JPH10173371A - Housing structure of electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently radiate the heat from a housing through its surface by providing a heat sink to radiate the heat from the housing with a heat sink radiating surface, exposed to the housing bottom face. SOLUTION: A housing 10 has a wide opening 13 at the bottom. A high- thermal conductivity metal sheet, such as Al sheet to be a heat sink 14 is fixed to the opening 13 through a drip- and dust-proof packing 15 and exposed to the air, except its fixing parts. The exposed surface of the heat sink 14 in the same plane as the housing bottom face occupies of this bottom face. Owing to the structure being made of high thermal conductivity Al sheet, the heat radiation from the housing 10 to outside can be made efficient.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing structure of an electronic device relating to heat radiation inside the device.

[0002]

2. Description of the Related Art In an electronic device, particularly an electronic device having no ventilation hole for heat radiation, heat generated from the inside is radiated to the outside air via a housing surface. Therefore, it is desirable that the housing structure of the electronic device is configured to efficiently radiate heat from the inside of the housing to the outside of the housing.

[0003] Referring to FIG. 3, a housing structure of a conventional electronic device will be described.

The housing 1 is made of a resin material such as ABS to reduce the size and weight of the device. A display window 2 is formed on the upper surface of the housing 1, and the display window 2 is closed from the inside. 1
The LCD 3 is provided on the ceiling. The inside of the housing 1 is partitioned into an upper space 5 and a lower space 6 by a wiring board 4 horizontally hung on left and right side walls. An electronic component 7 such as an integrated circuit or a transistor, which is a main heating element inside the housing 1, is fixed on the lower surface of the wiring board 4, and a heat sink for cooling the electronic component 7 is mounted on the lower surface of the electronic component 7. 8 is attached.

The heat generated from the electronic component 7 is transmitted to the heat sink 8, and the air heated through the heat sink 8 is diffused into the lower space 6.

[0006]

Since the inside of the housing 1 is partitioned into the upper space 5 and the lower space 6 by the wiring board 4, heat from the electronic components 7 is transmitted through the heat sink 8. Although the heat is radiated into the lower space 6, the heat in the lower space 6 is hardly transferred to the upper space 5. Further, the transfer of heat from the lower space 6 to the outside of the housing 1 is not efficient because it passes through the surface of the housing 1 made of a resin material such as ABS having a low thermal conductivity.

[0007] As described above, in the housing of a conventional electronic device,
There is a problem that heat is not efficiently released from the inside of the housing to the outside air via the housing surface.

The present invention has been made in view of the above circumstances, and provides a housing structure of an electronic device that can efficiently radiate heat from the inside of the housing to the outside air via the housing surface.

[0009]

SUMMARY OF THE INVENTION The present invention relates to a housing structure of an electronic device having a heat sink for radiating heat inside a housing, and a heat radiating surface of the heat sink is exposed at a bottom surface of the housing. Further, the heat sink relates to a housing structure of an electronic device having a radiating fin, and further relates to a housing structure of the electronic device in which a heating element inside the device and the heat sink are brought into contact. .

By exposing the heat sink to the surface of the case, the efficiency of heat radiation from the inside of the case to the outside of the case is improved.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 1, a housing 10 is formed of a resin material such as ABS to reduce the size and weight of the device. A display window 11 is formed on the upper surface of the housing 10 and the display window 11 is closed from the inside. An LCD 12 is provided on the ceiling of the housing 10 so as to perform the above operation. The bottom of the housing 10 has a large opening,
A heat sink 14 made of a thin metal plate such as Al having a high thermal conductivity is fixed to the opening 13 via a packing 15 for drip-proof and dust-proof. The heat sink 14 occupies most of the bottom surface of the housing 10 on substantially the same plane as the bottom surface of the housing 10 except for the fixing portion, and is exposed to the outside air.

The interior of the housing 10 is divided into an upper space 17 and a lower space 18 by a wiring board 16 horizontally extending between left and right side walls. An electronic component 19 such as an integrated circuit or a transistor, which is a main heating element inside the housing 10, is fixed to the center of the lower surface of the wiring board 16 so as to face the heat sink 14.

The air heated by the heat generated by the electronic component 19 transfers heat to the heat sink 14, and the heat sink 14 radiates heat to the outside air.

As described above, the heat sink 14 occupies most of the bottom surface of the housing 10 on substantially the same plane as the bottom surface of the housing 10 except for the peripheral portion for fixing, and is exposed to the outside air. The case 1 is made of a thin metal plate such as Al having high conductivity.
Heat can be efficiently radiated from the inside to the outside of the housing 10.

Next, another embodiment of the present invention will be described with reference to FIG. In FIG. 2, the same components as those in FIG. 1 are denoted by the same reference numerals.

A bottom surface of the casing 10 is open, and a heat sink 14 made of a metal having high thermal conductivity, such as Al, is fitted into the opening 13 via a packing 15 for drip-proof and dust-proof. Fins 20 are formed outside the heat sink 14. The fins 20 are exposed to the outside air from the opening 13 on substantially the same plane as the bottom surface of the housing 10.

The inside of the housing 10 is divided into an upper space 17 and a lower space 18 by a wiring board 16 horizontally extending between left and right side walls. An electronic component 19 is mounted on the lower surface of the wiring board 16 at a position facing the heat sink 14, and the electronic component 19 comes into close contact with the heat sink 14.

The heat generated by the electronic component 19 is conducted to the heat sink 14 and is radiated to the outside air through the heat sink 14.

As described above, since the heat sink 14 has the fins 20 formed thereon to increase the surface area, and since the heat sink 14 is in solid contact with the electronic component 19, the heat of the electronic component 19 is reduced by the heat sink 14. The heat is efficiently radiated to the outside of the housing 10 through the.

[0021]

As described above, according to the present invention, the heat sink is mounted so as to be exposed to the outside of the housing, and the heat generating element inside the housing and the heat sink are in solid contact with each other. The heat exchange with the outside of the body is efficiently performed, the heat dissipation function of the housing is improved, and an excellent effect that the reduction in size and weight of the housing can be promoted is exhibited.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an embodiment of the present invention.

FIG. 2 is a schematic sectional view showing another embodiment of the present invention.

FIG. 3 is a schematic sectional view showing a conventional example.

[Explanation of symbols]

 10 case 14 heat sink 20 fin

Claims (3)

[Claims] 1. A housing structure for an electronic device, comprising: a heat sink for radiating heat inside the housing, wherein a heat radiating surface of the heat sink is exposed on a bottom surface of the housing. 2. A housing structure for an electronic device according to claim 1, wherein said heat sink has a radiating fin. 3. The housing structure of an electronic device according to claim 1, wherein a heat generating element inside the device and the heat sink are brought into contact with each other.