JP2003333863A - Power supply - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent foreign particles including dust from entering inside a box of a power supply by a simple structure. <P>SOLUTION: In a power supply fixed on the wall surface of a housing that converts DC power into AC power corresponding to the frequency of a commercial power supply system and supplies the power to the system; upper vent holes 44B are formed in a top panel 20 that is the top surface of the box 11 of the power supply 10, and lower vent holes 44A in the bottom surface 16 of a box panel 18 that is the bottom surface. As opening and closing members that are opened and closed according to temperatures, lids 50 made of shape- memory alloys are provided at least on the vent holes 44B of the top surface. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply device capable of converting direct-current power into alternating-current power corresponding to a frequency of a commercial power supply system and supplying the alternating current power to the power supply system, and more particularly, to a ventilation system on an upper surface and a lower surface of a housing. The present invention relates to a power supply device that forms a mouth.

[0002]

2. Description of the Related Art In recent years, a solar system as a grid-connected power generation device that can not only use power generated by sunlight as an energy source but also use surplus power not used by itself Photovoltaic devices are becoming popular.

In such a solar power generation device, the DC power generated by the solar cell is converted into AC power corresponding to the frequency of the commercial power supply system by using the power supply device.

As this type of power supply device, there is known a power supply device in which a plurality of slits having substantially the same width are formed on the upper surface and the lower surface of the housing as ventilation holes for enhancing the heat radiation effect.
These slits are formed at intervals of substantially the same width as the slits.

A protective plate is provided between the heat sink housed in the housing and the upper surface of the housing, and the protective plate also has slits formed in the same manner as the upper surface. The protective plates are arranged in a staggered manner so that the slits with the plates do not overlap.

[0006]

However, in the above-mentioned power supply device, by providing the protective plate, it is possible to suppress the entry of foreign matter such as dust into the housing. However, the slit between the upper surface of the housing and the protective plate can be suppressed. It is necessary to dispose the protective plates so that they do not overlap with each other, and it is necessary to dispose the upper surface of the housing and the protective plate at an interval so that the ventilation resistance of the air does not increase too much. There is a problem that the structure for suppressing the intrusion of foreign matter is complicated.

An object of the present invention was made in consideration of the above circumstances, and it is an object of the present invention to provide a power supply device which has a simple structure and can prevent foreign matter such as dust from entering the housing.

[0008]

According to a first aspect of the present invention, there is provided a power supply device capable of converting DC power into AC power corresponding to a frequency of a commercial power supply system and supplying the AC power to the power supply system. Vents are formed on the top and bottom of the body,
An opening / closing member that opens / closes according to temperature is provided at least in the vent hole on the upper surface.

According to a second aspect of the present invention, in the first aspect of the invention, the opening / closing member is a shape memory alloy lid.

According to a third aspect of the present invention, in the second aspect of the invention, the lid has a bent portion at substantially the center thereof.
When the lid body reaches a predetermined temperature, the lid body is opened along the bent portion.

The invention according to claim 4 is the invention according to claims 1 to 3.
In the invention described in any one of the above items, the heating element in the housing is cooled by air rising by natural convection.

The invention according to claim 5 is based on claims 1 to 4.
In the invention described in any one of 1, the DC power is generated by a solar cell.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment of a power supply device according to the present invention. (A) is a top view, (B) is a front view, (C) is a bottom view, (D) is a left side view, E) is a right side view.
FIG. 2 is a front view of the power supply device of FIG. 1 with the front panel removed.

A solar power generation device as a grid interconnection power generation device comprises a solar cell (not shown) as power generation means and a grid interconnection type power supply device 10. This power supply device 10 is connected (interconnected) to a commercial power supply system, converts DC power generated by a solar cell into AC power corresponding to AC power of the commercial power supply system, and supplies the AC power to this commercial power supply system ( Regeneration) possible.

As shown in FIG. 4, the power supply device 10 includes a plurality of substrates (a main substrate 13 as a first substrate, a sub substrate 14 as a second substrate), and a display in a housing 11. Substrates 15) are arranged and laminated.
The power supply device 10 is fixed to, for example, the wall surface 34 of the house. Specifically, the power supply device 10 is fixed to the wall surface 34 via a wall hanging plate 35 attached to the wall surface 34.
In this attached state, the main substrate 13, the sub-substrate 14, the display substrate 15, and the like are laminated in parallel to the direction of natural convection of air (arrow A) due to heat.

The housing 11 of the power supply device 10 includes a front panel 12, a main body panel 18 in which a lower surface portion 16 as a lower surface plate and a side surface portion 17 as a side surface plate are integrated, and a rear panel 19 as a rear surface plate. And a top panel 20 as a top plate. As shown in FIGS. 4 and 5, the housing 11 includes a rear panel 19 and a top panel 20 on the back side and the top side of a main body panel 18 in which a lower surface portion 16 and a side surface portion 17 are integrated by screwing or the like. It is fixed. The front panel 12 is fixed to the lower surface 16 of the body panel 18 and the top panel 20 with screws so as to close the front opening 21 of the body panel 18.

A heat sink 22 as a heat radiation member is fixed to the rear panel 19 by means of screws, and the main substrate 13 is fixedly attached to the heat sink 22 using a plurality of hexagonal columns 23 and the like. That is, the main board 13 is fixedly attached to the rear panel 19 of the housing 11 via the heat sink 22.

Electronic components such as an inverter device 24 which is a heating element and an electrolytic capacitor 25 are mainly mounted on the main substrate 13. The inverter device 24 is a module in which a plurality of switching elements connected in a single-phase bridge shape are modularized, and converts DC power into AC power. The inverter device 24 is in direct contact with and fixed to the heat sink 22 so that heat is efficiently radiated from the switching element.

Various electronic devices including a microcomputer 26 are mounted on the sub-board 14. The microcomputer 26 is, for example, an inverter device 24.
The inverter device 24 controls the ON / OFF operation of the switching element to convert the DC power generated by the solar cell into AC power corresponding to the frequency of the commercial power supply system.

This sub-board 14 is shown in FIGS. 2, 3 and 4.
As shown in FIG. 5, the main board 13 is fixedly attached to the housing 11 via a sub-board attachment metal fitting 27 as a board attachment member installed so as to cover the main board 13. That is, as shown in FIG. 5, the sub-board mounting bracket 27 is one in which the side wall surface 29 is integrally extended from one side edge of the substantially planar base surface 28, and the sub-board 14 is attached to the base surface 28. Is fixedly attached. Then, as shown in FIGS. 2 and 3, the base surface 28 uses the screws 30 to form the top panel 20.
In addition, the side wall surface 29 uses the screw 30 to form the rear panel 19.
Fixed to each.

The side wall surface 29 of the sub-board mounting bracket 27
Has a function of blocking heat from the reactor 31 as a heating element fixed to the rear panel 19 and protecting the electrolytic capacitor 25 and the like of the main board 13 from the heat. In addition, the sub-board mounting bracket 27 divides the room 32 (FIG. 4) that houses the main board 13 from the room 33 (FIG. 2) that houses the reactor 31 by the base surface 28 and the side wall surface 29, and separates each room. At 32 and 33, natural convection of air due to heat ((arrow A in FIG. 4)) occurs. Thereby, the heat dissipation effect of the main board 13 in the room 32 and the heat dissipation effect of the reactor 31 in the room 33 are promoted.

As shown in FIGS. 4 and 5, the display substrate 15 has a plurality of operation buttons 36 and a display section 37,
Display bracket 3 as a display mounting member using screws 30
It is fixedly attached to 8. This display part metal fitting 38 is for adhering an ornament 39, and as shown in FIG.
7 and the central portion thereof is fixed to the lower surface portion 16 of the main body panel 18 by using the screw 30 and the bush 43.

The display board 15 and the display metal fitting 38 are constructed as described above.
In the mounted state of the ornament 39, the operation button 36 of the display substrate 15 is inserted into the button insertion holes 40 and 41 of the display metal fitting 38 and the ornament 39, respectively, and protrudes from the ornament 39. Further, as shown in FIGS. 1 and 4, the ornament 39 has an opening 42 in the front panel 12 when the front panel 12 is fixed to the lower surface portions 16 of the top panel 20 and the main body panel 18 with screws 30. Housed inside.

As described above, since the display board 15 and the ornament 39 are fixedly attached to the display portion metal fitting 38, and the display portion metal fitting 38 is fixed to the lower surface portion 16 of the main body panel 18, the front panel 12 is When fixed to the lower surface 16 of the main body panel 18 and the top panel 20 in the housing 11, the display board 15, the ornament 39, the display metal fitting 38, and the housing 11 are integrated.
Further, the display board 15 is attached to the display unit metal fitting 38 and is not integrated with the sub-board 14, but is connected to the sub-board 14 via the display unit metal fitting 38 and the sub-board mounting metal fitting 27.

Further, as shown in FIG.
Is fixed to the sub-board mounting bracket 27, the sub-board 14 is mounted on the sub-board mounting bracket 27, and the display substrate 1 is mounted on the display bracket 38.
5 and ornament 39 attached,
The sub-board mounting bracket 27 is detached from the rear panel 19 and the top panel 20, and the display bracket 38 is attached to the main body panel 18.
It is configured to be detachable from the lower surface portion 16 of the. Furthermore,
With the display board 15 and the ornament 39 attached to the display metal fitting 38, the display metal fitting 38 is configured to be detachable from the sub-board mounting metal fitting 27 and the lower surface 16 of the main body panel 18. The positioning of the ornament 39 and the like are facilitated.

The terminal block 46 shown in FIG.
In the above, the main board 13 is placed at a position opposite to the reactor 31. The terminal block 46 is the terminal block mounting plate 4
It is fixed to 7 with screws. As shown in FIGS. 2 and 5, the terminal block attachment plate 47 is detachably attached to the rear panel 19 of the housing 11 with screws 30 at three points with the terminal block 46 attached.

Wirings from the main board 13, the sub-board 14, and the display board 15 are connected to the back side (rear panel 19 side) of the terminal block 46, and the front side of the terminal block 46 (front panel 12).
The wiring from the solar cell is connected to (side). After the wiring is connected to the terminal block 46 in this manner, the wiring cover 49 is
The terminal block 46 and the terminal block mounting plate 47 are mounted so as to cover the terminal block 46 and the terminal block mounting plate 47 in the cutout portion of the side surface portion 17 of the main body panel 18.

In this embodiment mode, as shown in FIG.
As shown in (C) and FIG. 6, a plurality of slit-shaped lower ventilation holes 44A are formed in the lower surface portion 16 of the main body panel 18, and a plurality of substantially square-shaped upper ventilation holes 44B are formed in the top panel 20. Has been done. The lower vent 44A is shown in FIG.
As shown in, in the lower surface portion 16 of the main body panel 18,
It is formed in the corresponding region from the heat sink 22 to the sub-board mounting bracket 27 via the main board 13.

The upper vent 44B of the top panel 20 has
As shown in FIGS. 1, 4, 5, and 6, a lid 50 made of a shape memory alloy is provided as an opening / closing member that opens / closes according to temperature. The shape memory alloy lid 50 is opened to the outside of the housing 11 when the temperature inside the housing 11, that is, the temperature of the lid 50 is equal to or higher than a predetermined temperature, and closed when the temperature is lower than the predetermined temperature. It is set (shape memory).

During the daytime when the sun is shining, the DC power from the solar cell is supplied to the power supply device 10, the power supply device 10 is in an operating state, and the temperature of the air inside the housing 11 is increased by the heat dissipation of the heat sink 22 and the reactor 31. Rising. Also,
Since the solar cell does not generate electric power at night when there is no sunshine, the power supply device 10 is in an operation stop state, and the temperature rise of the air in the housing 11 due to the heat dissipation of the heat sink 22 and the reactor 31 disappears.

The shape memory alloy lid 50 is used for the power supply unit 1.
It is preferably opened during zero operation. That is, the power supply device 10
Since the temperature of the lid body 50 rises due to heat dissipation of the heat sink 22 and the reactor 31 when the vehicle is operating, the lid body 50 made of the shape memory alloy has a temperature equal to or higher than a predetermined temperature when the power supply device 10 is operating. It is set (shape memory) to open at (for example, 45 ° C.).

Therefore, during operation of the power supply device 10, the temperature of the air inside the housing 11 rises due to the heat radiation of the heat sink 22, the reactor 31, etc., so that the lid of the upper vent hole 44B is covered by the broken line arrow shown in FIG. Body 50 opens. Then, air flows into the housing 11 from the lower ventilation port 44A by natural convection, takes heat from the heat sink 22, the reactor 31 and the like and flows out from the upper ventilation port 44B, and the inverter device 24 and the reactor through the heat sink 22. 31 and the like are cooled. At this time, since air is flowing out from the upper ventilation port 44B by natural convection, entry of dust and the like into the housing 11 coming through the upper ventilation port 44B is suppressed.

Further, since the temperature of the lid 50 is below a predetermined temperature and the upper vent 44B is closed while the power supply 10 is stopped, the upper vent 44B is closed while the power supply 10 is stopped. The invasion of dust and the like into the casing 11 coming through is suppressed.

The heat sink 22 and the reactor 31 are parts that require less maintenance than the electronic parts of the main board 13 and the sub-board 14. In other words,
The electronic components of the main substrate 13 and the sub-substrate 14 are components that require higher maintenance than the heat sink 22 and the reactor 31. That is, the main board 13 and the sub-board 14 are more likely to malfunction when foreign matter such as dust enters.

As shown in FIG. 6, the upper vent hole 44B is provided on the top panel 20 so that foreign matter such as dust is less likely to enter the main board 13, the sub-board 14, etc. through the upper vent hole 44B. Heat sink 22 and reactor 3
1 (heat sink 22 and reactor 31
(Almost directly above).

In other words, the upper vent 44B is
It is formed substantially directly above the heat radiating member (for example, the heat sink 22) of the heat generating element (for example, the reactor 31) or the heat generating element (for example, the inverter device 24). As a result, the heating element is cooled more effectively.

The shape memory alloy lid 50 is opened to the outside of the housing 11 at a predetermined temperature or higher as shown in FIG. 4, and is substantially in the center of the lid 50 as shown in FIGS. It is set (shape memory) so as to be folded at the folding portion 51 indicated by the alternate long and short dash line.

That is, when the lid 50 reaches a predetermined temperature, it is opened along the bent portion 51 provided at the substantially center. As a result, the space above the housing 11 can be saved.

The ratio of the total opening area of the lower ventilation holes 44A in the lower surface portion 16 of the main body panel 18 to the total opening area of the upper ventilation holes 44B in the top panel 20 is set to be approximately 15:13. As a result, the air in the housing 11 is smoothly convected, and the heat generating elements such as the inverter device 24 and the reactor 31 via the heat sink 22 are cooled more effectively.

As shown in FIGS. 1 and 5, an insect screen 45 for covering the lower vent 44A is provided on the inner surface of the lower surface 16 of the main body panel 18.

As described above, according to the present embodiment, the power supply device 1
No. 0 is formed on the top panel 20 which is the upper surface of the housing 11 and the upper vent 44B is formed on the top panel 20, and the main panel 18 which is the lower surface is formed.
The lower vent portion 44A is formed in the lower surface portion 16 of the above, and at least the upper vent hole 44B is provided with the lid 50 made of a shape memory alloy as an opening / closing member that opens at a predetermined temperature or higher. Since it is not necessary to provide a protective plate having a slit inside the top panel 20 in 11 in order to prevent foreign matter such as dust from entering the housing 11, foreign matter such as dust and the like has a simple vent structure. Can be suppressed from entering the housing 11.

Further, according to the present embodiment, the shape memory alloy lid 50 is set (shape memory) so as to be opened at a predetermined temperature or higher when the power supply device 10 is operating. When the power supply device 10 operates, the lid 50 opens,
When the power supply device 10 stops operating, the lid 50 closes,
Regardless of whether the power supply device 10 is in the operating state or the operating stop state, foreign matter such as dust can be prevented from entering the housing 11.

Further, according to the present embodiment, the upper ventilation port 4
4B (a ventilation hole on the upper surface of the housing) is a component that requires less maintenance (for example, the heat sink 22 or the reactor 3).
Since it is formed almost directly above 1), there is a high need for maintenance (for example, main board 13 and sub-board 1).
Invasion of foreign matter such as dust into the electronic component 4) is further suppressed.

In the present embodiment, the case where the lid 50 made of shape memory alloy is opened to the outside of the housing 11 has been described, but the present invention is not limited to this, and the lid made of shape memory alloy is used. May open inside the housing. In this case, if it is set (shape memory) so that the shape memory alloy lid is opened along the bent portion provided at the substantially center of the shape memory alloy lid, space saving can be achieved.

Although the present invention has been described based on the above embodiment, the present invention is not limited to this.

[0047]

According to the power supply device of the present invention, foreign matter such as dust can be prevented from entering the housing with a simple structure.

[Brief description of drawings]

FIG. 1 shows an embodiment of a power supply device according to the present invention,
(A) is a top view, (B) is a front view, (C) is a bottom view,
(D) is a left side view and (E) is a right side view.

FIG. 2 is a front view of the power supply device of FIG. 1 with a front panel removed.

FIG. 3 is a perspective view of the power supply device of FIG.

FIG. 4 is a sectional view taken along line IV-IV in FIG.

5 is an exploded perspective view of the power supply device of FIG. 1. FIG.

FIG. 6 is a plan view showing a mounted state of the top panel.

[Explanation of symbols]

10 power supply 11 housing 12 Front panel 16 Lower surface 18 body panel 20 top panel 22 heat sink 24 Inverter device (heating element) 31 reactor (heating element) 44A lower vent 44B Upper vent 50 Lid (opening / closing member)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masatomo Kobayashi             1 Otsuki-cho, Ashikaga City, Tochigi Prefecture Sanyo Electric Air Conditioning             Within the corporation F term (reference) 5H007 AA06 BB02 BB07 HA03 HA05                       HA07

Claims (5)

[Claims] 1. A power supply device capable of converting direct-current power into alternating-current power corresponding to a frequency of a commercial power supply system and supplying the alternating current power to the system, wherein ventilation holes are formed in an upper surface and a lower surface of a casing of the power supply device, A power supply device characterized in that an opening / closing member that opens and closes according to temperature is provided in a ventilation hole on the upper surface. 2. The power supply device according to claim 1, wherein the opening / closing member is a lid made of a shape memory alloy. 3. The power supply device according to claim 2, wherein the lid has a bent portion substantially in the center thereof and is opened along the bent portion when the lid reaches a predetermined temperature. . 4. The power supply device according to claim 1, wherein the heating element in the housing is cooled by air rising by natural convection. 5. The power supply device according to claim 1, wherein the DC power is generated by a solar cell.