JP2002203425A - Discharge lamp lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently dissipate heat of electronic components which generate a large amount of heat with a small amount of resin material, and enhance manufacturing efficiency. SOLUTION: This discharge lamp lighting device is equipped with a printed board 1; a box-shaped shell 2 housing the printed board 1 so that a bottom surface 21 is faced to the lower surface of the printed board 1 in a separated state; and a plurality of electronic components 3 mounted on the lower surface of the printed board 1, for lighting a discharge lamp. A bridge member 4 is installed in the discharge lamp lighting device. The bridge member 4 consists of a pair of plate-shaped members 41 interposed between the lower surface of the printed board 1 and the bottom surface 21 of the shell 2, and constitutes a chamber for filling a resin material 5 together with the inner surface containing the lower surface of the printed board 1 and the bottom surface 21 of the shell 2, and the resin material 5 is filled in the chamber.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a printed circuit board,
A printed circuit board comprising: an outer housing for housing the printed circuit board such that the bottom face faces away from the one surface; anda plurality of electronic components mounted on the printed circuit board and constituting an electronic circuit for lighting the discharge lamp. The present invention relates to a discharge lamp lighting device in which a resin material is provided in a room constituted by one surface and an inner surface including a bottom surface of an outer shell.

[0002]

2. Description of the Related Art Conventionally, a plurality of electronic components mounted on a printed circuit board and constituting an electronic circuit for lighting a discharge lamp include electronic components that generate a large amount of heat. However, measures have been taken such as increasing the area of the printed circuit board to perform heat dissipation.

Japanese Patent Application Laid-Open No. 1-220889 discloses an electronic device in which a plurality of electronic components are mounted on a printed circuit board to form a required electronic circuit. Further, an electronic device in which a resin having a low thermal resistance for sealing an electronic component is applied is disclosed.

[0004]

However, in the electronic device described in the above publication, a resin having a low thermal resistance for sealing all electronic components is applied to both sides of the printed circuit board. The necessity of a resin material causes disadvantages, particularly in terms of cost, and also causes a problem that the resin is adhered to both surfaces and the production efficiency is reduced.

The present invention has been made in view of the above circumstances, and provides a discharge lamp lighting device capable of efficiently radiating electronic components having a large amount of heat with a small amount of resin material and improving the manufacturing efficiency. The purpose is to provide.

[0006]

According to a first aspect of the present invention, there is provided an outer casing for accommodating a printed circuit board and a printed circuit board such that a bottom surface of the printed circuit board faces away from the one surface. And a plurality of electronic components mounted on the printed circuit board and constituting an electronic circuit for lighting the discharge lamp, wherein a discharge lamp lighting device comprises: And a resin material is filled into one surface of the printed circuit board, an inner surface including the outer bottom surface, and a room formed by the bridge means.

According to a second aspect of the present invention, in the discharge lamp lighting device according to the first aspect, the bridge means has a contact area between one surface of the printed circuit board and the resin material, the bottom surface of the outer shell and the resin material. It is characterized in that it is formed in a shape that is larger than the contact area with the material.

According to a third aspect of the present invention, in the discharge lamp lighting device according to the first aspect, the bridge means is configured such that a contact area between one surface of the printed circuit board and the resin material is equal to the bottom surface of the outer shell. It is characterized in that it is formed in a shape that is smaller than the contact area with the material.

According to a fourth aspect of the present invention, in the discharge lamp lighting device according to the first aspect, the bridge means comprises at least two members having different heights.

According to a fifth aspect of the present invention, in the discharge lamp lighting device according to the first aspect, the bridge means gradually increases the indoor height between one surface of the printed circuit board and the bottom surface of the outer shell. It is characterized by being formed in a shape that changes to

According to a sixth aspect of the present invention, in the discharge lamp lighting device of the first aspect, the bridge means continuously adjusts a height of the room between one surface of the printed circuit board and the bottom surface of the outer shell. It is characterized by being formed in a shape that changes to

According to a seventh aspect of the present invention, in the discharge lamp lighting device according to the first aspect, the electronic component is mounted on one surface of the printed board, and the bridge means is provided on the one side of the printed board. It is characterized by being formed in a shape surrounding a specific electronic component mounted on the surface.

According to an eighth aspect of the present invention, in the discharge lamp lighting device according to any one of the first to seventh aspects, the resin material is urethane or silicon.

According to a ninth aspect of the present invention, there is provided a printed circuit board having a through-hole, an outer housing for housing the printed circuit board such that the bottom surface faces away from the one surface, and a package mounted on the printed circuit board. A discharge lamp lighting device comprising: a plurality of electronic components forming an electronic circuit for lighting an electric lamp; and a resin material filled in a room formed by an inner surface including one surface and an outer bottom surface of the printed circuit board. The electronic component is mounted near the through hole on the other surface of the printed circuit board, and the electronic component includes the resin material that has advanced to the other surface side of the printed circuit board from the through hole. It is characterized by being in contact.

According to a tenth aspect of the present invention, there is provided a printed circuit board, an outer housing for accommodating the printed circuit board such that the bottom surface faces away from the one surface, and a discharge lamp mounted on the printed circuit board for lighting a discharge lamp. A plurality of electronic components constituting an electronic circuit for, a discharge lamp lighting device in which a resin material is provided in a room formed by an inner surface including a bottom surface of one surface and an outer periphery of the printed circuit board, It is characterized by having a heat radiating means which is partially exposed to the outside of the outer shell in contact with the resin material.

[0016]

FIG. 1 is a sectional view of a discharge lamp lighting device according to a first embodiment of the present invention.
An embodiment will be described. However, FIG. 1B is a cross-sectional view taken along line AA ′ of FIG.

The discharge lamp lighting device shown in FIG. 1 has a rectangular printed circuit board 1 extending in one direction (in the left-right direction in the figure) and an inner bottom surface 21 which is separated from this one surface (the lower surface in the figure).
The printed board 1 is housed so that the opening faces each other, and an opening 22 set to a size corresponding to the shape of the printed board 1 is provided.
(Example of FIG. 1) which is mounted on the printed circuit board 1 and forms part or all of an electronic circuit for lighting a discharge lamp (not shown). (Only four are shown in the figure).

Here, in the first embodiment, a bridge member 4 as a resin material reducing means is interposed between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2, and the lower surface of the printed circuit board 1, An inner surface including the bottom surface 21 of the second member and a room formed by the bridge member 4 are filled with a heat-radiating resin material 5 made of urethane, silicon, or the like. In the example of FIG. 1, the bridge member 4 is
And a pair of members 41 formed in a plate shape having a height between the lower surface of the outer shell 2 and the bottom surface 21 of the outer shell 2 and having a length corresponding to the shorter inner dimension of the opening 22 of the outer shell 2. , The resin material 5 in the room sandwiched between the pair of members 41.
Is filled. Then, the electronic component 3 that generates a large amount of heat
Is mounted on the lower surface of the printed circuit board 1 located in the room filled with the resin material 5.

The procedure for assembling the discharge lamp lighting device having such a structure is as follows.
The resin material 5 is filled in the chamber of the outer shell 2 sandwiched between the members. Thereafter, the printed circuit board 1 on which the plurality of electronic components 3 are mounted is
The electronic component 3 generating a large amount of heat is stored in the outer shell 2 while being covered with the resin material 5. Thereby, the discharge lamp lighting device having the structure shown in FIG. 1 is obtained.

According to this discharge lamp lighting device, since the electronic component 3 that generates a large amount of heat is covered with the resin material 5, the heated electronic component 3 radiates heat through the resin material 5, and the temperature rise of the electronic component 3 is reduced. Therefore, the heat radiation of the electronic component 3 having a large amount of heat can be efficiently performed. Further, since the resin material 5 is filled only between the pair of members 41 of the bridge member 4 between the lower surface of the printed board 1 and the bottom surface 21 of the outer shell 2, the resin material is filled in a region including the entire bottom surface 21 of the outer shell 2. The amount of the resin material 5 can be reduced as compared with the case of filling. Further, since no resin material is applied to the other surface (upper surface) of the printed circuit board 1, manufacturing efficiency can be improved.

FIG. 2 is a sectional view of a discharge lamp lighting device according to a second embodiment of the present invention. The second embodiment will be described with reference to FIG. However, FIGS. 2B and 2C are cross-sectional views taken along line AA ′ and line BB ′ in FIG.

The discharge lamp lighting device shown in FIG. 2 has a printed circuit board 1, an outer shell 2, and a plurality (only eight are shown in the example of FIG. 2).
Electronic component 3 is provided in the same manner as the first embodiment, and a difference from the first embodiment is that a bridge member 4A interposed between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 is provided. And the bottom surface of the printed circuit board 1 and the bottom surface 2 of the outer shell 2
The resin material 5 is filled in the inner surface including the first member 1 and the chamber formed by the bridge member 4A.

Here, in the example of FIG. 2, the bridge member 4A
Is a tapered surface 411A that continuously changes the indoor height between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2.
Is formed in a pair of members 41A formed in a shape having the inside on the indoor side where the resin material 5 is filled. That is, the bridge member 4A is formed in a shape in which the contact area between the lower surface of the printed board 1 and the resin material 5 is larger than the contact area between the bottom surface 21 of the outer shell 2 and the resin material 5. Each member 41A is formed in such a shape that a portion contacting the lower surface of the substrate 1 is narrow and a portion contacting the bottom surface 21 of the outer shell 2 is wide. The electronic component 3 that generates a large amount of heat is mounted on the lower surface of the printed circuit board 1 located in a room filled with the resin material 5.

First, a procedure for assembling the discharge lamp lighting device having such a structure will be described.
The resin material 5 is filled into the chamber of the outer shell 2 sandwiched by 1A.
Thereafter, the printed circuit board 1 on which the plurality of electronic components 3 are mounted
Is housed in the outer shell 2 while the electronic component 3 generating a large amount of heat is covered with the resin material 5. Thereby, the discharge lamp lighting device having the structure shown in FIG. 2 is obtained.

According to this discharge lamp lighting device, the same effect as that of the first embodiment can be obtained, and the contact area between the lower surface of the printed circuit board 1 and the resin material 5 is smaller than the contact area between the bottom surface 21 of the outer shell 2 and the resin material 5. Since the bridge member 4A is formed in a shape larger than the contact area, more electronic components 3 can be covered with the resin material 5 and the amount of the resin material 5 used can be more suitably reduced. . In addition, when the amount of heat generated by the individual electronic components 3 is not so large, but there are many electronic components 3 that require heat radiation, a wide range of electronic components 3 are required.
Can be uniformly radiated to the outside of the shell 2 through a small amount of the resin material 5.

FIG. 3 is a sectional view of a discharge lamp lighting device according to a third embodiment of the present invention. The third embodiment will be described with reference to FIG. However, FIGS. 3B and 3C are cross-sectional views taken along line AA ′ and line BB ′ in FIG.

The discharge lamp lighting device shown in FIG. 3 has a printed circuit board 1, an outer shell 2, and a plurality (only two are shown in the example of FIG. 3).
Electronic component 3 is provided in the same manner as the first embodiment, and a difference from the first embodiment is that a bridge member 4B interposed between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 is provided. And the bottom surface of the printed circuit board 1 and the bottom surface 2 of the outer shell 2
The resin material 5 is filled in an inner surface including the first member 1 and a room formed by the bridge member 4B.

Here, in the example of FIG. 3, the bridge member 4B
Is a tapered surface 411B that continuously changes the height of the room between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2.
Is formed on the inside of the room filled with the resin material 5 by a pair of members 41B. That is, the bridge member 4B is formed in a shape in which the contact area between the lower surface of the printed circuit board 1 and the resin material 5 is smaller than the contact area between the bottom surface 21 of the outer shell 2 and the resin material 5. Each member 41B is formed in such a shape that a portion contacting the lower surface of the substrate 1 is wide and a portion contacting the bottom surface 21 of the outer shell 2 is narrow. The electronic component 3 that generates a large amount of heat is mounted on the lower surface of the printed circuit board 1 located in a room filled with the resin material 5.

The procedure for assembling the discharge lamp lighting device having such a structure is as follows.
The resin material 5 is filled in the chamber of the outer shell 2 sandwiched by 1B.
Thereafter, the printed circuit board 1 on which the plurality of electronic components 3 are mounted
Is housed in the outer shell 2 while the electronic component 3 generating a large amount of heat is covered with the resin material 5. Thereby, the discharge lamp lighting device having the structure shown in FIG. 3 is obtained.

According to this discharge lamp lighting device, the same effect as that of the first embodiment can be obtained, and the contact area between the lower surface of the printed circuit board 1 and the resin material 5 is smaller than the contact area between the bottom surface 21 of the outer shell 2 and the resin material 5. Since the bridge member 4B is formed in a shape smaller than the contact area, the contact area of the resin material 5 with the bottom surface 21 of the outer shell 2 can be increased, and
The amount of the resin material 5 used can be more suitably reduced. When the number of electronic components 3 generating a large amount of heat is small, the electronic components 3 can radiate heat to the outside of the outer casing 2 through the resin material 5 in a concentrated manner.

FIG. 4 is a sectional view of a discharge lamp lighting device according to a fourth embodiment of the present invention. The fourth embodiment will be described with reference to FIG.

The discharge lamp lighting device shown in FIG. 4 has a printed circuit board 1, an outer shell 2, and a plurality (only four are shown in the example of FIG. 4).
Electronic component 3 is provided in the same manner as the first embodiment, and a difference from the first embodiment is that a bridge member 4C interposed between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 is different from the first embodiment. And the bottom surface of the printed circuit board 1 and the bottom surface 2 of the outer shell 2
The resin material 5 is filled in the inner surface including the first member 1 and the room formed by the bridge member 4C.

Here, in the example of FIG. 4, the bridge member 4C
Are lower than the height between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 and have different heights.
C and 42C. The higher member 41C is the electronic component 3 (31) that generates less heat.
The lower member 42 </ b> C is provided between the electronic component 3 (33) and the bottom 21 of the outer shell 2, which generate a large amount of heat. It goes without saying that a structure in which the support member 6 and the locking portion 7 are further provided as shown in the example of FIG.

In the procedure for assembling the discharge lamp lighting device having such a structure, first, the resin material 5 is filled in the chamber of the outer shell 2 including the bridge member 4C. Thereafter, the printed circuit board 1 on which the plurality of electronic components 3 are mounted is placed on the resin material 5 in the outer shell 2 while the electronic components 3 are covered with the resin material 5.
Store on top. Thereby, the discharge lamp lighting device having the structure shown in FIG. 4 is obtained.

According to this discharge lamp lighting device, the same effect as in the first embodiment can be obtained, and the resin material 5 in an amount corresponding to the heat generation amount of the electronic component 3 is filled immediately below. More specifically, just below the electronic component 3 (33) that generates a large amount of heat, a larger amount of the resin material 5 is filled than immediately below the electronic component 3 (31) that generates a small amount of heat. Can be efficiently dissipated according to the calorific value. In other words, the electronic component 3 that generates a large amount of heat is radiated through a larger amount of the resin material 5. Further, since the filled resin material 5 is in contact with the inner surface of the outer shell 2, the heated electronic component 3 radiates heat to the outside of the outer shell 2 through the resin material 5. By filling the resin material 5 immediately below, the temperature of the filled resin material 5 is easily made uniform, and the heat radiation effect from the resin material 5 to the outer shell 2 is also increased.

In FIG. 4, bridge member 4C is
Although it is constituted by three members, it may be constituted by three or more members.

FIG. 5 is a sectional view of a discharge lamp lighting device according to a fifth embodiment of the present invention, and the fifth embodiment will be described with reference to FIG.

The discharge lamp lighting device shown in FIG. 5 has a printed circuit board 1, an outer shell 2, and a plurality (only five are shown in the example of FIG. 5).
Electronic component 3 is provided in the same manner as in the first embodiment, and a difference from the first embodiment is that a bridge member 4D interposed between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 is provided. And the bottom surface of the printed circuit board 1 and the bottom surface 2 of the outer shell 2
The resin material 5 is filled in an inner surface including the first member 1 and a room formed by the bridge member 4D.

Here, in the example of FIG. 5, the bridge member 4D
Is formed in a shape that is lower than the height between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 and that changes the height of the room therebetween stepwise. The electronic components 3 mounted on the lower surface of the printed circuit board 1 are classified into four types according to the amount of heat generation, and the electronic components 31, 32, 33, and 34 are arranged from right to left in ascending order of heat generation. Bridge member 4D
Is gradually decreasing from right to left.

In the procedure for assembling the discharge lamp lighting device having such a structure, first, the resin material 5 is charged into the chamber of the outer shell 2 including the bridge member 4D. Thereafter, the printed circuit board 1 on which the plurality of electronic components 3 are mounted is placed on the resin material 5 in the outer shell 2 while the electronic components 3 are covered with the resin material 5.
Store on top. Thereby, the discharge lamp lighting device having the structure shown in FIG. 5 is obtained.

According to this discharge lamp lighting device, the same effect as that of the first embodiment can be obtained, and the resin material 5 located below the printed circuit board 1 is stepped from right to left by the bridge member 4D. Since the layer immediately below the electronic component 3 that generates a large amount of heat is thicker, heat can be dissipated according to the amount of heat generated by the electronic component 3, so that efficient heat radiation can be achieved. At the same time, similarly to the fourth embodiment, the temperature of the filled resin material 5 is easily made uniform, and the heat radiation effect from the resin material 5 to the outer shell 2 is also increased.

FIG. 6 is a sectional view of a discharge lamp lighting device according to a sixth embodiment of the present invention. The sixth embodiment will be described with reference to FIG.

The discharge lamp lighting device shown in FIG. 6 has a printed circuit board 1, an outer shell 2, and a plurality (only three are shown in the example of FIG. 6).
Electronic component 3 is provided in the same manner as the first embodiment, and a difference from the first embodiment is that a bridge member 4E provided between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 is provided. And the bottom surface of the printed circuit board 1 and the bottom surface 2 of the outer shell 2
The resin material 5 is filled in an inner surface including the first member 1 and a room formed by the bridge member 4E.

Here, in the example of FIG. 6, the bridge member 4E
Is formed in a shape that is lower than the height between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 and continuously changes the height of the room therebetween. On the lower surface of the printed circuit board 1, electronic components 31, 33, and 34 are arranged from right to left in ascending order of heat generation, and the height of the bridge member 4E is continuously increased from right to left. It is lower.

In the procedure for assembling the discharge lamp lighting device having such a structure, first, the resin material 5 is filled in the chamber of the outer shell 2 including the bridge member 4E. Thereafter, the printed circuit board 1 on which the plurality of electronic components 3 are mounted is placed on the resin material 5 in the outer shell 2 while the electronic components 3 are covered with the resin material 5.
Store on top. Thereby, the discharge lamp lighting device having the structure shown in FIG. 6 is obtained.

According to this discharge lamp lighting device, the same effect as that of the first embodiment can be obtained, and the resin material 5 located below the printed circuit board 1 is continuously formed from the right to the left by the bridge member 4E. Since the layer immediately below the electronic component 3 that generates a large amount of heat is thicker, heat can be dissipated according to the amount of heat generated by the electronic component 3, so that efficient heat radiation can be achieved. At the same time, similarly to the fourth embodiment, the temperature of the filled resin material 5 is easily made uniform, and the heat radiation effect from the resin material 5 to the outer shell 2 is also increased.

FIG. 7 is a sectional view of a discharge lamp lighting device according to a seventh embodiment of the present invention, and the seventh embodiment will be described with reference to FIG. However, FIG. 7B is a cross-sectional view as viewed from the front-rear direction of FIG. 7A, and FIG. 7C is a cross-sectional view as viewed from line AA ′ of FIG.

The discharge lamp lighting device shown in FIG. 7 includes a printed circuit board 1, an outer shell 2, and electronic components 3 (only one is shown in the example of FIG. 7) in the same manner as in the first embodiment. First
As a difference from the embodiment, a bridge member 4F is provided between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2, and the lower surface of the printed circuit board 1, the inner surface including the bottom surface 21 of the outer shell 2, and the bridge The resin material 5 is filled in the room constituted by the member 4F.

Here, in the example of FIG. 7, the bridge member 4F
Are four members 41F, 41 formed in a plate shape having a height between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2.
F, 42F, 42F, and these members are
A cylindrical section having a rectangular cross section is formed, and surrounds the electronic component 3 mounted on the lower surface of the printed circuit board 1. The resin material 5 is filled in the cylindrical portion of the bridge member 4F.

As to the procedure for assembling the discharge lamp lighting device having such a structure, first, the resin material 5 is filled in the cylindrical portion of the bridge member 4F in the room of the outer shell 2. Thereafter, the printed circuit board 1 on which the plurality of electronic components 3 are mounted is housed in the outer shell 2 while covering the electronic components 3 generating a large amount of heat with the resin material 5. Thus, a discharge lamp lighting device having the structure shown in FIG. 7 is obtained.

According to this discharge lamp lighting device, the same effects as in the first embodiment can be obtained, and only the electronic component 3 having a large amount of heat can be radiated to the outside 2 through the resin material 5. It is possible to reliably dissipate the heat of the electronic component 3 and cool it down, and it is possible to suppress the required amount of the resin material 5. That is, when the heat value of a specific electronic component 3 is very large, the electronic component 3 can be appropriately radiated through a small amount of the resin material 5.

Although FIG. 7 shows a structure in which a specific electronic component 3 is covered with the resin material 5 in the bridge member 4F, a plurality of electronic components 3 are covered with the resin material 5 in the bridge member 4F. The structure may be used.

As described above, in the first to seventh embodiments, the shape or arrangement of the bridge member is determined in accordance with the electronic component 3 requiring heat radiation, so that the space between the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 is determined. Since the degree of heat dissipation of the resin material 5 can be varied depending on the electronic component 3 to be used, and the temperature of the resin material 5 can be made uniform, the resin material 5 Thus, effects such as efficient heat dissipation can be obtained. In addition, by limiting the range in which the resin material 5 is filled by the bridge member, the amount of the resin material 5 filled in the outer shell 2 can be reduced, so that the cost is reduced.

FIG. 8 is a sectional view of a discharge lamp lighting device according to an eighth embodiment of the present invention, FIG. 9 is an explanatory view of characteristics of the resin material shown in FIG. 8 depending on viscosity, and FIG. 10 is a discharge lamp lighting device of FIG. FIGS. 11 and 12 are explanatory views of a discharge lamp lighting device related to the discharge lamp lighting device of the eighth embodiment.
The eighth embodiment will be described with reference to these drawings.

First, a discharge lamp lighting device related to the discharge lamp lighting device of the eighth embodiment will be described with reference to FIGS.

The discharge lamp lighting device shown in FIG. 11 is mounted on both sides of the printed circuit board 1, the outer casing 2 for accommodating the printed circuit board 1, and the printed circuit board 1, and constitutes an electronic circuit for lighting the discharge lamp. A resin material 5 including a plurality of electronic components 3 and filled in an outer shell 2 on the lower surface side of the printed circuit board 1
have. According to this discharge lamp lighting device, the electronic component 3 (surface-mounted component 30) mounted on the lower surface (solder surface) of the printed circuit board 1 can radiate heat to the outside of the outer casing 2 through the resin material 5. However, in this structure, the above-mentioned heat radiation effect cannot be expected for each electronic component 3 mounted on the upper surface side of the printed circuit board 1. On the contrary, the temperature becomes higher than usual due to having the outer shell 2, and There is a risk of adversely affecting the life of the parts. In addition, through a hole in the printed board 1 or a gap between the printed board 1 and the outer shell 2,
The resin material may enter the upper surface side of the printed circuit board 1, and if a large amount of the resin material enters the printed circuit board 1, the resin material may enter the inside of the electronic component, and the original performance of the electronic component may be deteriorated.

The discharge lamp lighting device shown in FIG. 12 includes a printed circuit board 1, an outer shell 2, and a plurality of electronic components 3 in the same manner as the discharge lamp lighting device of FIG. The resin material 5 is filled in the inside and also in the outer shell 2 on the upper surface side of the printed circuit board 1. According to this discharge lamp lighting device, both the electronic component 3 (30) mounted on the lower surface of the printed board 1 and the electronic component 3 mounted on the upper surface of the printed board 1 radiate heat to the outside of the outer casing 2 through the resin material 5. In addition to the printed circuit board 1
The effect that the electronic component 3 mounted on the upper surface of the electronic component 3 is fixed by the resin material 5 is obtained. However, with this structure, the resin material may penetrate into the electronic components such as the external connection terminals and the variable resistor, and the original performance of the electronic components may be degraded. Since the resin material is filled up to this point, the amount of the resin material used increases.

Next, an eighth embodiment will be described. The discharge lamp lighting device shown in FIG. 8 includes a printed circuit board 1A having a plurality of through holes 11A and an outer casing 2 similar to that of the first embodiment.
And a plurality of electronic components 3 mounted on the printed circuit board 1A and constituting an electronic circuit for lighting the discharge lamp. The room includes an inner surface including the lower surface of the printed circuit board 1A and the bottom surface 21 of the outer shell 2. It has a filled resin material 5.

Here, in the example of FIG. 8, the printed circuit board 1A
A plurality of electronic components 3 are also mounted on the upper surface of the electronic component 3. Of these electronic components 3, the electronic component 3 located in the vicinity of the through hole 11A has a resin that has advanced from the through hole 11A to the upper surface side of the printed circuit board 1A. Material 5 is in contact. That is, the resin material 5 filled on the lower surface side of the printed board 1A is locally advanced to the upper surface side of the printed board 1A, and the resin material 5 is applied to a specific electronic component 3 of the plurality of electronic components 3 on the upper surface side.
Are brought into contact with each other to obtain the effects of heat radiation and fixing. The shape of the through hole 11A of the printed board 1A is
Any shape such as a circular shape, a slit shape, a triangular shape or a square shape may be used.
It is determined according to the shape and number of the electronic components 3 to be brought into contact with the resin material 5.

As to the procedure for assembling the discharge lamp lighting device having such a structure, first, as shown in FIG. 10A, a predetermined amount of the resin material 5 is piled up on the bottom surface 21 of the outer shell 2. Thereafter, as shown in FIG. 10B, the printed circuit board 1A on which the plurality of electronic components 3 are mounted on both sides is housed in the outer shell 2 while pressing the resin material 5 on the solder surface. At this time, in the example of FIG. 10, a pair of support members 6 for supporting the printed board 1A and a plurality of locking portions 7 for preventing the printed board 1A supported by the pair of support members 6 from coming off. Is formed on the inner side surface of the outer shell 2, so that the printed circuit board 1 </ b> A is stored and fixed in the outer shell 2. Further, since a plurality of through holes 11A are formed in the printed board 1A, the resin material 5 that cannot be accommodated on the lower surface side of the printed board 1A is removed from each through hole 11A through the printed board 1A.
And comes into contact with the electronic component 3 near the through hole 11A. As a result, a discharge lamp lighting device having the structure shown in FIG.

According to this discharge lamp lighting device, heat can be efficiently radiated to the electronic component 3 (30) mounted on the lower surface of the printed circuit board 1A, and the electronic component 3 generates a large amount of heat or is easily affected by temperature. Even if the component 3 is mounted on the upper surface of the printed board 1A, if the through hole 11A is formed in the printed board 1A near the electronic component 3, the electronic component 3
Since the resin material 5 which has advanced from the through hole 11A to the upper surface side of the printed board 1A comes into contact with the electronic component 3, the electronic component 3 can radiate heat to the outside of the outer casing 2 through the resin material 5 and thus is mounted on the upper surface of the printed board 1A. In addition, heat can be efficiently released from the electronic component 3 which generates a large amount of heat or is easily affected by temperature. Also, the amount of the resin material 5 used is limited to the printed circuit board 1A.
The amount of the resin material 5 used can be smaller than that of Japanese Unexamined Patent Publication No. 1-220889, since the amount of the resin material 5 can be slightly added to the amount corresponding to the room between the lower surface of the outer shell 2 and the bottom surface 21 of the outer shell 2.
In addition, since a step of applying the resin material 5 on the upper surface of the printed board 1A is not required, manufacturing efficiency can be improved.

Further, as can be seen from FIG. 9, the resin material 5 having a large viscosity (for example, having a viscosity of 100 Pa · s or more).
Is used, the characteristics of “the wall side is lower than the liquid level” and “the inside of the pipe is lower than the liquid level” can be obtained, so that the resin material 5 is provided inside the electronic component 3 (in FIG.
Can be prevented from entering. Then, in this case, if each through hole 11A is set to a size in which the resin material 5 can advance, the resin is formed on the upper surface side of the printed board through a hole in the printed board smaller than this or a gap between the printed board and the outer shell 2. The material 5 can be prevented from entering.

In the case where there is, for example, an electrolytic capacitor as the electronic component 3 which is easily affected by temperature among the plurality of electronic components 3 mounted on the upper surface of the printed circuit board 1A, FIG.
As shown in the example, use a horizontal electrolytic capacitor,
A slit-shaped through hole 1 having a length corresponding to, for example, the height of an electrolytic capacitor is formed in the printed circuit board 1A immediately below.
By piercing 1A, the resin material 5 which has advanced from the through hole 11A to the upper surface of the printed circuit board 1A comes into contact with the side surface of the electrolytic capacitor. Can be done Further, the unstable fixing of the horizontally placed electrolytic capacitor can be strengthened by the contact of the resin material 5.

In the case where, for example, a choke coil is used as the electronic component 3 generating a large amount of heat among the plurality of electronic components 3 mounted on the upper surface of the printed board 1A, as shown in the example of FIG. When a coil is used and a slit-shaped through hole 11A having a length corresponding to, for example, the width of the choke coil is formed in the printed board 1A immediately below the coil, the through hole 11A advances to the upper surface of the printed board 1A. Since the resin material 5 that has been brought into contact with the choke coil, heat can be efficiently radiated particularly from the choke coil whose temperature rises remarkably. Thereby, the influence of the heat radiation from the choke coil that generates heat of the electronic component 3 mounted on the upper surface side of the printed board 1A can be reduced.

FIG. 15 is a sectional view of a discharge lamp lighting device according to a ninth embodiment of the present invention, and FIGS. 16 and 17 are explanatory diagrams of a discharge lamp lighting device related to the discharge lamp lighting device of the ninth embodiment. The ninth embodiment will be described with reference to these drawings.

First, a discharge lamp lighting device related to the discharge lamp lighting device of the ninth embodiment will be described with reference to FIGS.

The discharge lamp lighting device shown in FIG. 16 is a printed circuit board 1, an outer casing 2 for accommodating the printed circuit board 1, and mounted on both sides of the printed circuit board 1 to constitute an electronic circuit for lighting the discharge lamp. A resin material 5 including a plurality of electronic components 3 and filled in an outer shell 2 on the lower surface side of the printed circuit board 1
have. According to this discharge lamp lighting device, the electronic component 3 (3) mounted on the lower surface (solder surface) of the printed circuit board 1
0) can radiate heat to the outside of the outer shell 2 through the resin material 5. However, in this structure, the electronic components 3 mounted on the lower surface side of the printed circuit board 1 are uniformly radiated, so that the heat radiation to the electronic components whose temperature is to be reduced cannot be efficiently performed. To obtain the effect, it is necessary to fill a larger amount of the resin material 5.

For this reason, in the discharge lamp lighting device shown in FIG. 17, a room formed by the inner surface including the lower surface of the printed circuit board 1 and the bottom surface 21 of the outer shell 2 is enlarged, and the room is filled with a large amount of the resin material 5. It has a structure. According to this discharge lamp lighting device, compared to the discharge lamp lighting device of FIG.
The heat radiation effect for the electronic component 3 mounted on the lower surface side of the printed board 1 can be enhanced. However, in this structure, the discharge lamp lighting device becomes large due to the large size of the room.

Next, a ninth embodiment will be described. The discharge lamp lighting device shown in FIG. 15 includes a printed circuit board 1 and a shell 2 similar to those of the first embodiment, and a plurality of electronic components 3 mounted on the printed circuit board 1 and constituting an electronic circuit for lighting the discharge lamp. , And has a resin material 5 in a room constituted by an inner surface including a lower surface of the printed circuit board 1 and a bottom surface 21 of the outer shell 2.

Here, in the example of FIG.
A plurality of electronic components 3 are also mounted on the upper surface of the printed circuit board 1, and a resin material 5 is provided around the electronic component 3 (30) to be radiated mounted on the lower surface of the printed circuit board 1. Further, there is further provided a heat dissipating member 8 made of aluminum whose part 81 is exposed to the outer side surface of the outer shell 2 in contact with the resin material 5. That is, the heat radiation member 8 having a heat radiation effect is brought into contact with the resin material 5 to obtain a greater heat radiation effect. The heat dissipating member
Not limited to aluminum, other metals, resins, heat pipes, or the like may be used.

In the procedure for assembling the discharge lamp lighting device having such a structure, first, a predetermined amount of the resin material 5 is put on the bottom surface 21 of the outer shell 2. Thereafter, the printed circuit board 1 on which the plurality of electronic components 3 are mounted on both sides is moved to the electronic components 3 (3
The resin material 5 is housed in the outer shell 2 while pressing the resin material 5 on the solder surface including the condition 0). Thus, a discharge lamp lighting device having a structure shown in FIG. 15 is obtained.

According to this discharge lamp lighting device, since the electronic component 3 (30) to be radiated can radiate heat to the outside of the outer casing 2 through the heat radiation member 8 through the resin material 5, the electronic component 3 (30) to be radiated
Can efficiently dissipate heat. In addition, the amount of the resin material 5 used can be reduced, and the resin material 5
This eliminates the need for a step of depositing, so that manufacturing efficiency can be improved.

When the resin material 5 is filled around the electronic component 3 such as an external connection terminal or a variable resistor, similarly to the eighth embodiment, the resin material 5 has a high viscosity (for example, 100 Pa · s).
If the resin material 5 having the above viscosity is used, it is possible to prevent the resin material 5 from entering the inside of the electronic component 3.

A structure in which a part of the heat radiating member exposed to the outside of the outer shell 2 is screwed to the lighting fixture may be used. FIG. 18 shows an example of this structure. In FIG. 18, the heat radiating member 8A is
A part 81A is exposed to the outside of the outer shell 2 in contact with the resin material 5, and is screwed to a part of the discharge lamp lighting fixture 10 by the screw 9. However, the opening of the outer shell 2A is closed, and a part 81A of the heat dissipation member 8A is exposed to the outside of the outer shell 2 through the gap 23. Since the heat dissipating member 8A and a part of the discharge lamp lighting device 10 function as a heat dissipating plate, heat in the outer shell 2 can be released to the outside, and a greater heat dissipating effect can be obtained.

In each of the above embodiments, the outer shell 2 may be made of resin or the like but may be made of metal. When the outer shell 2 is made of metal, the heat radiation effect can be enhanced.

In the first to seventh embodiments, the bridge member may be made of resin or the like but may be made of metal. When the bridge member is made of metal, the heat radiation effect can be enhanced. In this case, an insulating layer or an insulating sheet may be interposed between the lower surface of the printed circuit board and the printed circuit board. Further, when the outer shell and the bridge member are made of metal, the outer shell and the bridge member may be integrally formed.

[0077]

As is apparent from the above description, the invention according to claim 1 includes a printed circuit board, and an outer housing for accommodating the printed circuit board such that the bottom surface faces away from the one surface. A discharge lamp lighting device, comprising: a plurality of electronic components mounted on the printed circuit board and constituting an electronic circuit for lighting a discharge lamp, wherein a bridge is provided between one surface of the printed circuit board and a bottom surface of the outer shell. Means, and a resin material is filled in a room constituted by one surface of the printed circuit board, the inner surface including the outer bottom surface, and the bridge means, so that heat generated electronic components can be radiated through the resin material. The heat can be efficiently dissipated from the electronic components,
In addition, one surface of the printed circuit board, the inner surface including the outer bottom surface,
Since the resin material is filled in the room constituted by the bridge means and the bridge means, the amount of the resin material can be reduced as compared with the case where the region including the entire bottom surface of the outer shell is filled with the resin material. Further, since the resin material is not applied to the other surface of the printed circuit board, manufacturing efficiency can be improved. That is, it is possible to efficiently radiate an electronic component having a large amount of heat with a small amount of resin material, thereby improving the manufacturing efficiency.

According to a second aspect of the present invention, in the discharge lamp lighting device according to the first aspect, the bridge means is arranged such that a contact area between one surface of the printed circuit board and the resin material is equal to the bottom surface of the outer shell and the resin. Because it is formed in a shape that is larger than the contact area with the material, when multiple electronic components are mounted on one surface of the printed circuit board, more electronic components can be covered with the resin material, The amount of the resin material used can be more suitably reduced.

According to a third aspect of the present invention, in the discharge lamp lighting device according to the first aspect, the bridge means is arranged such that a contact area between one surface of the printed circuit board and the resin material is equal to that of the bottom surface of the outer shell. Since it is formed in a shape smaller than the contact area with the material, the contact area of the resin material with the bottom surface of the outer shell can be increased, and the amount of the resin material used can be more suitably reduced.

According to a fourth aspect of the present invention, in the discharge lamp lighting device according to the first aspect, since the bridge means is made of at least two members having different heights, the heat radiation of the electronic component is made in accordance with the amount of heat generated. It can be performed efficiently.

According to a fifth aspect of the present invention, in the discharge lamp lighting device according to the first aspect, the bridge means gradually increases the indoor height between one surface of the printed circuit board and the bottom surface of the outer shell. Since it is formed in a shape that allows the resin material to change in shape, it is possible to efficiently radiate heat and to make the temperature of the filled resin material uniform.

According to a sixth aspect of the present invention, in the discharge lamp lighting device of the first aspect, the bridge means continuously adjusts the height of the room between one surface of the printed circuit board and the bottom surface of the outer shell. Since it is formed in a shape that allows the resin material to change in shape, it is possible to efficiently radiate heat and to make the temperature of the filled resin material uniform.

According to a seventh aspect of the present invention, in the discharge lamp lighting device according to the first aspect, the electronic component is mounted on one surface of the printed board, and the bridge means is provided on the one side of the printed board. Since it is formed in a shape surrounding a specific electronic component mounted on the surface, it is possible to radiate the specific electronic component to the outside through the resin material, so that the specific electronic component can be reliably cooled and ,
The required amount of resin material can be reduced.

According to an eighth aspect of the present invention, in the discharge lamp lighting device according to any one of the first to seventh aspects, the resin material is urethane or silicon. The heat radiation of many electronic components can be efficiently performed, and the manufacturing efficiency can be improved.

According to a ninth aspect of the present invention, there is provided a printed circuit board having a through hole, an outer casing for housing the printed circuit board such that the bottom surface faces away from the one surface, and a printed circuit board mounted on the printed circuit board. A discharge lamp lighting device comprising: a plurality of electronic components forming an electronic circuit for lighting an electric lamp; and a resin material filled in a room formed by an inner surface including one surface and an outer bottom surface of the printed circuit board. The electronic component is mounted near the through hole on the other surface of the printed circuit board, and the electronic component includes the resin material that has advanced to the other surface side of the printed circuit board from the through hole. Since the electronic components are in contact with each other, when the electronic components are mounted on one surface of the printed circuit board, heat can be efficiently radiated to the electronic components. In addition, when an electronic component is mounted on the other surface of the printed circuit board, if a through hole is formed in the printed circuit board near the electronic component, the electronic component can be moved from the through hole to the other surface of the printed circuit board. Since the advanced resin material contacts, the electronic component can radiate heat to the outside through the resin material, and the heat of the electronic component mounted on the other surface of the printed circuit board can be efficiently radiated. Further, since the amount of the resin material used is only a small amount added to the amount corresponding to the room between the one surface of the printed circuit board and the bottom surface of the outer shell, the amount of the resin material used is small. Further, since the step of applying the resin material to the other surface of the printed circuit board is not required, the manufacturing efficiency can be improved. That is, it is possible to efficiently radiate an electronic component having a large amount of heat with a small amount of resin material, thereby improving the manufacturing efficiency.

According to a tenth aspect of the present invention, there is provided a printed circuit board, an outer housing for accommodating the printed circuit board such that the bottom surface faces away from the one surface, and a discharge lamp mounted on the printed circuit board for lighting the discharge lamp. A plurality of electronic components constituting an electronic circuit for, a discharge lamp lighting device in which a resin material is provided in a room formed by an inner surface including a bottom surface of one surface and an outer periphery of the printed circuit board, Since there is a heat dissipating unit that is partially exposed to the outside of the outer shell in contact with the resin material, when the electronic component to be dissipated is mounted on one surface of the printed circuit board, the electronic component to be dissipated passes through the resin material. Heat can be dissipated to the outside of the enclosure via the heat dissipating member, so the heat of the electronic components to be dissipated can be efficiently dissipated, and the amount of resin material used can be reduced. Since processes for becomes unnecessary, thereby improving the manufacturing efficiency. In other words, with a small amount of resin material, heat can be efficiently radiated from electronic components that generate a large amount of heat,
The manufacturing efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of a discharge lamp lighting device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a discharge lamp lighting device according to a second embodiment of the present invention.

FIG. 3 is a sectional view of a discharge lamp lighting device according to a third embodiment of the present invention.

FIG. 4 is a sectional view of a discharge lamp lighting device according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view of a discharge lamp lighting device according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view of a discharge lamp lighting device according to a sixth embodiment of the present invention.

FIG. 7 is a sectional view of a discharge lamp lighting device according to a seventh embodiment of the present invention.

FIG. 8 is a sectional view of a discharge lamp lighting device according to an eighth embodiment of the present invention.

9 is an explanatory diagram of characteristics due to the viscosity of the resin material shown in FIG.

FIG. 10 is a view showing a procedure for assembling the discharge lamp lighting device of FIG. 8;

FIG. 11 is an explanatory diagram of a discharge lamp lighting device related to a discharge lamp lighting device of an eighth embodiment.

FIG. 12 is an explanatory diagram of a discharge lamp lighting device related to the discharge lamp lighting device of the eighth embodiment.

FIG. 13 is a diagram showing a specific example and a specific mounting example of an electronic component to be radiated, which is mounted on the upper surface of a printed board in the eighth embodiment.

FIG. 14 is a diagram showing a specific example and a specific mounting example of an electronic component to be radiated mounted on the upper surface of a printed circuit board in the eighth embodiment.

FIG. 15 is a sectional view of a discharge lamp lighting device according to a ninth embodiment of the present invention.

FIG. 16 is an explanatory diagram of a discharge lamp lighting device related to the discharge lamp lighting device of the ninth embodiment.

FIG. 17 is an explanatory diagram of a discharge lamp lighting device related to the discharge lamp lighting device of the ninth embodiment.

FIG. 18 is a view showing a modification of the heat radiation member according to the ninth embodiment.

[Explanation of symbols]

1, 1A Printed circuit board 2 Outer shell 3 Electronic component 4, 4A, 4B, 4C, 4D, 4E, 4F Bridge member 5 Resin material 8, 8A Heat dissipation member

Continuing from the front page (72) Inventor Masayoshi Yasuda 404-1, Nishinobumatsu, Himeji-shi, Hyogo Ikeda Electric Co., Ltd. (72) Inventor Seiji Soga 1048, Ojimon, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd. (72) Invention Person Shunichi Hongo 404-1, Nishinobumatsu, Himeji-shi, Hyogo Ikeda Electric Co., Ltd. (72) Inventor Kazushige Ito 404-1, Nishinobumatsu, Himeji-shi, Hyogo Ikeda Electric Co., Ltd. (72) Kenji Matsuda Kadoma, Osaka 1048 Oaza Kadoma Matsushita Electric Works Co., Ltd. F-term (reference) 3K014 EA01 EA04

Claims (10)

[Claims] 1. A printed circuit board, an outer housing for accommodating the printed circuit board such that the bottom surface faces away from the one surface, and an electronic circuit mounted on the printed circuit board for lighting a discharge lamp. A discharge lamp lighting device comprising a plurality of electronic components, wherein a bridging means is interposed between one surface of the printed circuit board and a bottom surface of the outer shell, and one surface of the printed circuit board, a bottom surface of the outer shell A discharge lamp lighting device characterized by filling a resin material into an inner surface including the above and a room formed by the bridge means. 2. The method according to claim 1, wherein the bridge means is formed in a shape such that a contact area between one surface of the printed circuit board and the resin material is larger than a contact area between the bottom surface of the outer shell and the resin material. The discharge lamp lighting device according to claim 1, wherein 3. The method according to claim 1, wherein the bridge means is formed in a shape such that a contact area between one surface of the printed circuit board and the resin material is smaller than a contact area between the bottom surface of the outer shell and the resin material. The discharge lamp lighting device according to claim 1, wherein 4. The discharge lamp lighting device according to claim 1, wherein said bridge means comprises at least two members having different heights. 5. The device according to claim 1, wherein the bridge means is formed in a shape that changes the height of the room between one surface of the printed circuit board and the bottom surface of the outer shell in a stepwise manner. The discharge lamp lighting device as described in the above. 6. The device according to claim 1, wherein the bridge means is formed in a shape that continuously changes a height in a room between one surface of the printed circuit board and a bottom surface of the outer shell. The discharge lamp lighting device as described in the above. 7. The electronic component is mounted on one surface of the printed circuit board, and the bridge means is formed in a shape surrounding a specific electronic component mounted on one surface of the printed circuit board. The discharge lamp lighting device according to claim 1, wherein: 8. The discharge lamp lighting device according to claim 1, wherein said resin material is urethane or silicon. 9. A printed circuit board having a through hole, an outer casing for housing the printed circuit board such that the bottom surface faces away from the one surface, and a package mounted on the printed circuit board for lighting a discharge lamp. A discharge lamp lighting device, comprising: a plurality of electronic components forming an electronic circuit; and a resin material filled in a room formed by an inner surface including one surface and an outer bottom surface of the printed circuit board, wherein The electronic component is mounted near the through hole on the other surface of the substrate, and the electronic component is in contact with the resin material that has advanced from the through hole to the other surface side of the printed circuit board. Discharge lamp lighting device. 10. A printed circuit board, an outer housing for accommodating the printed circuit board such that the bottom surface faces away from the one surface, and an electronic circuit mounted on the printed circuit board for lighting a discharge lamp. And a plurality of electronic components to
A discharge lamp lighting device in which a resin material is provided in a room constituted by one surface of the printed circuit board and an inner surface including a bottom surface of an outer shell, wherein the discharge lamp lighting device is in contact with the resin material and partially exposed to the outside of the outer shell. A discharge lamp lighting device, comprising: