JPS63195795U - - Google Patents

Info

Publication number
JPS63195795U
JPS63195795U JP8659087U JP8659087U JPS63195795U JP S63195795 U JPS63195795 U JP S63195795U JP 8659087 U JP8659087 U JP 8659087U JP 8659087 U JP8659087 U JP 8659087U JP S63195795 U JPS63195795 U JP S63195795U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation hole
electronic device
casing
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8659087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8659087U priority Critical patent/JPS63195795U/ja
Publication of JPS63195795U publication Critical patent/JPS63195795U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例に係る電子装置放熱
構造を備えた電子装置の斜視図、第２図及び第３
図は第１図の電子装置放熱構造が行う作用を示す
斜視図である。また、第４図は従来の電子装置放
熱構造を備えた電子装置の斜視図である。 １：放熱孔、２：遮蔽板、３：電子装置筐体。 FIG. 1 is a perspective view of an electronic device equipped with an electronic device heat dissipation structure according to an embodiment of the present invention, FIG.
This figure is a perspective view showing the effect of the electronic device heat dissipation structure of FIG. 1. Further, FIG. 4 is a perspective view of an electronic device equipped with a conventional electronic device heat dissipation structure. 1: heat radiation hole, 2: shielding plate, 3: electronic device housing.

Claims (1)

【実用新案登録請求の範囲】 電子装置の筐体内部で発生した熱を筐体外部に
放熱する電子装置放熱構造において、 上記筐体に、上記熱を放出する放熱孔を設け、 該放熱孔に、常温で平板状をなして該放熱孔を
覆いかつ所定温度以上で略Ｌ字状に可逆変形して
該放熱孔を開放する形状記憶合金製の遮蔽板を取
付けたことを特徴とする電子装置放熱構造。[Scope of Claim for Utility Model Registration] In an electronic device heat dissipation structure for dissipating heat generated inside a casing of an electronic device to the outside of the casing, the casing is provided with a heat dissipation hole for discharging the heat, and the heat dissipation hole is provided with a heat dissipation hole. , an electronic device equipped with a shielding plate made of a shape memory alloy that forms a flat plate at room temperature and covers the heat dissipation hole, and reversibly deforms into a substantially L-shape at a predetermined temperature or higher to open the heat dissipation hole. Heat dissipation structure.
JP8659087U 1987-06-03 1987-06-03 Pending JPS63195795U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8659087U JPS63195795U (en) 1987-06-03 1987-06-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8659087U JPS63195795U (en) 1987-06-03 1987-06-03

Publications (1)

Publication Number Publication Date
JPS63195795U true JPS63195795U (en) 1988-12-16

Family

ID=30943034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8659087U Pending JPS63195795U (en) 1987-06-03 1987-06-03

Country Status (1)

Country Link
JP (1) JPS63195795U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003333863A (en) * 2002-05-15 2003-11-21 Sanyo Electric Co Ltd Power supply

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003333863A (en) * 2002-05-15 2003-11-21 Sanyo Electric Co Ltd Power supply

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