JPH03268483A - Cooling device for electronic equipment - Google Patents

Abstract

PURPOSE:To make it possible to minimize a dead space and hence make compact by forming an air duct and arranging a plurality of cooling bodies fixedly on the rear surface of a fixing board in a slight gap between the fixing board and the bottom board. CONSTITUTION:An air duct 12 is formed by partitioning the bottom of a box- shaped case 11 which houses electronic components with an electronic component mounting plate 11a which is multi-curved. A plurality of cooling bodies 3, such as radiation fins which radiates the generated heat of the electronic component are mounted on the bottom of the mounting plate 11a with a slight clearance provided between a base plate 11b and the cooling bodies. The cooling bodies 3 are cooled with cooled air produced by the action of a cooling fan 4 installed at the end of the air duct 12. An installation section for a mounting plate to fix an electrolytic capacitor 15 which reduces its life especially when it is subjected to a high temperature, is provided with an insulation air layer 16 between the cooling bodies and the mounting plate in order to prevent heat transfer from the cooling bodies 3. It is, therefore, possible to minimize dead space and hence make compact the size of this cooling device.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to electronic equipment such as inverter units,
This invention relates to a cooling device that can be made smaller by eliminating dead space.

[Conventional technology]

A conventional example of a cooling device for electronic equipment will be explained based on FIGS. 3 to 5. In these figures, a ventilation passage 2 is formed by partitioning the bottom of a box-shaped case 1 housing electronic components such as a printed circuit board (not shown) with a flat plate la for mounting electronic components. In the above-mentioned installation, a plurality of cooling bodies 3 such as radiation fins made of aluminum or the like having a high heat transfer coefficient are attached to the lower surface of the plate 1a in order to radiate the heat generated by the electronic components. Cooling is performed by cooling air produced by a cooling fan 40 provided at the end.

Since the cooling body 3 is generally smaller than the fan 4, the bottom plate 1b of the case 1 is used to increase the effective cooling air volume of the cooling body 3.
are bent to leave a slight gap between them and the cooling body 3.

[Problem to be solved by the invention]

The above structure has the drawback that a dead space is created below the bottom plate 1b, and the case 1 becomes larger by this amount.

SUMMARY OF THE INVENTION In order to eliminate the above-mentioned drawbacks, it is an object of the present invention to provide a cooling device for electronic equipment that can be miniaturized by eliminating dead space.

[Means to solve the problem]

In order to achieve the above-mentioned object, the present invention has a box-shaped electronic component storage case 11 with a multi-curved bottom.
2, and the mounting is such that a plurality of cooling bodies 3 are mounted on the lower surface of the plate 11a with a slight gap between them and the bottom plate 11b.

[Effect]

The mounting is performed by forming the plate 11a into a multi-curve shape to attach the cooling body 3 to the bottom plate 11.
Since it is arranged with a slight gap between it and b, the dead space described in the conventional example can be eliminated and the size can be reduced.

〔Example〕

FIG. 1 and FIG. 2 show an embodiment of this invention.
Components designated by the same reference numerals as in FIGS. 3 to 5 are the same parts. In these figures, the bottom of the box-shaped case 11 that houses the electronic components is curved, and the electronic components are mounted on the board 11.
A ventilation passage 12 is formed by partitioning with a. In the above-mentioned installation, a plurality of cooling bodies 3 such as radiation fins for dissipating heat generated by electronic components are attached to the bottom surface of the plate 11a with a slight gap between them and the bottom plate 11b, and the cooling bodies 3 are connected to the ventilation passages 12.
It is designed to be cooled by cooling air produced by a cooling fan 4 provided at the end of the cooling fan 4. The reason why the plate 11a is mounted in a multi-curved manner is to increase the effective cooling air volume of the cooling bodies 3 by the fan 4 by arranging the plurality of cooling bodies 3 with a slight gap between them and the flat bottom plate 11b. It is. When the electrolytic capacitor 15 is mounted on a plate, the life of which becomes particularly short when the temperature rises, an insulating air layer I6 is provided between the electrolytic capacitor 15 and the cooling body 3 to prevent heat transfer from the cooling body 3.

〔Effect of the invention〕

According to the present invention, in a cooling device for electronic equipment, the bottom of a box-shaped electronic component storage case is formed into a multi-curved shape, and the electronic component mounting is partitioned by a board to form a ventilation path, and the mounting is performed using a plurality of electronic components mounted on the bottom surface of the board. Since the cooling body is arranged with a slight gap between it and the bottom plate, it is possible to eliminate the dead space described in the conventional example, thereby achieving the effect of miniaturization.

[Brief explanation of drawings]

Fig. 1 is a longitudinal sectional view of an embodiment of the present invention, Fig. 2 is a perspective view of the main part of Fig. 1, Fig. 3 is a longitudinal sectional view of a conventional example, and Fig. 4 is a side view of Fig. 3; FIG. 5 is a perspective view of the main part of FIG. 3. 3...Cooling body, 4...Fan, 11...Case,
lla...installation is on the board, llb...bottom plate, 12...
ventilation duct. Figure 1 Figure 2

Claims (1)

[Claims] 1) The bottom of a box-shaped electronic component storage case is partitioned by a multi-curved electronic component mounting plate to form a ventilation path equipped with a cooling fan, which is attached to the bottom of the mounting plate and cooled by the action of the fan. A cooling device for electronic equipment, characterized in that a plurality of cooling bodies such as radiation fins are arranged with a slight gap between them and a bottom plate.