JP2000133976A - Unit type cooling structure for electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remarkably enhance a heat radiating effect and to enable maintaining a high cooling effect, by mounting a single or a plurality of heat radiating members on the upper part of a semiconductor module, and mounting a fan device on the upper end of the heat radiating member. SOLUTION: For providing a unit configuration of a CPU cooler 10, a basic heat sink 60, i.e., a heat radiating member is mounted and fixed on the upper part of a CPU 2. Furthermore, a plurality of additional heat sinks 50, i.e., heat radiating members are mounted and fixed on the upper part of the basic heat sink 60, and a fan device 3 is mounted on the upper part of the additional heat sink 50 at the upper end. Screw holes on the basic and additional heat sinks 50 and 60 have the same shape, the upper parts of the screw holes are drilled like columns larger than those of the lower parts, and the lower parts are drilled like columns smaller than those of the upper parts. When the screws are screwed, the upper ends of the screws are approximately the same plane as the upper ends of the basic and additional heat sinks 50 and 60, and the upper ends of the screws are housed into the members of the heat sinks 50 and 60.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a cooling structure for a semiconductor module of an electronic device in a computer or the like.

[0002]

2. Description of the Related Art Conventionally, a central processing unit (hereinafter, referred to as a CPU) of a computer or the like has a heat sink having heat radiation fins mounted on an upper portion of the CPU, or a CPU.
It is publicly known that a fan is mounted on the upper part of a PU. In order to enhance the heat radiation effect, the heat radiation fins have been devised in various shapes, and it is known to mount a plurality of fans or to mount both a heat sink and a fan. For example, the techniques are disclosed in JP-A-9-83166 and JP-A-9-305267.

[0003]

However, in the above-mentioned prior art, with the recent rapid increase in the speed of the CPU, the CP
There is a problem that the heating value of the U and the like increases, and the cooling effect cannot be sufficiently obtained. Further, since the heat sink and the fan cannot be added or divided, the cooling effect increases according to the heating value of the CPU. Therefore, there is no other way but to attach a separate heat sink or fan having a high cooling capacity.

[0004]

The above is the problem to be solved by the present invention. Next, means for solving the problem will be described. That is, in the cooling structure of the semiconductor module of the electronic device, one or more heat radiating members are mounted on the semiconductor module, and the fan device is mounted on the upper end of the heat radiating member.

The heat radiating member has a substantially rectangular parallelepiped shape, and a plurality of ventilation holes are provided in a vertical direction of the heat radiating member.

Further, among the heat radiating members, the heat radiating member which is in contact with the upper part of the semiconductor module has a plurality of ventilation holes in the left-right direction and the front-back direction.

Further, screw holes are provided at four corners of the heat dissipating member in plan view, and the heat dissipating members are fixed by screws that can be housed in the screw holes and that can be continuously screwed.

[0008]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is an overall perspective view of a CPU cooler of the present invention, FIG. 2 is a plan view of an additional heat sink, and FIG.
4 is a front view (side view), FIG. 4 is a plan view of a basic heat sink, FIG. 5 is a front view (side view), FIG. 6 is a perspective view of a fan device, FIG. 7 is a perspective view of an additional heat sink, and FIG.
9 is a perspective view of a basic heat sink, FIG. 9 is an assembled view of a CPU cooler of the present invention, FIG. 10 is a perspective view of a screw, FIG. 11 is a side sectional view showing an assembled structure of an additional heat sink (basic heat sink), and FIG. Perspective view of FIG. 1
FIG. 3 is a diagram showing an embodiment of a CPU cooler using a large heat sink.

First, the overall configuration will be described with reference to FIG. In this embodiment, a central processing unit 2 (hereinafter, referred to as a CPU) used for a computer or the like will be described as an embodiment of a semiconductor module to be cooled. As shown in FIG. 1, a CPU 2 is disposed on a base 1 such as a motherboard, and performs calculation processing and the like in an electronic device such as a computer. And
The CPU 2 generates heat as the processing speed increases and the number of times of processing increases, and the temperature also increases substantially in proportion to the increase in the number of processing elements.
If the temperature of the PU 2 itself rises, the operation will not be stable, and problems such as stoppage and runaway will sometimes occur. Therefore, it is necessary to cool the PU 2 from outside to prevent such problems.

Therefore, the CPU cooler 10 of the present invention comprises:
A basic heat sink 60 as a heat radiating member is placed and fixed on the upper part of the CPU 2, and a plurality of (two in this embodiment) additional heat sinks 50 as a heat radiating member are placed and fixed on the upper part of the basic heat sink 60, and the upper end is added. Heat sink 5
The fan unit 3 is mounted on the top of the unit 0.

Next, each component will be described with reference to FIGS. The additional heat sink 50 has a substantially square shape in plan view as shown in FIG. 2 and a substantially rectangular parallelepiped shape in front view (or side view) as shown in FIG. We use thing with high rate. The additional heat sink 50 is provided with a plurality of upper and lower ventilation holes 51a in the vertical direction, and penetrates from the upper surface to the lower surface of the additional heat sink 50. At four corners of the additional heat sink 50 in plan view, screw holes 52, 52, 52,.
52 are provided. FIG. 7 is a perspective view of the additional heat sink 50 configured as described above.

The basic heat sink 60 has a substantially square shape in plan view as shown in FIG. 4 and a substantially rectangular parallelepiped shape in front view (or side view) as shown in FIG. 5, and is made of aluminum. And the like with high thermal conductivity. The basic heat sink 60 has a plurality of vertical air holes 61a in the vertical direction, and front and rear air holes 61b in the horizontal direction.
, Left and right ventilation holes 61c are provided. The upper and lower air holes 61a provided from the upper surface of the basic heat sink 60 are drilled to a position slightly below the center in the vertical direction of the basic heat sink 60. At the four corners of the basic heat sink 60 in plan view, screw holes 62 for inserting screws 7 described later are provided.
・ 62 ・ 62 ・ 62 are provided. FIG. 8 shows the configuration of the basic heat sink 60 configured as described above.

As shown in FIG. 6, the fan device 3 has a substantially rectangular parallelepiped shape in a plan view and includes a motor (not shown) therein. The fan device 3 receives power from the base 1 by a power cable (not shown). , And the wings 31 are driven to rotate,
Blow down. Also in the fan device 3, screw holes 32 are provided at four corners in plan view.

Next, an assembling structure of the CPU cooler 10 of the present invention using the additional heat sink 50, the basic heat sink 60, the fan device 3, and the like will be described. The additional heat sink 50, the basic heat sink 60, and the fan device 3 are each provided with the CPU in plan view.
2, and the screw holes 32, 52, and 62 are arranged at the same position in a plan view when stacked vertically.

The screw holes 62 and 52 of the basic and additional heat sinks 60 and 50 have a common shape. As shown in FIG. 11, the upper side is formed in a cylindrical shape having a large radius, and the lower side is formed in a cylindrical shape having a small radius. Has been drilled. And FIG.
When the screw 7 is inserted, the upper end of the screw 7 is substantially flush with the upper surface of the basic / additional heat sink 60/50, and the upper part of the screw 7 is accommodated in the member of the heat sink 60/50. are doing. The screw 7 is provided with a screw portion 71 on the lower side so that a screw portion 72 on the lower side can be screwed therein, and a screw hole 71 is provided on the upper side, so that a plurality of screws 7, 7. . In such a configuration, as shown in FIG. 11, the screw 7 inserted into the screw hole 52 of the upper additional heat sink 50 projects below the additional heat sink 50, and the screw of the lower additional heat sink 50 (or the basic heat sink 60). Screw hole 7 of screw 7 inserted in hole 52
1 is screwed from above.

Then, as shown in FIG. 9, the basic heat sink 60, the additional heat sinks 50 and 50, and the fan device 3 are stacked in this order from below, and the screws 7 are fixed at the four corners, respectively. Complete. The screw used for fixing the fan device 3 and the additional heat sink 50 thereunder may be any screw that fits into the lower screw hole 7 in accordance with the vertical width of the fan device 3.

By adopting such a configuration, since the fixing means of each component is housed inside each component, it is possible to securely fix without increasing the overall configuration. The screw 7 is also made of a small and thermally conductive member, so that the basic and additional heat sink 50.
The excellent heat dissipation effect can be maintained without impeding the heat dissipation effect of 60.

Further, in this embodiment, as described above, each component is fixed by the screw 7 or the like, but the fixing method is not limited to this, and the fixing method is not limited to the side face of each component. A locking means may be provided, as long as it does not lower the thermal conductivity and has a small configuration and does not interfere with components around the electric device.

The CPU cooler 10 constructed as described above is fixed to the upper part of the CPU 2 by a not-shown locking means as shown in FIG. 1, and the heat generated by the calculation processing of the CPU 2 is transferred to the upper basic heat sink 60 and the additional heat sink. 5
Although the heat is transmitted to the heat sink and is dissipated, the heat dissipating effect is greatly increased because the volume of the additional heat conducting member is very large as compared with the conventional heat sink. Further, according to the assembling configuration using the screws 7, each heat sink 6
Since there is no gap between 0 and 50, the respective heat conductive members are in close contact with each other, so that heat can be efficiently transmitted to the upper member.

Although the temperature of the basic and additional heat sinks 60 and 50 rises due to the heat radiation of the CPU 2, the cool air sent downward from the fan device 3 disposed above is
.. And 61a. 61a.
... Since the heat sinks 60 and 50 are cooled while passing through the inside, the temperature rise of each heat sink 60 and 50 can be suppressed, and the cooling effect further increases.

Then, the air sent from the fan device 3 whose temperature has risen after cooling the heat sinks 60 and 50 is transmitted to the front and rear ventilation holes 61b, 61b... Blow holes 61c / 61
c ... is discharged toward the outside of the CPU cooler 10. Thereby, each heat sink 60/50
Is cooled and the gas whose temperature has risen does not stay, and is immediately pushed out to maintain a high cooling effect.

In the above embodiment, the two additional heat sinks 50 are mounted on the upper part of the basic heat sink 60. However, the fan device 3 may be arranged directly on the upper part of the basic heat sink 60, or , The number of the additional heat sinks 50 can be freely changed, such as one or three, and can be appropriately changed and applied according to the performance of the CPU 2, the heat generation amount, the size of the housing for housing these components, and the like. It is.

As shown in FIG. 12, an embodiment using a large heat sink 80 having a substantially rectangular shape in plan view will be described. The large heat sink 80 has substantially the same shape as a state in which the two additional heat sinks 50 are connected in the left-right direction, and upper and lower ventilation holes 81a, 81a,.
Is provided. The upper and lower ventilation holes 81a penetrate from the upper surface to the lower surface of the large heat sink 80, and have eight screw holes 82 in plan view as shown in FIG.
Are provided above the large heat sink 80, and the fan device 3, the additional heat sink 50, etc.
When the two screw holes are arranged, the positions of the screw holes 32 and 52 and the screw holes 82 are aligned.

As shown in FIG. 13, the basic heat sink 60 and the additional heat sink 5 are provided above the CPU 2.
0 is mounted and fixed, and the large heat sink 80 is mounted and fixed on the upper portion of the heat sink. The two fan devices 3 are arranged above the large heat sink 80. With such a configuration, the same effect as that of the above-described embodiment of FIG. 1 can be obtained, but the volume of the heat conductive member above the CPU 2 can be further increased, and the cooling effect increases. In addition, by mounting the two fan devices 3, the heat sinks 50, 60, and 80 can be efficiently cooled, and a more stable cooling effect can be achieved.

In the above-described embodiment, for example, the additional heat sink 50 may be eliminated, and the large heat sink 80 may be placed above the basic heat sink 60, or only one fan device 3 may be disposed above. . Further, a configuration in which two large heat sinks 80 are stacked can be appropriately applied in accordance with the performance of the CPU 2, the size of the housing, and the like.

In the above embodiment, the CPU 2 has a substantially square shape in plan view and is disposed on the base 1 such as a motherboard. However, in the configuration in which the CPU 2 is erected on the base 1, , The basic / extended heat sink 6
0, 50, a large heat sink 80, a fan device 3 and the like may be appropriately combined and arranged on the side of the upright CPU 2. If the CPU 2 is a polygon or a circle in a plan view, the basic / additional heat sink 60/5 is used.
0 is also a shape corresponding to the shape.

As described above, the CPU cooler 10 of the present invention provides a cooling structure that can be added and combined freely.
The present invention is applicable to other semiconductor modules having heat generation used in electric devices such as computers.

[0028]

As described above, the present invention has the following advantages. That is, in the cooling structure of the semiconductor module of the electronic device, one or two or more heat radiating members are mounted on the upper part of the semiconductor module, and the fan device is mounted on the upper end of the heat radiating member. The heat generated by the calculation processing of the CPU is conducted to a plurality of heat dissipating members mounted on the upper part and dissipated. However, compared to a conventional heat sink, the volume of the additional heat conducting member is extremely large, so the heat dissipated. The effect increases dramatically. Further, although the temperature of the heat radiating member rises due to the heat radiation of the CPU, a high cooling effect can be maintained by the cool air sent downward from the fan device provided at the upper part.

Further, since the heat radiating member has a substantially rectangular parallelepiped shape and a plurality of ventilation holes are provided in the up and down direction of the heat radiating member, the cool air blown downward from the fan device provided at the upper portion is supplied to each of the blowers. Since each heat radiating member is cooled while passing through the hole, the temperature rise of each heat radiating member can be suppressed, and the cooling effect is further increased.

Further, of the heat radiating members, the heat radiating member in contact with the upper part of the semiconductor module is provided with a plurality of air blowing holes in the left-right direction and the front-back direction.
The air sent from the fan device whose temperature has risen is discharged toward the outside of the CPU cooler from the ventilation holes of the heat radiating member above the semiconductor module. As a result, the hot air whose temperature has risen by cooling the heat radiating members is immediately pushed outward without stagnation, and a high cooling effect can be maintained.

Also, screw holes are provided at four corners of the heat radiating member in plan view, and the heat radiating members are fixed by screws that can be housed in the screw holes and can be continuously screwed. The structure has no gap between the members, and the respective heat conductive members are in close contact with each other, so that heat can be effectively transmitted to the upper member.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of a CPU cooler of the present invention.

FIG. 2 is a plan view of an additional heat sink.

FIG. 3 is a front view (side view) of the additional heat sink.

FIG. 4 is a plan view of a basic heat sink.

FIG. 5 is a front view (side view) of a basic heat sink.

FIG. 6 is a perspective view of a CPU fan device.

FIG. 7 is a perspective view of an additional heat sink.

FIG. 8 is a perspective view of a basic heat sink.

FIG. 9 is an assembly view of the CPU cooler of the present invention.

FIG. 10 is a perspective view of a screw.

FIG. 11 is a side sectional view showing an assembly structure of an additional heat sink (basic heat sink).

FIG. 12 is a perspective view of a large heat sink.

FIG. 13 is a diagram showing an embodiment of a CPU cooler using a large heat sink.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Motherboard 2 Central processing unit (CPU) 3 Fan device 7 Screw 10 CPU cooler 31 (Fan device) blade 32 Screw hole 50 Additional heat sink 51a (Additional heat sink) Upper and lower ventilation holes 52 Screw hole 60 Basic heat sink 61a (Basic heat sink) upper and lower Blow hole 61b (basic heat sink) Front and rear blow hole 61c (basic heat sink) left and right blow hole 62 screw hole 71 screw hole portion 72 screw portion 80 large heat sink 81a (large heat sink) vertical blow hole 82 screw hole

Claims (4)

[Claims] 1. A cooling structure for a semiconductor module of an electronic device, wherein one or more heat radiating members are mounted on an upper part of the semiconductor module, and a fan device is mounted on an upper end of the heat radiating member. A unit-type cooling structure for electronic equipment, characterized in that: 2. The unit-type cooling structure for an electronic device according to claim 1, wherein the heat radiating member has a substantially rectangular parallelepiped shape in a plan view, and a plurality of ventilation holes are provided in a vertical direction of the heat radiating member. 3. A unit type electronic device according to claim 2, wherein a plurality of air blowing holes are provided in the heat radiating member in contact with an upper portion of the semiconductor module among the heat radiating members. Cooling structure. 4. A structure in which screw holes are provided at four corners of the heat dissipating member in plan view, and the heat dissipating members are fixed by screws that can be housed in the screw holes and that can be continuously screwed. The unit-type cooling structure for an electronic device according to claim 1.