JP6722856B2 - lighting equipment - Google Patents

Description

The present invention relates to a lighting fixture including a fixture main body and a light emitting module attached to the fixture main body.

As a lighting fixture including a fixture main body and a light emitting module attached to the fixture main body, for example, a ceiling-embedded type that irradiates light downward by being embedded in a through hole formed in the ceiling There is a lighting fixture (so-called downlight) (for example, see Patent Document 1).

As a light emitting module provided in such a lighting fixture, one having a circular substrate and a plurality of light emitting elements and a plurality of circuit components mounted on a mounting surface of the substrate is known (for example, Patent Document 1). 2). That is, a plurality of light emitting elements and a plurality of circuit components are mixedly arranged in the inner peripheral area of the mounting surface of the substrate. In the outer peripheral area of the mounting surface of the substrate, a plurality of light emitting elements are arranged in a ring shape so as to surround a plurality of circuit components. Each of the plurality of light emitting elements is a chip component surface-mounted on the mounting surface of the substrate. Each of the plurality of circuit components is a lead component that is lead-through mounted on the mounting surface of the substrate.

JP, 2009-64636, A JP, 2005-159020, A

In the above-described lighting device using the light emitting module, a metal heat sink may be arranged on the back surface of the substrate (the surface opposite to the mounting surface) for radiating the heat from each of the plurality of light emitting elements. .. However, since the tip ends of the lead wires of the plurality of circuit components are projected on the back surface of the substrate, it is difficult to bring the heat sink into contact with the back surface of the substrate.

The present invention has been made in view of the above problems, and an object thereof is to provide a lighting fixture including a light emitting module having a plurality of circuit components, which is capable of efficiently radiating heat generated in the light emitting module. ..

In order to solve the above problems, a lighting fixture according to one embodiment of the present invention includes a fixture main body and a light emitting module attached to the fixture main body, the light emitting module being a substrate and a main component of the substrate. A plurality of light emitting elements arranged on a surface and a plurality of circuit components arranged on the main surface of the substrate, at least a part of which generates electric power for causing each of the plurality of light emitting elements to emit light. And a plurality of circuit components that configure a power supply circuit, wherein the instrument main body portion, in the back surface that is a surface opposite to the main surface of the substrate, a region on the back side of the plurality of light emitting elements and the plurality of light emitting elements. It has a mounting surface that forms a surface that contacts the area on the back side of the circuit component.

According to the lighting device of one embodiment of the present invention, heat generated in the light emitting module can be efficiently released.

FIG. 1 is a perspective view of a lighting fixture according to an embodiment when viewed obliquely from above. FIG. 2 is an exploded perspective view of the lighting fixture according to the embodiment. FIG. 3 is a sectional view taken along line III-III in FIG. 1. FIG. 4 is a plan view showing a schematic configuration of the light emitting module according to the embodiment. FIG. 5A is a first diagram showing part of the process of manufacturing the light emitting module according to the embodiment. FIG. 5B is a second diagram showing a part of the manufacturing process of the light-emitting module according to the embodiment. FIG. 5C is a third diagram showing a part of the manufacturing process of the light-emitting module according to the embodiment. FIG. 6 is an exploded perspective view of a lighting fixture according to a modified example of the embodiment.

Embodiments and modifications thereof will be described below with reference to the drawings. It should be noted that the embodiments and modified examples described below show one specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions of constituent elements, connection forms, and the like shown in the following embodiments and modified examples are merely examples and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments and modifications, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as arbitrary constituent elements.

It should be noted that each drawing is a schematic diagram and is not necessarily strictly illustrated. Further, in each drawing, the same reference numerals are given to substantially the same configurations, and overlapping description may be omitted or simplified.

(Embodiment)
Hereinafter, the lighting fixture according to the embodiment will be described.

[Overall structure of lighting equipment]
The overall configuration of the lighting fixture 1 according to the embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a perspective view of a lighting fixture 1 according to an embodiment when viewed obliquely from above. FIG. 2 is an exploded perspective view of the lighting fixture 1 according to the embodiment. FIG. 3 is a sectional view taken along line III-III in FIG. 1. In FIG. 3, the power cable 110 is conceptually represented by two broken lines.

The luminaire 1 according to the embodiment is a luminaire arranged on a mounted portion (for example, a building material such as a ceiling or a wall of a building such as a house). Specifically, the lighting fixture 1 according to the embodiment is embedded in a circular through hole 6 formed in a ceiling 4 (see FIG. 3), and thus is embedded in a ceiling to irradiate light downward. It is a built-in lighting fixture (so-called downlight). 1 to 3, the positive side of the Z axis represents the ceiling 4 side (upper side), and the negative side of the Z axis represents the floor surface side (lower side).

As shown in FIGS. 1 to 3, the lighting fixture 1 according to the present embodiment includes a fixture main body 8 and a light emitting module 14 attached to the fixture main body 8. The light emitting module 14 includes a light emitting section 71 arranged on the main surface 68 a of the substrate 68 and a drive circuit 80. AC power from a commercial AC power supply, for example, is supplied to the drive circuit 80 via a power cable 110. The drive circuit 80 converts AC power from the commercial AC power supply into DC power and supplies the DC power to the light emitting unit 71. As a result, the light emitting module 14 emits light.

Moreover, the lighting fixture 1 according to the present embodiment further includes a reflecting member 10 and a cover member 12. Hereinafter, each component of the lighting fixture 1 will be individually described.

[Apparatus body]
The instrument main body 8 is a member to which the light emitting module 14 is attached. Specifically, the instrument body 8 according to the present embodiment has a frame member 16, a case member 18, and a pair of mounting springs 20 and 22, as shown in FIGS. 1 to 3. ..

The frame member 16 is a member embedded in the through hole 6 of the ceiling 4, and is formed in a trumpet shape whose diameter gradually increases from the upper end to the lower end. The reflecting member 10 is attached inside the frame member 16.

A circular upper opening 16a is formed at the upper end of the frame member 16, and a circular lower opening 16b is formed at the lower end of the frame member 16. In addition, a ring-shaped collar portion 24 that projects radially outward is formed over the entire circumference of the lower end portion of the frame member 16. That is, the frame member 16 is a tubular member having an opening (lower opening 16b) for emitting the light emitted by the plurality of light emitting elements 70 to the outside.

The frame member 16 having the above configuration is produced by pressing a metal plate such as an aluminum plate or a steel plate.

The case member 18 is a member that houses the light emitting module 14. The case member 18 has a lower case member 26 and an upper case member 28 which are combined with each other.

One end of the lower case member 26 in the longitudinal direction (the end located on the negative side in the X-axis direction) is fixed to the upper end of the frame member 16 by, for example, one or more screws (not shown). A circular opening 30a is formed at the end of the lower case member 26. The diameter of the opening 30a is substantially the same as the diameter of the upper opening 16a of the frame member 16, and their central axes are substantially the same.

Further, as shown in FIG. 2, a pair of mounting portions 32 and 34 are provided at the end portion of the lower case member 26. The pair of mounting portions 32 and 34 are arranged at positions facing the outer peripheral surface of the frame member 16.

The upper case member 28 is a member arranged to cover the lower case member 26 from the upper side. The upper case member 28 and the lower case member 26 are joined by, for example, one or more screws (not shown).

The light emitting module 14 is arranged in a space formed between the upper case member 28 and the lower case member 26. The light emitting module 14 is arranged such that the light emitting portion 71 faces the opening 30a of the lower case member 26 and the back surface 68b of the substrate 68 is in contact with the mounting surface portion 28a of the instrument body 8. The mounting surface portion 28a is a portion that forms a surface on which the light emitting module 14 is mounted, and in the present embodiment, the mounting surface portion 28a is configured by a part of the upper case member 28 included in the instrument body portion 8.

Each of the upper case member 28 and the lower case member 26 having the above configuration is manufactured by pressing a metal plate such as an aluminum plate or a steel plate.

Each of the pair of mounting springs 20 and 22 is an example of a fixing member, and is a member for fixing the lighting fixture 1 in a state of being embedded in the mounted portion (the ceiling 4 in the present embodiment).

As shown in FIGS. 1 and 2, the pair of attachment springs 20 and 22 are attached to the pair of attachment portions 32 and 34 of the lower case member 26, respectively. Each of the pair of mounting springs 20 and 22 is formed of a metal plate such as stainless steel and has an elastic restoring force. By sandwiching the ceiling 4 between each of the pair of attachment springs 20 and 22 and the flange portion 24 of the frame member 16, the lighting fixture 1 is attached to the ceiling 4 as shown in FIG. As shown in FIGS. 1 to 3, a ring-shaped packing 64 for protecting the ceiling 4 is arranged between the flange portion 24 of the frame member 16 and the peripheral edge portion of the through hole 6 of the ceiling 4. ing.

[Reflecting member]
The reflecting member 10 is a member for reflecting light from each of the plurality of light emitting elements 70 included in the light emitting unit 71 of the light emitting module 14 downward.

The reflecting member 10 is formed of, for example, white resin such as polybutylene terephthalate (PBT), and the inner peripheral surface of the reflecting member 10 is formed with a reflecting surface that reflects light from each of the plurality of light emitting elements 70. Has been done. The reflecting member 10 may be made of a metal such as aluminum.

As shown in FIGS. 2 and 3, the reflecting member 10 is formed in a trumpet shape whose diameter gradually increases from the upper end to the lower end. A circular upper opening 10a is formed at the upper end of the reflecting member 10, and a circular lower opening 10b is formed at the lower end of the reflecting member 10. A support portion 66 having an L-shaped cross section that extends radially outward is formed over the entire circumference of the lower end portion of the reflection member 10. The support portion 66 is a portion that supports the cover member 12.

The reflection member 10 is fixed to the upper end portion of the frame member 16 together with the lower case member 26 with one or more screws (not shown), for example. The reflecting member 10 is inserted through the upper opening 16 a of the frame member 16 and the opening 30 a of the lower case member 26, and is arranged so as to straddle the inside of the frame member 16 and the internal space of the case member 18. Further, the peripheral portion of the upper opening 10a of the reflecting member 10 is arranged so as to surround the plurality of light emitting elements 70 (light emitting portions 71).

[Cover member]
The cover member 12 is a member that covers the light emitting unit 71 of the light emitting module 14 and the reflecting member 10. The cover member 12 is formed of a translucent resin material (for example, acrylic (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), polyvinyl chloride, or the like). As shown in FIGS. 2 and 3, the cover member 12 is supported by the support portion 66 of the reflecting member 10 by, for example, fitting, and is arranged at a position that covers the lower opening 10b of the reflecting member 10.

The light from each of the plurality of light emitting elements 70 directly or after being reflected by the reflecting surface of the reflecting member 10, passes through the lower opening 10b of the reflecting member 10 and enters the inner surface of the cover member 12. The light incident on the inner surface of the cover member 12 passes through the cover member 12, and then passes through the lower opening 16b of the frame member 16 to be irradiated downward. The cover member 12 may be made to have a light diffusing property by being formed of, for example, a milky white resin material. Further, the cover member 12 may have a lens function of condensing light or diffusing light. The material of the cover member 12 is not limited to resin, and glass may be used as the material of the cover member 12, for example.

[Light emitting module]
Next, details of the light emitting module 14 according to the present embodiment will be described with reference to FIGS. 4 to 5C in addition to FIGS. 2 and 3 described above. FIG. 4 is a plan view showing a schematic configuration of the light emitting module 14 according to the embodiment. 5A to 5C are first to third diagrams showing a part of the manufacturing process of the light emitting module 14 according to the embodiment.

As shown in FIGS. 2 to 4, the light emitting module 14 includes a substrate 68, a plurality of light emitting elements 70 and a plurality of circuit components 81 arranged on the main surface 68 a of the substrate 68. In the present embodiment, the plurality of light emitting elements 70 form the light emitting portion 71, and the plurality of circuit components 81 form the drive circuit 80. The drive circuit 80 includes a power supply circuit 80a that is a DC power supply circuit that converts AC power supplied from an external power supply into DC power, and a control circuit 80b that controls the light emitting state of the light emitting unit 71.

Each of the plurality of light emitting elements 70 included in the light emitting module 14 is, for example, a packaged surface mounting (SMD: Surface Mount Device) type LED (Light Emitting Diode) element. Each of the plurality of light emitting elements 70 has a package (container) made of white resin having a recess, an LED chip primarily mounted on the bottom surface of the recess of the package, and a sealing member sealed in the recess of the package. doing. The LED chip is, for example, a blue LED chip that emits blue light. The sealing member contains, for example, a yellow fluorescent material such as YAG (yttrium-aluminum-garnet) that emits fluorescent light using blue light from the blue LED chip as excitation light as a wavelength conversion material.

As described above, each of the plurality of light emitting elements 70 is a BY type white LED element configured by the blue LED chip and the yellow phosphor. Specifically, the yellow phosphor contained in the sealing member is excited by absorbing part of the blue light from the blue LED chip and emits yellow light. White light is generated by mixing the emitted yellow light with the blue light that has not been absorbed by the yellow phosphor. In this way, white light is emitted from the light emitting element 70.

At least a part of the plurality of circuit components 81 is a circuit component 81 (power source circuit component) that constitutes the power supply circuit 80a. Each of the circuit components 81 as power source circuit components is, for example, a capacitive element such as an electrolytic capacitor or a ceramic capacitor, a resistance element such as a resistor, a rectifying circuit element, a coil element, a choke coil (choke transformer), a noise filter, a diode. Alternatively, it is a semiconductor device such as an integrated circuit device.

Further, in the present embodiment, the plurality of circuit components 81 arranged on the substrate 68 include one or more circuit components 81 (control circuit components) forming the control circuit 80b. Each of the circuit components 81 as the control circuit component is a capacitive element such as a capacitor, a resistance element, a switching element such as MOSFET, a diode, or an integrated circuit (IC).

The board 68 is a printed wiring board on which the plurality of light emitting elements 70 and the plurality of circuit components 81 are mounted, and is formed in a horizontally long rectangular shape. In the present embodiment, the patterned metal wiring (not shown) is provided only on one surface (main surface 68a in FIG. 4) of both surfaces in the thickness direction of substrate 68. The plurality of light emitting elements 70 and the plurality of circuit components 81 are soldered to this metal wiring. The plurality of light emitting elements 70 are connected in series by metal wiring, for example, and the current output from the drive circuit 80 is supplied to the plurality of light emitting elements 70 via the metal wiring.

In the present embodiment, the main surface 68a of the substrate 68 has a light emitting region 74 and a circuit region 82 which are arranged side by side in the longitudinal direction of the substrate 68 (X-axis direction in FIG. 4). The plurality of light emitting elements 70 are mounted in the light emitting area 74, and the plurality of circuit components 81 are mounted in the circuit area 82.

As the type of the substrate 68, for example, a glass composite substrate such as a CEM3 (Composite epoxy material-3) substrate, a resin substrate, a metal base substrate, a ceramic substrate, or a paper phenol substrate is used.

Further, the numbers, shapes and arrangement positions of the circuit components 81 shown in FIGS. 2 to 4 are examples, and the number, shapes and arrangement positions shown in these drawings are not limited. 2 to 4, the power supply circuit 80a and the control circuit 80b included in the drive circuit 80 are illustrated side by side for convenience of description, but the power supply circuit 80a and the control circuit 80b are clear in appearance. They may be arranged in an indistinguishable manner. That is, on the main surface 68a of the substrate 68, a plurality of circuit components 81 forming the power supply circuit 80a and a plurality of circuit components 81 forming the control circuit 80b may be mixed.

The power supply circuit 80a converts the AC power supplied from the above-described external power supply via the power cable 110 and the terminal block 81a into DC power having a characteristic according to the light emitting unit 71. The control circuit 80b controls the light emission state of the light emitting unit 71 by controlling the current supplied from the power supply circuit 80a to the light emitting unit 71. In the present embodiment, the amount of light emitted from the light emitting unit 71 is adjusted (dimming) by the control of the control circuit 80b. That is, the drive circuit 80 according to the present embodiment has, to put it simply, an AC-to-DC conversion function and a dimming function.

The drive circuit 80 does not have to have a dimming function. That is, even if all of the plurality of circuit components 81 arranged on the substrate 68 are components forming a power supply circuit for generating electric power for causing the light emitting unit 71 (each of the plurality of light emitting elements 70) to emit light. Good. That is, the drive circuit 80 may have at least the function of the power supply circuit.

Here, the plurality of circuit components 81 according to the present embodiment are all surface mount type chip components, and are soldered to the metal wiring (not shown) provided on the main surface 68a of the substrate 68. That is, the drive circuit 80 does not include a lead-through mounting type lead component (radial component or axial component). Therefore, the drive circuit 80 is arranged on the main surface 68a of the substrate 68 without causing the tips of the leads and the protrusions formed by the solder on the back surface 68b of the substrate 68. Further, the plurality of light emitting elements 70 are also surface mount type LED elements as described above. Therefore, even after the plurality of light emitting elements 70 and the circuit components 81 are mounted on the substrate 68, the back surface 68b of the substrate 68 remains flat without any unevenness. As a result, the light emitting module 14 can be fixed (for example, screwed) to the instrument body 8 in a state where the entire surface (or almost the entire area) of the back surface 68b of the substrate 68 is in surface contact with the mounting surface portion 28a.

The light emitting module 14 having such a structure can be manufactured using, for example, a soldering method called a reflow method shown in FIGS. 5A to 5C.

5A to 5C are schematic diagrams showing a procedure of arranging the light emitting element 70 and the circuit component 81 on the substrate 68 according to the embodiment. In addition, in FIGS. 5A to 5C, the positive side of the Z-axis represents the vertically upward direction.

In the manufacturing process of the light emitting module 14 according to the present embodiment, when the plurality of light emitting elements 70 and the plurality of circuit components 81 are arranged on the substrate 68, the processes shown in FIGS. 5A to 5C are executed.

That is, as shown in FIG. 5A, the solder 50 is applied to each of the positions on the substrate 68 where the plurality of light emitting elements 70 and the plurality of circuit components 81 are to be arranged. For example, in order to connect a pair of positive and negative electrodes (not shown) of the light emitting element 70 and a metal wiring (not shown) of the substrate 68, a main surface of the substrate 68 corresponding to one light emitting element 70. The solder 50 is applied to two places of 68a. Further, the solder 50 is applied to two or more locations (two locations in FIGS. 5A to 5C) of the main surface 68 a of the substrate 68 corresponding to one circuit component 81.

This solder 50 is called, for example, "cream solder" and is in a paste state at the time of application. Moreover, as a method of applying the solder 50 to the substrate 68, for example, screen printing using a mask and a squeegee is adopted.

Thereafter, as shown in FIG. 5B, each of the plurality of light emitting elements 70 and the plurality of circuit components 81 is mounted on the substrate 68 by, for example, a component mounter. Since the plurality of light emitting elements 70 and the plurality of circuit components 81 are both mounted on the main surface 68a of the substrate 68, the substrate 68 should be mounted on the substrate 68 by passing the substrate 68 through the component mounter only once. It is also possible to mount all the light emitting elements 70 and the circuit components 81 on the substrate 68.

Thus, after the plurality of light emitting elements 70 and the plurality of circuit components 81 are mounted on the substrate 68, the substrate 68 is loaded into the reflow furnace as shown in FIG. It is heated by heat of about ℃ to 240 ℃, and then cooled. As a result, the solder 50 melted by heating is solidified, and each of the plurality of light emitting elements 70 and the plurality of circuit components 81 is soldered to the metal wiring formed on the main surface 68a of the substrate 68.

[effect]
As described above, the lighting fixture 1 according to the present embodiment includes the fixture main body 8 and the light emitting module 14 attached to the fixture main body 8. The light emitting module 14 is a substrate 68, a plurality of light emitting elements 70 arranged on the substrate 68, and a plurality of circuit components 81 arranged on the main surface 68a of the substrate 68, at least a part of which is a plurality of light emitting elements. A plurality of circuit components 81 that constitute a power supply circuit 80a that generates electric power for causing each of the light emitting devices 70 to emit light. The device body 8 forms a surface on the back surface 68b, which is the surface opposite to the main surface 68a of the substrate 68, that contacts the back side regions of the plurality of light emitting elements 70 and the back side regions of the plurality of circuit components 81. It has a mounting surface portion 28a.

According to this configuration, in the light emitting module 14, the mounting surface portion 28a is in contact with the back side of the elements (the plurality of light emitting elements 70 and the plurality of circuit components 81) serving as the heat source arranged on the main surface 68a of the substrate 68, It is attached to the instrument body 8. Therefore, the heat generated in the light emitting module 14 can be efficiently radiated to the outside via the instrument body 8. As a result, for example, deterioration of the plurality of light emitting elements 70 or the plurality of circuit components 81 is suppressed.

The light emitting module 14 having such a structure is realized by arranging the plurality of light emitting elements 70 and the plurality of circuit components 81 on the main surface 68a of the substrate 68 by surface mounting, as described above. In other words, the light emitting module 14 has a plurality of light emitting elements 70 and a plurality of circuit components 81 surface-mounted on the main surface 68a of the substrate 68. As described above, by adopting the surface mounting as the method of mounting the plurality of light emitting elements 70 and the plurality of circuit components 81, which are the elements necessary for emitting the illumination light, on the main surface 68a of the substrate 68, the back surface of the substrate 68 is adopted. 68b can be in a flat state without unevenness. As a result, the heat dissipation efficiency of the light emitting module 14 can be improved as described above, and the light emitting module 14 can be thinned, for example. In other words, the housing portion (the case member 18 in the present embodiment) of the instrument body 8 that houses the light emitting module 14 can be made thinner or smaller. Thereby, for example, the degree of freedom of the installation position of the lighting fixture 1 is improved.

In addition, in the present embodiment, the plurality of circuit components 81 include one or more circuit components 81 forming a control circuit 80b for controlling the light emitting states of the plurality of light emitting elements 70.

That is, the light emitting module 14 can be provided with, for example, a function of adjusting the amount of light emitted from the plurality of light emitting elements 70 (dimming function), and also for one or more circuit components 81 for the dimming function. Therefore, efficient heat dissipation can be performed through the instrument body 8.

Further, in the present embodiment, the attachment surface portion 28a of the instrument body portion 8 is in contact with the entire area of the back surface 68b of the substrate 68.

Specifically, the substrate 68 according to the present embodiment has a flat plate shape, and the back surface 68b thereof is in a flat state without unevenness. Further, the mounting surface portion 28a forms a flat surface larger than the back surface 68b. Therefore, the entire back surface 68b of the substrate 68 can be brought into contact with the mounting surface portion 28a.

In other words, not only the area on the back surface 68b of the substrate 68 immediately below the plurality of light emitting elements 70 and the plurality of circuit components 81 (when the main surface 68a is above and the back surface 68b is below), but also a wide range including these areas. It can be brought into surface contact with the mounting surface portion 28a. Therefore, the heat generated in the plurality of light emitting elements 70 and the plurality of circuit components 81 and conducted in the substrate 68 can be conducted to the instrument body 8 more efficiently.

Further, the fixture body 8 according to the present embodiment has a fixing member for fixing the lighting fixture 1 in a state where the lighting fixture 1 is embedded in the mounted portion. Specifically, the fixture body 8 has a pair of mounting springs 20 and 22 that are fixing members, respectively, and in the present embodiment, the lighting fixture 1 includes a pair of mounting springs 20 and 22. It is fixed to the ceiling 4, which is the attached part.

Thus, the lighting fixture 1 can be realized as a downlight which is a ceiling-embedded lighting fixture, for example. Further, as described above, since the lighting fixture 1 can efficiently dissipate the heat from the light emitting module 14, for example, the deterioration of the light emitting module 14 due to the heat generation is suppressed, and thus, the lighting fixture 1 can be prevented. The life can be extended. This is advantageous for the luminaire 1, for example a downlight that is not easy to replace.

Here, the lighting fixture 1 may include a fixture main body having a shape or structure different from that of the fixture main body 8 of the above-described embodiment. Therefore, a modified example of the main body of the lighting device 1 will be described below, focusing on the differences from the above-described embodiment.

(Modification of Embodiment)
FIG. 6 is an exploded perspective view of a lighting fixture 1a according to a modified example of the embodiment. The lighting fixture 1a shown in FIG. 6 includes a fixture body 40 and a light emitting module 14 attached to the fixture body 40. As described above, the light emitting module 14 includes the substrate 68, the plurality of light emitting elements 70 and the plurality of circuit components 81 arranged on the substrate 68. The instrument main body 40 has a mounting surface portion 45 that forms a surface on the back surface 68b of the substrate 68 that contacts the areas on the back side of the plurality of light emitting elements 70 and the areas on the back side of the plurality of circuit components 81.

The instrument body 40 includes a lower case member 46, an upper case member 48, and a frame member 47 that are combined with each other. The light emitting module 14 is arranged in a space formed between the lower case member 46 and the upper case member 48. A reflective member 50 is attached inside the frame member 47, and a translucent cover member 52 is attached to a lower end portion of the reflective member 50.

Light emitted from the plurality of light emitting elements 70 (light emitting portions 71) passes through the opening 46a of the lower case member 46 and the cover member 52, and is emitted to the outside from the lower opening 47c of the cylindrical frame member 47. It

The upper case member 48 is provided with a mounting portion 41, and the mounting spring 41 is mounted on the mounting portion 41. Although not shown in FIG. 6, a mounting portion and a mounting spring are also arranged on the back side (Y-axis plus side) of the upper case member 48. That is, the upper case member 48 has a pair of mounting springs. The lighting fixture 1a is attached to the ceiling 4 by sandwiching the ceiling 4 (see FIG. 3) with the packing 54 interposed between each of the pair of attachment springs and the flange portion at the lower end of the frame member 47.

The lighting fixture 1a according to the present modification has the same basic structure as the lighting fixture 1 according to the above embodiment. However, in the above-described embodiment, the mounting surface portion 28a is formed by one plate-shaped portion of the instrument body portion 8, whereas in the present modification, the mounting surface portion 45 is formed by the instrument body portion 40. It is formed by two plate-shaped portions that it has. In this respect, the lighting fixture 1a according to the present modification example is different from the lighting fixture 1 according to the above-described embodiment.

Specifically, the frame member 47 of the instrument body 40 forms a surface where the insertion hole 47a into which a part of the light emitting module 14 is inserted and the back surface 68b of the part of the light emitting module 14 are in contact with each other. And a mounting surface portion 47b. In this modification, the first mounting surface portion 47b is a wall portion at the upper end of the tubular frame member 47, and the back surface 68b of the part of the light emitting module 14 makes surface contact with the inner surface of the wall portion.

In addition, the upper case member 48 included in the appliance main body 40 has a second mounting surface portion 48a that forms a surface with which the back surface 68b of the portion of the light emitting module 14 exposed from the frame member 47 contacts.

In other words, in the present modification, the light emitting module 14 is such that the back surface 68b of the substrate 68 is in contact with the mounting surface portion 45 including the first mounting surface portion 47b and the second mounting surface portion 48a which are separate bodies, and the device body portion 40. Attached to.

As described above, the instrument main body 40 according to the present modification has the tubular frame member 47 having the opening for emitting the light emitted from the plurality of light emitting elements 70 to the outside, and at least a part of the mounting surface portion 45 is , Provided on the frame member 47.

In the present modification, the frame member 47 is provided in the device body 40 as a shade arranged so as to surround the plurality of light emitting elements 70 that are light sources, and has a relatively large surface area. Therefore, the heat generated in the light emitting module 14 can be more efficiently radiated to the outside via the frame member 47.

More specifically, a region of the back surface 68b of the substrate 68 on the back side of the plurality of light emitting elements 70 (light emitting portions 71) contacts the first mounting surface portion 47b, and the plurality of circuit components 81 (driving circuits) on the back surface 68b of the substrate 68 are driven. The area on the back side of 80) contacts the second mounting surface portion 48a.

That is, of the heat generated by the light emitting module 14, the heat generated by the plurality of light emitting elements 70 is mainly conducted directly to the frame member 47. As a result, it is possible to improve the heat dissipation efficiency of the plurality of light emitting elements 70. Further, the heat generated in the plurality of circuit components 81 is mainly conducted directly to the upper case member 48 and radiated to the outside. Therefore, for example, conduction of heat generated in the plurality of circuit components 81 to the plurality of light emitting elements 70 is suppressed.

(Other embodiments)
Although the present invention has been described above based on the embodiments and the modifications thereof, the present invention is not limited to the above embodiments and modifications. For example, various modifications may be made to the above embodiment or modification.

For example, the plurality of light emitting elements 70 may include different types of light emitting elements. For example, the plurality of light emitting elements 70 may include one or more first light emitting elements having a relatively low color temperature and one or more second light emitting elements having a relatively high color temperature. In this case, the drive circuit 80 adjusts the color temperature of the illumination light from the light emitting unit 71 by changing the light amount of one or more first light emitting elements and one or more second light emitting elements (color adjustment). Function).

Further, on the main surface 68a of the substrate 68, the light emitting region in which the plurality of light emitting elements 70 are arranged and the circuit region in which the plurality of circuit components 81 are arranged may not be arranged side by side in a predetermined direction. For example, on the main surface 68a of the substrate 68, the circuit region may be arranged so as to surround the light emitting region. That is, a plurality of circuit components 81 may be arranged so as to surround the plurality of light emitting elements 70. Thereby, for example, the outer shape of the lighting fixture 1 in a plan view can be made substantially circular.

Further, the back surface 68b of the substrate 68 and the mounting surface portion 28a or 45 do not have to be in direct contact with each other, and for example, the substrate 68 is provided via a heat conductive sheet or a heat conductive grease having an electrical insulation property. The back surface 68b may contact the mounting surface portion 28a or 45.

The fixing member included in the instrument body 8 or 48 may be a member different from the spring. For example, the instrument body 8 may have a fastening member such as a screw as a fixing member. That is, the luminaire 1 including the luminaire body 8 may be fixed to a mounted portion such as the ceiling 4 by a fastening member such as a screw.

The light emitting module 14 may be, for example, an AC drive type light emitting module that does not include a DC power supply circuit that converts AC power into DC power. In this case, for example, as the circuit component 81 arranged on the substrate 68, a tall component such as an electrolytic capacitor is not required, so that the lighting fixture 1 or 1a can be further thinned (downsized).

Further, although the light emitting element 70 is the SMD type LED element, the light emitting element 70 is not limited to this. For example, the light emitting module 14 may have a COB (Chip On Board) structure in which an LED chip is directly mounted on the substrate 68. In this case, a plurality of LED chips mounted on the substrate 68 are collectively sealed or individually sealed by a sealing member containing a wavelength conversion material to obtain illumination light of a predetermined color temperature. be able to.

Further, although the LED is illustrated as the light emitting element 70, the present invention is not limited to this, and other solid light emitting elements such as a semiconductor light emitting element such as a semiconductor laser, an organic EL (Electro Luminescence) or an inorganic EL may be used.

Further, in the above-described embodiment, the lighting fixture 1 is embedded in the through hole 6 formed in the ceiling 4, but the present invention is not limited to this. For example, a penetrating hole formed in a wall of a building or the like to be attached may be used. The lighting fixture 1 may be embedded in the hole.

In addition, a configuration obtained by applying various modifications to those skilled in the art to the above-described embodiment or modification, or any combination of the components and functions in the embodiment or modification without departing from the spirit of the present invention The form realized by the above is also included in the present invention.

1, 1a Lighting fixture 4 Ceiling (attached part)
8, 40 Instrument main body 14 Light emitting module 16, 47 Frame members 16b, 47c Lower opening (opening)
20, 22, 42 Mounting spring (fixing member)
28a, 45 Mounting surface portion 68 Substrate 68a Main surface 68b Back surface 70 Light emitting element 80a Power circuit 80b Control circuit 81 Circuit component

Claims (6)

Instrument body,
A light emitting module attached to the instrument body,
The light emitting module,
Board,
A plurality of light emitting elements arranged on the main surface of the substrate,
A plurality of circuit components arranged on the main surface of the substrate, at least a part of which constitutes a power supply circuit for generating electric power for causing each of the plurality of light emitting elements to emit light. Have,
An attachment that forms a surface of the device main body that is in contact with an area on the back side of the plurality of light emitting elements and an area on the back side of the plurality of circuit components on the back surface that is the surface opposite to the main surface of the substrate. It has a face,
The main surface of the substrate has a light emitting region and a circuit region arranged side by side in the longitudinal direction of the substrate, a plurality of light emitting elements are mounted in the light emitting region, and the plurality of circuit components are the circuit region. Implemented in
lighting equipment. The lighting device according to claim 1, wherein the plurality of circuit components include one or more circuit components that configure a control circuit for controlling a light emitting state of the plurality of light emitting elements. The instrument body further has a tubular frame member having an opening for emitting the light emitted by the plurality of light emitting elements to the outside,
The lighting device according to claim 1, wherein at least a part of the mounting surface portion is provided on the frame member. The lighting device according to claim 1, wherein the mounting surface portion is in contact with the entire area of the back surface of the substrate. The luminaire according to any one of claims 1 to 4, wherein the luminaire main body further has a fixing member for fixing the luminaire in a state where the luminaire is embedded in the mounted portion. Instrument body,
A light emitting module attached to the instrument body,
The light emitting module,
Board,
A plurality of light emitting elements arranged on the main surface of the substrate,
A plurality of circuit components arranged on the main surface of the substrate, at least a part of which constitutes a power supply circuit for generating electric power for causing each of the plurality of light emitting elements to emit light. Have,
An attachment that forms a surface of the device main body that is in contact with an area on the back side of the plurality of light emitting elements and an area on the back side of the plurality of circuit components on the back surface that is the surface opposite to the main surface of the substrate. It has a face,
The instrument body is a tubular frame member having an opening through which the light emitted by the plurality of light emitting elements is emitted to the outside, and is one of the mounting surface portions provided at a position facing the opening. A luminaire having a frame member integrally provided with a wall portion forming a portion .

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