JP4133597B2 - Wiring block storage structure and wiring block storage method - Google Patents

Wiring block storage structure and wiring block storage method Download PDF

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JP4133597B2
JP4133597B2 JP2003157160A JP2003157160A JP4133597B2 JP 4133597 B2 JP4133597 B2 JP 4133597B2 JP 2003157160 A JP2003157160 A JP 2003157160A JP 2003157160 A JP2003157160 A JP 2003157160A JP 4133597 B2 JP4133597 B2 JP 4133597B2
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metal case
wiring block
bottom wall
insulating plate
wiring
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JP2004363192A (en
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浩一 池上
直樹 柳原
敏洋 新浜
浩之 中川
拓也 酒井
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池田電機株式会社
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Description

【０００１】
【発明の属する技術分野】
本発明は放電灯点灯装置等の電気機器において、各種電子部品を基板に配線した配線ブロックを金属ケース及び配線板内に収納保持するようにした配線ブロックの収納構造及び配線ブロックの収納方法に関する。
【０００２】
【従来の技術】
例えば電気機器である放電灯点灯装置では、従来より図３又は図４に示すように、金属ケース１の（底壁２）内面に添うように絶縁板３を設け、各種電子部品５をプリント基板６に配線して配線ブロック７を構成し、プリント基板６が金属ケース１の底壁２側から浮くように、配線ブロック７を金属ケース１内に収納保持したものがある。
この種の電気機器における従来の配線ブロックの収納構造には、図３に示すように、放熱用樹脂を注入する作業性を重視し、配線ブロック７のプリント基板６側と金属ケース１の底壁２側との間に、放熱用樹脂８を全体に亘って充填し、これにより発熱する電子部品５を放熱するようにしたものがある（例えば特許文献１の図５）。
【０００３】
また、図４に示すように、注入する放熱用樹脂８の樹脂量を減少させることを重視し、配線ブロック７のプリント基板６側と金属ケース１の底壁２側との間に、放熱に必要な部分のみに局所的に放熱用樹脂８を充填し、これにより発熱する電子部品５を放熱するようにしたものがある（例えば特許文献１の図１〜図３）。
【０００４】
【特許文献１】
特開２００１−１７７２７５号公報
【特許文献２】
特開２００１−３２６３０６号公報
【０００５】
【発明が解決しようとする課題】
しかしながら、前者では、放熱の必要が無い箇所にまで放熱用樹脂８の充填を行うため、使用する放熱用樹脂８の樹脂量が必要以上に多くなった。
また、後者では、部分的に放熱用樹脂８の充填を行うため、作業スピードの低下や管理面のむずかしさ等を伴っていた。
合わせて、放熱が必要な電子部品（発熱部品）５も放熱用樹脂８→絶縁板３→空気層（絶縁板と金属ケース間に構造上どうしても生じるわずかなスキマ）→金属ケース１（底壁２）へと放熱するため、金属ケース１と絶縁板３とのはまり具合で放熱効果にバラツキが生じる可能性が高かった。
【０００６】
また、面実装化に伴い入力歪改善回路や発振回路等の制御を行う制御回路又は制御ＩＣも電子部品として面実装されており、これらの制御回路又は制御ＩＣも樹脂充填されることにより、放熱用樹脂８の持つ浮遊容量で回路的に金属ケース１と接続されてしまう。ここで、金属ケース１に外部から何らかのノイズ等が印加した場合に、この浮遊容量を介してノイズ等が制御回路又は制御ＩＣへも伝わり、しいては制御回路又は制御ＩＣの誤動作につながる可能性も発生する。この場合のノイズの発生源は、安定器が点灯させている放電灯や他の電気製品からの漏れ電流成分や、それらの電源をオンオフさせたときに発生する電源チャタリング等である。
【０００７】
本発明は上記問題点に鑑み、放熱用樹脂が無駄にならないようにすると共に、放熱用樹脂を充填する際に放熱用樹脂の樹脂量を正確に管理する必要がなくて放熱用樹脂の充填作業を簡単になし得るようにし、また、放熱効果を向上させることができるようにしたものである。
【０００８】
【課題を解決するための手段】
この技術的課題を解決するための本発明の技術手段は、金属ケース１７の底壁１８内面に添うように絶縁板２５が設けられ、各種電子部品１２を基板１３に配線して配線ブロック１１が構成され、基板１３が金属ケース１７の底壁１８側から浮くように、配線ブロック１１が金属ケース１７内に収納保持され、配線ブロック１１の基板１３側と金属ケース１７の底壁１８側との間に、放熱用樹脂２９が充填された配線ブロックの収納構造において、
放熱を必要とする電子部品１２ａが基板１３の底壁１８側に配置され、この放熱を必要とする電子部品１２ａに対応して、絶縁板２５に切り抜き開口部３０が設けられ、放熱用樹脂２９が、金属ケース１７の底壁１８と放熱を必要とする電子部品１２ａとに切り抜き開口部３０を介して接触するように、底壁１８と放熱を必要とする電子部品１２ａとの間に充填されている点にある。
【０００９】
また、本発明の他の技術的手段は、金属ケース１７の底壁１８内面に添うように絶縁板２５が設けられ、各種電子部品１２を基板１３に配線して配線ブロック１１が構成され、基板１３が金属ケース１７の底壁１８側から浮くように、配線ブロック１１が金属ケース１７内に収納保持され、配線ブロック１１の基板１３側と金属ケース１７の底壁１８側との間に、放熱用樹脂２９が充填された配線ブロックの収納構造において、
配線ブロック１１の放熱の不要な部分に対応して、絶縁板２５に、金属ケース１７の底壁１８から浮き上がって絶縁板２５と基板１３との間を狭めて放熱用樹脂２９の充填量を減らすように、基板１３に向けて突出した凸部３１が設けられている点にある。
【００１０】
また、本発明の他の技術的手段は、金属ケース１７の底壁１８内面に添うように絶縁板２５が設けられ、各種電子部品１２を基板１３に配線して配線ブロック１１が構成され、基板１３が金属ケース１７の底壁１８側から浮くように、配線ブロック１１が金属ケース１７内に収納保持され、配線ブロック１１の基板１３側と金属ケース１７の底壁１８側との間に、放熱用樹脂２９が充填された配線ブロックの収納構造において、
制御ＩＣ又は制御回路用の電子部品１２ｃが基板１３の底壁１８側に配置され、制御ＩＣ又は制御回路の電子部品１２ｃに対応して、絶縁板２５に、金属ケース１７の底壁１８から浮き上がって金属ケース１７との間に空気層３３を形成するように、制御ＩＣ又は制御回路の電子部品１３ｃに向けて突出した凸部３１が設けられている点にある。
【００１１】
また、本発明の他の技術的手段は、底壁１８内面に添うように絶縁板３が設けられた金属ケース１７内に、各種電子部品１２を基板１３に配線して構成した配線ブロック１１を、基板１３が金属ケース１７の底壁１８側から浮くように、収納保持すると共に、配線ブロック１１の基板１３側と金属ケース１７の底壁１８側との間に、放熱用樹脂２９を充填した配線ブロックの収納方法において、
絶縁板２５に、配線ブロック１１の放熱が不要な箇所に向けて突出する凸部３１を設けておき、この絶縁板２５を金属ケース１７の底壁１８に添うように配置した後、金属ケース１７内の絶縁板２５上に放熱用樹脂２９を注入し、その後、配線ブロック１１を金属ケース１７内に挿入して、配線ブロック１１の基板１３を絶縁板２５の凸部３１上に載せるように配置した点にある。
【００１２】
【発明の実施の形態】
以下、本発明の一実施の形態を図面に基づいて説明する。
図１及び図２において、１１は放電灯点灯装置の配線ブロック（点灯装置本体）で、各種電子部品１２をプリント基板１３に配線して構成されている。プリント基板１３の表面（上面）及び裏面（下面）にはトランジスタ、抵抗、コンデンサ、トランス等の各種電子部品１２（１２ａ，１２ｂ，１２ｃ）が配置されている。プリント基板１３の裏面側の電子部品１２のうちの数点の電子部品は、放熱する必要のある電子部品（発熱の大きい面実装部品）１２ａであり、他の電子部品は、放熱する必要のない（発熱の小さい）電子部品１２ｂである。また、放熱する必要のない（発熱の小さい）電子部品１２ｂには、制御ＩＣ又は制御回路用の電子部品１２ｃが含まれている。即ち、制御ＩＣや制御回路用の電子部品１２ｃは、放熱を必要とする（発熱の大きい）電子部品１２ａではなく、放熱を必要としない（発熱の小さい）電子部品１２ｂである。
【００１３】
プリント基板１３の裏面（下面）には前記電子部品１２をプリント配線するための銅箔が多数配置され、前記各種電子部品１２のリード線がプリント基板１３の裏面側で半田により銅箔に接続されている。
１７は配線ブロック１１を収納保持する金属ケースで、上端が開口した長方形の箱形に形成され、底壁１８と一対の長側壁１９と一対の短側壁２０とを一体に備える。ケース１７の一対の長側壁１９に、内方に突出した台座２３が、間隔をおいて複数個（例えば２個）ずつ設けられている。
【００１４】
各台座２３は互いに同一の高さ位置にあって、配線ブロック１１のプリント基板１３の外周部を受けて、配線ブロック１１（プリント基板１３）をケース１７の底壁１８から浮かせかつプリント基板１３が底壁１８と平行になるように、配線ブロック１１をケース１７内で載置するようになっている。
金属ケース１７の内面に添うように絶縁板２５が設けられている。絶縁板２５は、金属ケース１７の底壁１８内面に添う底壁部２６と、一対の長側壁１９内面に添う一対の長側壁部２７と、一対の短側壁２０内面に添う一対の短側壁部２８とを有する。配線ブロック１１のプリント基板１３側と金属ケース１７の底壁１８側との間に、放熱用樹脂２９が充填されている。
【００１５】
プリント基板１３の底壁１８（裏面）側に配置された前記放熱を必要とする電子部品１２ａに対応して、絶縁板２５に切り抜き開口部３０が設けられている。切り抜き開口部３０は、絶縁板２５に、放熱を必要とする電子部品１２ａのパッケージと同サイズの切り抜き加工を施してして形成され、前記プリント基板１３側と底壁１８側との間に充填した放熱用樹脂２９が、金属ケース１７の底壁１８と放熱を必要とする電子部品１２ａとに切り抜き開口部３０を介して接触しており、この切り抜き開口部３０によって、放熱を必要とする電子部品１２ａの熱を放熱用樹脂２９から金属ケース１７へとスムーズに放熱するようになっている。
【００１６】
配線ブロック１１の放熱の不要な部分に対応して、即ち放熱する必要のない電子部品１２ｂ（制御ＩＣ又は制御回路用の電子部品１２ｃを含む）に対応して、絶縁板２５に、プリント基板１３に向けて突出した凸部３１が設けられ、凸部３１は、金属ケース１７の底壁１８から浮き上がって絶縁板２５とプリント基板１３との間の空間を狭めて、使用する放熱用樹脂２９の樹脂量（充填量）を減らすようになっている。また、制御ＩＣ又は制御回路用の電子部品１２ｃがプリント基板１３の底壁１８側に配置され、絶縁板２５の凸部３１は、制御ＩＣや制御回路用の電子部品１２ｃと金属ケース１７との間に、制御ＩＣ又は制御回路用の電子部品１２ｃに対応して、絶縁板２５に、金属ケース１７の底壁１８から浮き上がって金属ケース１７との間に空気層３３を形成するように、制御ＩＣ又は制御回路用の電子部品１２ｃに向けて突出しており、金属ケース１７の底壁１８と制御ＩＣ又は制御回路用の電子部品１２ｃとの間に、放熱用樹脂２９以外の空気層３３を持たせることによって、放熱用樹脂２９の持つ浮遊容量を介して外部からのノイズが制御ＩＣや制御回路用の電子部品１２ｃへ伝わることを阻止するようになっている。
【００１７】
なお、前記放電灯点灯装置等の配線ブロック１１において放熱を必要とする電子部品１２ａとしては、例えば電界効果トランジスタ、バイポーラトランジスタ、ダイオードブリッジ、サイリスタ等があり、また、放熱を必要としない電子部品１２ｂとしては、コンデンサ、小信号トランジスタ等がある。
上記実施の形態によれば、放電灯点灯装置を製造する場合、まず、絶縁板２５に、予め、放熱を必要とする電子部品１２ａに対応して、絶縁板２５に切り抜き開口部３０を設けると共に、配線ブロック１１の放熱の不要な部分、即ち放熱する必要のない電子部品１２ｂ（制御ＩＣ又は制御回路用の電子部品１２ｃを含む）に対応して、プリント基板１３に向けて突出した凸部３１を設けておき、この絶縁板２５を、金属ケース１７の内側に挿入し、絶縁板２５の底壁部２６を金属ケース１７の底壁１８内面に添わすと共に、絶縁板２５の一対の長側壁部２７を金属ケース１７の一対の長側壁１９の内面に添わし、絶縁板２５の一対の短側壁部２８を金属ケース１７の一対の短側壁２０の内面に添わしておく。
【００１８】
但し、放熱の必要が無くても、絶縁板２５の底壁部２６外周部の、側壁部２７，２８を直角に曲げ形成する付近は、絶縁板２５に強度を持たせるため凸部３１を加工しない。
その後、金属ケース１７内の絶縁板２５の底壁部２６上に液体状の放熱用樹脂２９を注入する。次に、各種電子部品１２をプリント基板１３に配線して構成した配線ブロック１１を、金属ケース１７内の絶縁板２５内に挿入して、配線ブロック１１のプリント基板１３を絶縁板２５の凸部３１上に載せるように配置し、金属ケース１７の底壁１８から浮かせ、かつプリント基板１３が底壁１８と平行になるように配置固定する。その後、液体状の放熱用樹脂２９を加熱等により固まらせる。
【００１９】
これにより、発熱の大きな電子部品１２ａだけを限定して、金属ケース１７と電子部品１２ａとの間に、絶縁板２５や、絶縁板２５と金属ケース１７との間に生じるわずかなスキマが介在されることがなくなり、直接放熱樹脂２９を介して放熱することが可能となって、放熱効果を向上させることができる。
また、放熱用樹脂２９を注入する際に、特に発熱部分に留意することなく注入しても放熱用樹脂２９は凸部３１（発熱しない箇所）には回り込まず、凹部（発熱する部品、箇所）のみに回り込むこととなる。
【００２０】
放熱用樹脂２９を注入する際には、発熱箇所を意識せずに注入しても、その後、プリント基板１３で上から押さえ付けることにより、放熱用樹脂８は凸部３１には回り込まず、その他の部分へのみ回り込むことになる。従って、放熱用樹脂２９は最低限必要な樹脂量のみで対応することが可能となり、使用する放熱用樹脂２９の量を大幅に低減することができる。
発熱部分に対応して絶縁板２５に切り抜き開口部３０を設けているので、これにより、放熱ルートが発熱する電子部品１２ａ→放熱用樹脂２９→金属ケース１７となり、放熱効果を大幅にアップさせることが可能となる。
【００２１】
また、絶縁板２５の制御ＩＣ又は制御回路用の電子部品１２ｃに対応する部分に凸部３１を設けているので、制御ＩＣ又は制御回路用の電子部品１２ｃと金属ケース１７の間に空気層３３を設けて、両者が浮遊容量で接続されることを阻止することができる。従って、外部から金属ケース１７へ印加されるノイズが制御ＩＣ又は制御回路の電子部品１２ｃへ伝わる可能性は極めて低くなる。
なお、前記実施の形態では、電気機器として放電灯点灯装置に本発明を適用実施し、配線ブロック１１により点灯装置本体を構成するものとしているが、本発明が適用実施される電気機器は放電灯点灯装置に限定されず、テープレコーダ、ラジオその他の電気機器であってもよい。
【００２２】
また、前記実施の形態では、各種電子部品１２を配線して配線ブロック１１を構成するための基板として、プリント基板１３を使用しているが、各種電子部品１２を配線するための基板は、プリント基板１３に限定されず、各種電子部品１２を配線できる基板であれば他の配線基板を用いてもよい。
また、前記実施の形態では、絶縁板２５は、金属ケース１７の底壁１８内面に添う底壁部２６と、一対の長側壁１９内面に添う一対の長側壁部２７と、一対の短側壁２０内面に添う一対の短側壁部２８とを有しているが、これに代え、絶縁部材２５は、金属ケース１７の底壁１８内面に添う底壁部２６のみで、一対の長側壁部２７と、一対の短側壁部２８とが省略されていてもよく、要するに、絶縁板２５は、少なくとも金属ケース１７の底壁１８内面に添うように構成されていればよい。
【００２３】
【発明の効果】
本発明によれば、放熱用樹脂が無駄にならないようにすると共に、放熱用樹脂を充填する際に放熱用樹脂の樹脂量を正確に管理する必要がなくて放熱用樹脂の充填作業を簡単になし得る。また、放熱効果を向上させることができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態を示す正面断面図である。
【図２】同絶縁板の平面図である。
【図３】従来例を示す正面断面図である。
【図４】他の従来例を示す正面断面図である。
【符号の説明】
１１ 配線ブロック
１２ 電子部品
１３ プリント基板
１７ 金属ケース
１８ 底壁
２５ 絶縁板
２９ 放熱用樹脂
３０ 切り抜き開口部
３１ 凸部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wiring block housing structure and a wiring block housing method in which a wiring block in which various electronic components are wired to a substrate is housed and held in a metal case and a wiring board in an electric device such as a discharge lamp lighting device.
[0002]
[Prior art]
For example, in a discharge lamp lighting device which is an electric device, as shown in FIG. 3 or FIG. 4, an insulating plate 3 is provided so as to follow the inner surface of the (bottom wall 2) of the metal case 1, and various electronic components 5 are printed boards. 6 is configured such that the wiring block 7 is configured, and the wiring block 7 is housed and held in the metal case 1 so that the printed circuit board 6 floats from the bottom wall 2 side of the metal case 1.
As shown in FIG. 3, the conventional wiring block housing structure in this type of electrical equipment places importance on the workability of injecting a heat-dissipating resin, and the printed circuit board 6 side of the wiring block 7 and the bottom wall of the metal case 1. Between the two sides, there is one in which the entire heat-dissipating resin 8 is filled so as to dissipate the heat generated electronic component 5 (for example, FIG. 5 of Patent Document 1).
[0003]
Also, as shown in FIG. 4, emphasis is placed on reducing the amount of the heat-dissipating resin 8 to be injected, and heat is dissipated between the printed circuit board 6 side of the wiring block 7 and the bottom wall 2 side of the metal case 1. There is one in which only a necessary portion is locally filled with a heat-dissipating resin 8 to radiate heat from the electronic component 5 that generates heat (for example, FIG. 1 to FIG. 3 of Patent Document 1).
[0004]
[Patent Document 1]
JP 2001-177275 A [Patent Document 2]
Japanese Patent Laid-Open No. 2001-326306
[Problems to be solved by the invention]
However, in the former, since the heat-dissipating resin 8 is filled up to a place where heat dissipation is not required, the amount of the heat-dissipating resin 8 used is more than necessary.
In the latter case, since the heat-dissipating resin 8 is partially filled, the operation speed is reduced and the management is difficult.
At the same time, the electronic component (heat generating component) 5 that needs to dissipate heat is also the resin 8 for heat dissipation → the insulating plate 3 → the air layer (slight gap caused by the structure between the insulating plate and the metal case) → the metal case 1 (the bottom wall 2) ), The metal case 1 and the insulating plate 3 are likely to vary in the heat dissipation effect due to the fit between the metal case 1 and the insulating plate 3.
[0006]
In addition, control circuits or control ICs that control input distortion improvement circuits, oscillation circuits, etc., are being surface-mounted as electronic components with surface mounting, and these control circuits or control ICs are also filled with resin, thereby dissipating heat. The stray capacitance of the resin 8 is connected to the metal case 1 in a circuit. Here, when some noise or the like is applied to the metal case 1 from the outside, the noise or the like may be transmitted to the control circuit or the control IC via the stray capacitance, which may lead to a malfunction of the control circuit or the control IC. Also occurs. Noise generation sources in this case are leakage current components from discharge lamps and other electrical products that are lit by the ballast, and power chattering that occurs when those power supplies are turned on and off.
[0007]
In view of the above problems, the present invention prevents the heat-dissipating resin from being wasted and does not require accurate control of the amount of the heat-dissipating resin when filling the heat-dissipating resin. Can be easily achieved, and the heat dissipation effect can be improved.
[0008]
[Means for Solving the Problems]
The technical means of the present invention for solving this technical problem is that an insulating plate 25 is provided so as to follow the inner surface of the bottom wall 18 of the metal case 17, and various electronic components 12 are wired to the substrate 13 so that the wiring block 11 is provided. The wiring block 11 is housed and held in the metal case 17 so that the substrate 13 floats from the bottom wall 18 side of the metal case 17, and the substrate 13 side of the wiring block 11 and the bottom wall 18 side of the metal case 17 are In the storage structure of the wiring block filled with the heat radiation resin 29 in between,
An electronic component 12a that requires heat dissipation is disposed on the bottom wall 18 side of the substrate 13, and a cutout opening 30 is provided in the insulating plate 25 corresponding to the electronic component 12a that requires heat dissipation. Is filled between the bottom wall 18 and the electronic component 12a requiring heat dissipation so as to contact the bottom wall 18 of the metal case 17 and the electronic component 12a requiring heat dissipation through the cutout opening 30. There is in point.
[0009]
Further, according to another technical means of the present invention, an insulating plate 25 is provided so as to follow the inner surface of the bottom wall 18 of the metal case 17, and the wiring block 11 is configured by wiring various electronic components 12 to the substrate 13. The wiring block 11 is housed and held in the metal case 17 so that 13 floats from the bottom wall 18 side of the metal case 17, and heat is dissipated between the substrate 13 side of the wiring block 11 and the bottom wall 18 side of the metal case 17. In the storage structure of the wiring block filled with the resin 29 for use,
Corresponding to the portion of the wiring block 11 that does not require heat dissipation, the insulating plate 25 is lifted from the bottom wall 18 of the metal case 17 and the space between the insulating plate 25 and the substrate 13 is narrowed to reduce the filling amount of the heat radiating resin 29. As described above, the protrusion 31 protruding toward the substrate 13 is provided.
[0010]
Further, according to another technical means of the present invention, an insulating plate 25 is provided so as to follow the inner surface of the bottom wall 18 of the metal case 17, and the wiring block 11 is configured by wiring various electronic components 12 to the substrate 13. The wiring block 11 is housed and held in the metal case 17 so that 13 floats from the bottom wall 18 side of the metal case 17, and heat is dissipated between the substrate 13 side of the wiring block 11 and the bottom wall 18 side of the metal case 17. In the storage structure of the wiring block filled with the resin 29 for use,
The control IC or control circuit electronic component 12c is disposed on the bottom wall 18 side of the substrate 13, and is lifted from the bottom wall 18 of the metal case 17 to the insulating plate 25 corresponding to the control IC or control circuit electronic component 12c. Thus, a convex portion 31 protruding toward the electronic component 13c of the control IC or control circuit is provided so as to form an air layer 33 between the metal case 17 and the metal case 17.
[0011]
Another technical means of the present invention is that a wiring block 11 constituted by wiring various electronic components 12 to a substrate 13 in a metal case 17 provided with an insulating plate 3 so as to follow the inner surface of the bottom wall 18 is provided. The substrate 13 is stored and held so that it floats from the bottom wall 18 side of the metal case 17, and a heat radiation resin 29 is filled between the substrate 13 side of the wiring block 11 and the bottom wall 18 side of the metal case 17. In the wiring block storage method,
The insulating plate 25 is provided with a convex portion 31 that protrudes toward a place where the heat radiation of the wiring block 11 is not necessary, and after the insulating plate 25 is disposed so as to follow the bottom wall 18 of the metal case 17, the metal case 17. The heat dissipation resin 29 is injected onto the inner insulating plate 25, and then the wiring block 11 is inserted into the metal case 17 so that the substrate 13 of the wiring block 11 is placed on the convex portion 31 of the insulating plate 25. It is in the point.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 and 2, reference numeral 11 denotes a wiring block (lighting device main body) of a discharge lamp lighting device, which is configured by wiring various electronic components 12 to a printed circuit board 13. Various electronic components 12 (12a, 12b, 12c) such as transistors, resistors, capacitors, and transformers are arranged on the front surface (upper surface) and the back surface (lower surface) of the printed circuit board 13. Some of the electronic components 12 on the back surface side of the printed circuit board 13 are electronic components that need to radiate heat (surface mounted components that generate a large amount of heat) 12a, and other electronic components do not need to radiate heat. This is the electronic component 12b (small heat generation). The electronic component 12b that does not need to dissipate heat (small heat generation) includes a control IC or electronic component 12c for a control circuit. That is, the electronic component 12c for the control IC and the control circuit is not the electronic component 12a that requires heat dissipation (large heat generation), but the electronic component 12b that does not require heat dissipation (small heat generation).
[0013]
A large number of copper foils for printed wiring of the electronic component 12 are arranged on the back surface (lower surface) of the printed circuit board 13, and the lead wires of the various electronic components 12 are connected to the copper foil by soldering on the back surface side of the printed circuit board 13. ing.
A metal case 17 for storing and holding the wiring block 11 is formed in a rectangular box shape having an open upper end, and integrally includes a bottom wall 18, a pair of long side walls 19, and a pair of short side walls 20. A plurality of (for example, two) pedestals 23 projecting inward are provided on the pair of long side walls 19 of the case 17 at intervals.
[0014]
The pedestals 23 are at the same height, receive the outer periphery of the printed board 13 of the wiring block 11, float the wiring block 11 (printed board 13) from the bottom wall 18 of the case 17, and the printed board 13 is The wiring block 11 is placed in the case 17 so as to be parallel to the bottom wall 18.
An insulating plate 25 is provided so as to follow the inner surface of the metal case 17. The insulating plate 25 includes a bottom wall portion 26 that follows the inner surface of the bottom wall 18 of the metal case 17, a pair of long side wall portions 27 that adhere to the inner surfaces of the pair of long side walls 19, and a pair of short side wall portions that conform to the inner surfaces of the pair of short side walls 20. 28. A heat radiation resin 29 is filled between the printed circuit board 13 side of the wiring block 11 and the bottom wall 18 side of the metal case 17.
[0015]
A cutout opening 30 is provided in the insulating plate 25 corresponding to the electronic component 12 a that is disposed on the bottom wall 18 (back surface) side of the printed circuit board 13 and requires heat dissipation. The cutout opening 30 is formed by cutting the insulating plate 25 to the same size as the package of the electronic component 12a requiring heat dissipation, and is filled between the printed board 13 side and the bottom wall 18 side. The heat-dissipating resin 29 is in contact with the bottom wall 18 of the metal case 17 and the electronic component 12a that requires heat dissipation through the cutout opening 30, and the cutout opening 30 allows the electrons that require heat dissipation. The heat of the component 12 a is smoothly radiated from the heat radiation resin 29 to the metal case 17.
[0016]
Corresponding to the part of the wiring block 11 that does not need to radiate heat, that is, corresponding to the electronic component 12b that does not need to radiate heat (including the electronic component 12c for the control IC or the control circuit), the insulating board 25 is connected to the printed circuit board 13. The protrusion 31 protrudes toward the surface of the metal case 17 and rises from the bottom wall 18 to narrow the space between the insulating plate 25 and the printed circuit board 13. The amount of resin (filling amount) is reduced. The control IC or control circuit electronic component 12 c is disposed on the bottom wall 18 side of the printed circuit board 13, and the convex portion 31 of the insulating plate 25 is formed between the control IC or control circuit electronic component 12 c and the metal case 17. In the meantime, in correspondence with the control IC or the electronic component 12c for the control circuit, control is performed so that an air layer 33 is formed on the insulating plate 25 from the bottom wall 18 of the metal case 17 and between the metal case 17 and the insulating plate 25. It protrudes toward the electronic component 12c for the IC or control circuit, and has an air layer 33 other than the heat dissipation resin 29 between the bottom wall 18 of the metal case 17 and the electronic component 12c for the control IC or control circuit. Thus, noise from the outside is prevented from being transmitted to the control IC and the electronic component 12c for the control circuit through the stray capacitance of the heat radiation resin 29.
[0017]
The electronic component 12a that requires heat dissipation in the wiring block 11 such as the discharge lamp lighting device includes, for example, a field effect transistor, a bipolar transistor, a diode bridge, a thyristor, and the like, and an electronic component 12b that does not require heat dissipation. These include capacitors and small signal transistors.
According to the above embodiment, when manufacturing a discharge lamp lighting device, first, the insulating plate 25 is provided with the cutout opening 30 in advance in the insulating plate 25 corresponding to the electronic component 12a that requires heat dissipation. The protrusion 31 that protrudes toward the printed circuit board 13 in correspondence with the portion of the wiring block 11 that does not need to radiate heat, that is, the electronic component 12b that does not need to radiate heat (including the electronic component 12c for the control IC or the control circuit). The insulating plate 25 is inserted inside the metal case 17, the bottom wall portion 26 of the insulating plate 25 is attached to the inner surface of the bottom wall 18 of the metal case 17, and a pair of long side walls of the insulating plate 25 are provided. The portion 27 is attached to the inner surfaces of the pair of long side walls 19 of the metal case 17, and the pair of short side wall portions 28 of the insulating plate 25 are attached to the inner surfaces of the pair of short side walls 20 of the metal case 17.
[0018]
However, even if there is no need for heat dissipation, the convex portion 31 is processed in the vicinity of the outer peripheral portion of the bottom wall portion 26 of the insulating plate 25 where the side wall portions 27 and 28 are bent at right angles so that the insulating plate 25 has strength. do not do.
Thereafter, a liquid heat radiation resin 29 is injected onto the bottom wall portion 26 of the insulating plate 25 in the metal case 17. Next, the wiring block 11 configured by wiring various electronic components 12 to the printed circuit board 13 is inserted into the insulating plate 25 in the metal case 17, and the printed circuit board 13 of the wiring block 11 is connected to the convex portion of the insulating plate 25. It is arranged so as to be placed on 31, floats from the bottom wall 18 of the metal case 17, and is arranged and fixed so that the printed circuit board 13 is parallel to the bottom wall 18. Thereafter, the liquid heat radiation resin 29 is hardened by heating or the like.
[0019]
As a result, only the electronic component 12a generating a large amount of heat is limited, and the slight gap generated between the insulating plate 25 and the insulating plate 25 and the metal case 17 is interposed between the metal case 17 and the electronic component 12a. Therefore, it is possible to radiate heat directly through the heat radiating resin 29, and the heat radiation effect can be improved.
Further, when injecting the heat-dissipating resin 29, the heat-dissipating resin 29 does not go around the convex portion 31 (the portion that does not generate heat) and does not wrap around the concave portion (the component that generates heat). It will only go around.
[0020]
Even when the heat radiating resin 29 is injected without being aware of the heat generation location, the heat radiating resin 8 does not wrap around the convex portion 31 by being pressed from above with the printed circuit board 13. It will only go to the part of. Therefore, the heat radiation resin 29 can be handled with only the minimum required resin amount, and the amount of the heat radiation resin 29 to be used can be greatly reduced.
Since the cutout opening 30 is provided in the insulating plate 25 corresponding to the heat generating part, the heat dissipation route becomes the electronic component 12a → the heat radiating resin 29 → the metal case 17, thereby greatly improving the heat dissipation effect. Is possible.
[0021]
Further, since the convex portion 31 is provided at a portion corresponding to the control IC or control circuit electronic component 12 c of the insulating plate 25, the air layer 33 is provided between the control IC or control circuit electronic component 12 c and the metal case 17. It is possible to prevent both from being connected by stray capacitance. Therefore, the possibility that noise applied to the metal case 17 from the outside is transmitted to the control IC or the electronic component 12c of the control circuit is extremely low.
In the above embodiment, the present invention is applied to a discharge lamp lighting device as an electric device, and the lighting device body is configured by the wiring block 11. However, the electric device to which the present invention is applied is a discharge lamp. The device is not limited to the lighting device, and may be a tape recorder, a radio, or other electrical equipment.
[0022]
Moreover, in the said embodiment, although the printed circuit board 13 is used as a board | substrate for wiring various electronic components 12 and comprising the wiring block 11, the board | substrate for wiring various electronic components 12 is printed. The wiring board is not limited to the board 13, and other wiring boards may be used as long as various electronic components 12 can be wired.
In the embodiment, the insulating plate 25 includes the bottom wall portion 26 that follows the inner surface of the bottom wall 18 of the metal case 17, the pair of long side wall portions 27 that follow the inner surfaces of the pair of long side walls 19, and the pair of short side walls 20. However, instead of this, the insulating member 25 is only the bottom wall portion 26 that follows the inner surface of the bottom wall 18 of the metal case 17, and the pair of long side wall portions 27. The pair of short side walls 28 may be omitted. In short, the insulating plate 25 only needs to be configured to follow at least the inner surface of the bottom wall 18 of the metal case 17.
[0023]
【The invention's effect】
According to the present invention, the heat-dissipating resin is not wasted, and it is not necessary to accurately control the amount of the heat-dissipating resin when filling the heat-dissipating resin, so that the heat-dissipating resin filling operation is simplified. You can get none. Moreover, the heat dissipation effect can be improved.
[Brief description of the drawings]
FIG. 1 is a front cross-sectional view showing an embodiment of the present invention.
FIG. 2 is a plan view of the insulating plate.
FIG. 3 is a front sectional view showing a conventional example.
FIG. 4 is a front sectional view showing another conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Wiring block 12 Electronic component 13 Printed circuit board 17 Metal case 18 Bottom wall 25 Insulation board 29 Heat radiation resin 30 Cutout opening part 31 Convex part

Claims (4)

金属ケース（１７）の底壁（１８）内面に添うように絶縁板（２５）が設けられ、各種電子部品（１２）を基板（１３）に配線して配線ブロック（１１）が構成され、基板（１３）が金属ケース（１７）の底壁（１８）側から浮くように、配線ブロック（１１）が金属ケース（１７）内に収納保持され、配線ブロック（１１）の基板（１３）側と金属ケース（１７）の底壁（１８）側との間に、放熱用樹脂（２９）が充填された配線ブロックの収納構造において、
放熱を必要とする電子部品（１２ａ）が基板（１３）の底壁（１８）側に配置され、この放熱を必要とする電子部品（１２ａ）に対応して、絶縁板（２５）に切り抜き開口部（３０）が設けられ、放熱用樹脂（２９）が、金属ケース（１７）の底壁（１８）と放熱を必要とする電子部品（１２ａ）とに切り抜き開口部（３０）を介して接触するように、底壁（１８）と放熱を必要とする電子部品（１２ａ）との間に充填されていることを特徴とする配線ブロックの収納構造。An insulating plate (25) is provided so as to follow the inner surface of the bottom wall (18) of the metal case (17), and a wiring block (11) is configured by wiring various electronic components (12) to the substrate (13). The wiring block (11) is housed and held in the metal case (17) so that (13) floats from the bottom wall (18) side of the metal case (17), and the board (13) side of the wiring block (11) and In the storage structure of the wiring block filled with the heat radiation resin (29) between the bottom wall (18) side of the metal case (17),
An electronic component (12a) that requires heat dissipation is disposed on the bottom wall (18) side of the substrate (13), and a cutout opening is formed in the insulating plate (25) corresponding to the electronic component (12a) that requires heat dissipation. Part (30) is provided, and the heat-dissipating resin (29) contacts the bottom wall (18) of the metal case (17) and the electronic component (12a) requiring heat dissipation via the cut-out opening (30). As described above, the wiring block storage structure is filled between the bottom wall (18) and the electronic component (12a) that requires heat dissipation. 金属ケース（１７）の底壁（１８）内面に添うように絶縁板（２５）が設けられ、各種電子部品（１２）を基板（１３）に配線して配線ブロック（１１）が構成され、基板（１３）が金属ケース（１７）の底壁（１８）側から浮くように、配線ブロック（１１）が金属ケース（１７）内に収納保持され、配線ブロック（１１）の基板（１３）側と金属ケース（１７）の底壁（１８）側との間に、放熱用樹脂（２９）が充填された配線ブロックの収納構造において、
配線ブロック（１１）の放熱の不要な部分に対応して、絶縁板（２５）に、金属ケース（１７）の底壁（１８）から浮き上がって絶縁板（２５）と基板（１３）との間を狭めて放熱用樹脂（２９）の充填量を減らすように、基板（１３）に向けて突出した凸部（３１）が設けられていることを特徴とする配線ブロックの収納構造。An insulating plate (25) is provided so as to follow the inner surface of the bottom wall (18) of the metal case (17), and a wiring block (11) is configured by wiring various electronic components (12) to the substrate (13). The wiring block (11) is housed and held in the metal case (17) so that (13) floats from the bottom wall (18) side of the metal case (17), and the board (13) side of the wiring block (11) and In the storage structure of the wiring block filled with the heat radiation resin (29) between the bottom wall (18) side of the metal case (17),
Corresponding to the portion of the wiring block (11) that does not need to dissipate heat, the insulating plate (25) is lifted from the bottom wall (18) of the metal case (17) and between the insulating plate (25) and the substrate (13). The wiring block housing structure is characterized in that a convex portion (31) protruding toward the substrate (13) is provided so as to reduce the filling amount of the heat-dissipating resin (29). 金属ケース（１７）の底壁（１８）内面に添うように絶縁板（２５）が設けられ、各種電子部品（１２）を基板（１３）に配線して配線ブロック（１１）が構成され、基板（１３）が金属ケース（１７）の底壁（１８）側から浮くように、配線ブロック（１１）が金属ケース（１７）内に収納保持され、配線ブロック（１１）の基板（１３）側と金属ケース（１７）の底壁（１８）側との間に、放熱用樹脂（２９）が充填された配線ブロックの収納構造において、
制御ＩＣ又は制御回路用の電子部品（１２ｃ）が基板（１３）の底壁（１８）側に配置され、制御ＩＣ又は制御回路の電子部品（１２ｃ）に対応して、絶縁板（２５）に、金属ケース（１７）の底壁（１８）から浮き上がって金属ケース（１７）との間に空気層（３３）を形成するように、制御ＩＣ又は制御回路の電子部品（１３ｃ）に向けて突出した凸部（３１）が設けられていることを特徴とする配線ブロックの収納構造。An insulating plate (25) is provided so as to follow the inner surface of the bottom wall (18) of the metal case (17), and a wiring block (11) is configured by wiring various electronic components (12) to the substrate (13). The wiring block (11) is housed and held in the metal case (17) so that (13) floats from the bottom wall (18) side of the metal case (17), and the board (13) side of the wiring block (11) and In the storage structure of the wiring block filled with the heat radiation resin (29) between the bottom wall (18) side of the metal case (17),
An electronic component (12c) for the control IC or control circuit is disposed on the bottom wall (18) side of the substrate (13), and corresponds to the electronic component (12c) of the control IC or control circuit on the insulating plate (25). And projecting toward the control IC or the electronic component (13c) of the control circuit so as to form an air layer (33) between the metal case (17) and the metal case (17). The wiring block storage structure is provided with a convex portion (31). 底壁（１８）内面に添うように絶縁板（３）が設けられた金属ケース（１７）内に、各種電子部品（１２）を基板（１３）に配線して構成した配線ブロック（１１）を、基板（１３）が金属ケース（１７）の底壁（１８）側から浮くように、収納保持すると共に、配線ブロック（１１）の基板（１３）側と金属ケース（１７）の底壁（１８）側との間に、放熱用樹脂（２９）を充填した配線ブロックの収納方法において、
絶縁板（２５）に、配線ブロック（１１）の放熱が不要な箇所に向けて突出する凸部（３１）を設けておき、この絶縁板（２５）を金属ケース（１７）の底壁（１８）に添うように配置した後、金属ケース（１７）内の絶縁板（２５）上に放熱用樹脂（２９）を注入し、その後、配線ブロック（１１）を金属ケース（１７）内に挿入して、配線ブロック（１１）の基板（１３）を絶縁板（２５）の凸部（３１）上に載せるように配置したことを特徴とする配線ブロックの収納方法。A wiring block (11) configured by wiring various electronic components (12) to a substrate (13) in a metal case (17) provided with an insulating plate (3) so as to follow the inner surface of the bottom wall (18). The substrate (13) is stored and held so as to float from the bottom wall (18) side of the metal case (17), and the substrate (13) side of the wiring block (11) and the bottom wall (18) of the metal case (17). In the storage method of the wiring block filled with the heat radiation resin (29) between the
The insulating plate (25) is provided with a convex portion (31) projecting toward a place where the heat radiation of the wiring block (11) is not required, and this insulating plate (25) is connected to the bottom wall (18 of the metal case (17). ), The resin (29) for heat dissipation is injected onto the insulating plate (25) in the metal case (17), and then the wiring block (11) is inserted into the metal case (17). The wiring block is stored in such a manner that the substrate (13) of the wiring block (11) is placed on the convex portion (31) of the insulating plate (25).
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