JPS628683U - - Google Patents
Info
- Publication number
- JPS628683U JPS628683U JP9863985U JP9863985U JPS628683U JP S628683 U JPS628683 U JP S628683U JP 9863985 U JP9863985 U JP 9863985U JP 9863985 U JP9863985 U JP 9863985U JP S628683 U JPS628683 U JP S628683U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- electronic
- electronic device
- generating part
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 4
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の電子機器の放電装置の実施例
を示す斜視図、第２図はその縦断面図、第３図は
本考案装置の他の実施例を示す縦断面図、第４図
は従来の電子機器を例示する斜視図である。
１…キヤビネツト、２，３，４…空気取入れ口
、５，１０…凹部、６，１１…放熱用透孔、７…
交流電源トランス、８…ボリウムつまみ、９…ジ
ヤツク部。
FIG. 1 is a perspective view showing an embodiment of the discharge device for electronic equipment according to the present invention, FIG. 2 is a longitudinal cross-sectional view thereof, FIG. 3 is a longitudinal cross-sectional view showing another embodiment of the device according to the present invention, and FIG. 1 is a perspective view illustrating a conventional electronic device. 1... Cabinet, 2, 3, 4... Air intake port, 5, 10... Recess, 6, 11... Heat radiation hole, 7...
AC power transformer, 8...volume knob, 9...jack section.
Claims (1)
ネツトの上面部品取付部の近傍に放熱用透孔を形
成し、対流によつて発熱部を冷却するようにした
ことを特徴とする電子機器の放熱装置。 (2) 放熱用透孔が電子部品用つまみの下側に設
けられていることを特徴とする実用新案登録請求
の範囲第１項記載の電子機器の放熱装置。[Scope of Claim for Utility Model Registration] (1) In an electronic device equipped with a heat generating part, a heat dissipation hole is formed in the vicinity of the upper part mounting part of the cabinet so that the heat generating part is cooled by convection. A heat dissipation device for electronic equipment featuring: (2) The heat dissipation device for an electronic device according to claim 1, wherein the heat dissipation hole is provided below the electronic component knob.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9863985U JPS628683U (en) | 1985-06-28 | 1985-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9863985U JPS628683U (en) | 1985-06-28 | 1985-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS628683U true JPS628683U (en) | 1987-01-19 |
Family
ID=30966762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9863985U Pending JPS628683U (en) | 1985-06-28 | 1985-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS628683U (en) |
-
1985
- 1985-06-28 JP JP9863985U patent/JPS628683U/ja active Pending
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