JPH06209179A - Electronic machinery using thermoelectric cooling element - Google Patents

Abstract

PURPOSE:To obtain an electronic machine capable of effectively cooling the atmospheric temperature of electronic circuit parts without being affected by outside air temperature. CONSTITUTION:A cooling plate having an U-shaped trench and a temperature sensor 24, and a radiator 8 are attached to a chassis. A blower 11 for sending the outside air to the radiator 8 is installed. Thermoelectric elements 9 are arranged between the cooling plate 6 and the radiator 8. Electronic circuit parts 14 are mounted on a mother board 13 and a printed wiring board 17 via a heat conduction plate 20. A circuit module 18 provided with a wedge type clamp 21, and a cover 19 covering the chassis from the outside are installed. In another invention, the chassis and the cover 19 are formed by using compound plates.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device which houses a printed wiring board and indirectly cools an electronic circuit component mounted on the printed wiring board, and more particularly to an ambient temperature of the electronic circuit component. Is efficiently cooled to a temperature lower than that of the outside air, and the atmosphere temperature set accurately is controlled.

[0002]

2. Description of the Related Art Conventionally, the most general method for cooling an electronic device containing an electronic circuit component has been to blow outside air directly onto the electronic circuit component. However, as the functions in the field of electronic devices are becoming more dispersed, it is not always installed in a room where temperature, humidity, dust, etc. are controlled as in the conventional case. Therefore, in the method in which the outside air is blown directly onto the electronic circuit parts, dust floating in the outside air may adhere to the electronic circuit parts, and the adhered parts may be corroded or dielectric breakdown may occur. And in terms of reliability, it is no longer the preferred method. Therefore, as a method of cooling an electronic device installed in such an environment, there is an example in which an outside air is not directly blown to the electronic circuit component. FIG. 8 is a horizontal cross-sectional view showing the typical conventional electronic device, and FIG. 9 is a view showing a cross-section CC of FIG.

In the figure, 18 is a circuit module in which an electronic circuit component 14 and a connector plug 15 are mounted on a printed wiring board 17, and 31 is a first surface having an opening for inserting and removing the circuit module 18 on the upper surface. A surface 32 is provided, and a heat dissipation path 35 is formed outside the second surface 33 and the third surface 34 that are perpendicular to the first surface 32 and face each other. Inside the heat dissipation path 35, a heat dissipation path 35 is formed. Is provided with a radiating fin 36, and a heat absorbing fin 37 is provided inside the second surface 33 and the third surface 34, and a front portion of the second surface 33 and the third surface 34 has a first portion. This is a case in which the first ventilation hole 38a and the second ventilation hole 38b are provided in the rear portion, and the outside air is taken in from the first ventilation hole 38a and flows to the second ventilation hole 38b through the heat dissipation passage 35. , The first blower 3 It is released by. A bracket 42 is attached to the case 31 so as to cover the heat absorbing fins 37, a card guide 41 for holding the circuit module 18 is arranged, and a third ventilation hole 38c is provided between the card guides 41. , 13 is provided with a connector seat 12 that engages with the connector plug 15 of the circuit module 18, and the bracket 4 is mounted so that the connector seat 12 faces the first surface 32 of the case 31.
Motherboard attached to 2, 40 is the above case 31
A second blower for circulating the internal air between the circuit module 18 and the heat absorbing fins 37 through the third ventilation hole 38c of the bracket 42,
Reference numeral 19 denotes a cover for covering the first surface 32 from the outside, which is fixed to the case 31 at the peripheral portion with screws or the like.

In such an electronic device, the heat generated from the electronic circuit component 14 is generated by the second blower 40.
Is transmitted to the internal air circulated by the heat absorption fins 3
7 is radiated to the outside air flowing through the heat radiation passage 35 through the heat absorption fins 37 and the heat radiation fins 36. Then, by radiating heat, the cooled internal air flows again to the electronic circuit component 14 of the circuit module 18. Therefore, the circuit module 18 housed in the electronic device is cooled by a method in which the outside air is not blown directly to the electronic circuit component 14.

[0005]

Recently, an increase in the amount of heat generated by increasing the density of electronic equipment has improved the heat dissipation characteristics of the electronic equipment, and further improved performance and stability thereof.
There is a demand for lowering the ambient temperature of electronic circuit components mounted in electronic equipment and reducing the temperature fluctuation rate. However, since the conventional electronic device is configured to indirectly radiate the heat of the electronic circuit component to the outside air, a temperature difference is always generated due to the thermal resistance of each component through which the heat is transmitted, and the temperature of the electronic circuit component is The temperature could not be lowered below the temperature of the outside air where the electronic equipment was installed. Further, the ambient temperature of the electronic circuit parts is determined by the temperature of the outside air, the amount of heat generated by the electronic circuit parts, and the thermal resistance of each component, but if the temperature of the outside air or the amount of heat generated by the electronic circuit parts changes, the The ambient temperature of the circuit parts also changes. In such cases,
In order to improve the heat dissipation characteristics, it is necessary to increase the surface area of the heat dissipation fins 36 and the heat absorption fins 37, and in order to suppress the change of the ambient temperature of the electronic circuit parts, the heat generation amount of the electronic circuit parts is kept constant. It is necessary to adopt methods such as setting the value, increasing the heat capacity of each component of the electronic device, and further providing a temperature sensor for detecting the ambient temperature of the electronic circuit component. However, this causes a drawback that the entire electronic device becomes large. Also,
There is also a proposal to attach a cooling device, which uses the heat of vaporization of a refrigerant such as CFCs, to electronic devices, similar to a cooling device for a house. However, an electronic device of this structure must also be provided with a compressor and piping, and as with the conventional electronic device described above, the entire electronic device becomes complicated and large in size, and further, CFCs that may cause ozone layer destruction must be used. I have to.

In view of the above, as a proposal other than the above, there is a proposal, as disclosed in Japanese Patent Publication No. 4-43421, to mount a device cooling device using a thermoelectric cooling element to an electronic device. FIG. 10 is a horizontal cross-sectional view showing an example in which this equipment cooling device is attached to an electronic equipment, and FIG. 11 is a view showing a cross-section DD of FIG.

In the figure, a heat dissipation passage 57 having a rectangular cross section is provided at the center of a casing 52, both ends of which are open to the outside, and a first blower 58 is provided in each case.
The wall surface surrounding the upper, lower, left and right sides of the heat dissipation passage 57 is formed by a heat dissipation plate 59. The heat radiation plate 59 has upper and lower surfaces that form the upper and lower surfaces of the heat radiation passage 57. The vertical radiation fins 60 projecting into the heat radiation passage 57 and the heat radiation plate 59 that forms the left and right surfaces of the heat radiation passage 57 include the heat radiation passage. A large number of horizontal heat radiating fins 61 projecting inside 57 are provided. Also, on the outer periphery of the heat sink 59,
A large number of thermoelectric cooling elements 9 are arranged so as to surround the heat dissipation passage 57. The heat generating surface 10b of the thermoelectric cooling element 9 is the inner side, and the heat generating surface 10b is in close contact with the heat sink 59, and is the outer side cooling surface 10a. The cooling plate 6 that covers it
Two are in close contact. Further, heat absorption passages 64, 65, 66, 67 surrounded by the casing 52 and the cooling plate 62 and provided with heat absorbing fins 63 projecting from the outer surface of the cooling plate 62 are provided on the upper, lower, left and right sides of the heat dissipation passage 57. The internal air is circulated by the second blowers 68 to 71 which are provided and communicate with the electronic devices 53 to 56 through the openings provided at both ends of the heat absorption passages 64 to 67, and which are provided in the openings. It was made to let. Therefore, when an electric current is applied to the thermoelectric cooling element 9, the Peltier effect causes the heat generating surface 10b of the thermoelectric cooling element 9 to generate heat, and the cooling surface 10a is cooled. Then, when the first blower 58 operates, the outside air is introduced into the heat dissipation passage 57 from one opening, and the outside air is absorbed by the heat dissipation plate 59 and the heat dissipation fins 60 and 6.
It is blown to 1. At this time, the heat sink 5
9 and the heat radiation fins 60 and 61 are heated to a high temperature by the heat transmitted from the heat generation surface 10b of the thermoelectric cooling element 9 that is in close contact with the heat radiation plate 59, and the heat is released to the outside air. Then, the heated outside air is discharged to the outside from the other opening of the heat radiation passage 57. In addition, the second blower 6
When 8 to 71 are activated, the internal air heated to a high temperature by the heat generated by the electronic circuit components 14 housed in the electronic devices 53 to 56 is guided to the heat absorption passages 64 to 67 from one opening, and the internal air is cooled. And it is forcedly sprayed onto the heat absorbing fins 63. At this time, since the cooling plate 62 and the endothermic fins 63 are cooled by the cooling surface 10a of the thermoelectric cooling element 9 that is in close contact with the cooling plate 62, the heat of the high-temperature internal air is removed, and The internal air is cooled. Then, the cooled internal air passes through the heat absorption passage 6
It returns to the inside of electronic equipment 53-56 from the other opening of 4-67. Thus, the electronic devices 53 to 56 and the heat absorption passages 64 to
By circulating the internal air with 67, the electronic circuit components 14 housed in the electronic devices 53 to 56 are continuously cooled.

In an electronic device equipped with such a device cooling device, since the device cooling device enables a high heat exchange rate, an electronic circuit component or the like housed in the electronic device is not affected by the outside air temperature. Can be cooled. However, in an electronic device to which such a device cooling device is attached, the electronic device must be arranged so as to surround the device cooling device as a center, and the electronic device is mounted, such as an aircraft or a vehicle. It imposes many constraints on shape and structure. Further, the internal air of the electronic device often flows through a passage formed by an object to be stored, for example, a circuit module having electronic circuit components mounted thereon. At this time, in order to evenly flow the internal air to the electronic circuit parts, it is necessary to change the cross-sectional area of the passage and to provide an air volume adjusting mechanism such as an orifice, which makes the electronic device large and complicated, and the air volume. It takes a lot of time and effort to adjust, and since the electronic circuit parts have various uneven shapes,
Due to the unevenness, the internal air becomes a partially complicated and unstable flow, and thermal resistance between the electronic circuit components and the internal air,
There is a drawback of the forced air cooling method in which the so-called heat transfer degree is changed and the ambient temperature of the electronic circuit component is difficult to stabilize. Then, the heat of the electronic circuit components housed in the electronic device is transmitted to the circulating internal air and is radiated to the outside air flowing through the heat radiation passage through the heat absorbing fins and the heat radiating fins, so that many components transfer the heat, In particular, the atmospheric temperature of the electronic circuit component is not constant until the heat capacity of the internal air is saturated, and much time is spent until the electronic circuit component is cooled to a predetermined atmospheric temperature. Furthermore, when trying to lower the ambient temperature of the electronic circuit parts below the outside air temperature, the heat from the outside air enters the inside of the electronic device and is superposed with the heat generated by the electronic circuit parts, so the electronic circuit parts of the thermoelectric cooling element are cooled. There is a problem that the efficiency of cooling, that is, the cooling capacity is reduced.

The present invention has been made in order to solve these problems, and its purpose is to have a simple structure and a high heat transfer rate, and further to prevent atmospheric temperature and temperature fluctuations in electronic circuit parts and the like. An object is to obtain an electronic device equipped with a cooling device that can be controlled stably and accurately. Further, in addition to the above object, another invention of the present invention is to cool the atmosphere temperature of the electronic circuit component effectively and efficiently without being affected by the outside air temperature when the atmosphere temperature of the electronic circuit component is lowered from the outside air temperature. The purpose is to obtain an electronic device that can.

[0010]

In order to achieve this object, an electronic apparatus according to the present invention comprises a box-shaped chassis having a first surface opened, and a second chassis forming a right angle with the first surface of the chassis. A cooling plate having a U-shaped groove that is attached to the third inner surface facing the inner surface and the second inner surface of the chassis and that is perpendicular to the first surface of the chassis and that is arranged inwardly. A temperature sensor embedded within the cooling plate and a second outer surface of the chassis, the second outer surface being perpendicular to the first surface of the chassis and the third outer surface opposite the second outer surface. And a radiator having a large number of radiator fins protruding from the third outer surface, and provided at the tip of the radiator fins of the radiator,
Provided between the blower that blows outside air to the radiating fins, and between the cooling plate and the radiator so that the cooling surface is in close contact with the cooling plate and the heat generating surface is in close contact with the surface that forms the root of the radiator fins of the radiator. Mounted on the cooling plate at right angles to the U-shaped groove of the cooling plate and with the connector seat facing the first surface of the chassis. And a printed circuit board on one surface of which a electronic circuit component is mounted via a heat transfer plate, and
A connector plug that engages with the connector seat of the motherboard is mounted on the side of, and the second side that is perpendicular to the first side is mounted.
And a wedge-shaped clamp is provided on the third side opposite to the second side and the heat transfer plate and the wedge-shaped clamp are arranged so as to fit into the U-shaped groove of the cooling plate. It is provided with a rectangular circuit module and a cover arranged so as to cover the first surface of the chassis from the outside. Here, the heat transfer plate is a metal plate having good thermal conductivity (eg, aluminum alloy)
And a plurality of places are punched out in a rectangular shape, one surface is in close contact with the printed wiring board, and the other surface is in close contact with the electronic circuit component.

In an electronic apparatus according to another embodiment of the present invention, the core material is paper formed by forming a large number of continuous hexagonal columns in a honeycomb shape or a resin foam having a large number of bubbles, and the core material is A chassis and a cover are formed by a composite plate sandwiched between non-ferrous metal plates and the like.

An electronic apparatus according to still another embodiment of the present invention is attached to the cooling plate with low thermal resistance and has a fourth inner surface and a fourth inner surface which are perpendicular to the second inner surface of the chassis.
Is provided with a heat absorbing plate arranged along a fifth inner surface facing the inner surface.

[0013]

The electronic apparatus of the present invention uses the thermoelectric cooling element utilizing the Peltier effect. When a current is passed through the thermoelectric cooling element, the cooling surface of the element is cooled by the behavior of the electrons in the semiconductor, and heat is generated. The surface heats up. That is,
The element acts as a type of heat pump that transfers heat from the cooling surface to the heat generating surface. Therefore, the heat generated from the electronic circuit component is transferred to the cooling surface of the thermoelectric cooling element from the end of the circuit module via the heat transfer plate, via the U-shaped groove of the cooling plate. Then, the heat is radiated into the outside air through the radiation fins of the radiator that are in close contact with the heat generating surface of the thermoelectric cooling element. In this way, the heat generated from the electronic circuit parts passes through the heat transfer plate made of a metal having good thermal conductivity, so that the speed of transfer of the heat is high, and the degree of transfer of the heat depends on the current applied to the thermoelectric cooling element. Since the temperature sensor continuously controls, the ambient temperature of the electronic circuit component can be stably cooled, and the fluctuation of the ambient temperature can be accurately controlled. Then, it suffices to provide a cooling plate sandwiching the thermoelectric cooling element, a radiator and a blower for flowing the outside air to the radiator, and a heat transfer plate in close contact with the electronic circuit component on the printed wiring board, which makes the structure extremely simple. be able to.

Further, in another embodiment of the present invention, when the ambient temperature of the electronic circuit component is lowered from the outside air temperature, the heat in the outside air penetrates into the inside of the electronic device through the chassis and the cover, but many chassis are present. Since the continuous hexagonal column of paper is formed into a honeycomb shape or a composite material in which a resin foam core material with a large number of air bubbles is sandwiched with non-ferrous metal plates, the heat passing through the chassis and cover is , Which is superior to metals in heat insulation, is transmitted through the air layer surrounded by paper and a honeycomb-shaped hexagonal column, or the air and resin in air bubbles, preventing heat from entering from the outside air and being affected by the outside air temperature. Without, the ambient temperature of the electronic circuit component can be effectively and efficiently cooled.

In still another embodiment of the present invention, when the cooling plate is cooled by the thermoelectric cooling element, the cooling plate and the heat absorbing plate attached with low thermal resistance are cooled. Radiant heat generated by the electronic circuit components mounted on the circuit module is absorbed by the cooled heat absorbing plate. Therefore, the heat generated from the electronic circuit component is transferred by the heat transfer plate and the heat absorbing plate, and the ambient temperature of the electronic circuit component can be cooled more effectively.

[0016]

【Example】

Example 1. 1 and 2 show an embodiment of an electronic device according to the present invention, FIG. 1 is a horizontal sectional view thereof, and FIG. 2 is a view showing a sectional view AA of FIG. In the figure, 4 is the first
1 is a box-shaped chassis having an open surface 1, and in this embodiment, a composite plate 23 in which a non-ferrous metal plate 22b sandwiches a paper core material 22a formed by forming a large number of continuous hexagonal columns in a honeycomb shape.
It was formed in. The second inner surface 2a forming a right angle with the first surface 1 of the chassis 4 and the third inner surface 3a facing the second inner surface 2a are perpendicular to the first surface 1 of the chassis 4. At the same time, a cooling plate 6 having a U-shaped groove 5 arranged so as to face inward is attached. A temperature sensor 24 for detecting the temperature of the cooling plate 6 is embedded inside the cooling plate 6. further,
A second outer surface 2b forming a right angle with the first surface 1 of the chassis 4.
The third outer surface 3b opposite to the second outer surface 2b has a second outer surface 2b and a third outer surface 3 of the chassis 4.
A radiator 8 having a large number of radiating fins 7 protruding from b is attached, and a blower 11 for blowing outside air to the radiating fins 7 is provided at the tip of the radiating fins 7. And between the cooling plate 6 and the radiator 8,
A large number of thermoelectric cooling elements 9 are arranged in which the cooling surface 10a is in close contact with the cooling plate 6 and the heat generating surface 10b is in close contact with the surface forming the root of the heat dissipation fin 7 of the radiator 8. 13 includes a connector seat 12, and the cooling plate 6
A mother board mounted on the cooling plate 6 so that the connector seat 12 faces the first surface 1 of the chassis 4 at a right angle to the U-shaped groove 5 and a printed wiring board 17 is provided. The electronic circuit component 14 is mounted via the heat transfer plate 20 made of a metal plate having good heat conductivity, and the first side 16a
Is mounted with a connector plug 15 that engages with the connector seat 12 of the motherboard 13, and further the first plug
The second side 16b that is perpendicular to the side 16a of the
The third side 16c opposite to the side 16b is provided with a wedge-shaped clamp 21, and the heat transfer plate 20 and the wedge-shaped clamp 21 are fitted into the U-shaped groove 5 of the cooling plate 6. The rectangular circuit module 19 thus arranged is a cover which is arranged so as to cover the first surface 1 of the chassis 4 from the outside and is formed of the same composite plate 23 as the chassis 4.

Next, the operation of the electronic device constructed as described above will be described. When cooling the electronic circuit component 14 mounted on the circuit module 18, an electric current is passed through the thermoelectric cooling element 9. Then, due to the Peltier effect, the heating surface 10b of the thermoelectric cooling element 9 generates heat, and the cooling surface 10a is cooled. Therefore, the blower 11 is operated. When the blower 11 operates, the outside air is introduced into the radiator 8 and the outside air is forcibly blown to the radiating fins 7. At this time, the heat radiator 8 and the heat radiation fins 7 are at a high temperature due to the heat transmitted from the heat generation surface 10b of the thermoelectric cooling element 9 that is in close contact with the heat radiator 8. Therefore, the heat is radiated to the outside air. In addition, the circuit module 18
The heat transfer plate 20 of the
It is in contact with the U-shaped groove 5 of the cooling plate 6. At this time, since the cooling plate 6 is cooled by the cooling surface 10a of the thermoelectric cooling element 9 which is in close contact with the surface of the cooling plate 6 opposite to the U-shaped groove 5, the electron The heat generated from the circuit component 14 is transmitted through the heat transfer plate 20 and is guided to the cooling plate 6 from the heat transfer plate 20 which is in contact with the U-shaped groove 5 of the cooling plate 6. Then, the introduced heat is transferred to the radiator 8 and the radiation fins 7 through the thermoelectric cooling element 9, and is radiated to the outside air flowing into the radiator 8.

Thus, the heat generated from the electronic circuit component 14 mounted on the circuit module 18 passes through the heat transfer plate 20 made of a metal having good heat conductivity, so that the heat transfer speed is high and , The degree of cooling of the electronic circuit component 14, that is, the degree of heat transfer depends on the thermoelectric cooling element 9
Since the temperature sensor 24 for detecting the temperature of the cooling plate 6 continuously controls the current applied to the cooling plate 6, the ambient temperature of the electronic circuit component 14 is cooled stably, and the variation of the ambient temperature is accurately measured. Can be controlled.

Then, the chassis 4 and the cover 1
9 is a composite plate 23 in which a non-ferrous metal plate 22b sandwiches a paper core material 22a formed by forming a large number of continuous hexagonal columns in a honeycomb shape.
Since the air layer surrounded by the paper core material 22a and the honeycomb-shaped hexagonal column has excellent heat insulating properties as compared with metals, the composite plate 23 is Heat resistance is increased and heat transfer is suppressed. Therefore, even when the ambient temperature of the electronic circuit component 14 is lower than the ambient temperature, the chassis 4 and the cover 19 prevent heat from entering from the ambient air. That is, since the entire heat absorbing ability of the thermoelectric cooling element 9 can be used for cooling the electronic circuit component 14 without being affected by the outside air temperature, the ambient temperature of the electronic circuit component 14 can be effectively and efficiently cooled. In addition, since it is not necessary to consider the amount of heat entering from the outside air, the number of expensive thermoelectric cooling elements 9 can be reduced, and the price can be reduced and the size and weight can be reduced.

Also, in this electronic apparatus, the cooling plate 6 sandwiching the thermoelectric cooling element 9 and the radiator 8 and a blower for flowing outside air to the radiator, and the printed wiring board 17 are provided.
It suffices to provide the heat transfer plate 20 that is in close contact with the electronic circuit component 14, and since there is no need for a blower for forcibly cooling the inside of the electronic device and an air volume adjusting mechanism such as an orifice for uniformly flowing the internal air, It can be extremely simple in construction. Further, since the cooling device is configured integrally with the electronic device, it is only necessary to consider the shape and size of the electronic device, and restrictions given to the shape and structure of the aircraft or vehicle in which the electronic device is mounted. And little impact.

Further, the outside air flowing through the radiator 8 is released to the outside as it is just by exchanging heat with the radiator 8 and the radiation fins 7. Therefore, in an environment where dust and the like are suspended in the outside air. Even when it is operated, it has no influence on the electronic circuit parts housed in the electronic device.

In this embodiment, the core member 22a of the composite plate 23 of the chassis 4 and the cover 19 is used.
Uses a paper sheet in which a large number of continuous hexagonal columns are formed in a honeycomb shape, but the same action and effect can be expected by using a resin foam having a large number of cells as the core material 22a.

Example 2. FIG. 3 shows another embodiment in which the heat absorbing plate 26 is attached to the cooling plate 6 of the first embodiment. The heat absorbing plate 26 is attached to the cooling plate 6 with low heat resistance, and A fourth inner surface 25a and a fourth inner surface 25 that form a right angle with the second inner surface 2a of the chassis 4.
It is arranged along the fifth inner surface 25b facing a. According to this embodiment, when the cooling plate 6 is cooled by the thermoelectric cooling element 9, the cooling plate 6 and the heat absorbing plate 26 attached with low thermal resistance are cooled. And
Radiant heat generated by the electronic circuit component 14 mounted on the circuit module 18 is absorbed by the cooled heat absorbing plate 26. In this way, the heat generated from the electronic circuit component 14 is comprehensively transferred by the heat transfer plate 20 and the heat absorbing plate 26, and the ambient temperature of the electronic circuit component 14 can be cooled more effectively.

[0024]

As described above, the present invention utilizes the thermoelectric cooling element, and the cooling plate having the U-shaped groove cooled by the cooling surface of the thermoelectric cooling element is the U-shaped groove. It absorbs the heat of the electronic circuit parts through the heat transfer plate of the circuit module that fits in the heat transfer plate, and transfers the heat to the radiator by the heat generating surface of the thermoelectric cooling element, so that the heat is dissipated to the outside air. The heat transfer rate is high and the heat transfer rate is fast, and the heat transfer rate is continuously controlled by the temperature sensor that detects the temperature of the cooling plate, so the ambient temperature of the electronic circuit parts is cooled stably. Then
Moreover, it is possible to accurately control the fluctuation of the ambient temperature. And, since no moving device is required other than the blower for flowing the outside air to the radiator, the structure is extremely simple, and
Since the cooling device is configured integrally with the electronic device, only the shape and size of the electronic device need be considered,
There are few restrictions and influences on the shape and structure of aircrafts and vehicles in which this electronic device is mounted.

Further, in another embodiment of the present invention, since the chassis and the cover are formed by the composite plate having excellent heat insulating properties, heat invasion from the outside air is prevented, and the thermoelectric cooling element of the thermoelectric cooling element is not affected by the outside air temperature. Since all of the heat absorption capacity can be used to cool electronic circuit components, the ambient temperature of electronic circuit components can be effectively and efficiently cooled, and the number of expensive thermoelectric cooling elements can be reduced. Can be

Further, according to still another embodiment of the present invention, by providing the heat absorbing plate which is cooled together with the cooling plate, the heat absorbing plate absorbs the radiant heat generated from the electronic circuit component and closely contacts with the electronic circuit component. Since the heat from the electronic circuit component is transferred to the cooling plate together with the heat transfer plate, the cooling of the electronic circuit component is promoted, and the ambient temperature of the electronic circuit component can be cooled more effectively, which is an excellent effect.

[Brief description of drawings]

FIG. 1 is a horizontal sectional view showing an embodiment of the present invention.

FIG. 2 is a view showing a cross section AA of FIG.

FIG. 3 is a diagram showing another embodiment of the present invention.

FIG. 4 is a diagram showing a structure of a composite plate using paper as a core material.

FIG. 5 is a view showing a structure of a composite plate having a resin foam as a core material.

FIG. 6 is a diagram showing a circuit module.

FIG. 7 is a view of FIG. 6 viewed from the direction B.

FIG. 8 is a horizontal cross-sectional view showing a typical example of a conventional electronic device.

9 is a diagram showing a cross section CC of FIG. 8. FIG.

FIG. 10 is a horizontal sectional view showing an example in which a conventional device cooling device is attached to an electronic device.

11 is a diagram showing a cross-section DD of FIG.

[Explanation of symbols]

 1 1st surface 2a 2nd inner surface 2b 2nd outer surface 3a 3rd inner surface 3b 3rd outer surface 4 Chassis 5 Groove 6 Cooling plate 7 Radiating fin 8 Radiator 9 Thermoelectric cooling element 10a Cooling surface 10b Radiating surface 11 Blower 12 Connector Seat 13 Motherboard 14 Electronic Circuit Parts 15 Connector Plug 16a First Side 16b Second Side 16c Third Side 17 Printed Wiring Board 18 Circuit Module 19 Cover 20 Heat Transfer Plate 21 Wedge Clamp 22a Core Material 22b Nonferrous Metal Plate 23 composite plate 24 temperature sensor 25a fourth inner surface 25b fifth inner surface 26 heat absorption plate 31 case 32 first surface 33 second surface 34 third surface 35 heat dissipation passage 36 heat dissipation fin 37 37 heat absorption fin 38a first Ventilation hole 38b Second ventilation hole 38c Third ventilation hole 39 First blower 40 Second blower 41 Card Guide 42 Bracket 52 Casing 53 Electronic device 57 Radiating passage 58 First blower 59 Radiating plate 60, 61 Radiating fin 62 Cooling plate 63 Endothermic fin 64 Endothermic passage 68 Second blower

Claims (4)

[Claims] 1. A box-shaped chassis having a first surface opened,
It is attached to a second inner surface that is at a right angle to the first surface of the chassis and a third inner surface that faces the second inner surface, and is at a right angle to the first surface of the chassis and faces inward. A cooling plate having a U-shaped groove, a temperature sensor embedded inside the cooling plate, a second outer surface and a second outer surface that are perpendicular to the first surface of the chassis, and A radiator having a radiator fin attached to the third outer surface on the opposite side and protruding from the second outer surface and the third outer surface of the chassis; and a radiator provided at the tip of the radiator fin of the radiator. A blower for blowing outside air to the fins, a surface provided between the cooling plate and the radiator, the cooling surface is in close contact with the cooling plate, and the heat generating surface constitutes the root of the radiation fin of the radiator. Thermoelectric cooling placed in close contact with Comprising a child, the connector seat, perpendicular and grooves U-shaped in the cooling plate, and a first of said chassis
A surface of the mother board attached to the cooling plate so that the connector seat faces the surface of the printed circuit board; and an electronic circuit component mounted on the printed wiring board via a heat transfer plate on the first surface.
A connector plug that engages with the connector seat of the motherboard is mounted on the side of, and further on the second side that is perpendicular to the first side and the third side that faces the second side. A wedge-shaped clamp is provided, a rectangular circuit module in which the heat transfer plate and the wedge-shaped clamp are arranged so as to be fitted in a U-shaped groove of the cooling plate, and a first of the chassis. An electronic device using a thermoelectric cooling element, comprising a cover arranged so as to cover the surface from the outside. 2. The chassis and the cover are formed of a composite plate in which a non-ferrous metal plate or the like is sandwiched with a paper core material in which a large number of continuous hexagonal columns are formed in a honeycomb shape. An electronic device using the thermoelectric cooling element according to 1. 3. The electronic device using the thermoelectric cooling element according to claim 2, wherein the core material of the composite plate is a resin foam having a large number of bubbles. 4. A heat absorbing plate, which is attached to the cooling plate with low heat resistance and is arranged along a fourth inner surface that is perpendicular to the second inner surface of the chassis and a fifth inner surface that faces the fourth inner surface. An electronic device using the thermoelectric cooling element according to claim 2 or 3, which is provided.