、５２……出口孔、７
……ラツク、８……側板。
FIG. 1 is a configuration diagram showing an embodiment of the present invention, and A
is a perspective view, B is a BB sectional view of A, FIG. 2 is a configuration diagram of another embodiment of the present invention, FIG. 3 is an explanatory diagram of the heat dissipation device of the device in FIG. 2, and A is a plan view. , B is a front view, and FIG. 4 is a perspective view of the configuration of the conventional device. 1...Printed circuit board, 2...Electronic components, 3...
Heat sink, 31...Main body, 33...Radiation fin, 4...Front plate, 5, 53, 54...
... Concave groove strip, 51 ... Inlet hole, 52 ... Outlet hole, 7
...Easy, 8...Side plate.
Claims (1)
却する放熱装置において、 前記放熱装置の内部に設けられた空気通路体と
、 前記放熱装置の表面に設けられ、前記空気通路
体と接続する入口孔と出口孔とを備え、 入口孔から空気通路体を介して出口孔へ流体を
送るようにしたことを特徴とする放熱装置。[Claims for Utility Model Registration] A heat radiating device that cools electronic components or electronic equipment by discharging heat generated therein, comprising: an air passage provided inside the heat radiating device; and a heat radiating device provided on the surface of the heat radiating device; A heat dissipation device comprising an inlet hole and an outlet hole connected to the air passage body, and configured to send fluid from the inlet hole to the outlet hole via the air passage body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12561485U JPS6245892U (en) | 1985-08-16 | 1985-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12561485U JPS6245892U (en) | 1985-08-16 | 1985-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6245892U true JPS6245892U (en) | 1987-03-19 |
Family
ID=31018660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12561485U Pending JPS6245892U (en) | 1985-08-16 | 1985-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6245892U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05327247A (en) * | 1992-05-20 | 1993-12-10 | Fujitsu Ltd | Heat radiating structure for printed-board unit |
| JP2005310892A (en) * | 2004-04-19 | 2005-11-04 | Nippon Seiki Co Ltd | Light emitting device |
| JP2012138426A (en) * | 2010-12-24 | 2012-07-19 | Toshiba Corp | Liquid cooling chassis |
-
1985
- 1985-08-16 JP JP12561485U patent/JPS6245892U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05327247A (en) * | 1992-05-20 | 1993-12-10 | Fujitsu Ltd | Heat radiating structure for printed-board unit |
| JP2005310892A (en) * | 2004-04-19 | 2005-11-04 | Nippon Seiki Co Ltd | Light emitting device |
| JP2012138426A (en) * | 2010-12-24 | 2012-07-19 | Toshiba Corp | Liquid cooling chassis |
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