JP6365974B2 - Power supply device, light source unit, and lighting apparatus using the same - Google Patents

Description

  The present invention relates to a power supply device, a light source unit capable of emitting light by power supply from the power supply device, and a lighting fixture using the light source unit.

  Conventionally, electronic devices such as a power supply device and a lighting device in which a circuit board on which an electrical component is mounted is housed in a metal case, and a lighting fixture including the electronic device as a lighting device have been proposed (for example, Patent Documents). 1).

  The lighting fixture of Patent Document 1 includes a base made of a metal case, a translucent insulating sheet covering the base, a circuit board on which a plurality of electrical components for lighting a fluorescent lamp are mounted, and a circuit board to the base. An electronic device having a potting resin for heat dissipation is included.

  The potting resin is provided over the insulating sheet and the component mounting region of the circuit board on which the electrical component generating a large amount of heat is mounted. The electronic device discharges the heat of the electrical component that generates a large amount of heat through a potting resin that is electrically insulating and has good thermal conductivity to the base. The base is provided with an inspection hole for making the inside visible. The inspection hole is opened corresponding to the component mounting area of the circuit board on which an electrical component generating a large amount of heat is mounted.

  The lighting fixture of Patent Document 1 is capable of inspecting the presence or absence of potting resin in the case from the outside of the case through the inspection hole without disassembling the electronic device after the assembly is completed.

JP 2011-159546 A

  By the way, the power supply device is required to have a relatively simple structure and a more reliable structure, and the structure of the electronic device described above is not sufficient, and further improvement is required.

  The present invention has been made in view of the above-described reasons, and an object thereof is to provide a power supply device, a light source unit, and a lighting fixture using the power supply device, which can be made more reliable with a relatively simple structure. There is to do.

  The power supply device of the present invention includes a mounting board, a metal case that accommodates the mounting board, a translucent sheet material disposed between the mounting board and the case, the mounting board, and the sheet. And a filling resin filled between the two. The mounting board constitutes a power conversion circuit that converts input power into predetermined output power. The sheet material has electrical insulation. The filling resin is configured so that heat from the power conversion circuit can be conducted to the case. The power conversion circuit includes a first electronic component covered with the filling resin and a second electronic component not covered with the filling resin. The mounting substrate has a first region where the first electronic component is mounted and a second region where the second electronic component is mounted on a surface facing the case. The case has a first through hole facing the first region and a second through hole facing the second region through the sheet material.

  The light source unit of the present invention includes the power supply device described above, a light source, a support member that supports the light source and the power supply device, and a translucent cover that is attached to the support member so as to cover the light source. Yes. The light source is configured to emit light by feeding from the power supply device.

  The lighting fixture of the present invention includes the above-described light source unit and a fixture main body to which the light source unit is attached.

  The power supply device of the present invention can be made more reliable with a relatively simple structure.

  The light source unit of the present invention can be made more reliable with a relatively simple structure.

  The lighting fixture of the present invention can be made more reliable with a relatively simple structure.

1 is an exploded perspective view showing a power supply device according to a first embodiment. FIG. 3 is a front perspective view showing the power supply device according to the first embodiment. FIG. 3 is a partial cross-sectional view on the back side for explaining a main part of the power supply device according to Embodiment 1. FIG. 5 is a perspective view showing another power supply device according to the first embodiment. FIG. 5 is a perspective view showing another power supply device according to the first embodiment. FIG. 5 is a perspective view showing still another power supply device according to the first embodiment. FIG. 3 is an explanatory diagram illustrating an assembly process of the power supply device according to the first embodiment. It is a perspective view explaining the light source unit of Embodiment 2. FIG. It is a rear view which shows the light source unit of Embodiment 2. It is a disassembled perspective view which shows the lighting fixture using the light source unit of Embodiment 2. FIG. It is a perspective view which shows the lighting fixture using the light source unit of Embodiment 2. FIG.

(Embodiment 1)
Below, the power supply device 10 of this embodiment is demonstrated, referring FIG. 1 thru | or FIG. In the figure, the same members are denoted by the same reference numerals and redundant description is omitted. The size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. In the following description, each element constituting the present embodiment may be configured such that a plurality of elements are configured by one member and the plurality of elements are shared by one member. You may implement | achieve by sharing with several members.

  As shown in FIGS. 1 to 3, the power supply device 10 according to the present embodiment is disposed between the mounting substrate 2, the metal case 3 that accommodates the mounting substrate 2, and the mounting substrate 2 and the case 3. A translucent sheet material 4 and a filling resin 5 filled between the mounting substrate 2 and the sheet material 4 are provided. The mounting board 2 constitutes a power conversion circuit that converts input power into predetermined output power. The sheet material 4 has electrical insulation. The filling resin 5 is configured so that heat from the power conversion circuit can be conducted to the case 3. The power conversion circuit includes a first electronic component 1 a covered with the filling resin 5 and a second electronic component 1 b not covered with the filling resin 5. The mounting substrate 2 has a first region 2a1 where the first electronic component 1a is mounted and a second region 2a2 where the second electronic component 1b is mounted on the surface 2aa facing the case 3. Hereinafter, the surface 2aa of the mounting substrate 2 facing the case 3 is also referred to as a first surface 2aa. The case 3 has a first through hole 3ba facing the first region 2a1 and a second through hole 3bb facing the second region 2a2 with the sheet material 4 interposed therebetween.

  The power supply device 10 includes a first through hole 3ba that can confirm the filling state of the filling resin 5 in the first region 2a1, and a second through hole 3bb that can confirm that the filling resin 5 has not reached the second region 2a2. With the relatively simple configuration provided with the case 3, the reliability can be further increased.

  Below, the specific structure of the power supply device 10 of this embodiment is demonstrated in detail.

  The power supply device 10 can be configured to include, for example, a power conversion circuit that converts an AC input current from an external commercial AC power source into a predetermined DC output current. Although not shown, the power conversion circuit can be configured by a switching power supply having a rectifying / smoothing unit and a constant current power supply unit. The rectifying / smoothing unit rectifies the AC input current supplied from the terminal block, and then outputs a smoothed DC current. The constant current power supply unit outputs the direct current output from the rectifying and smoothing unit while maintaining a predetermined constant current value. The power conversion circuit is configured to output a direct current having a predetermined constant current value using a feedback circuit. The rectifying / smoothing unit can be configured using, for example, a diode or a capacitor. The constant current power supply unit can be configured using, for example, a switching element such as an FET (Field Effect Transistor), a control element such as a transformer, a choke coil, a capacitor, and a microcomputer. The feedback circuit is configured to be able to maintain a predetermined constant current value, for example, by controlling the duty ratio of the switching element according to a command from the control element. The power supply device 10 constitutes the power conversion circuit using a plurality of electronic components 1. In the power supply device 10 of the present embodiment, among the plurality of electronic components 1, the electronic component 1 covered with the filling resin 5 is referred to as a first electronic component 1a, and the electronic component 1 not covered with the filling resin 5 is the second electronic component. It is also referred to as a component 1b. In the power supply device 10 of the present embodiment, the electronic component 1 is a component that can be interpreted in a broad sense and can be electrically used in the configuration of the power conversion circuit. Examples of the electronic component 1 include a capacitor, a diode, a resistor, a transistor, a switching element, and a control element. Examples of the electronic component 1 include a current fuse, a transformer, a choke coil, and a terminal block.

  The electronic component 1 is mounted on the mounting substrate 2 by through-hole mounting in which leads (not shown) of the electronic component 1 are inserted into through holes provided in the mounting substrate 2 and fixed to the conductors of the mounting substrate 2 by soldering. be able to. The electronic component 1 can be through-hole mounted on the mounting board 2 by a flow method in which the mounting board 2 is dipped in a soldering iron in which solder is melted. Further, the electronic component 1 is applied to the mounting substrate 2 by a reflow method in which a solder paste is printed on the mounting surface of the electronic component 1 on the mounting substrate 2 and then the electronic component 1 is placed on the solder paste and then soldered by applying heat. Can be surface mounted.

  As shown in FIGS. 1 and 3, the electronic component 1 includes a relatively small electronic component 1 that can be disposed between the mounting substrate 2 and the case 3 among the plurality of electronic components 1 according to the function thereof. Compared with the comparatively small electronic component 1, the comparatively large electronic component 1 is provided. Hereinafter, the relatively small electronic component 1 is referred to as a small electronic component 1c, and the relatively large electronic component 1 is also referred to as a large electronic component 1d. Examples of the small electronic component 1c include a diode, a resistor, a switching element, and a control element. Examples of the large electronic component 1d include a capacitor, a transformer, a choke coil, and a terminal block. The large electronic component 1d is mounted on the second surface 2ab opposite to the first surface 2aa of the mounting substrate 2. The small electronic component 1c can be mounted not only on the first surface 2aa of the mounting substrate 2 but also on the second surface 2ab. The electronic component 1 is a plurality of small electronic components 1c mounted on the first surface 2aa of the mounting substrate 2 as compared with the electronic component 1 having a relatively large calorific value and the electronic component 1 having a relatively large calorific value. The electronic component 1 with a small calorific value is provided. Hereinafter, the electronic component 1 having a relatively large heat generation amount is referred to as a high heat generation electronic component 1e, and the electronic component 1 having a relatively low heat generation is also referred to as a low heat generation electronic component 1f. Examples of the high heat generation electronic component 1e include a switching element, and examples of the low heat generation electronic component 1f include a resistance and a control element.

  The mounting board 2 can mount a plurality of electronic components 1 constituting the power conversion circuit. The mounting substrate 2 can be, for example, an outer shape of a long rectangular flat plate. Although not shown, the mounting substrate 2 includes an insulating base and a conductor having a predetermined shape formed on the insulating base. The mounting substrate 2 has a plurality of electronic components 1 mounted on each of the first surface 2aa and the second surface 2ab. The mounting substrate 2 includes a conductor having a predetermined shape on the first surface 2aa. In addition, the mounting substrate 2 includes a conductor having a predetermined shape on the second surface 2ab. The mounting substrate 2 includes a through wiring (not shown) that penetrates in the thickness direction of the insulating substrate. The through wiring electrically connects a conductor having a predetermined shape provided on the first surface 2aa and a conductor having a predetermined shape provided on the second surface 2ab. On the first surface 2aa and the second surface 2ab of the mounting substrate 2, a protective film made of a synthetic resin or the like is preferably formed as appropriate in order to protect the conductor electrically and mechanically. The mounting substrate 2 can join the conductor provided on the first surface 2aa and the second surface 2ab and the electronic component 1 using a bonding material such as solder, AuSn, or silver paste. The mounting substrate 2 constitutes the power conversion circuit by electrically connecting a plurality of electronic components 1 through a conductor having a predetermined shape and through wiring. As a material for the insulating substrate, for example, a glass epoxy resin can be used. As the conductor material, a metal material such as a laminated film of Cu and Ag can be used. The mounting substrate 2 is not limited to a glass epoxy resin substrate using a glass epoxy resin as an insulating substrate, and may be a paper phenol substrate, a metal base substrate, a ceramic substrate, or the like. As the ceramic substrate, an alumina ceramic substrate, an aluminum nitride substrate, or the like can be used.

  The mounting substrate 2 has a large electronic component 1d mounted on the second surface 2ab by through-hole mounting. The mounting board 2 preferably has the small electronic component 1c mounted on the first surface 2aa by surface mounting. On the first surface 2aa, the mounting substrate 2 has a high heat generation electronic component 1e such as a switching element having a relatively large heat generation amount and a low heat generation electronic device such as a control element having a relatively small heat generation amount compared to the high heat generation electronic component 1e. The component 1f is spaced apart.

  The mounting substrate 2 has a first region 2a1 for mounting the first electronic component 1a on the first surface 2aa so that the heat from the power conversion circuit can be efficiently radiated to the outside of the case 3 through the filling resin 5. Is stipulated. In the power supply device 10, the high heat generation electronic component 1 e is selected as the first electronic component 1 a covered with the filling resin 5. The mounting substrate 2 defines a second region 2a2 for mounting the second electronic component 1b on the first surface 2aa. In the power supply device 10, the low heat generation electronic component 1 f is selected as the second electronic component 1 b not covered with the filling resin 5. In the mounting substrate 2, the first region 2a1 and the second region 2a2 may be appropriately set in advance on the first surface 2aa. The mounting substrate 2 can set a plurality of first regions 2a1 on the first surface 2aa. The mounting substrate 2 may set a plurality of second regions 2a2 on the first surface 2aa. The power supply device 10 may be configured to adhere to the sheet material 4 with the filling resin 5 covering the first electronic component 1a. The mounting substrate 2 is preferably provided with first regions 2a1 at both ends in the longitudinal direction on the first surface 2aa in order to stabilize the adhesion of the filling resin 5 to the sheet material 4. The mounting substrate 2 is preferably provided with a second region 2a2 between the pair of first regions 2a1 on the first surface 2aa. The first region 2a1 can be set to a rectangular shape, for example, but is not limited to a rectangular shape, and may have an appropriate shape such as an ellipse depending on the viscosity of the resin material of the filling resin 5, the arrangement of the electronic component 1, and the like. It can be. Similarly, the second region 2a2 can be set to a rectangular shape, for example. However, the second region 2a2 is not limited to a rectangular shape, and may have an appropriate shape such as an ellipse depending on the shape of the mounting substrate 2 and the arrangement of the electronic components 1. be able to.

  The case 3 can accommodate the mounting substrate 2 on which the power conversion circuit is formed. The case 3 can be formed, for example, in a bottomed rectangular tube-like outer shape. The case 3 is formed in a long shape so that the long mounting substrate 2 can be accommodated. The case 3 has a bottom 3c that faces the first surface 2aa of the mounting substrate 2. The case 3 includes a first side wall 3e and a second side wall 3d so as to surround the bottom 3c. The first side wall portion 3 e is provided along the longitudinal direction of the mounting substrate 2. The second side wall portion 3 d is provided along the short direction of the mounting substrate 2. The case 3 includes a bottom 3c, a pair of opposing first side wall portions 3e, and a pair of opposing second side wall portions 3d to form a recess 3a. The case 3 is integrally formed with a bottom 3c, a first side wall 3e, and a second side wall 3d. The case 3 includes a notch 3da on one of the pair of second side wall portions 3d so that the terminal block that is the electronic component 1 can be exposed to the outside. Although not shown, the case 3 can be configured such that the first side wall portion 3e includes a protrusion protruding into the recess 3a and a claw. The case 3 can have the mounting substrate 2 fixed at a predetermined position of the concave portion 3a through the sheet material 4 and the filling resin 5 by appropriately including protrusions and claws. The case 3 is preferably made of a metal material that is more excellent in thermal conductivity than a resin material so that heat generated in the power conversion circuit of the mounting substrate 2 can be efficiently radiated to the outside.

  Generally, in the power supply device 10, when heat from a highly heat-generating electronic component 1 e such as a switching element in a switching power supply is directly conducted to another electronic component 1 such as a capacitor, the lifetime of the other electronic component 1 is shortened. There is a case. Further, the power supply device 10 may be unstable in the operation of the other electronic components 1 due to the heat from the highly heat-generating electronic component 1e. Therefore, in the power supply device 10, heat from the highly heat-generating electronic component 1 e constituting the power conversion circuit is conducted to the case 3 through the sheet material 4 by the filling resin 5 to improve heat dissipation. As a material of the case 3, for example, a metal material such as stainless steel, iron alloy, or copper alloy can be used. The case 3 can be formed by punching or bending a flat metal plate.

  The case 3 is provided with a first through-hole 3ba in the bottom 3c where the filling state of the filling resin 5 in the first region 2a1 can be confirmed. The first through hole 3ba penetrates in the thickness direction of the bottom 3c. The case 3 is provided with a second through-hole 3bb on the bottom 3c where it can be confirmed that the filling resin 5 has not reached the second region 2a2. The second through-hole 3bb penetrates in the thickness direction of the bottom 3c. One or a plurality of first through holes 3ba and second through holes 3bb can be provided. The first through hole 3ba and the second through hole 3bb can be formed in a circular shape in plan view. The first through hole 3ba and the second through hole 3bb are not only formed in a circular shape, but may be formed in a rectangular shape as shown in FIG.

  Further, the first through hole 3ba and the second through hole 3bb may be formed in an elongated slit shape as shown in FIG. The slit-shaped first through-hole 3ba is provided along one end edge of the first region 2a1 set in a rectangular shape in advance, so that the filling state of the filling resin 5 is larger than that of the circular-shaped first through-hole 3ba. This can be confirmed relatively easily. The slit-shaped second through-hole 3bb can confirm the filling state of the filling resin 5 over a relatively wide range compared to the circular-shaped second through-hole 3bb. 1st through-hole 3ba and 2nd through-hole 3bb can also be formed in various shapes, such as elliptical shape, square shape, rhombus shape, and polygonal shape, in planar view. The first through hole 3ba and the second through hole 3bb can be appropriately formed by punching a metal plate when the case 3 is formed.

  Moreover, in the power supply device 10, it is preferable that at least any one of a shape or a size differs between the first through hole 3ba and the second through hole 3bb. In the power supply device 10 shown in FIG. 6, a slit-shaped first through-hole 3ba provided elongated along one end edge of the first region 2a1 set in advance in a rectangular shape, and a circular shape capable of confirming the entire second electronic component 1b. Second through hole 3bb. The power supply device 10 determines the difference between the first through-hole 3ba and the second through-hole 3bb because the first through-hole 3ba and the second through-hole 3bb are different from each other in shape or size. It can be done relatively easily. The opening area of the first through hole 3ba may be larger or smaller than the opening area of the second through hole 3bb. The opening area of the first through-hole 3ba is made smaller than the opening area of the second through-hole 3bb, thereby suppressing a reduction in the contact area between the filling resin 5 and the case 3 via the sheet material 4, and in the case 3 A decrease in heat dissipation can be suppressed. By making the opening area of the second through hole 3bb larger than the opening area of the first through hole 3ba, it is possible to easily determine whether or not the second electronic component 1b is covered with the filling resin 5. .

  In the power supply device 10, it is preferable that the first through hole 3ba and the second through hole 3bb are formed in a size that prohibits insertion of the test finger. Here, the test finger is a pseudo finger defined in Annex 4 (2) c of the Japanese Electrical Appliance and Material Safety Law. The first through-hole 3ba and the second through-hole 3bb can be set to a size that does not allow a test finger to enter by appropriately setting the shape and size of the holes. The power supply device 10 has a size that prohibits the insertion of the test finger in the first through hole 3ba and the second through hole 3bb, so that even if the case 3 of the power supply device 10 is exposed to the outside, a person mistakenly It can be set as the structure which does not touch a power converter circuit. Although not shown in the figure, the test finger has a shape imitating a human finger whose tip of a cylindrical body is spherical. The main body of the test finger has a cylindrical outer shape with a diameter of 12 mm and a length of 80 mm. The test finger is formed at an angle of about 37 ° from the tip to 10 mm with the tip as the apex, and formed at an angle of 14 ° from the tip to 20 mm with the tip as the apex. The power supply device 10 is configured so that the test finger does not touch the power conversion circuit through the first through-hole 3ba and the second through-hole 3bb even when the force applied to the test finger is 30 N in a normal use state. ing. As long as the first through hole 3ba and the second through hole 3bb are not large enough to fit the test finger, the circular shape shown in FIG. 2, the rectangular shape shown in FIG. 4, the slit shape shown in FIG. 5, and the shape shown in FIG. Different sizes and shapes may be appropriately formed.

  The sheet material 4 is disposed between the mounting board 2 and the metal case 3 and is configured to be able to enhance electrical insulation between the mounting board 2 and the metal case 3. The sheet material 4 has translucency and electrical insulation. The sheet material 4 is preferably formed slightly longer than the longitudinal direction of the mounting substrate 2 in accordance with the size of the mounting substrate 2. The sheet material 4 has a pair of side surface portions 4e and a bottom surface portion 4c, and has a C-shaped outer shape in cross-sectional view. The sheet material 4 may be configured such that the bottom surface portion 4c and the bottom portion 3c of the metal case 3 are in close contact with each other, and the side surface portion 4e and the first side wall portion 3e of the metal case 3 can be in close contact with each other. it can. By forming the sheet material 4 into a sheet shape using a resin material, it is possible to ensure translucency and insulation. The sheet material 4 may be formed in a C shape by bending a resin sheet, or may be formed in a C shape by integral molding. When the mounting substrate 2 is arranged so as to be held between the protrusions of the case 3 and the claws, the sheet material 4 is pressed and fixed to the case 3 side by the mounting substrate 2 via the filling resin 5.

  The sheet material 4 is not limited to a configuration transparent to visible light as long as the filling state of the filling resin 5 in the first region 2a1 can be confirmed from the outside of the case 3 through the first through hole 3ba. The sheet material 4 may be colored milky white or the like as long as the filling state of the filling resin 5 in the first region 2a1 can be confirmed from the outside of the case 3 through the first through-hole 3ba. Similarly, as long as it can be confirmed that the filling resin 5 has not reached the second region 2a2 from the outside of the case 3 through the second through hole 3bb, the sheet material 4 has only a configuration transparent to visible light. Not limited. The sheet material 4 may be colored as long as it can be confirmed that the filling resin 5 has not reached the second region 2a2 from the outside of the case 3 through the second through hole 3bb. The sheet material 4 may have irregularities so that the presence or absence of the filling resin 5 can be easily confirmed from the outside of the case 3 through the first through hole 3ba and the second through hole 3bb. The unevenness can be formed by embossing the sheet material 4. The unevenness can be provided on the third surface 4aa facing the mounting substrate 2 in the bottom surface portion 4c. The unevenness provided on the third surface 4aa of the sheet material 4 can also prevent the filling resin 5 from unnecessarily spreading when the filling resin 5 is applied. The unevenness can also be provided on the fourth surface 4ab opposite to the third surface 4aa in the bottom surface portion 4c of the sheet material 4. As a material of the sheet material 4, for example, a resin material such as a polyester resin, a polypropylene resin, or a polyethylene terephthalate resin can be used.

  The filling resin 5 is filled between the sheet material 4 on the case 3 side and the first surface 2aa of the mounting substrate 2 so that heat from the mounting substrate 2 is thermally conducted to the case 3 through the sheet material 4. Is configured to be possible. As a material of the filling resin 5, for example, a urethane resin or a silicone resin can be used. The filling resin 5 may contain a heat dissipating filler in order to increase the thermal conductivity. As the material of the heat dissipating filler, for example, aluminum oxide, aluminum nitride, silicon oxide, or the like can be used. The filling resin 5 can also be adjusted to a predetermined viscosity by appropriately adjusting the content of the heat dissipating filler. By adjusting the filling resin 5 to a predetermined viscosity, in the assembly process of the power supply device 10, the filling resin 5 extends from the mounting substrate 2 and the sheet material 4 to the second region 2 a 2 beyond the first region 2 a 1. Unnecessary spreading can be suppressed. The filling resin 5 contains a coloring material or a fluorescent material having a color different from that of the sheet material 4 so that the presence or absence of the first through hole 3ba or the second through hole 3bb can be easily determined via the sheet material 4. You may let them.

  Below, the power supply device 10 of this embodiment is demonstrated compared with the power supply device of a comparative example.

  In the power supply device of the comparative example, a switching power supply is configured similarly to the power supply device 10 of the present embodiment except that the second through hole 3bb is not provided. In the power supply device of the comparative example, a switching element and a control element are mounted as the electronic component 1 on the first surface 2aa facing the case 3 of the mounting substrate 2.

  By the way, in the power supply device, when the filling resin 5 covers between a plurality of terminals of the microcomputer as a control element, there is a possibility that the resistance against external noise is lowered due to a parasitic capacitance between the terminals and malfunctions. In particular, when the power supply device configures a switching power supply that stably outputs predetermined power by controlling the duty ratio of the switching element by a feedback circuit, there is a possibility that noise is generated when the switching element is driven on and off. . For this reason, the power supply device can radiate the heat dissipation performance by assembling the mounting substrate 2 to the case 3 so that the first region 2a1 covered with the filling resin 5 and the second region 2a2 not covered with the filling resin 5 can be distinguished. Noise resistance can be ensured.

  However, in the power supply device of the comparative example, when only the first through hole 3ba for confirming the first region 2a1 covered with the filling resin 5 is provided, the second region 2a2 is assembled before the mounting substrate 2 and the case 3 are assembled. It is difficult to confirm whether or not the filled resin 5 has not reached. In the power supply device, in the case of only the configuration in which the first through hole 3ba for confirming the first region 2a1 covered with the filling resin 5 is provided in the case 3, it is confirmed that the filling resin 5 does not reach the second region 2a2. Therefore, it is necessary to disassemble and confirm after the mounting substrate 2 and the case 3 are assembled. In the power supply device, in the case of only the configuration in which the first through hole 3ba for confirming the first region 2a1 in which the filling resin 5 is covered with the case 3 is provided, the working efficiency tends to deteriorate in any case.

  In the power supply device 10 of the present embodiment, the first through hole 3ba is provided in the case 3 in accordance with a position facing the first region 2a1. The power supply device 10 can easily confirm the first region 2a1 covered with the filling resin 5 from the first through hole 3ba in a state where the mounting substrate 2 is assembled to the case 3. Therefore, the power supply device 10 can confirm whether it is assembled so that the heat from the highly heat-generating electronic component 1 e can be efficiently released to the outside of the case 3. Further, in the power supply device 10, the second through hole 3bb is provided in the case 3 in accordance with the position of the second region 2a2. The power supply device 10 can easily confirm from the second through hole 3bb that the filling resin 5 has not reached in the state where the mounting substrate 2 is assembled to the case 3. Thereby, the power supply device 10 can check whether the filling resin 5 unnecessarily covers the electronic component 1 and the electronic component 1 has low resistance to noise and reliability is not lowered. it can.

  Below, the assembly process of the power supply device 10 is demonstrated using FIG.

  In the assembly process of the power supply device 10, first, the sheet material 4 having a C-shaped sectional view is accommodated along the recess 3 a of the case 3. In the assembly process, the sheet material 4 is inserted into the recess 3 a of the case 3 along the direction of the white arrow between the case 3 and the sheet material 4 in FIG. 7.

  Next, in the assembly process, the resin material of the filling resin 5 is discharged onto the sheet material 4 from a nozzle (not shown). The resin material of the filling resin 5 is discharged to a position facing the first region 2a1 set in advance on the mounting substrate 2. The resin material of the filling resin 5 contains a heat dissipating filler, is adjusted to a predetermined viscosity, and has thixotropic properties. The resin material of the filling resin 5 is in a state of rising on the sheet material 4 by having a predetermined viscosity. Since the resin material of the filling resin 5 has thixotropy, the resin material is prevented from spreading unnecessarily on the sheet material 4 when being discharged onto the sheet material 4.

  Since the resin material of the filling resin 5 has a predetermined viscosity, the resin material is raised on the first region 2a1. The first region 2a1 is preferably provided so as to avoid the second electronic component 1b provided on the mounting substrate 2. In the assembly process, the mounting substrate 2 is placed on the sheet material 4 to which the resin material of the filling resin 5 is applied. In the assembly process, the mounting substrate 2 is pressed toward the case 3 along the direction of the white arrow between the mounting substrate 2 and the filling resin 5 in FIG. Is spread so as to be in close contact with the second surface 2ab of the mounting substrate 2 and the sheet material 4.

  In the assembly process, the resin material of the filling resin 5 is cured in a state where the mounting substrate 2 and the case 3 are arranged at a predetermined distance. In the assembly process, the sheet material 4 and the mounting substrate 2 are bonded by an appropriate curing method such as heating the resin material of the filling resin 5, and the case 3 and the mounting substrate 2 can be thermally bonded. The mounting substrate 2 may have a spacer interposed so that the distance from the sheet material 4 can be maintained at a predetermined interval.

  Subsequently, in the assembly process, the filling state of the filling resin 5 is confirmed through the sheet material 4 from the first through hole 3ba and the second through hole 3bb in the bottom 3c of the case 3. In the assembling process, it is possible to confirm whether or not the filling state of the filling resin 5 is a desired state by visual inspection of the assembling worker. Further, in the assembly process, it may be confirmed whether or not the filling state of the filling resin 5 is a desired state by a computer that performs image processing on a signal from the image sensor. In the assembling process, if the filling resin 5 does not cover the first electronic component 1a in the first region 2a1 through the sheet material 4 through the first through hole 3ba, the assembled power supply device 10 is regarded as a defective product. The power supply device 10 is removed. Further, in the assembly process, if the filling resin 5 covers the second electronic component 1b in the second region 2a2 from the second through hole 3bb via the sheet material 4, the assembled power supply device 10 is regarded as a defective product. The power supply device 10 is removed from the assembly line. In the assembling process, the filling resin 5 completely covers the first electronic component 1a from the first through hole 3ba to the first region 2a1 and the second region 2a2 from the second through hole 3bb. If it is confirmed that the filling resin 5 has not reached the upper limit, the power supply device 10 can be determined as a non-defective product. Thereby, in the assembly process, the power supply apparatus 10 with higher reliability can be assembled relatively easily.

  In the assembly process, instead of applying the filling resin 5 to the sheet material 4, the resin material of the filling resin 5 is separately applied to the mounting substrate 2 so as to cover the first electronic component 1 a, and the mounting substrate 2 is attached to the sheet material 4. You may make it press. In the assembly process, for example, a predetermined amount of the resin material of the filling resin 5 is discharged from the nozzle (not shown) onto the mounting substrate 2. The mounting substrate 2 only needs to be coated with the resin material of the filling resin 5 only in the first region 2a1 defined in advance on the second surface 2ab.

  In this assembling process, as in the above-described assembling process, the power supply device 10 having a relatively simple structure and higher reliability can be assembled.

(Embodiment 2)
The light source unit 20 of the present embodiment is configured such that the light source can emit light by power feeding from the power supply device 10 of the first embodiment. Below, the light source unit 20 and the lighting fixture 30 of this embodiment are demonstrated using FIG. 8 thru | or FIG. In the drawings, the same members are denoted by the same reference numerals and redundant description is omitted.

  As shown in FIG. 8, the light source unit 20 includes a light source 21, a support member 24 to which the light source 21 is attached, and a cover 23 attached to the support member 24 so as to cover the light source 21 on the light emitting surface side. . As shown in FIG. 9, the light source unit 20 includes a power supply device 10 on the side opposite to the light emitting surface. In the light source unit 20, the power supply device 10 is fixed to the support member 24 so as to close the opening of the recess 3 a of the case 3. The power supply device 10 can fix the power supply device 10 and the support member 24 using a screw or the like (not shown).

  The light source 21 has a wiring board 22 formed in a long flat plate shape. The wiring board 22 has a plurality of solid-state light emitting elements 21a arranged in the longitudinal direction. The light source 21 is electrically connected to the power supply device 10 through an electric wire (not shown). The solid light emitting elements 21 a are mounted on the fifth surface 22 aa at regular intervals along the longitudinal direction of the wiring board 22. The solid state light emitting device 21a is a semiconductor light emitting device capable of emitting light by feeding. The solid light emitting element 21a can be configured to include, for example, an LED chip capable of emitting blue light in the light emitting layer. It is preferable that the solid light emitting element 21a includes a sealing member made of a translucent material containing a phosphor. The solid light emitting element 21a can emit white light or the like by, for example, a color mixture of blue light from the LED chip and yellow light from the phosphor contained in the sealing member. The solid state light emitting device 21a may be configured such that a plurality of solid state light emitting devices 21a are electrically connected in series, in parallel, or in series / parallel using the conductor of the wiring board 22. The wiring board 22 is formed in a long plate shape so that a plurality of solid state light emitting elements 21 a can be arranged in the longitudinal direction of the wiring board 22. As the wiring board 22, for example, a ceramic board on which a conductor having a predetermined shape is formed can be used. For example, Au or the like can be used as the conductor of the wiring board 22. The wiring substrate 22 is not limited to a ceramic substrate, and a glass epoxy resin substrate or a metal base substrate can also be used.

  The cover 23 is formed in a long shape with a C-shaped cross-sectional view covering the wiring substrate 22. The cover 23 has a convex curved surface portion 23a in which the protruding amount increases from the both end sides toward the center side in a cross-sectional view. The cover 23 is held by a support member 24 that supports the wiring board 22. The cover 23 can be formed of a translucent resin material.

  The support member 24 is formed in a long shape along the longitudinal direction of the wiring board 22. The support member 24 is formed in a long plate shape having a C-shaped cross-sectional view. The support member 24 is provided with a side portion 24 b that protrudes toward the cover 23 along the longitudinal direction of the support member 24. In the support member 24, the back surface side of the wiring substrate 22 is disposed on the main portion 24 a of the support member 24, and the wiring substrate 22 is disposed between the pair of side portions 24 b. The support member 24 is integrally formed with a main portion 24a and a pair of side portions 24b that rise at a predetermined angle from both ends of the main portion 24a. The side portion 24b has a function of reflecting the light emitted from the solid light emitting element 21a to the front side on the cover 23 side. The support member 24 is inclined with respect to the wiring substrate 22 so that the pair of side portions 24b open outward as the pair of side portions 24b move away from the main portion 24a. In the side portion 24b, the surface side facing the solid light emitting element 21a constitutes a reflection surface 24ba that reflects light emitted from the solid light emitting element 21a forward. The support member 24 can fix the light source 21 by, for example, a claw 24d formed by cutting and raising a part of the main portion 24a of the support member 24. As shown in FIG. 10, the support member 24 includes a pair of hooking metal fittings 26 extending toward one end in the width direction at positions near both ends in the longitudinal direction, and a pair of hooking springs 25 disposed on the other end in the width direction. have. The support member 24 is formed by bending a metal plate such as a steel plate. The support member 24 can be formed using, for example, an aluminum material as a material having high thermal conductivity. The support member 24 can be formed by bending a plate of aluminum material.

  The light source unit 20 preferably includes a first connector 10a in order to connect to an external commercial AC power source. The 1st connector 10a is connected to the terminal block of the power supply device 10 provided in the light source unit 20 side, and it is comprised so that attachment / detachment with the 2nd connector 33a by the side of the instrument main body 31 is possible. The light source unit 20 can supply power to the solid state light emitting element 21a from the external commercial AC power supply side via the power supply device 10 by inserting and electrically connecting the first connector 10a and the second connector 33a. It is configured.

  Next, the lighting fixture 30 provided with the light source unit 20 is demonstrated.

  The light source unit 20 of the present embodiment is configured so that it can be appropriately attached to the fixture main body 31 of the elongated lighting fixture 30 as an alternative to a straight tube fluorescent tube, for example. The light source unit 20 is not limited to being used for a long luminaire, but can be used for a rectangular luminaire and various shapes of luminaires.

  The lighting fixture 30 includes a light source unit 20 and a fixture main body 31. The instrument body 31 is fixed to the suspension bolt 32 a and is directly attached to the lower surface of the ceiling material 50. The light source unit 20 is detachably attached to the instrument body 31.

  The instrument main body 31 is formed in a long and flat box shape. The instrument body 31 is formed by bending a sheet metal. The instrument body 31 is provided with a recess 31a having a rectangular shape in plan view along the longitudinal direction. The instrument body 31 has a recess 31 a opposite to the ceiling material 50. The instrument main body 31 accommodates the light source unit 20 in the recess 31a. The instrument body 31 is provided with inclined portions 31b on both sides of the recess 31a. The inclined portion 31b extends from the opening edge of the recess 31a. The inclined portion 31b is configured to be inclined toward the ceiling member 50 toward the outside. The bottom plate 31aa of the recess 31a is provided with a first hole 31ba through which the power line 53 is passed. The bottom plate 31aa is provided with a second hole 31bb through which the suspension bolt 32a is passed at a position near both ends. An instrument terminal block 33 for connecting the power line 53 is attached to the lower surface of the bottom plate 31aa.

  Below, the assembly process of the lighting fixture 30 is demonstrated.

  The operator passes the power line 53 that has been wired in advance on the back of the ceiling through the first hole 31ba of the instrument body 31. Further, the operator passes the suspension bolt 32a exposed to the indoor side through the second hole 31bb, and then screws the nut 32b into the suspension bolt 32a to fix the instrument body 31. Thereafter, the operator connects the power line 53 to the instrument terminal block 33, the second connector 33 a provided on the electric wire led out from the instrument terminal block 33, and the first connector electrically connected to the power supply device 10. 10a is connected.

  In the assembly process of the lighting fixture 30, the hook metal 26 of the light source unit 20 is hooked in the insertion hole 31 ca provided in the side plate 31 c of the fixture body 31, and then the hook spring 25 is provided on the other side plate 31 c of the fixture body 31. Hook on the hook 31d. When the light source unit 20 is rotated to lift the light source unit 20 with the hook metal fitting 26 as a fulcrum, the light source unit 20 returns to the original state with the hook spring 25 being hooked on the hook portion 31d. In the light source unit 20, the light source unit 20 is held by the fixture body 31 by the spring force of the hook spring 25, and the installation of the lighting fixture 30 on the ceiling is completed.

DESCRIPTION OF SYMBOLS 1a 1st electronic component 1b 2nd electronic component 2 Mounting board 2a1 1st area | region 2a2 2nd area | region 2aa Surface (1st surface)
DESCRIPTION OF SYMBOLS 3 Case 3ba 1st through-hole 3bb 2nd through-hole 4 Sheet material 5 Filling resin 10 Power supply device 20 Light source unit 21 Light source 23 Cover 24 Support member 30 Lighting fixture 31 Instrument main body

Claims (5)

A mounting board for configuring a power conversion circuit that converts input power into predetermined output power, a metal case that accommodates the mounting board, and an electrical insulation provided between the mounting board and the case Comprising a translucent sheet material, and a filling resin filled between the mounting substrate and the sheet material to conduct heat from the power conversion circuit to the case,
The power conversion circuit includes a first electronic component covered with the filling resin and a second electronic component not covered with the filling resin,
The mounting substrate has a first region where the first electronic component is mounted and a second region where the second electronic component is mounted on a surface facing the case.
The case includes a first through hole facing the first region and a second through hole facing the second region with the sheet material interposed therebetween.   2. The power supply device according to claim 1, wherein the first through hole and the second through hole are formed so that at least one of a shape and a size thereof is different from each other.   3. The power supply device according to claim 1, wherein the first through hole and the second through hole are formed in a size that prohibits insertion of a test finger.   The power supply device according to any one of claims 1 to 3, a light source that emits light by power supply from the power supply device, a support member that supports the light source and the power supply device, and a cover for covering the light source. And a translucent cover attached to the support member.   An illumination fixture comprising: the light source unit according to claim 4; and a fixture main body to which the light source unit is attached.

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