JP2001144483A - Structure for cooling printed board unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure for cooling a printed board unit which can cool appropriately the printed board unit even if electronic parts composed of high heat generating elements are mounted to both surfaces of the printed board built in an electronic device, by cooling the electronic parts appropriately close to the enclosure of the electronic device. SOLUTION: A cooling air is distributed on one mounting surface side of a printed board where the electronic parts are mounted to its both surfaces, and the electronic parts mounted to the other mounting surface side of the printed board are close to the enclosure of an electronic device. In such a structure for cooling a printed board unit, a cooling fan is provided to distribute a cooling air to the other mounting surface side of the printed board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure of a printed circuit board unit in which electronic components are mounted on both sides of a printed circuit board, and more particularly, to efficient cooling of an electronic component close to a housing of an electronic device. The present invention relates to a cooling structure of a printed board unit to be realized.

[0002]

2. Description of the Related Art In recent years, electronic devices such as information processing devices have
In order to meet the demand for increased processing capability, high-performance, high-performance CPUs have been mounted. There is also a tendency to expand the scalability of the system. For this reason, the power consumption of elements and devices is gradually increasing. On the other hand, electronic devices such as information processing devices have become smaller and thinner, and in particular, the temperature of printed circuit board units on which electronic components are mounted has risen, and the temperature inside the device and the surface temperature of the housing have risen. There is a demand for efficient heat radiation treatment in a closed space.

FIG. 7 shows a mounting form of a portable electronic device.
The portable electronic device 51 includes a main body 51a and a main body 51a.
Display unit 5 which is rotatably connected to a fulcrum part via a fulcrum part 51c.
1b. A printed board unit 60 is provided inside the main body 51a and is close to the lower surface of the apparatus. On the upper surface of the printed board unit 60, an electronic component 61a made of a high heating element is mounted, and on the lower surface of the printed board unit 60, an electronic component 6 made of a high heating element is mounted.
1b is mounted.

FIG. 8 shows a mounting form of a desktop electronic device. The desktop electronic device 52 includes a printed board unit 60 adjacent to the lower surface of the device. The printed board unit 60 has an electronic component 61a made of a high heat generating element mounted on the upper surface, and connects a sub-printed board unit 60a used for, for example, system expandability via a connector. An electronic component 61b made of a high heat generating element is mounted on the lower surface.

FIG. 9 shows a mounting form of a self-contained electronic device.
The self-contained electronic device 53 includes a printed board unit 60 adjacent to one side surface of the device. The printed board unit 60 has an electronic component 61a made of a high heat-generating element mounted on the other side surface of the apparatus, and connects a sub-printed board unit 60a used for, for example, system expandability via a connector. An electronic component 61b made of a high heat generating element is mounted on one side surface of the device.

FIG. 10 shows a diagram of the prior art.
In the figure, a main body 5 constituting a portable electronic device 51 is shown.
The heat generated by the electronic component 61a composed of a high heat generating element mounted on the upper surface of the printed board unit 60 provided inside 1a is exhausted by the cooling fan 82 to the outside of the apparatus.

On the other hand, an electronic component 61b made of a high heat-generating element mounted on the lower surface of the printed board unit 60 has a heat radiating member 71 formed of a material having good heat conductivity on its surface, and the heat radiating member 71 is a portable type. It is in contact with and thermally connected to a housing 55 constituting the electronic device 51. Electronic component 61b
Is transmitted to the housing 55 via the heat radiating member 71,
Heat is radiated from the surface of the housing 55.

FIG. 11 shows a diagram of the prior art.
In the figure, a printed board unit 60 is provided inside an electronic device 54 composed of a desktop electronic device. The heat generated by the electronic component 61a composed of the high heat generating element mounted on the sub-printed board unit 60a connected to the upper surface of the printed board unit 60 is exhausted to the outside of the apparatus by the cooling fan 82.

On the other hand, an electronic component 61b made of a high heat generating element mounted on the lower surface of the printed board unit 60 is provided with a heat radiating member 71 formed of a material having good thermal conductivity on the surface thereof. And is thermally connected to the housing 55 constituting the housing 54. The heat generated by the electronic component 61b is transferred to the housing 55 via the heat radiating member 71, and
The heat is radiated from the surface of 5. Note that the same cooling structure is employed in self-contained electronic devices.

[0010]

As described above, the prior art has the following problems.

1) When a heat radiation member is installed on an electronic component,
Depending on the positioning and fixing structure of the heat radiating member, the production quality of the contact surface with the electronic component or the contact surface with the housing cannot be ensured, heat transfer becomes insufficient, and sufficient cooling may not always be obtained.

2) For this reason, the electronic components close to the housing of the electronic device cannot be cooled appropriately, and it is necessary to limit the heat generation of the electronic components or the number of mounted electronic components. Therefore, the mounting density of the printed board is reduced, and the size of the electronic device cannot be reduced.

An object of the present invention is to appropriately cool an electronic component close to a housing of an electronic device.

[0014] Accordingly, the present invention is to suitably cool a printed board unit even when electronic components comprising high heat generating elements are mounted on both sides of a printed board incorporated in an electronic device.

Another object of the present invention is to improve the mounting density of a printed circuit board and reduce the size of an electronic device.

[0016]

In order to solve the above problems, the present invention employs the following means.

Electronic components are mounted on both sides of the printed circuit board, and cooling air is circulated on one mounting surface side of the printed circuit board so that the electronic components mounted on the other mounting surface of the printed circuit board come close to the housing of the electronic device. Cooling system for cooling a printed board unit consisting of a main board incorporated in a portable electronic device, a desktop electronic device, or a self-contained electronic device arranged in such a manner that the cooling air flows to the other mounting surface side of the printed board. Is provided.

By taking the above measures, it is possible to efficiently cool the electronic components close to the housing of the electronic device, and to mount the electronic components comprising the high heat generating elements on both sides of the printed board. Cool the unit suitably. Further, the mounting density of the printed board is improved.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention has the following embodiments.

As shown in FIG. 1, the cooling structure of the printed board unit has a structure in which electronic components are mounted on both sides of the printed board, cooling air flows on one mounting face side of the printed board, and the cooling air flows on the other mounting face of the printed board. In the cooling structure of the printed board unit in which the mounted electronic component 11b is close to the housing of the electronic device, a cooling fan 12 that circulates cooling air is provided on the other mounting surface side of the printed board.

[0021] By adopting the above-mentioned form, the electronic parts close to the housing of the electronic equipment can be efficiently cooled, and the electronic parts comprising high heat generating elements on both sides of the printed board incorporated in the portable electronic equipment. The printed circuit board unit is suitably cooled even if is mounted. Further, the mounting density of the printed board is improved.

Further, as shown in FIG. 4, the cooling structure of the printed board unit has a structure in which electronic components are mounted on both sides of the printed board, and the cooling air is supplied to the sub-printed board unit 10a mounted on one mounting surface side of the printed board. In the cooling structure of the printed circuit board unit in which the electronic component 11b mounted on the other mounting surface of the printed circuit board is close to the housing 5 of the electronic device, the cooling air flowing through the other mounting surface side of the printed circuit board is cooled. A fan 12 is provided.

By adopting the above-described embodiment, the electronic parts close to the housing of the electronic equipment can be efficiently cooled, and high heat generation occurs on both sides of the printed board incorporated in the desktop electronic equipment or the self-contained electronic equipment. The printed board unit is suitably cooled even when electronic components including elements are mounted.
Further, the mounting density of the printed board is improved.

Further, as shown in FIGS. 3A and 5, the cooling structure of the printed board unit is provided on the surface of the electronic component 11b composed of the high heat generating element mounted on the other mounting surface side of the printed board. A heat sink (16) formed of a material having good thermal conductivity to be installed and forming the cooling air passage (6) is provided.

By adopting the above configuration, the heat generated by the high heat generating element is radiated by the heat sink, and the cooling air is used to discharge the warm air, thereby improving the cooling efficiency of the electronic components close to the housing of the electronic device.

Further, as shown in FIGS. 3 (b) and 6, the cooling structure of the printed board unit is provided on the surface of an electronic component 11b composed of a high heat generating element mounted on the other mounting surface side of the printed board. The cooling air passage 6 and the heat transfer portion 22 to the housing 5 of the electronic device 2 are formed of a material having good thermal conductivity to be installed.
Is provided.

With the above configuration, the heat generated by the high heat generating element is transferred to the housing of the electronic device by the heat radiating member to radiate the heat from the surface of the electronic device, and the warm air is discharged by the cooling air. The cooling efficiency of the electronic components adjacent to the housing is improved.

Further, as shown in FIG. 2, the cooling structure of the printed board unit is provided with a cooling air passage 6 for circulating cooling air on the other mounting surface side of the printed board 13 and guiding the cooling air to an exhaust port. .

By adopting the above configuration, the cooling air is concentrated and supplied to the high heat generating element group mounted on the printed board, thereby improving the cooling efficiency of the electronic components close to the housing of the electronic device.

Further, as shown in FIG. 2, the cooling air passage 6 has an exhaust portion 14 formed on one side of the printed board 13 located on the exhaust side, and the cooling fan passage formed on the other mounting surface side of the printed board 13. And a duct 15 through which warm air of the printed board 12 flows.

By adopting the above configuration, by dividing one mounting surface and the other mounting surface of the printed board, cooling air is separated and distributed to each mounting surface, and
The heat generated by the electronic components adjacent to the housing of the electronic device is guided to the cooling fan to discharge warm air.

Further, as shown in FIG. 4B, the cooling fan 12 also discharges warm air of the sub-printed board unit 10 mounted on one of the mounting surfaces of the printed board.

By adopting the above-mentioned configuration, an electronic component mounted on both sides of a printed board or an electronic component close to a housing of an electronic device without adding a cooling fan,
The sub-printed board unit mounted on one of the mounting surfaces of the printed board is cooled by one cooling fan.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A typical embodiment according to the present invention will be described with reference to FIGS. In the following, the same portions are denoted by the same reference numerals, and detailed description may be omitted.

FIG. 1 shows a diagram of an embodiment of the present invention.

As shown in FIG. 7, a printed board unit 10 is provided in the main body 1a of the portable electronic device 1 in the vicinity of the lower surface of the apparatus. On the upper surface of the printed board unit 10, an electronic component 11a made of a high heat generating element is mounted, and on the lower surface of the printed board unit 10, an electronic component 1 made of a high heat generating element is mounted.
1b is mounted. Further, a cooling fan 12 is installed at a rear portion of the main body 1a. In FIG. 3A, the installation of the cooling fan 12 in the up-down direction is substantially at the center of the printed board unit 10. In FIG. 2B, the cooling fan 12 is installed vertically in the upper part of the printed circuit board unit 10.

FIG. 2 shows a diagram of an embodiment of the present invention.

FIG. 4 explains the cooling structure shown in FIG. 1B in detail. The electronic component 11b
The cooling air passage 6 which guides the heat generated by the cooling air to the cooling fan 12 through the cooling air is provided. The cooling air passage 6 forms an exhaust portion 14 having a cutout on one side located on the exhaust side of the printed board 13, and separates the mounting surface on the upper surface of the printed board from the mounting surface on the lower surface, thereby providing cooling. The wind is separated and distributed to each mounting surface. Further, the cooling air passage 6 forms a duct 15 for flowing the warm air of the electronic component 11 b to the cooling fan 12.

It is desirable that only the electronic components 11b that need to be cooled by the cooling fan 12 are arranged in a concentrated manner, and the duct 15 is formed so as to surround the electronic components 11b. In addition, the width of the exhaust portion 14 is made to match the width of the
To face.

The duct 15 does not require a special space to be installed at a predetermined position, and can be arranged by utilizing an existing space provided between the housing 5 and the electronic component 11b. Also, by appropriately setting the width direction of the duct 15, a large number of electronic components 11 b that need to be cooled by the cooling fan 12 are mounted, and the printed board 13 is mounted.
Mounting density can be increased.

FIG. 3 shows a diagram of an embodiment of the present invention.

In FIG. 6A, the electronic component 11b
Fins 17 formed of a material having good thermal conductivity, such as aluminum, on the surface of the heat sink 1 and forming a cooling air passage 6 through which cooling air flows between the fins 17
6 is installed. The heat sink 16 dissipates heat generated by the electronic component 11 b and discharges warm air by the cooling fan 12. The detailed description of installing the heat sink 16 will be described later.

In FIG. 2B, the electronic component 11b
Formed of a material having good thermal conductivity on the surface of
A heat dissipating member 21 forming a heat transfer portion 22 to the housing 5 of the main body 1a is installed. The heat dissipating member 21 includes the electronic component 11b.
And the housing 5 are thermally connected, and the cooling air is circulated. That is, the electronic component 11b
Is transferred to the housing 5 to radiate heat from the surface of the electronic device, and the cooling fan 12 discharges warm air. The detailed description of installing the heat radiating member 21 will be described later.

FIG. 4 shows a diagram of an embodiment of the present invention.

In the same drawing, similarly to FIG. 8 described above, for example, the electronic device 2 of the desktop type includes a printed board unit 10 close to the lower surface of the device. The printed board unit 10 has an electronic component 11a composed of a high heat generating element mounted on the upper surface, and connects, for example, a sub-printed board unit 10a used for system expandability or the like via a connector. An electronic component 11b made of a high heat generating element is mounted on the lower surface.

The cooling air passage 6 guides the heat generated by the electronic component 11 b through the cooling air and guides the warm air to the cooling fan 12.
It has. The cooling air passage 6 is used to distribute the warm air of the electronic component 11 b to the cooling fan 12.
Ducts 15 are formed on the lower surface of b and the cooling fan 12 side. In addition, similarly to FIG. 2 described above, the exhaust unit 14 in which one side located on the exhaust side of the printed board 13 has been cut out.
It is desirable to form

As shown in FIG. 4A, an electronic component 11a composed of a high heat generating element mounted on the sub-printed board unit 10a connected to the upper surface of the printed board unit 10.
The heat generated by the cooling fan 32 is discharged to the outside of the apparatus by the cooling fan 32.

As shown in FIG. 4B, the size of the cooling fan 12 is increased to generate heat of the electronic component 11b group and the electronic component 11a mounted on the sub-printed board unit 10a.
The heat generated by the cooling fan 12 is exhausted by the cooling fan 12. In this case, it is not necessary to add a cooling fan to cool the electronic component 11b adjacent to the housing of the electronic device.

FIG. 5 shows a diagram of an embodiment of the present invention.

Referring to FIG. 3, similarly to FIG. 3A, fins 17 are formed on the surface of the electronic component 11b by using a material having good thermal conductivity such as aluminum, and the space between the fins 17 is formed. A heat sink 16 that forms the cooling air passage 6 through which the cooling air flows is provided. Heat sink 1
Numeral 6 radiates heat generated by the electronic component 11b and discharges warm air by the cooling fan 12.

When the heat sink 16 is installed on the surface of the electronic component 11b as shown in FIG. 2B, the heat sink 16 is installed via a heat radiating sheet 18 made of an elastic material having good heat conductivity. In addition, heat generated by the electronic component 11b can be reliably transferred to the heat sink 16.

FIG. 6 shows a diagram of an embodiment of the present invention.

In the same drawing, as in the case of FIG. 3B, the surface of the electronic component 11b is formed of a material having good heat conductivity, and the cooling air passage 6 and the housing 5 of the electronic device 2 are formed. The heat dissipating member 21 forming the heat transfer part 22 is installed. The heat dissipating member 21 is for thermally connecting the electronic component 11b and the housing 5 and for flowing cooling air. That is, the heat generated by the electronic component 11b is transferred to the housing 5 to radiate heat from the surface of the electronic device, and the cooling fan 12 discharges warm air.

It is desirable that the heat radiating member 21 has elasticity. By appropriately pressing the surface of the electronic component 11 b and the housing 5, heat generated by the electronic component 11 b is applied to the housing 5 via the heat radiating member 21. Heat can be reliably transferred. Further, the surface of the electronic component 11b can be pressed with a relatively small pressing force, and the load on the leads of the electronic component 11b can be reduced by reducing the stress applied to the electronic component 11b.

[0055]

According to the present invention, the following effects can be expected.

Electronic components are mounted on both sides of the printed circuit board, and cooling air flows through one of the mounting surfaces of the printed circuit board so that the electronic components mounted on the other mounting surface of the printed circuit board are close to the housing of the electronic device. In the cooling structure of the board unit, by providing a cooling fan that circulates cooling air on the other mounting surface side of the printed board, it is possible to efficiently cool electronic components adjacent to the housing of the electronic device, and The printed board unit can be suitably cooled even when electronic components including high heat generating elements are mounted on both sides of the printed board built in the electronic device. Further, the mounting density of the printed board can be improved, and the size of the portable electronic device can be reduced.

Also, electronic components are mounted on both sides of the printed circuit board, and cooling air is circulated to the sub-printed board unit mounted on one mounting surface side of the printed circuit board to mount electronic components mounted on the other mounting surface of the printed circuit board. In the cooling structure of the printed circuit board unit that is close to the housing of the electronic device, a cooling fan that circulates cooling air is provided on the other mounting surface side of the printed circuit board so that the electronic components that are close to the housing of the electronic device can be efficiently used. It is possible to cool the printed board unit suitably even if electronic components including high heat generating elements are mounted on both sides of a printed board incorporated in a desktop electronic device or a self-contained electronic device. Further, the mounting density of the printed board can be improved, and the size of a desktop electronic device or a self-contained electronic device can be reduced.

Further, by providing a heat sink made of a material having good thermal conductivity and formed on a surface of an electronic component comprising a high heat generating element mounted on the other mounting surface side of the printed board and forming a cooling air passage, In addition to dissipating the heat generated by the high heat generating element by the heat sink, it can discharge the warm air by the cooling air, and can efficiently cool the electronic components adjacent to the housing of the electronic device.
Cooling efficiency can be improved.

Further, a cooling air passage and a cooling air passage formed on the surface of an electronic component comprising a high heat generating element mounted on the other mounting surface side of the printed circuit board to the housing of the electronic device are formed. By providing a heat dissipating member that forms a heat transfer section, the heat dissipating member can transfer heat generated by the high heat generating element to the housing of the electronic device and dissipate heat from the surface of the electronic device, and discharge warm air by cooling air. Can be
Electronic components close to the housing of the electronic device can be efficiently cooled, and cooling efficiency can be improved.

Further, by providing a cooling air passage on the other mounting surface side of the printed board for flowing the cooling air and guiding the cooling air to the exhaust port, the cooling air is concentrated on the group of high heat generating elements mounted on the printed board. The electronic components adjacent to the housing of the electronic device can be efficiently cooled, and the cooling efficiency can be improved.

Further, the cooling air passage has an exhaust portion formed on one side of the printed board located on the exhaust side, and a duct for flowing warm air of the printed board to the cooling fan on the other mounting surface side of the printed board. By providing one mounting surface and the other mounting surface of the printed board, cooling air can be separated and distributed to each mounting surface, and the electronic device close to the housing of the electronic device can be distributed. The heat generated by the components can be guided to the cooling fan to discharge warm air.

Further, the cooling fan also discharges the warm air of the sub-printing board unit mounted on one mounting surface side of the printed board, thereby mounting the cooling fan on both sides of the printed board without adding a cooling fan. The electronic component or the electronic component close to the housing of the electronic device and the sub-printed board unit mounted on one of the mounting surfaces of the printed board can be cooled by one cooling fan.

[Brief description of the drawings]

FIG. 1 is a diagram of an embodiment of the present invention.

FIG. 2 is a diagram of an embodiment of the present invention.

FIG. 3 is a diagram of an embodiment of the present invention.

FIG. 4 is a diagram of an embodiment of the present invention.

FIG. 5 is a diagram of an embodiment of the present invention.

FIG. 6 is a diagram of an embodiment of the present invention.

FIG. 7 is a diagram illustrating a mounting mode of the portable electronic device.

FIG. 8 is a diagram illustrating an implementation of a desktop electronic device.

FIG. 9 is a diagram illustrating a mounting mode of a self-contained electronic device.

FIG. 10 is a diagram of the prior art.

FIG. 11 is a diagram of the prior art.

[Explanation of symbols]

 5: Housing 6: Cooling air passage 10: Printed board unit 11a: Electronic component 11b: Electronic component 12: Cooling fan 13: Printed board 14: Exhaust unit 15: Duct 16: Heat sink 17: Fin 21: Heat radiating member 22: Transmission Hot part

Claims (7)

[Claims] An electronic component is mounted on both sides of a printed circuit board, cooling air is circulated on one mounting surface side of the printed circuit board, and the electronic component mounted on the other mounting surface of the printed circuit board is close to a housing of the electronic device. A cooling structure for a printed circuit board unit, comprising: a cooling fan that circulates cooling air on the other mounting surface side of the printed circuit board. 2. Electronic components mounted on both sides of a printed board, and cooling air flowing through a sub-printed board unit mounted on one mounting surface side of the printed board to be mounted on the other mounting surface of the printed board. A cooling structure for a printed circuit board unit disposed close to a housing of an electronic device, comprising: a cooling fan that circulates cooling air on the other mounting surface side of the printed circuit board. 3. The cooling structure of the printed circuit board unit is formed of a material having good heat conductivity and installed on the surface of an electronic component comprising a high heat generating element mounted on the other mounting surface of the printed circuit board. The cooling structure for a printed circuit board unit according to claim 1, further comprising a heat sink that forms a passage. 4. The cooling structure of the printed board unit is formed of a material having good heat conductivity and provided on a surface of an electronic component comprising a high heat generating element mounted on the other mounting surface side of the printed board. The cooling structure for a printed board unit according to claim 1, further comprising a heat radiating member that forms a passage and a heat transfer unit to a housing of the electronic device. 5. The cooling structure of the printed circuit board unit, further comprising: a cooling air passage that circulates cooling air and guides the cooling air to an exhaust port on the other mounting surface side of the printed circuit board. 5. The cooling structure for a printed board unit according to 2, 3, or 4. 6. The cooling air passage includes: an exhaust portion formed on one side of a printed board located on an exhaust side; and a duct for flowing warm air of the printed board to the cooling fan on the other mounting surface side of the printed board. The cooling structure for a printed board unit according to claim 5, further comprising: 7. The cooling fan according to claim 2, wherein the cooling fan also discharges warm air from a sub-printed board unit mounted on one of the mounting surfaces of the printed board. Cooling structure of printed board unit.