JPH07183680A - Radiation structure for case - Google Patents

Abstract

PURPOSE:To prevent dust and dirt from entering by radiating heat with thermal shape memory alloy of a top plate deforming reacting with a temperature rise inside a case to form a radiation hole. CONSTITUTION:A top plate 2 is equipped with thermal shape memory alloy 10 which deforms with high temperature and thermal shape memory alloy 10 which deforms at normal temperature. When a heat source 1 generates high temperature, the alloy 10 deforms reacting with a temperature rise inside a case, forming a radiation hole on the top plate 2 to permit heat inside the case to be radiated. When power supply to a device ceases, the alloy 11 deforms reacting with a temperature drop inside the case, restoring the top plate 2 to an original state. Thus entrance of dust and dirt can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure for a housing such as a television or a liquid crystal projector.

[0002]

2. Description of the Related Art In the conventional heat dissipation structure of a housing, heat dissipation holes are efficiently formed in a place where heat dissipation is required, for example, a top plate.

[0003]

With the conventional heat dissipation structure as described above, when the device is not used, dust or the like may enter the inside of the device, which may cause a decrease in the heat dissipation effect or a failure of the device. Sometimes it was.

[0004]

In order to solve the above problems, in the heat dissipation structure of the present invention, a thermal shape memory alloy is provided on the top plate of the housing, etc., and the thermal shape memory alloy reacts to the temperature rise inside the housing. By deforming, a heat dissipation hole is formed,
It is characterized by radiating heat.

[0005]

The heat dissipation structure configured as described above can dissipate heat only when the temperature rises and heat dissipation is required in a housing having a heat source that generates a high temperature. Prevents dust from entering the housing.

[0006]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 shows an embodiment of the present invention. In this embodiment, the heat dissipation structure is in a closed state when the equipment is not used. When the electric power is supplied to the device and the device starts to work, the heat source 1 generates heat.

Referring to FIG. 2, which is a detailed view of a portion A of FIG. 1, a top plate 2 is provided with a thermal shape memory alloy 10 that deforms at a high temperature and a thermal shape memory alloy 11 that deforms at a constant temperature. When the heat source 1 emits a high temperature, it reacts to the temperature rise inside the housing,
The thermal shape memory alloy 10 is deformed, and a heat dissipation hole is formed in the top plate 2, so that heat can be dissipated inside the housing. Further, when power is not supplied to the equipment, the thermal shape memory alloy 11 is deformed in response to the temperature processing inside the housing, and the top plate 2 returns to the original state.

[0008]

As described above, the heat dissipating structure of the present invention is extremely effective because it can prevent the entry of dust and the like while providing the heat dissipating hole in the top plate such as the housing.

[Brief description of drawings]

FIG. 1 is a perspective view of a heat dissipation structure according to an embodiment of the present invention.

FIG. 2 is a detailed view of a portion A of FIG.

[Explanation of symbols]

 1 Heat Source 2 Top Plate 10 Thermal Shape Memory Alloy Deforming at High Temperature 11 Thermal Shape Memory Alloy Deforming at Low Temperature

Claims (2)

[Claims] 1. A heat dissipation structure for a housing, wherein a heat dissipation hole is formed of a thermal shape memory alloy that deforms in response to temperature changes. 2. The heat dissipation structure for a housing according to claim 1, wherein the top plate of the housing is provided with a heat dissipation hole.