JPH11143585A - Information processor having heat radiation structure - Google Patents

Information processor having heat radiation structure

Info

Publication number
JPH11143585A
JPH11143585A JP9308385A JP30838597A JPH11143585A JP H11143585 A JPH11143585 A JP H11143585A JP 9308385 A JP9308385 A JP 9308385A JP 30838597 A JP30838597 A JP 30838597A JP H11143585 A JPH11143585 A JP H11143585A
Authority
JP
Japan
Prior art keywords
heat
pipe
outer case
information processing
generating component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9308385A
Other languages
Japanese (ja)
Other versions
JP4006795B2 (en
Inventor
Isao Murakami
功 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP30838597A priority Critical patent/JP4006795B2/en
Publication of JPH11143585A publication Critical patent/JPH11143585A/en
Application granted granted Critical
Publication of JP4006795B2 publication Critical patent/JP4006795B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To evenly disperse heat and also to increase a heat radiation area to effectively attain natural convective radiation by floating a heat pipe above an external case at a part which receives the heat from a heating part and then adhering the heat pipe to the external case directly or via a heat radiation plate at the part excluding the said heat receiving part. SOLUTION: A heat radiation rubber 4 touches the top face of a CPU 3 which is mounted on a circuit board 2. Then a block 7 which holds a heat pipe 6 against a heat radiation plate 5 touches the rubber 4. The plate 5 is caulked to the block 7 holding the pile 6 to surely hold the pipe 6. The pipe 6 has a U-shape while a heat receiving part 6a which is held between the plate 5 and the block 7 is located approximately at the center of the U-shape. The pipe 6 is bent upward at a place near the part 6a and also floated above the inner surface of an external case 1 at the part 6a. Meanwhile, the pipe 6 is adhered to the case 1 at the part including its both ends, but excluding the part 6a.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はCPU等の発熱部品
を内蔵し、この放熱のための放熱構造を有するポータブ
ルコンピューター等の情報処理装置に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an information processing apparatus such as a portable computer having a built-in heat-generating component such as a CPU and having a heat dissipation structure for heat dissipation.

【0002】[0002]

【従来の技術】従来、ポータブルコンピューターなどの
情報処理装置は内部にCPUなどの発熱を伴う部品を有
しており、発熱が他の部品等に与える影響を防止するた
め、種々の放熱のための構造を有している。
2. Description of the Related Art Conventionally, an information processing apparatus such as a portable computer has a heat-generating component such as a CPU therein, and various heat-radiating devices for preventing heat from affecting other components. It has a structure.

【0003】従来の放熱構造を有する情報処理装置の内
部構成を図3に示す。図3において、31は発熱部品で
あるCPU、32はCPU31と金属製の放熱板33と
の間に密着して設けられる放熱ゴム、34は金属製のヒ
ートシンク35に保持されるヒートパイプで、CPU3
1に先端を接触させている。さらにヒートパイプ34と
これを保持したヒートシンク35を樹脂製の本体ケース
36の側面に設けられた空冷ファンモータ37の近傍ま
で延ばして配置している。
FIG. 3 shows an internal configuration of an information processing apparatus having a conventional heat dissipation structure. In FIG. 3, reference numeral 31 denotes a CPU which is a heat-generating component; 32, a heat radiation rubber provided in close contact with the CPU 31 and a metal heat sink 33; 34, a heat pipe held by a metal heat sink 35;
1 is in contact with the tip. Further, a heat pipe 34 and a heat sink 35 holding the heat pipe 34 are arranged so as to extend to the vicinity of an air-cooled fan motor 37 provided on a side surface of a resin main body case 36.

【0004】CPU31から発生する熱は、放熱板33
によって放熱されるとともに、ヒートパイプ34を介し
てヒートシンク35に伝達され、ヒートシンク35から
放熱される。そして、これらの熱は空冷ファンモータ3
7により、強制的に外部に放出される。
[0004] The heat generated by the CPU 31 is
The heat is dissipated, and transmitted to the heat sink 35 via the heat pipe 34, and is dissipated from the heat sink 35. These heats are transferred to the air-cooled fan motor 3
7, forcibly released to the outside.

【0005】[0005]

【発明が解決しようとする課題】しかしこのような放熱
構造を有する情報処理装置においては、効率的な放熱を
行なうことができる面積が限られており、十分な自然対
流放熱が実現できないため、空冷ファンモータ等の設置
による強制放熱が必要であった。
However, in an information processing apparatus having such a heat dissipation structure, the area for efficient heat dissipation is limited, and sufficient natural convection heat dissipation cannot be realized. Forced heat radiation by installing a fan motor or the like was necessary.

【0006】さらにこのような放熱構造においては、ヒ
ートパイプやヒートシンクの配置された部分が局部的に
熱くなるため、外装ケースやその付近の部品が熱的な悪
影響を受けないように対策を行なう必要があった。
Further, in such a heat radiation structure, since the portion where the heat pipe and the heat sink are arranged is locally heated, it is necessary to take measures to prevent the external case and its surrounding parts from being adversely affected by heat. was there.

【0007】本発明は、発熱部品の熱を局部的に熱くす
ることなく均等に分散させると同時に放熱面積を広げ
て、効率的に自然対流放熱ができる放熱構造を有する情
報処理装置を提供することを目的とする。
An object of the present invention is to provide an information processing apparatus having a heat radiating structure capable of dispersing heat of a heat-generating component evenly without locally increasing the heat and simultaneously expanding a heat radiating area to efficiently radiate natural convection heat. With the goal.

【0008】[0008]

【課題を解決するための手段】この課題を解決するため
に本発明は、情報処理装置本体の外装ケースを金属製と
しヒートシンクとして利用するとともに、ヒートパイプ
を発熱部品からの受熱部では外装ケースから浮かせて配
置し、それ以外の部分では外装ケースに直接または放熱
板を介して密着させて配置するものである。
SUMMARY OF THE INVENTION In order to solve this problem, the present invention uses an external case of a main body of an information processing apparatus made of metal and uses it as a heat sink, and uses a heat pipe as a heat receiving part from a heat generating component. It is placed in a floating state, and in other parts, it is placed directly or in close contact with the outer case via a heat sink.

【0009】この発明によれば、発熱部品の熱を局部的
に熱くすることなく均等に分散させると同時に放熱面積
を広げることができ、効率的に自然対流放熱ができる放
熱構造が得られる。
According to the present invention, the heat of the heat-generating component can be evenly dispersed without locally increasing the heat, and at the same time, the heat-dissipating area can be increased, whereby a heat-dissipating structure capable of efficiently performing natural convection heat-dissipation can be obtained.

【0010】[0010]

【発明の実施の形態】本発明の請求項1に記載の発明
は、外装ケースを発熱部品の放熱のためのヒートシンク
とした情報処理装置であって、前記外装ケース内面と発
熱部品に接触し前記発熱部品の熱を前記外装ケースに伝
達するヒートパイプとを備え、前記ヒートパイプを前記
発熱部品からの受熱部では前記外装ケースから浮かせて
配置し、それ以外の部分では前記外装ケースに直接また
は放熱板を介して密着させて配置するもので、以下のよ
うな作用を有する。つまり、この構成により外装ケース
がヒートパイプからの熱を分散して受け取ることができ
るので、外装ケースが均一に熱せられる。さらに外装ケ
ースであるため広い範囲で直接外気と触れることがで
き、情報処理装置内部の熱を大量に放熱できる。この結
果、空冷ファンモータ等による強制放熱の手段を必要と
することなく、効率的に自然対流放熱ができる放熱構造
を得ることができる。
DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 of the present invention is an information processing apparatus in which an outer case is used as a heat sink for radiating heat-generating components. A heat pipe for transmitting heat of a heat-generating component to the outer case, wherein the heat pipe is arranged so as to float from the outer case at a heat receiving portion from the heat-generating component, and radiates heat to the outer case at other portions. It is arranged in close contact with a plate, and has the following action. That is, with this configuration, the outer case can receive the heat from the heat pipe in a dispersed manner, so that the outer case can be heated uniformly. Furthermore, since it is an exterior case, it can directly come into contact with outside air in a wide range, and a large amount of heat inside the information processing device can be radiated. As a result, it is possible to obtain a heat dissipation structure capable of efficiently performing natural convection heat dissipation without requiring forced heat dissipation means such as an air-cooled fan motor.

【0011】請求項2に記載の発明は、請求項1記載の
放熱構造を有する情報処理装置において、外装ケースに
立壁を設け、ヒートパイプの少なくとも1箇所に取り付
けまたは接触させたL字の放熱板を、前記外装ケースの
底面と立壁の両方に密着して配置するようにしたもの
で、この構成により、直接および放熱板を介して外装ケ
ースとヒートパイプの接触面積を増大させることがで
き、この結果ヒートパイプから外装ケースへの放熱量を
増加させるという作用を有する。
According to a second aspect of the present invention, in the information processing apparatus having the heat radiating structure according to the first aspect, an upright wall is provided in the outer case, and the L-shaped heat radiating plate is attached or contacted to at least one portion of the heat pipe. Is arranged in close contact with both the bottom surface and the upright wall of the outer case. With this configuration, it is possible to increase the contact area between the outer case and the heat pipe directly and via the heat sink. As a result, it has the effect of increasing the amount of heat radiation from the heat pipe to the outer case.

【0012】請求項3に記載の発明は、請求項1記載の
放熱構造を有する情報処理装置において、外装ケースの
少なくとも発熱部品に接近した外装面を、薄い断熱性の
シートで覆うことを特徴とするもので、以下のような作
用を有する。つまり、金属製であるため、熱伝導率が大
きく同じ温度でも感覚的に樹脂よりは熱く感じる外装ケ
ースの外装面を薄い樹脂製のシートで覆うことで、金属
をそのまま外装面とする場合と比べて外装ケースをさら
に熱くし外気との温度差を大きくすることができ、外気
への放熱効率を向上させるという作用を有する。
According to a third aspect of the present invention, in the information processing apparatus having the heat dissipation structure according to the first aspect, at least an exterior surface of the exterior case near the heat-generating component is covered with a thin heat-insulating sheet. It has the following functions. In other words, because it is made of metal, the outer surface of the outer case, which has a large thermal conductivity and feels more intuitively than resin even at the same temperature, is covered with a thin resin sheet. Thus, the outer case can be further heated to increase the temperature difference from the outside air, and the heat radiation efficiency to the outside air can be improved.

【0013】以下、本発明の実施の形態について、図1
および図2を用いて説明する。 (実施の形態1)図1は本発明の実施の形態による放熱
構造を有する情報処理装置の内部構成を示す平面、およ
び側面より視た構成図である。図1において、1は情報
処理装置本体の底面側の外装ケースであり、金属製で、
材料としては軽くできる点からマグネシウム合金が好ま
しい。
Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. (Embodiment 1) FIG. 1 is a plan view showing the internal configuration of an information processing apparatus having a heat dissipation structure according to an embodiment of the present invention, as viewed from the top and from the side. In FIG. 1, reference numeral 1 denotes an outer case on the bottom side of the information processing apparatus main body, which is made of metal.
As a material, a magnesium alloy is preferable because it can be reduced in weight.

【0014】そして、外装ケースの内部は以下に示すよ
うな構成とする。つまり、内蔵する回路基板2に実装さ
れた発熱部品であるCPU3の天面に放熱ゴム4を接触
させ、さらに放熱板5との間にヒートパイプ6をはさみ
込んだ構成のブロック7を放熱ゴム4と接触させて配置
する。放熱板5およびブロック7は金属製で、好ましく
は銅またはアルミニウムにより構成される。また本実施
の形態では、ヒートパイプ6を確実に保持するために、
放熱板5をヒートパイプ6をはさみ込んだ状態でブロッ
ク7にかしめる構造をとっている。そしてこの構成によ
り、CPU3の熱を効率的にヒートパイプ6に伝えるこ
とができる。
The interior of the outer case has the following configuration. That is, the heat radiation rubber 4 is brought into contact with the top surface of the CPU 3, which is a heat-generating component mounted on the built-in circuit board 2, and the heat pipe 6 is sandwiched between the heat radiation rubber 5 and the block 7. And placed in contact. The radiator plate 5 and the block 7 are made of metal, and are preferably made of copper or aluminum. In this embodiment, in order to hold the heat pipe 6 reliably,
The heat radiating plate 5 has a structure in which the heat pipe 6 is sandwiched between the heat radiating plate 5 and the block 7. With this configuration, the heat of the CPU 3 can be efficiently transmitted to the heat pipe 6.

【0015】次にヒートパイプ6は、図1に示すように
U字の形状をしており、放熱板5とブロック7にはさみ
込まれた受熱部6aはU字のほぼ真ん中に位置する。ま
たこの受熱部6aの付近では、ヒートパイプに高さ方向
の曲げ加工が施されている。この構成によりヒートパイ
プ6を、受熱部6aでは外装ケース1の内面と接触する
ことなく浮いた状態にし、両端部を含むそれ以外の部分
では外装ケース1に密着させた状態に配置することがで
きる。
Next, the heat pipe 6 has a U shape as shown in FIG. 1, and the heat receiving portion 6a sandwiched between the heat radiating plate 5 and the block 7 is located substantially in the middle of the U shape. In the vicinity of the heat receiving portion 6a, the heat pipe is bent in the height direction. With this configuration, the heat pipe 6 can be placed in a floating state without contacting the inner surface of the outer case 1 at the heat receiving portion 6a, and can be arranged in a state of being in close contact with the outer case 1 at other portions including both ends. .

【0016】なお本実施の形態では、受熱部6aの周囲
においてはヒートパイプ6の下側に放熱板5を配置して
いるが、この放熱板5も外装ケース1に対し、ねじ締め
による固定部以外は接触しないように配置している。こ
の結果、相対的に温度が高いヒートパイプ6の受熱部6
aより集中して外装ケース1に熱を伝えるのではなく、
熱源が分散されて外装ケース1にほぼ均等に熱を伝える
ことができ、外装ケース1から外気への放熱が有利にな
るばかりでなく、情報処理装置本体に内蔵するハードデ
ィスクユニットやバッテリー等の熱に弱い要素部品に特
別な放熱対策をおこなう必要がなく比較的自由に配置が
できる点でも優れている。
In this embodiment, the heat radiating plate 5 is arranged below the heat pipe 6 around the heat receiving portion 6a, but the heat radiating plate 5 is also fixed to the outer case 1 by screwing. Are arranged so that they do not touch each other. As a result, the heat receiving portion 6 of the heat pipe 6 having a relatively high temperature
a, instead of conducting heat to the outer case 1
The heat source is dispersed so that heat can be almost uniformly transmitted to the outer case 1, and not only is the heat radiation from the outer case 1 to the outside air advantageous, but also the heat of the hard disk unit and battery built in the information processing apparatus main body. It is also excellent in that it does not require special heat dissipation measures for weak element parts and can be arranged relatively freely.

【0017】さらに本実施の形態においては、ヒートパ
イプ6の片方の端を放熱板8により外装ケース1に押し
つけるように固定する。そして放熱板8はL字の形状を
しており、外装ケース1の底面と立壁の両方に密着する
ように外装ケース1にねじ締めして固定する。またヒー
トパイプ6のもう一方の端は、L字の形状をした放熱板
9がかしめによって取り付けられており、この放熱板9
も外装ケース1の底面と立壁の両方に密着するように同
様に外装ケース1にねじ締めして固定している。そして
この構成により、直接および放熱板を介して外装ケース
1とヒートパイプ6の接触面積を増大させ、より効率的
に外装ケース1に熱を伝えることができる。
Further, in the present embodiment, one end of the heat pipe 6 is fixed so as to be pressed against the outer case 1 by the heat radiating plate 8. The radiator plate 8 has an L-shape, and is fixed to the outer case 1 by screws so as to be in close contact with both the bottom surface and the upright wall of the outer case 1. At the other end of the heat pipe 6, an L-shaped heat sink 9 is attached by caulking.
Also, the outer case 1 is similarly screwed and fixed to the outer case 1 so as to be in close contact with both the bottom surface and the upright wall. With this configuration, the contact area between the outer case 1 and the heat pipe 6 can be increased directly and via the heat radiating plate, so that heat can be transferred to the outer case 1 more efficiently.

【0018】以上の結果、発熱部品の熱をヒートパイプ
から外装ケース、さらに外気へと最適な条件で伝えるこ
とができ、空冷ファンモータ等による強制放熱の手段を
利用しなくても効率的な自然対流放熱が実現できるので
ある。そして、空冷ファンモータを内蔵しないため、空
冷ファンモータによる騒音や振動の発生がなく静かで品
位の高い情報処理装置を提供できる。さらに衝撃に弱い
空冷ファンモータを使用しないことや外装ケースに通風
孔をあける必要がないことは、フィールド用の情報処理
装置に要求される耐衝撃、防塵、防水設計の点からも有
利である。
As a result, the heat of the heat-generating component can be transmitted from the heat pipe to the outer case and further to the outside air under optimum conditions, and efficient natural heat can be obtained without using forced radiation means such as an air-cooled fan motor. Convection heat dissipation can be realized. Since the air-cooled fan motor is not built in, a quiet and high-quality information processing apparatus without noise and vibration caused by the air-cooled fan motor can be provided. Further, not using an air-cooled fan motor that is vulnerable to impact and eliminating the need to make a ventilation hole in the outer case are advantageous in terms of impact resistance, dust resistance, and waterproof design required for a field information processing device.

【0019】(実施の形態2)また、図2に示すような
実施の形態では、外装ケース1の外装底面1aのうちヒ
ートパイプ6を配置する面をすべてカバーするように薄
い樹脂製のシート10を両面テープで貼り付けている。
シート10は、好ましくは耐熱性や難燃性が良好なPV
Cまたはポリカーボネートを使用し、薄さも外気への放
熱効率をそこなわずに、熱伝導率が大きく樹脂と比較し
て感覚的に熱く感じやすい金属表面をカバーして熱さを
和らげる効果が得られるように、0.3mm〜0.5m
m程度が好ましい。そしてこの構成により、外装ケース
の外装底面1aをシート10で覆わない場合に比べ、外
装ケース1に伝える熱量をさらに増加させ外気との温度
差を大きくすることができ、外装ケース1から外気への
放熱効率をさらに向上させることが可能になる。また、
外装ケース1のマグネシウム合金の外装面をカバーする
ことで、成型時の湯じわ等の外観不良を隠すことができ
るため、マグネシウム合金の成型品のパテ塗りや塗装等
の2次加工の処理が軽減できたり、成型品の歩留まりを
上げることができる。さらに、シート10の表記内容や
色を変えることが容易にできるため、デザイン的にも有
利である。
(Embodiment 2) In the embodiment as shown in FIG. 2, a thin resin sheet 10 is provided so as to cover all surfaces of the exterior bottom surface 1a of the exterior case 1 where the heat pipes 6 are arranged. With double-sided tape.
The sheet 10 is preferably a PV having good heat resistance and flame retardancy.
Uses C or polycarbonate to cover the metal surface, which has a high thermal conductivity and is easy to feel sensually hot compared to resin, without reducing the heat dissipation efficiency to the outside air even if it is thin. 0.3mm to 0.5m
m is preferable. With this configuration, the amount of heat transferred to the outer case 1 can be further increased and the temperature difference with the outside air can be increased, as compared with a case where the outer bottom surface 1a of the outer case is not covered with the sheet 10, and the temperature from the outer case 1 to the outside air can be increased. Heat radiation efficiency can be further improved. Also,
By covering the exterior surface of the magnesium alloy of the exterior case 1, appearance defects such as hot water wrinkles at the time of molding can be hidden, so that the secondary processing such as putty coating and painting of the molded product of the magnesium alloy can be performed. It can reduce or increase the yield of molded products. Further, the notation content and color of the sheet 10 can be easily changed, which is advantageous in terms of design.

【0020】[0020]

【発明の効果】以上のように本発明によれば、発熱部品
の熱を局部的に熱くすることなく均等に分散させると同
時に放熱面積を広げることができ、効率的に自然対流放
熱ができる放熱構造が得られ、しかも次のような有利な
効果が得られる。
As described above, according to the present invention, the heat of the heat-generating components can be distributed evenly without locally increasing the heat, and at the same time, the heat-radiating area can be increased, so that the natural convection heat can be efficiently radiated. The structure can be obtained, and the following advantageous effects can be obtained.

【0021】すなわち本発明では、情報処理装置内部に
局部的に熱い部分を持たないため、内蔵するハードディ
スクユニットやバッテリー等の熱に弱い要素部品に特別
な放熱対策をおこなう必要なく、比較的自由に配置がで
きる。また、効率的な自然対流放熱ができるため、空冷
ファンモータを実装しなくてすむので、騒音や振動の発
生がなく静かで品位の高い情報処理装置を提供できる。
さらに衝撃に弱い空冷ファンモータを使用しないこと
や、外装ケースに通風孔をあける必要がないことは、フ
ィールド用の情報処理装置に要求される耐衝撃、防塵、
防水設計の点からも有利である。
That is, in the present invention, since there is no locally hot part inside the information processing apparatus, it is not necessary to take a special heat radiation measure for heat-sensitive element parts such as a built-in hard disk unit and a battery, and it is relatively free. Can be arranged. In addition, since efficient natural convection heat radiation can be performed, it is not necessary to mount an air-cooled fan motor, so that it is possible to provide a quiet and high-quality information processing device without generating noise or vibration.
Furthermore, the elimination of air-cooled fan motors that are vulnerable to shocks, and the elimination of ventilation holes in the outer case, have the impact-resistant, dust-proof,
This is also advantageous in terms of waterproof design.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態による放熱構造を有する情
報処理装置の内部構成を示す構成図
FIG. 1 is a configuration diagram showing an internal configuration of an information processing apparatus having a heat dissipation structure according to an embodiment of the present invention.

【図2】本発明の実施の形態による放熱構造を有する情
報処理装置の外装面を樹脂シートで覆った状態を示す図
FIG. 2 is a diagram showing a state in which an exterior surface of an information processing apparatus having a heat dissipation structure according to an embodiment of the present invention is covered with a resin sheet;

【図3】従来の放熱構造を有する情報処理装置の内部構
成を示す構成図
FIG. 3 is a configuration diagram showing an internal configuration of an information processing apparatus having a conventional heat dissipation structure.

【符号の説明】[Explanation of symbols]

1 外装ケース 1a 外装ケースの外装底面 3 CPU 5、8、9放熱板 6 ヒートパイプ 6a ヒートパイプの受熱部 10 シート REFERENCE SIGNS LIST 1 outer case 1a outer bottom surface of outer case 3 CPU 5, 8, 9 heat sink 6 heat pipe 6a heat receiving portion of heat pipe 10 sheet

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】外装ケースを発熱部品の放熱のためのヒー
トシンクとした情報処理装置であって、前記外装ケース
内面と発熱部品に接触し前記発熱部品の熱を前記外装ケ
ースに伝達するヒートパイプとを備え、前記ヒートパイ
プを前記発熱部品からの受熱部では前記外装ケースから
浮かせて配置し、それ以外の部分では前記外装ケースに
直接または放熱板を介して密着させて配置することを特
徴とする放熱構造を有する情報処理装置。
1. An information processing apparatus, wherein an outer case is used as a heat sink for heat radiation of a heat-generating component, wherein the heat pipe contacts an inner surface of the outer case and the heat-generating component to transfer heat of the heat-generating component to the outer case. Wherein the heat pipe is floated from the outer case in the heat receiving part from the heat generating component, and is arranged in the other part by closely contacting the outer case directly or via a heat radiating plate. An information processing device having a heat dissipation structure.
【請求項2】外装ケースに立壁を設け、ヒートパイプの
少なくとも1箇所に取り付けまたは接触させたL字の放
熱板を、前記外装ケースの底面と立壁の両方に密着して
配置することを特徴とする請求項1記載の放熱構造を有
する情報処理装置。
2. An exterior case is provided with an upright wall, and an L-shaped heat sink attached or contacted to at least one location of the heat pipe is disposed in close contact with both the bottom surface and the upright wall of the exterior case. An information processing apparatus having the heat dissipation structure according to claim 1.
【請求項3】外装ケースの少なくとも発熱部品に接近し
た外装面を、薄い樹脂製のシートで覆うことを特徴とす
る請求項1記載の放熱構造を有する情報処理装置。
3. The information processing apparatus having a heat dissipation structure according to claim 1, wherein at least an exterior surface of the exterior case near the heat-generating component is covered with a thin resin sheet.
JP30838597A 1997-11-11 1997-11-11 Information processing apparatus having heat dissipation structure Expired - Lifetime JP4006795B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30838597A JP4006795B2 (en) 1997-11-11 1997-11-11 Information processing apparatus having heat dissipation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30838597A JP4006795B2 (en) 1997-11-11 1997-11-11 Information processing apparatus having heat dissipation structure

Publications (2)

Publication Number Publication Date
JPH11143585A true JPH11143585A (en) 1999-05-28
JP4006795B2 JP4006795B2 (en) 2007-11-14

Family

ID=17980437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30838597A Expired - Lifetime JP4006795B2 (en) 1997-11-11 1997-11-11 Information processing apparatus having heat dissipation structure

Country Status (1)

Country Link
JP (1) JP4006795B2 (en)

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US6404627B1 (en) 1999-08-13 2002-06-11 Fujitsu Limited Radiator mechanism for information processor
US7019967B2 (en) * 2001-04-24 2006-03-28 Apple Computer, Inc. Computer component protection
US7184265B2 (en) 2003-05-29 2007-02-27 Lg Electronics Inc. Cooling system for a portable computer
US7188484B2 (en) * 2003-06-09 2007-03-13 Lg Electronics Inc. Heat dissipating structure for mobile device
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US7821782B2 (en) 2008-02-08 2010-10-26 Motion Computing, Inc. Ergonomic solvent resistant portable computer
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US6404627B1 (en) 1999-08-13 2002-06-11 Fujitsu Limited Radiator mechanism for information processor
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US8050028B2 (en) 2001-04-24 2011-11-01 Apple Inc. Heat dissipation in computing device
US7019967B2 (en) * 2001-04-24 2006-03-28 Apple Computer, Inc. Computer component protection
US9720462B2 (en) 2001-04-24 2017-08-01 Apple Inc. Heat dissipation in computing device
US8605426B2 (en) 2001-04-24 2013-12-10 Apple Inc. Heat dissipation in computing device
US7184265B2 (en) 2003-05-29 2007-02-27 Lg Electronics Inc. Cooling system for a portable computer
US7188484B2 (en) * 2003-06-09 2007-03-13 Lg Electronics Inc. Heat dissipating structure for mobile device
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US7821782B2 (en) 2008-02-08 2010-10-26 Motion Computing, Inc. Ergonomic solvent resistant portable computer
US8152071B2 (en) 2008-02-08 2012-04-10 Motion Computing, Inc. Multi-purpose portable computer with integrated devices
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US10103087B2 (en) 2014-03-18 2018-10-16 Huawei Device (Dongguan) Co., Ltd. Heat dissipation assembly and electronic device
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