JPH0567081U - Airtight enclosure for printed circuit boards - Google Patents

Abstract

(57) [Summary] [Purpose] Provided is a sealed enclosure for printed circuit boards, in which heat of electronic components mounted on the printed circuit board is efficiently transferred to the sealed enclosure, and the efficiency of housing the printed board in the enclosed enclosure is high. To do. A printed circuit board 6 on which a heat-generating electronic component 14 is mounted, a hermetically sealed housing 1 for accommodating a large number of the printed circuit boards 6 arranged in parallel in the vertical direction, and a housing are formed on the outer surface of the hermetically sealed housing 1. Radiating fins 7 and 8 and the radiating fins 7 and 8
And a cooling means 12 for air-cooling the printed circuit board, wherein the printed circuit board is a metal core board 6, and the metal core board 6 has an end portion 6a,
6b is attached so as to be in direct contact with the inner surface of the closed casing 1 by the contact portions A and B.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a sealed casing for a printed circuit board, which indirectly radiates heat mainly generated by an electronic component mounted on the printed circuit board by housing the printed circuit board in the sealed chassis and cooling the sealed chassis itself.

[0002]

[Prior Art]

 For example, heat generated by electronic components of printed circuit boards used at sea, etc., cannot be radiated by directly drawing outside air into the electronic components even if a filter or the like is provided. This is because the outside air such as the sea contains corrosive substances that cannot be removed by filters. Therefore, a sealed casing for printed circuit boards is used that indirectly radiates heat generated by electronic components mounted on the printed circuit board by housing the printed circuit board in the sealed casing and cooling the sealed casing itself. In this closed housing, in order to increase the storage efficiency of the printed circuit board, it is required to efficiently guide the heat generated by electronic components to the closed housing.

A device disclosed in Japanese Utility Model Application Laid-Open No. 55-162999 is known as a device for efficiently guiding heat generated by electronic parts and the like to a closed casing, which will be described with reference to FIG. FIG. 4 is a partial cross-sectional view of the front surface, in which a radiation fin 52 is formed on the outer surface of the upper side of the closed casing 51, and a storage space 53 is formed inside the closed casing 51. A guide tool 55 having a groove 54 is attached to the lower surface of the storage space 53, and an L-shaped heat absorbing plate 56 and a guide tool 55 having the groove 54 are attached to the upper surface of the storage space 53 with bolts in order. .. Then, the printed circuit board 57 is inserted and attached to the concave grooves 54 of the upper and lower guides 55. The printed circuit board 57 is one in which a wiring circuit is formed on a heat-resistant insulating plate such as epoxy, and electronic parts 58 are mounted on important points. Further, an outer lid 59 is provided on the radiating fins 52, and the cooling fan 60 allows the outside air 61 to flow along the radiating fins 52.

In the closed casing for printed circuit board of FIG. 4, the heat mainly generated by the electronic component 58 mounted on the printed circuit board 57 is absorbed by the heat absorbing plate 56 by the radiant radiation, and the heat of the sealed casing 51 is mainly stored. It is guided to the upper side and reaches the radiation fin 52. Then, it is cooled by the outside air 61 flowing along the radiating fins 52.

[0005]

[Problems to be solved by the device]

 However, in the case of interposing the heat absorbing plate 56 as shown in FIG. 4, the heat generated by the electronic component 58 is once absorbed by the heat absorbing plate 56 by the radiant radiation, and is transferred to the hermetically sealed casing 51 through the heat absorbing plate 56. Therefore, there is a problem that the heat dissipation efficiency is low. In addition, the heat absorption plate 56 occupies a considerable portion of the internal space 53 of the closed casing 51, which causes a problem that the storage efficiency of the printed board 57 is reduced.

The present invention has been made in view of the above problems of the prior art. The purpose of the present invention is that the heat of electronic components mounted on a printed circuit board is efficiently sealed in a housing. The purpose of the present invention is to provide a hermetically sealed case for a printed circuit board that is well transmitted and has a high efficiency of housing the printed circuit board in the hermetically sealed case.

[0007]

[Means for Solving the Problems]

 To achieve the above object, a hermetically sealed housing for a printed circuit board according to the present invention includes a printed circuit board on which heat-generating electronic components are mounted, a hermetically sealed housing for accommodating a large number of the printed circuit boards arranged in parallel in a vertical direction, In a closed casing for a printed circuit board, comprising a heat radiation fin formed on an outer surface of the hermetically sealed housing and a cooling means for air-cooling the heat radiation fin, the printed circuit board is a metal core substrate, The board is attached so that the end portion of the board is in direct contact with the inner surface of the closed casing. It is preferable that heat radiation fins are formed on the upper and lower outer surfaces of the hermetically sealed case, and the fins are attached so that the upper and lower end portions of the metal core substrate and the upper and lower inner surfaces of the hermetically sealed case are in direct contact with each other.

[0008]

The heat generated by the electronic component is directly transferred to the hermetically sealed case via the metal core substrate. Since the heat is transferred by the metal core substrate, the heat is transferred substantially evenly in the upper and lower parts and is radiated from the radiating fins on the upper and lower outer surfaces of the closed casing.

[0009]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. 1 is a front sectional view of a printed circuit board hermetically sealed housing of the present invention, FIG. 2 is a side sectional view thereof, and FIG. 3 is an enlarged sectional view of an X portion of FIG. First, the entire sealed casing for a printed circuit board will be described with reference to FIG.

In FIG. 2, the closed casing 1 is composed of a main body 2, a front cover 3 and a rear cover 4, and a closed space 5 is formed inside. A large number of vertically arranged metal core substrates 6 are arranged in parallel in the closed space 5 in the vertical direction. Heat radiating fins 7 and 8 are provided on upper and lower outer surfaces of the main body 2, and a motherboard 10 and a connector 10 for a metal core substrate 6 are attached to the rear lid 4. The closed casing 1 having such a structure is inserted and fixed in the outer casing 11, and a cooling fan 12 as a cooling means is attached to the back surface of the outer casing 11. The outside air 13 passes between the radiating fins 7 and 8 to reach the back space of the external housing 11, and is discharged again to the outside air by the cooling fan 12.

Next, a mounting structure of the metal core substrate 6 and the closed casing 1 will be described with reference to FIG. Concave grooves 15 and 16 are provided above and below the inner surface of the main body 2 of the closed casing 1. The upper and lower end portions 6a and 6b of the metal core substrate 6 are inserted and attached to the grooves 15 and 16, respectively. Here, the metal core substrate 6 has a structure having a metal plate such as an aluminum plate inside, and the metal plate is insulated by being covered with an epoxy resin or the like. More specifically, as shown in FIG. 3, it has a five-layer structure in which metal plate layers 22 and 23 are provided on both sides of a central insulating layer 21 and further insulating layers 24 and 25 are provided on both sides. There is. In particular, the upper and lower end portions 6a and 6b have only the central insulating layer 21 and the metal plate layers 22 and 23 on both sides, and the heat of the electronic components 14 mounted on the metal core substrate 6 is accumulated by the metal core substrate 6 itself. The structure is such that it can be transmitted to the ends 6a and 6b. Reference numeral 17 denotes a retainer for pressing the side surfaces of the upper and lower end portions 6a, 6b of the metal core substrate 6 against the side surfaces of the recessed grooves 15, 16 to fix the side surface of the recessed groove 15 and the side opposite to the retainer 17. The upper and lower end portions 6a, 6b are in direct contact with the side surfaces, and heat is transferred via the contact portions A 1, B 2. As the retainer 17, trapezoidal blocks are alternately arranged in a straight line, and the width W is widened by tightening bolts that suspend the trapezoidal blocks.

In FIG. 1, heat mainly generated by the electronic component 14 is transferred to the metal core substrate 6 and further transferred in the vertical direction of the metal core substrate 6. Then, it is transmitted to the main body 2 of the closed casing 1 through the contact portions A and B, and reaches the heat radiation fins 7 and 8. The cooling fan 12 circulates the outside air 13 along the radiating fins 7 and 8, and the heat generated by the electronic component 14 is radiated from the radiating fins 7 and 8. In this way, since heat is directly transferred from the metal core substrate 6 to the main body 2, heat dissipation efficiency is improved. Further, since heat is transferred substantially evenly in the vertical direction of the metal core substrate 6, heat is effectively radiated from the upper and lower radiating fins 7 and 8 of the main body 2. As a result, the heat dissipation capacity of the closed casing 1 itself is improved, and a large number of metal core substrates 6 can be stored in the closed casing 1, and the storage efficiency is also increased.

[0013]

[Effect of the device]

 The sealed case for a printed circuit board of the present invention is one in which the printed circuit board is a metal core board and the metal core board is attached so that the end portion of the printed circuit board directly contacts the inner surface of the sealed case. Since it is directly transferred to the sealed housing via the board, the heat transfer efficiency between the electronic components and the sealed housing is improved, and the housing efficiency of the metal core board is improved without having a separate heat transfer component in the sealed housing. Improve. Then, radiating fins are formed on the upper and lower outer surfaces of the hermetically sealed housing, and the metal core substrate is attached so that the upper and lower end portions of the metal core substrate and the upper and lower inner surfaces of the hermetically sealed housing are in direct contact with each other. The heat radiation fins on the surface radiate heat almost evenly, further improving heat transfer efficiency and storage efficiency.

[Brief description of drawings]

FIG. 1 is a front sectional view of a printed circuit board hermetically sealed housing of the present invention.

FIG. 2 is a side cross-sectional view of a closed casing for a printed circuit board according to the present invention.

FIG. 3 is an enlarged cross-sectional view of a portion X in FIG.

FIG. 4 is a front cross-sectional view of a conventional printed circuit board hermetic enclosure.

[Explanation of symbols]

 1 Airtight Enclosure 6 Metal Core Substrate 7,8 Radiating Fin 12 Cooling Fan 15 Recessed Groove A, B Contact Part

Claims (2)

[Scope of utility model registration request] 1. A printed circuit board on which a heat-generating electronic component is mounted, a hermetically-sealed housing for accommodating a large number of the printed circuit boards arranged in parallel in a vertical direction, and a heat dissipation formed on an outer surface of the hermetically-sealed housing. In a hermetically sealed case for a printed circuit board, comprising a fin and a cooling means for air-cooling the radiation fin,
The printed circuit board is a metal core board, and the metal core board is attached so that the metal core board is in direct contact with the inner surface of the sealed case at an end thereof. 2. The printed circuit board hermetically sealed housing according to claim 1, wherein heat radiation fins are formed on upper and lower outer surfaces of the hermetically sealed housing, and upper and lower end portions of the metal core substrate and upper and lower inner surfaces of the hermetically sealed housing. A hermetically sealed case for a printed circuit board, which is attached so as to be in direct contact.