CN117202596A - Head-mounted electronic device - Google Patents
Head-mounted electronic device Download PDFInfo
- Publication number
- CN117202596A CN117202596A CN202210614425.6A CN202210614425A CN117202596A CN 117202596 A CN117202596 A CN 117202596A CN 202210614425 A CN202210614425 A CN 202210614425A CN 117202596 A CN117202596 A CN 117202596A
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- Prior art keywords
- heat
- heat dissipation
- electronic device
- head
- mounted electronic
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 85
- 239000003292 glue Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 description 19
- 238000001816 cooling Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004660 morphological change Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A head-mounted electronic device, comprising: a housing; a screen assembly disposed within the housing; a circuit assembly disposed within the housing and spaced apart from the screen assembly to form a heat dissipation channel; wherein a first heat sink and a second heat sink are respectively disposed on sides of the screen assembly and the circuit assembly facing each other, the first heat sink and the second heat sink being disposed within the heat dissipation channel. According to the head-mounted electronic device, the fan can radiate heat to the circuit assembly and simultaneously radiate heat to the screen assembly, so that the overall heat radiation capacity of the head-mounted electronic device is improved, and the stable operation capacity of the head-mounted electronic device is ensured.
Description
Technical Field
The present application relates to a head-mounted electronic device.
Background
In the prior art, wind in VR equipment basically blows out from between PCB board and the casing, and in whole heat dissipation in-process, the wind that dispels the heat to the PCB board can't take away the heat of the screen in the VR equipment, that is to say, PCB board and screen can't carry out the forced air cooling heat dissipation simultaneously, and the VR equipment among the prior art can't high-efficient utilize the casing to conduct the heat dissipation in addition.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present application is to provide a head-mounted electronic device, in which a fan of the head-mounted electronic device can radiate heat to a circuit assembly and also radiate heat to a screen assembly, so that the overall heat radiation capability of the head-mounted electronic device is improved, and the stable operation capability of the head-mounted electronic device is ensured.
The head-mounted electronic device according to the present application includes: a housing; a screen assembly disposed within the housing; a circuit assembly disposed within the housing and spaced apart from the screen assembly to form a heat dissipation channel; wherein a first heat sink and a second heat sink are respectively disposed on sides of the screen assembly and the circuit assembly facing each other, the first heat sink and the second heat sink being disposed within the heat dissipation channel.
According to the head-mounted electronic device, the first heat dissipation piece and the second heat dissipation piece which are used for dissipating heat of the screen assembly and the circuit assembly are placed in the same heat dissipation channel, so that the fan can dissipate heat of the screen assembly while dissipating heat of the circuit assembly, the overall heat dissipation capacity of the head-mounted electronic device is improved, and the stable operation capacity of the head-mounted electronic device is ensured.
According to one embodiment of the application, the first heat sink and the second heat sink are each configured as an air-cooled heat sink.
According to one embodiment of the application, a first heat conducting glue layer is arranged between the first heat dissipation piece and the screen assembly, and a second heat conducting glue layer is arranged between the second heat dissipation piece and the circuit assembly.
According to one embodiment of the application, a heat insulating plate is arranged in the heat dissipation channel to divide the heat dissipation channel into a first heat dissipation channel and a second heat dissipation channel, the first heat dissipation piece is arranged in the first heat dissipation channel, and the second heat dissipation piece is arranged in the second heat dissipation channel.
According to one embodiment of the application, the side of the circuit component facing away from the screen component and the third heat sink are the same.
According to an embodiment of the present application, the third heat sink is configured as a heat pipe or a metal plate, which is attached to the circuit assembly and the housing, respectively.
According to one embodiment of the present application, a third heat conductive adhesive layer is disposed between the third heat sink and the circuit assembly.
According to one embodiment of the application, the circuit component is provided with a first side surface provided with a chip and a second side surface facing away from the first side surface, the first side surface is opposite to the screen component, the chip is attached to the second heat dissipation piece, and the second side surface is attached to the third heat dissipation piece; or (b)
The second side face is opposite to the screen assembly, the second side face is attached to the second heat dissipation piece, and the chip is attached to the third heat dissipation piece.
According to one embodiment of the application, the head-mounted electronic device further comprises: the rigid frame, the second heat dissipation piece with circuit subassembly all with rigid frame fixed connection, the second heat dissipation piece with be provided with the fourth heat conduction glue film between the rigid frame, the rigid frame with be provided with the fifth heat conduction glue film between the circuit subassembly.
According to one embodiment of the application, the head-mounted electronic device further comprises: a rigid frame, the second heat sink comprising: the heat dissipation fins are integrally fixed on the rigid frame, and a sixth heat conduction glue layer is arranged between the rigid frame and the circuit component.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of a head-mounted electronic device according to one embodiment of the application;
FIG. 2 is a schematic diagram of a head-mounted electronic device according to another embodiment of the application;
FIG. 3 is a schematic diagram of a head-mounted electronic device according to yet another embodiment of the application;
FIG. 4 is a schematic diagram of a head-mounted electronic device according to yet another embodiment of the application;
FIG. 5 is a schematic diagram of a head mounted electronic device according to yet another embodiment of the application;
fig. 6 is a schematic diagram of a head-mounted electronic device according to yet another embodiment of the application.
Reference numerals:
the head-mounted electronic device 100 is configured to,
the housing 110, the heat dissipation path 101, the first heat dissipation path 101a, the second heat dissipation path 101c,
the screen assembly 130 is configured to display a screen image,
the circuitry of the circuit assembly 150, the chip 151,
the first heat sink 171, the second heat sink 173, the third heat sink 175,
first thermal conductive adhesive layer 191, second thermal conductive adhesive layer 192, third thermal conductive adhesive layer 193, fourth thermal conductive adhesive layer 194, fifth thermal conductive adhesive layer 195, sixth thermal conductive adhesive layer 196, cooling fan 197, thermal insulation board 198, rigid frame 199.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
A head-mounted electronic device 100 according to an embodiment of the present application is described below with reference to fig. 1-6.
The head-mounted electronic device 100 according to the present application may include a housing 110, a screen assembly 130, and a circuit assembly 150.
The housing 110 serves as an overall frame of the head-mounted electronic device 100, not only as an exterior appearance of the entire head-mounted electronic device 100, but also as a support for supporting internal or external components. The housing 110 is provided with an installation space inside, and the screen assembly 130, the circuit assembly 150, the fan, the microphone, etc. may be installed in the installation space inside the housing 110.
The screen assembly 130 may be used to display graphic text, and the user may access the virtual world by viewing the graphic text displayed on the screen, etc., and the screen assembly 130 is a very important part of the head-mounted electronic device 100 and is an important medium for outputting content to the user. Also, as such, the screen assembly 130 inevitably generates heat, and excessive heat build-up directly affects the display effect of the screen assembly 130.
The circuit assembly 150 is arranged inside the shell 110, and the circuit assembly 150 is provided with a chip 151 and other control devices, so that the output content of the screen assembly 130 and the sound emitted by the earphone can be controlled, and the more important effect is to control the user to interact with the content in the game, so that the user has more immersion feeling. It should be noted that the circuit assembly 150 in the present application includes, but is not limited to, a PCB circuit board.
In addition, the circuit assembly 150 and the screen assembly 130 are spaced apart from each other such that a heat dissipation path 101 is formed between the circuit assembly 150 and the screen assembly 130, and in the embodiment of the present application, the first heat dissipation member 171 and the second heat dissipation member 173 are respectively disposed on sides of the screen assembly 130 and the circuit assembly 150 facing each other, and the first heat dissipation member 171 and the second heat dissipation member 173 are each disposed within the heat dissipation path 101.
That is, the first heat sink 171 may be disposed at the rear surface of the screen assembly 130 and within the heat dissipation channel 101, and the second heat sink 173 is disposed on the circuit assembly 150 and within the heat dissipation channel 101. Meanwhile, the virtual device is further provided with a cooling fan 197, negative pressure can be generated inside the shell 110 when the cooling fan 197 works, so that air with lower external temperature is introduced into the shell 110, air flow with lower temperature passes through the cooling channel 101 and exchanges heat with the first cooling member 171 and the second cooling member 173, so that the circuit assembly 150 can be cooled, the screen assembly 130 can be cooled, the whole cooling capacity of the head-mounted electronic device 100 is improved, and the head-mounted electronic device 100 can be stably and high-quality operated.
According to the head-mounted electronic device 100 of the embodiment of the application, the first heat dissipation member 171 and the second heat dissipation member 173 for dissipating heat of the screen assembly 130 and the circuit assembly 150 are placed in the same heat dissipation channel 101, so that the fan can dissipate heat of the screen assembly 130 while dissipating heat of the circuit assembly 150, thereby improving the overall heat dissipation capability of the head-mounted electronic device 100 and ensuring the stable operation capability of the head-mounted electronic device 100.
In some embodiments of the present application, the first heat sink 171 and the second heat sink 173 are each configured as an air-cooled heat sink. More specifically, the first heat sink 171 and the second heat sink 173 are each provided with a plurality of heat dissipating fins spaced apart, thereby increasing the heat exchange area of the heat sink with the low temperature air flow in the heat dissipating channel 101, so that the first heat sink 171 and the second heat sink 173 can rapidly transfer heat on the screen assembly 130 and the circuit assembly 150 to the air flow in the heat dissipating channel 101.
Of course, it is understood that the first heat sink 171 and the second heat sink 173 may be configured as other types of heat sinks, such as a heat pipe or a metal plate, so long as heat of the component to be heat-dissipated is transferred to the cool air in the heat dissipation channel 101.
According to some embodiments of the present application, a first thermal conductive adhesive layer 191 is disposed between the first heat sink 171 and the screen assembly 130, and a second thermal conductive adhesive layer 192 is disposed between the second heat sink 173 and the circuit assembly 150. Therefore, the heat generated by the screen assembly 130 can be more quickly and efficiently transferred to the first heat sink 171, the heat generated by the circuit assembly 150 can also be more quickly and efficiently transferred to the second heat sink 173, so that the heat generated by the screen assembly 130 and the circuit assembly 150 can be timely removed, and the screen assembly 130 and the circuit assembly 150 can work more stably.
In some embodiments of the present application, as shown in fig. 3, a heat insulating plate 198 is provided in the heat dissipation path 101 to divide the heat dissipation path 101 into a first heat dissipation path 101a and a second heat dissipation path 101c, a first heat dissipation member 171 is provided in the first heat dissipation path 101a, and a second heat dissipation member 173 is provided in the second heat dissipation path 101c.
That is, the cooling air flow introduced from the outside when the cooling fan 197 rotates may be divided into two and flow into the first cooling passage 101a and the second cooling passage 101c, respectively. The first heat sink 171 exchanges heat only with the low-temperature air flow in the first heat dissipation path 101a, and the second heat sink 173 exchanges heat only with the low-temperature air flow in the second heat dissipation path 101c. Thus, the heat generated by the circuit assembly 150 is prevented from being coupled to the screen assembly 130, mutual interference between the circuit assembly 150 and the screen assembly 130 is avoided, and the working stability of the head-mounted electronic device 100 is further improved.
Meanwhile, the cross-sectional areas of the first heat dissipation path 101a and the second heat dissipation path 101c may be selectively adjusted according to the heat value generated by the screen assembly 130 and the circuit assembly 150. That is, the air flow rate per unit time of the first heat dissipation channel 101a and the second heat dissipation channel 101c is adjustable, thereby further securing the heat dissipation efficiency of the first heat dissipation member 171 and the second heat dissipation member 173.
In some embodiments of the present application, a side of the circuit assembly 150 facing away from the screen assembly 130 is provided with a third heat sink 175. That is, unlike the prior art in which the cooling member only cools one side of the circuit assembly 150, in the head-mounted electronic device 100 of the present application, the heat dissipation members are disposed on both sides of the circuit assembly 150, so that the heat dissipation of the circuit assembly 150 can be performed more omnidirectionally, and the working stability of the circuit assembly 150 is improved.
One of the second heat sink 173 and the third heat sink 175 is attached to a side of the circuit assembly 150 where the chip 151 is not disposed, and the other of the second heat sink 173 and the third heat sink 175 is attached to a side of the circuit assembly 150 where the chip 151 is disposed, and more preferably, the other of the second heat sink 173 and the third heat sink 175 is attached to the chip 151 of the circuit assembly 150, so that heat generated from the chip 151 can be more rapidly transferred to the third heat sink 175.
The third heat sink 175 may be an air-cooled heat sink, and the circuit assembly 150 and the housing may be spaced apart to form a cooling air duct, and the heat dissipation fan 197 may simultaneously provide a low-temperature air flow to the cooling air duct, thereby dissipating heat from a side of the circuit assembly 150 facing away from the screen assembly 130. Further, as shown in fig. 6, a heat pipe may be further disposed in the cooling air duct, and the heat pipe may be adhered to and fixed with the housing 110, so that the circuit assembly 150 may be cooled more rapidly.
While in embodiments of the present application, the third heat sink 175 is configured as a heat pipe or metal plate, which may be attached to the circuit assembly 150 and the housing, respectively. Thereby, at least part of the heat generated by the circuit assembly 150 may also be transferred to the housing through the third heat sink 175. Thus, a portion of the heat generated by the circuit assembly 150 may be directed to the housing, and the area of the housing may be larger, thereby cooling the circuit assembly 150 more rapidly.
It should be noted that, the heat pipe is a common device in the heat dissipation field, and most of the heat is transferred through the morphological change of the phase change medium, which is not described herein.
Further, a third thermal conductive adhesive layer 193 is disposed between the third heat sink 175 and the circuit assembly 150, and a thermal conductive adhesive layer is disposed between the third heat sink 175 and the housing. Thus, heat from the circuit assembly 150 can be transferred to the third heat sink 175 through the third thermal conductive adhesive layer 193, and the third heat sink 175 in turn can transfer heat to the housing through the thermal conductive adhesive layer. The third heat conductive adhesive layer 193 and the heat conductive adhesive layer may improve heat transfer efficiency.
Of course, it is understood that if the third heat sink 175 is a heat pipe, the heat pipe can be directly attached to the housing 110 without providing a heat conductive adhesive layer between the heat pipe and the housing 110.
More specifically, the circuit assembly 150 has a first side on which the chip 151 is disposed and a second side facing away from the first side, and more specifically, the circuit assembly 150 includes: the semiconductor device comprises a substrate and a chip 151 arranged on the substrate, wherein the substrate is provided with a first side surface and a second side surface in the thickness direction, and the chip 151 is arranged on the first side surface.
The first side may face the screen assembly 130 such that the chip 151 disposed on the first side may be attached to the second heat sink 173, and the second side may be attached to the third heat sink 175; the second side may be opposite to the screen assembly 130 such that the second side is attached to the second heat sink 173 and the chip 151 disposed on the first side is attached to the third heat sink 175. That is, the chip 151 on the circuit assembly 150 may face the screen or face away from the screen, and the positions of the second heat sink 173 and the third heat sink 175 are different under different conditions.
In some embodiments of the present application, as shown in fig. 5-6, the head-mounted electronic device 100 further includes a rigid frame 199, the rigid frame 199 being disposed inside the housing 110 and fixedly coupled to the housing 110, the second heat sink 173 and the circuit assembly 150 being fixedly coupled to the rigid frame 199. Thus, a fourth thermal adhesive layer 194 is disposed between the second heat sink 173 and the rigid frame 199, and a fifth thermal adhesive layer 195 is disposed between the rigid frame 199 and the circuit assembly 150.
The rigid frame 199 may serve as a support for mounting the second heat sink 173 and the circuit assembly 150, while the heat dissipating fan 197 may also be fixed to the rigid frame 199.
In some embodiments of the present application, the head-mounted electronic device 100 further includes a rigid frame 199, and the second heat sink 173 includes a plurality of heat dissipation fins, which may be integrally fixed on the rigid frame 199, and a sixth thermal conductive adhesive layer 196 is disposed between the rigid frame 199 and the circuit assembly 150. The rigid frame 199 may be secured to the housing, and the fan and circuit assembly 150 may also be secured to the rigid frame 199.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A head-mounted electronic device, comprising:
a housing;
a screen assembly disposed within the housing;
a circuit assembly disposed within the housing and spaced apart from the screen assembly to form a heat dissipation channel; wherein the method comprises the steps of
The screen assembly and the circuit assembly are respectively provided with a first heat dissipation piece and a second heat dissipation piece on the side faces facing each other, and the first heat dissipation piece and the second heat dissipation piece are both arranged in the heat dissipation channel.
2. The head-mounted electronic device of claim 1, wherein the first heat sink and the second heat sink are each configured as an air-cooled heat sink.
3. The head mounted electronic device of claim 1, wherein a first layer of thermal adhesive is disposed between the first heat sink and the screen assembly, and a second layer of thermal adhesive is disposed between the second heat sink and the circuit assembly.
4. The head mounted electronic device of claim 1, wherein a heat shield is disposed within the heat dissipation channel to separate the heat dissipation channel into a first heat dissipation channel and a second heat dissipation channel, the first heat dissipation element being disposed within the first heat dissipation channel and the second heat dissipation element being disposed within the second heat dissipation channel.
5. The head-mounted electronic device of claim 1, wherein a side of the circuit assembly facing away from the screen assembly and the third heat sink.
6. The head mounted electronic device of claim 5, wherein the third heat sink is configured as a heat pipe or a metal plate that is attached to the circuit assembly and the housing, respectively.
7. The head mounted electronic device of claim 5, wherein a third layer of thermally conductive glue is disposed between the third heat sink and the circuit assembly.
8. The head-mounted electronic device of claim 5, wherein the circuit assembly has a first side on which a chip is disposed and a second side facing away from the first side, the first side facing the screen assembly, the chip being attached to the second heat sink, the second side being attached to the third heat sink; or (b)
The second side face is opposite to the screen assembly, the second side face is attached to the second heat dissipation piece, and the chip is attached to the third heat dissipation piece.
9. The head-mounted electronic device of claim 1, further comprising: the rigid frame, the second heat dissipation piece with circuit subassembly all with rigid frame fixed connection, the second heat dissipation piece with be provided with the fourth heat conduction glue film between the rigid frame, the rigid frame with be provided with the fifth heat conduction glue film between the circuit subassembly.
10. The head-mounted electronic device of claim 9, further comprising: a rigid frame, the second heat sink comprising: the heat dissipation fins are integrally fixed on the rigid frame, and a sixth heat conduction glue layer is arranged between the rigid frame and the circuit component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210614425.6A CN117202596A (en) | 2022-05-31 | 2022-05-31 | Head-mounted electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210614425.6A CN117202596A (en) | 2022-05-31 | 2022-05-31 | Head-mounted electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117202596A true CN117202596A (en) | 2023-12-08 |
Family
ID=88991200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210614425.6A Pending CN117202596A (en) | 2022-05-31 | 2022-05-31 | Head-mounted electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117202596A (en) |
-
2022
- 2022-05-31 CN CN202210614425.6A patent/CN117202596A/en active Pending
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