JP2553083Y2 - Hybrid integrated circuit device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device having a large power consumption of an electronic component, and more particularly to a DC / DC device.
The present invention relates to a hybrid integrated circuit device constituting a converter.

[0002]

2. Description of the Related Art Conventionally, when a circuit which consumes a large amount of power in a circuit, for example, a DC / DC converter is realized by a hybrid integrated circuit device, the circuit is formed through an insulating layer based on a metal having a large thermal conductivity. Metal substrates are generally used. As shown in FIG. 3, the hybrid integrated circuit device includes, on a metal substrate 11, a transformer 12, a transistor 13, and a capacitor 14 as electronic components generating a large amount of heat.
Are mounted, and an IC 15 or the like as an electronic component that generates a small amount of heat is mounted.

An insulator 17 having an opening facing the electronic component and an external connection terminal 16 are formed by integral molding, and the insulator 17 is mounted on the metal substrate 11.
The external connection terminals 16 are fixed to the metal substrate 11. In addition, the external connection terminal 16 is separately provided and press-fitted into the insulator 17.
The external connection terminals 16 may be soldered to the metal substrate 11 by a reflow furnace or the like.

Next, the operation will be described.

When power and signals are input to the transformer 12, the transistor 13, the capacitor 14, and the IC 15, the transformer 12, the transistor 13, the capacitor 14
The IC 15 performs a predetermined operation. At this time, the transformer 12, the transistor 13, and the capacitor 14 generate heat, and the generated heat is radiated from the opening of the insulator 17.

[0006]

The conventional hybrid integrated circuit device is constructed as described above. An electronic component having a large heat value and an electronic component having a small heat value are formed on a metal substrate 11 having a high thermal conductivity. Therefore, the electronic component having a small heat generation must use the same temperature-guaranteed component as the electronic component having a large heat generation, and there is a problem that the component price becomes expensive.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and is a hybrid integrated circuit that does not require electronic components having a small amount of heat and components whose temperature is the same as those of electronic components having a large amount of heat. The aim is to obtain a device.

[0008]

Means for Solving the Problems According to the invention of claim 1,
Is (a) a metal substrate having a circuit formed through an insulating layer, a substantially central portion (B) and the opening, the metal substrate
A printed circuit board supported at a predetermined distance from the
(C) On a metal substrate facing the opening of the printed circuit board
The amount of heat generated at a predetermined position in the circuit formed in
A first electronic component, and (d) provided around the opening.
On the metal substrate so as to partially fit into the notch
A second integrated electronic component having a large heat value and a third electronic component having a small heat value disposed at a predetermined position of a circuit formed on a printed circuit board are mounted on a hybrid integrated circuit device.
Be prepared.

That is, in the invention according to claim 1, the metal substrate
Printed circuit board having openings on board at predetermined intervals
Is placed on the metal substrate facing this opening.
A large first electronic component and a second electronic component
Partly fits into the notch provided around the opening
Upright on a metal substrate,
The third electronic component that generates a small amount of heat is arranged.
Thus, the first and the large heat generation can be achieved by using the opening.
And the second electronic component can generate heat positively
In both cases, some of the electronic components that generate a large amount of heat are placed upright
To increase the component mounting density and reinforce the openings.
ing. In addition, a third heat-generating small
By arranging electronic components, special as a third electronic component
Eliminates the need to use temperature-
You.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a hybrid integrated circuit device according to the present invention.

The hybrid integrated circuit device has a metal substrate 11 on which a circuit is formed based on a metal via an insulating layer, and on one side of the metal substrate 11 is an electronic component having a large calorific value. A transformer 12, a transistor 13, and a capacitor 14 are mounted. A printed circuit board 18 having an external connection terminal 16 press-fitted into a hole 19 formed on the periphery thereof and having an opening 21 at a portion facing the transformer 12, the transistor 13, and the capacitor 14 is provided above the metal substrate 11. It is placed.

Further, the printed circuit board 18 and the external connection terminals 1
The printed circuit board 18 and the metal board 11 are electrically connected by soldering the printed circuit board 6 to the printed circuit board 6. The printed circuit board 18 has an IC as an electronic component that generates a small amount of heat.
15 and control system components 20 are mounted.

Next, the operation of this embodiment will be described.

When power and signals are input to the transformer 12, the transistor 13, the capacitor 14, the IC 15, and the control component 20, the transformer 12, the transistor 1
3. The capacitor 14, the IC 15, and the control component 20 perform a predetermined operation. At this time, the transformer 12, the transistor 13, and the capacitor 14 generate heat, and the generated heat is transferred to the opening 21 of the printed circuit board 18 and the metal substrate 11.
The heat is dissipated from

Next, another embodiment of the present invention will be described with reference to FIG. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, a notch 22 is formed in the opening 21 of the printed circuit board 18 which is an insulator, and the capacitor 14 is mounted upright on the notch 22. In this manner, the area occupied by the capacitor 14 is reduced, the component mounting density can be improved, and the size can be reduced.
In mounting the components, each component is mounted on the printed circuit board 18 into which the external connection terminal 16 is press-fitted in advance, and each component is mounted on the metal substrate 11. Then, the printed board 18 is placed on the metal board 11, and collective reflow connection is performed by an atmosphere furnace or the like.

[0018]

[Effect of the Invention] As described above, the invention according to claim 1
According to the metal substrate, the opening is arranged on the printed circuit board
The first and second large heat generation values
Since two electronic components are arranged, efficient heat dissipation of electronic components
It can be performed. Moreover, the second electronic component has an opening.
So that it partially fits into the notch provided around
Because it stands on a metal substrate,
It is possible to efficiently arrange vertically elongated electronic components such as
Contradictory objectives of increasing mounting density and promoting heat dissipation
Can be achieved, and can be fitted to the notch
The arrangement can also reinforce the opening. Ma
In addition, the amount of heat generated on the printed circuit board
By arranging a small third electronic component,
The need to use specially temperature-protected components as components
The cost of parts can be reduced.
You.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a hybrid integrated circuit device according to the present invention.

FIG. 2 is a perspective view showing another embodiment of the present invention.

FIG. 3 is a perspective view showing a conventional hybrid integrated circuit device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Metal substrate 12 Transformer 13 Transistor 14 Capacitor 15 IC 18 Printed circuit board 21 Opening

Claims (1)

(57) [Scope of request for utility model registration] 1. A metal substrate having a circuit formed with an insulating layer interposed therebetween, a printed board having an opening at a substantially central portion and supported by a predetermined distance from the metal substrate, and an opening in the printed board. Formed on a metal substrate facing
The first heat-dissipating first element disposed at a predetermined position of the
Part of the electronic component and a notch provided around the opening.
The amount of heat generated standing on the metal substrate as described above
A second electronic component, and a third electronic component having a small heat value and arranged at a predetermined position of a circuit formed on the printed circuit board.
A hybrid integrated circuit device.