JP2002232172A - Heat radiating device for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the heat radiating device of electronic components which sufficiently secures a space where heat is generated from electronic components and reduces the capacity and the weight of a heat-radiating member much more than a conventional one, while it has superior heat radiating effect, and in which an electronic unit body can be miniaturized and lightened. SOLUTION: Heat, generated from the electronic components can be radiated, even in the space where heat is not radiated in a conventional case, by simultaneously cooling a plurality of electronic components by one heat-radiating member. Thus, an electronic circuit of high heat radiation can be cooled and an electronic unit can be miniaturized and lengthened, by reducing the capacity and weight of the heat radiating member with the integration of the heat radiating member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating device for electronic components, and more particularly to a device for radiating electronic components on a printed wiring board to be mounted on various electronic devices such as a television, a video, a radio, a disk drive, a tape player, and a disk player. According to the heat dissipating device, the high heat generated from the electronic component is quickly released to the outside and the outside, and at the same time, the other components in the electronic device which are weak to heat are protected from the high heat while protecting the electronic component from the high heat, and The present invention relates to a heat radiating device for an electronic component which can reduce the size and weight of the electronic device body.

[0002]

2. Description of the Related Art A conventional radiator will be described below.

FIG. 12 is a front view showing a basic structure of a conventional heat radiating device for electronic parts. The conventional heat radiating device for an electronic component includes a printed wiring board 2 on which various electronic components 1 are mounted, a heat radiating member 3 for radiating heat generated from the electronic component 1, and the electronic component 1 and the heat radiating member 3. It is constituted by a heat conducting part 4 interposed between the two. An electronic device such as a television uses the printed wiring board 2 on which a large number of the electronic components 1 are mounted. Since the electronic components 1 generally generate heat during use, the electronic components 1 generate a large amount of heat. If left unattended, the electronic component 1 and other components in the electronic device will be damaged by high heat, and as a result, each component will not be able to perform its desired function, and eventually the electronic device will be able to operate. There is a risk of disappearing.

Therefore, in order to prevent the generation of such high heat, heat is radiated to the outside by using the heat radiating member 3 such as a heat sink for each of the electronic components 1. The heat sink is formed of an aluminum plate having a plurality of fins 3a to increase the surface area, and the air passing between the fins 3a exchanges heat with the fins 3a to reduce the temperature of the heat sink and the electronic component 1. Lower.

[0005]

However, in the conventional heat radiating device, a large heat radiating member is required for an electronic component that generates a large amount of heat. Since a wiring board, a housing, or another electronic component is close to the electronic component, the heat dissipating member interferes with the heat dissipating member of the printed wiring board, the housing, the electronic component, or the proximate electronic component. Therefore, there is a problem that a heat radiating member having a desired function cannot be used.

Therefore, in order to use the heat radiation member, it is necessary to increase the size of the printed wiring board or to increase the interval between the printed wiring boards, resulting in a problem that the size and weight of the electronic device main body are increased. Had a point.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has a sufficient space for releasing heat generated from the electronic component. An object of the present invention is to provide a heat radiating device for an electronic component capable of reducing the volume and the weight as compared with the related art and reducing the size and weight of the electronic device body.

[0008]

In order to achieve this object, a heat radiating device according to the present invention comprises: a printed wiring board on which a plurality of electronic components are mounted; a heat radiating member for radiating heat generated from the electronic components; In a heat radiating device for an electronic component having a heat conducting component interposed between the electronic component and the heat radiating member, a plurality of the heat radiating members are used to secure a space for releasing heat generated from the electronic component. Wherein the electronic components are simultaneously cooled.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is to simultaneously cool a plurality of electronic components with one heat radiating member.

[0010] The heat dissipating member is provided with a protruding portion at a portion facing the electronic component, and each protruding portion is formed such that a distance between the protruding portion and the corresponding electronic component is the same. It is.

Further, the heat dissipating member is installed in parallel with the printed wiring board, and the printed wiring board is installed horizontally, wherein at least one vent hole is provided near a center of the heat dissipating member. It is.

Further, in a configuration in which the heat radiating member is installed in parallel with the printed wiring board and the printed wiring board is installed vertically, the heat radiating member is for discharging air on the printed wiring board side to the outside. It has at least one or more ventilation holes and guides. It should be noted that it is effective to provide the ventilation hole above the heat radiating member for the reason described later.

[0013] Further, in a configuration in which the heat radiating member is installed in parallel with the printed wiring board and the printed wiring board is installed vertically, the heat radiating member serves to introduce air from the outside to the printed wiring board side. those comprising at least one vent and guide. In addition, it is effective to provide this ventilation hole especially below the heat radiating member for the reasons described later.

Further, the heat radiating member has at least one or more ventilation holes near the high heat-generating electronic component.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the heat radiating device for electronic parts of the present invention will be described below with reference to the television receiver shown in FIG. The television receiver includes a printed wiring board 2 on which various electronic components 1 and a heat radiating member 3 are attached, a display 8 and a housing 9.
It is constituted by.

(Embodiment 1) FIG. 1 shows a basic configuration of Embodiment 1 of the present invention, and shows a heat radiator in a case where the printed wiring board is horizontally installed by a front view. As in the conventional example shown in FIG. 12, the printed wiring board 2 to which the electronic component 1 is attached, the heat radiating member 3 that emits heat generated from the electronic component 1, the electronic component 1, and the heat radiation It is constituted by a heat conducting part 4 interposed between the member 3.

The present embodiment is different from the conventional example in that in the conventional example, the electronic components 1 are individually cooled by the individual heat radiating members 3, but in the present embodiment, a plurality of the electronic components 1 are combined into one. The heat is simultaneously cooled by the heat radiating member 3. Also, by providing a projecting portion 5 projecting toward the printed wiring board at a position corresponding to the electronic component 1 of the heat radiation member 3,
At the same time as improving the heat conduction efficiency, interference between the heat radiating member 3 and the electronic component 1 that does not require heat radiation is prevented.

Further, by providing a plurality of ventilation holes 6 near the center of the heat radiating member 3, the heat radiating effect is improved, and at the same time, the temperature rise of the electronic component 1 not cooled by the heat radiating member 3 is prevented. In.

Next, the cooling mechanism of the heat radiating device of the present embodiment will be described with reference to the schematic views of the heat radiating plate 1 shown in FIGS. In the above-described conventional configuration, the electronic component that generates a large amount of heat requires the large heat-dissipating member. However, due to the miniaturization of the electronic device and the high-density mounting of the printed wiring board, the printed wiring board and the housing Alternatively, since the other electronic component is close to the electronic component, the desired function of the heat dissipation member to interfere with the adjacent printed circuit board, the housing, the electronic component or the heat dissipation member of the adjacent electronic component. However, there is a problem that the heat dissipating member having the above cannot be used.

On the other hand, in the present embodiment, as shown in FIG. 1, a plurality of electronic components are simultaneously cooled by one heat radiating member, so that the heat generated from the electronic components can be obtained even in a space where heat is not radiated so far. , The electronic circuit having high heat generation can be further cooled, and at the same time, the size and weight of the electronic device can be reduced by reducing the volume and weight of the heat radiation member due to the aggregation of the heat radiation members.

Also, as shown in FIG. 1, projecting portions projecting toward the printed wiring board are provided at portions of the heat radiating member corresponding to the electronic components, and each projecting portion has an interval between the corresponding electronic component. By forming the protrusions so as to be the same, the thickness of the heat conductive component interposed between the electronic component having a low height and the heat radiating member is increased so that the heat transfer efficiency is reduced. At the same time, interference between the heat radiating member and the electronic component that does not require heat radiation can be prevented.

Further, by providing a plurality of ventilation holes near the center of the heat radiation member as shown in FIG. 2, (a) of FIG.
By discharging air between the heat radiating member and the printed wiring board through a vent as shown in FIG. 5, by introducing air from a gap between the heat radiating member and the printed wiring board on the outer periphery of the heat radiating member, The heat radiating surface of the heat radiating member on the side of the printed wiring board can function effectively and the heat radiating effect can be improved, and at the same time, the temperature rise of the electronic component not cooled by the heat radiating member can be prevented.

Further, as shown in FIG. 2B, by utilizing the convection of FIG. 2A to generate convection on the upper portion of the heat radiating member, the heat radiation effect can be improved. For the above reason, it is preferable to provide the ventilation hole near the center.

(Embodiment 2) FIG. 3 shows a basic structure of Embodiment 2 of the present invention. FIG. 3 is a front view showing a heat radiator when the printed wiring board is installed vertically. As in the conventional example shown in FIG. 12, the printed wiring board 2 to which the electronic component 1 is attached, the heat radiating member 3 that emits heat generated from the electronic component 1, the electronic component 1, and the heat radiation It is constituted by a heat conducting part 4 interposed between the member 3.

The present embodiment differs from the conventional example in that the electronic components 1 are individually cooled by the individual heat radiating members 3 in the conventional example, but in the present embodiment, a plurality of the electronic components 1 are The heat is simultaneously cooled by the heat radiating member 3.

A projecting portion 5 projecting toward the printed wiring board is provided at a portion of the heat radiation member 3 corresponding to the electronic component 1.
Is provided, the heat conduction efficiency is improved, and at the same time, interference between the heat radiating member 3 and the electronic component 1 that does not require heat radiation is prevented. Furthermore, by providing the heat radiating member 3 with the ventilation hole 6 having a plurality of guides 7, the heat radiating effect is improved, and at the same time, the temperature rise of the electronic component 1 not cooled by the heat radiating member 3 is prevented. I have.

Next, the cooling mechanism of the heat radiating device of this embodiment will be described with reference to FIGS. 3, 4 and 7 which are schematic diagrams showing the shapes 2 and 5 of the heat radiating plate. The problem with the conventional configuration described above, the effect of simultaneously cooling a plurality of the electronic components with one heat radiating member in the present embodiment, the portion of the heat radiating member corresponding to the electronic component protruding toward the printed wiring board. The effect of providing the protrusion is the same as that of the first embodiment.

Further, in the structure in which the heat radiating member is provided in parallel with the printed wiring board and the printed wiring board is provided vertically, a downward opening is provided on the printed wiring board side of the heat radiating member. By providing a plurality of ventilation holes having a guide having a portion, air between the heat radiation member and the printed wiring board is exhausted from the ventilation hole, and the heat radiation member and the printed wiring board below the heat radiation member By introducing air through the gap,
The heat radiating surface of the heat radiating member on the side of the printed wiring board can function effectively to improve the heat radiating effect, and at the same time, it is possible to prevent the temperature of the electronic component not cooled by the heat radiating member from rising.

Further, by providing a plurality of ventilation holes having a guide having an upward opening on the printed wiring board side of the heat radiation member, air is supplied from the ventilation hole between the heat radiation member and the printed wiring board. Introducing and discharging air from a gap between the heat radiating member above the heat radiating member and the printed wiring board, effectively functioning a heat radiating surface of the heat radiating member on the printed wiring board side, and improving a heat radiating effect. At the same time, it is possible to prevent the temperature of the electronic component not cooled by the heat radiating member from rising.

Further, for the following reason, the plurality of ventilation holes having a guide having a downward opening on the printed wiring board side of the heat radiating member are provided above the heat radiating member and upward on the printed wiring board side of the heat radiating member. It is effective to provide a plurality of ventilation holes having a guide having an opening below the heat radiation member. FIG. 10 is a distribution diagram of the ambient temperature in the present embodiment. The ambient temperature on the printed wiring board side and the opposite side at the same height is higher on the printed wiring board side.

This is because the presence of the printed circuit board in addition to the presence of the electronic component, which is a heating element, restricts the ingress and egress of air, and furthermore, convection does not sufficiently occur because the electronic component becomes an obstacle. It is. In such a case, discharging the air on the printed wiring board side above the heat radiation member improves the heat radiation effect.

This is because the ambient temperature on the opposite side of the printed wiring board is high above the heat radiating member, so that introducing air there to the printed wiring board has little effect, and there is no obstacle on the introduction side. When the air on the printed circuit board side is exhausted, the air that is heated is released into the open space. This is because air can be discharged without lowering the heat radiation effect on the opposite side, and the amount of discharge is large because there are no obstacles on the discharge side.

Conversely, when air is introduced into the printed wiring board below the heat radiating member, the heat radiating effect is improved. This is because there is not much difference in the heat radiation effect due to the introduction and discharge of air because there is not much difference in the ambient temperature below the heat radiating member. This is because the ambient temperature can be reduced.

In the above embodiment, the guide 7 is provided on the printed wiring board side. However, as shown in FIGS. 5, 6, 8 and 9, the guide 7 is provided on the opposite side of the printed wiring board or on both sides. Needless to say, it is good. In addition, the specific shapes and structures of the respective parts shown in the above embodiments are merely examples of the embodiment of the present invention, and the technical scope of the present invention is limited by these. It must not be interpreted.

(Embodiment 3) FIGS. 11 and 12 show the basic structure of Embodiment 3 of the present invention, and show a heat radiator in the case where a two-layer printed wiring board is installed.
As shown in the drawing, the upper printed circuit board 22 and the lower printed circuit board 21 have a configuration in which electronic components are sandwiched therebetween.
As in the conventional example, the electronic component 1 is placed on the lower printed circuit board 21.
The electronic component 12 is disposed on the upper printed circuit board 22. In FIG. 12, the electronic component 11 on the lower printed circuit board 21 is hatched to
Is distinguished.

Here, the upper printed board 22 and the lower printed board 21 are provided with heat radiating members 32 and 31 which are integrally formed so as to be in contact with the electronic components 12 and 11 disposed respectively. The heat radiating members 31 and 32 are made of a material having high thermal conductivity, and the electronic components 1 having different heights are provided.
1 and 12 are contacted via the heat conducting component 40 or directly, and absorb heat generated in the electronic components 11 and 12. With this configuration, the electronic component 11,
The heat generated in the heat dissipation members 12 and 3 has a large heat capacity.
2 can be transmitted and heat can be efficiently dissipated.

A gap is formed between the heat dissipating members 31 and 32 due to the arrangement of the electronic components. A heat dissipating fin 70 as shown in FIG. 12 is provided in the gap, and ventilation holes 61 and 62 are further provided. Thus, heat can be more efficiently dissipated.

That is, as shown in FIGS. 11 and 12,
Vent holes 61 and 62 are provided in portions where the electronic components 11 and 12 as heat generating sources are not arranged, and the vent holes 61 and 62 are provided.
If the radiating fins 70 are arranged radially from the electronic components 11 and 12, the heat generated by the electronic components 11 and 12 heats the nearby air, and the heated and expanded air is guided by the radiating fins 70 and the ventilation holes are formed. It goes to 61 and 62 and will be emitted outside.

By thus integrally molding the heat radiating member with a member having high thermal conductivity, heat can be efficiently radiated even on a printed circuit board having a complicated structure in which a plurality of electronic components having different heights are arranged. Becomes possible.

When the distance between the upper printed board 22 and the lower printed board 21 is small and it is impossible to provide a heat radiating member for each, it is also possible to provide one heat radiating member 30 as shown in FIG. Is possible. That is, since the heat radiating member 30 is integrally molded, it can be molded even in a complicated shape. In accordance with the arrangement of the electronic components 11 and 12, the projecting portion 50 is formed with respect to the electronic components 11 and 12 having different heights. Thus, efficient heat radiation can be achieved by providing direct contact via the heat conducting component 40 or by providing the radiation fins 70.

Here, if the ventilation holes 62 are provided at positions corresponding to the radiation fins 70, the heated air is
When passing through the zero portion, it is released to the outside from the vent hole 62, and more efficient heat dissipation is possible.

As long as the arrangement of the electronic components 11 and 12 permits, as described above, the ventilation holes 62 are provided at positions where these electronic components do not exist, and the radiation fins extend from the respective electronic components 11 and 12 toward the ventilation holes 62. Arranging 70 enables more efficient heat radiation.

[0043]

The present invention is embodied in the form described above, and has the following effects.

By simultaneously cooling a plurality of electronic components with one heat radiating member, the heat generated from the electronic components can be released even in a space where heat is not radiated so far. At the same time as cooling can be performed, the size and weight of the electronic device can be reduced by reducing the volume and weight of the heat radiating member due to the aggregation of the heat radiating members.

The heat dissipating member is provided with a projection at a position facing the electronic component, and each projection is formed so that the distance between the projection and the corresponding electronic component is the same. Accordingly, it is necessary to prevent the heat conducting component interposed between the electronic component having a low height and the heat dissipating member from being increased in thickness and heat conduction efficiency from deteriorating, and at the same time to dissipate heat from the heat dissipating member. Can be prevented from interfering with the electronic component.

Further, in the configuration in which the heat radiating member is installed in parallel with the printed wiring board and the printed wiring board is installed horizontally, at least one vent hole is provided near the center of the heat radiating member. By discharging the air between the heat radiating member and the printed wiring board and effectively functioning the heat radiating surface of the heat radiating member on the printed wiring board side, the heat radiating effect can be improved at the same time. The temperature rise of the electronic component not cooled by the heat radiating member can be prevented.

Further, in a configuration in which the heat radiating member is installed in parallel with the printed wiring board and the printed wiring board is installed vertically, the heat radiating member is for discharging air on the printed wiring board side to the outside. By providing at least one ventilation hole and a guide, air between the heat radiating member and the printed wiring board is exhausted, and the heat radiating surface of the heat radiating member on the printed wiring board side functions effectively, so that heat is radiated. The effect can be improved, and at the same time, the temperature rise of the electronic component that is not cooled by the heat radiating member can be prevented.

Further, in the configuration in which the heat radiating member is installed in parallel with the printed wiring board and the printed wiring board is installed vertically, the heat radiating member is used for introducing air from outside to the printed wiring board side. By providing at least one ventilation hole and a guide, air is introduced between the heat radiating member and the printed wiring board, and the heat radiating surface of the heat radiating member on the printed wiring board side functions effectively, thereby dissipating heat. The effect can be improved, and at the same time, the temperature rise of the electronic component that is not cooled by the heat radiating member can be prevented.

Further, the heat radiating member is provided with at least one or more ventilation holes near the high heat generating electronic component, so that the air near the high heat generating electronic component can be efficiently discharged to the outside. I can do it.

[Brief description of the drawings]

FIG. 1 is a front view showing a basic configuration of a heat radiating device for an electronic component according to a first embodiment of the present invention.

FIG. 2 shows a shape 1 of a heat sink according to the first embodiment of the present invention.
Schematic diagram showing

FIG. 3 is a front view showing a basic configuration of a heat radiating device for electronic components according to second and third embodiments of the present invention.

FIG. 4 is a view showing a shape 2 of a heat sink according to a second embodiment of the present invention.
Schematic diagram showing

FIG. 5 shows a shape 3 of a heat sink according to a second embodiment of the present invention.
Schematic diagram showing

FIG. 6 shows the shape 4 of the heat sink in the second embodiment of the present invention.
Schematic diagram showing

FIG. 7 shows a shape 5 of a heat sink according to the second embodiment of the present invention.
Schematic diagram showing

FIG. 8 shows a shape 6 of a heat sink according to the second embodiment of the present invention.
Schematic diagram showing

FIG. 9 shows the shape of a heat sink 7 in the second embodiment of the present invention.
Schematic diagram showing

FIG. 10 is a distribution diagram of ambient temperature in a second embodiment of the present invention.

FIG. 11 is a diagram showing a configuration of an electronic component heat dissipation device according to a third embodiment of the present invention.

FIG. 12 is a view showing an arrangement of heat radiation fins of an electronic component according to a third embodiment of the present invention.

FIG. 13 is a diagram showing a configuration of a heat radiating device for an electronic component according to a third embodiment of the present invention.

FIG. 14 is a partial cross-sectional view when the present embodiment is applied to a television receiver.

FIG. 15 is a front view showing a basic configuration of a conventional heat radiating device for electronic components.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Printed wiring board 3 Heat dissipation member 3a Fin 4 Heat conduction component 5 Projection part 6 Vent hole 7 Guide

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Hiroto Inoue 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E322 AA01 AA11 AB06 BA01 BA04 BA05 FA04 5F036 AA01 BB01 BB05 BB21 BC33

Claims (7)

[Claims] A wiring board on which a plurality of electronic components are mounted; a heat radiating member for radiating heat generated from the electronic components to the outside; and a heat conductive component interposed between the electronic components and the heat radiating member. In a heat radiating device for electronic components having
A heat radiating device for an electronic component, wherein a plurality of the electronic components are simultaneously cooled by one heat radiating member. 2. The heat dissipating member is provided with a projection at a portion facing the electronic component, and each projection is formed such that a distance between the projection and the corresponding electronic component is the same. The heat radiating device for an electronic component according to claim 1, wherein: 3. The heat dissipating member is installed in parallel with the wiring board, and in a configuration in which the wiring board is installed horizontally, at least one vent hole is provided near a center of the heat dissipating member. The heat radiating device for an electronic component according to claim 1. 4. In a configuration in which the heat radiating member is installed in parallel with the wiring board and the wiring board is installed vertically, the heat radiating member has a ventilation hole for discharging air on the wiring board side to the outside. 2. The heat radiating device for an electronic component according to claim 1, further comprising at least one or more guides. 5. In a configuration in which the heat radiating member is installed in parallel with the wiring board and the wiring board is installed vertically, the heat radiating member is a ventilation hole for introducing air from the outside to the wiring board side. 2. The heat radiating device for an electronic component according to claim 1, further comprising at least one or more guides. 6. The heat radiating device for an electronic component according to claim 1, wherein the heat radiating member has at least one or more ventilation holes near the electronic component that generates high heat. 7. A heat radiating device for an electronic component, comprising: a wiring board on which a plurality of electronic components having different heights are arranged; and a heat radiating member that radiates heat generated in the electronic component to the outside. The member has a protrusion at a position corresponding to the electronic component, and at the protrusion, contacts the electronic component directly or via a heat conducting member, and has at least one ventilation hole. A heat radiating device for an electronic component, wherein a heat radiating fin is arranged in a direction facing the projection.