JP2007281371A - Heat dissipating structure for electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To promote miniaturization and the increase of a capacity and high density mounting. <P>SOLUTION: A first electronic component 12 is stored and arranged in an equipment case body 10 so as to be thermally connected to the equipment case body 10 and a heat dissipator 11, and a second electronic component 13 is stored and housed so as to be thermally separated in the equipment case body 10, and the equipment case body 10 and the heat dissipator 11 are thermally connected through a heat dissipating member 16. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic device such as a communication device such as an outdoor base station, and more particularly to a heat dissipation structure for cooling the electronic component.

  Generally, in an electronic device, a printed circuit board on which various electronic components are mounted is accommodated in the device housing. In order to ensure the performance of the electronic component mounted on the printed circuit board, heat generated by driving the electronic component is dissipated. And cooling is needed. As a heat dissipation structure for cooling such electronic components, an air passage that circulates between the inside and the outside of the device casing is provided, and heat from the electronic components and the like housed in the device casing using this air passage is provided. There is known a configuration in which the battery is discharged out of the device casing.

  However, the heat dissipation structure requires a large space in the device housing due to its configuration, and thus has a problem that the device housing is enlarged.

Therefore, as a heat dissipation structure for cooling such an electronic component, the electronic component of the printed circuit board is disposed by being thermally coupled to the device housing via the heat dissipation plate, and the heat generated by driving the electronic component is A structure having a configuration that enables highly efficient thermal control after ensuring the miniaturization of the device casing by heat transport to the device casing through the heat sink and dissipating heat has been proposed (for example, (See Patent Documents 1 and 2).
JP 2002-217343 A JP 2004-288830 A

  However, in the above heat dissipation structure, when increasing the capacity of an electronic component in order to increase the function of the electronic device, the requirement is satisfied in consideration of the increase in the amount of heat accompanying the increase in the capacity of the electronic component and the arrangement space. Difficult to do.

  The present invention has been made in view of the above circumstances, and has a heat dissipation structure for an electronic device that can promote downsizing and promote high density mounting as well as large capacity. The purpose is to provide.

  The present invention includes a first electronic component that is thermally coupled to and accommodated in a device housing, a radiator provided on an outer peripheral wall of the device housing, and is thermally separated into the device housing. The electronic device has a heat dissipation structure including the second electronic component accommodated and disposed and a heat dissipation member that thermally couples the second electronic component to the radiator.

  According to the above configuration, the first electronic component is accommodated and disposed in the device casing in a thermally coupled manner, and the second electronic component that is thermally separated and accommodated in the interior is disposed in the heat dissipation member. The heat associated with the driving of the first electronic component is thermally transported to the device casing and the radiator, and the heat associated with the driving of the second electronic component is transmitted via the heat dissipation member. The heat is then transported to the device casing and the radiator and radiated to the outside of the casing.

  As a result, high-efficiency thermal control is realized while keeping the internal space of the equipment housing to a minimum, and it is easy to promote high-density mounting as well as increase in equipment capacity. It becomes possible.

  As described above, according to the present invention, it is possible to provide a heat dissipation structure for an electronic device that can promote downsizing and can increase the capacity and promote the high density mounting. Can do.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a heat dissipation structure for an electronic apparatus according to an embodiment of the present invention. An apparatus housing 10 is formed of a metal material, for example, in a sealed structure so that it can be installed outdoors. For example, a radiator 11 in which radiating fins 111 are arranged in parallel is attached to the outer peripheral portion of the device casing 10, and the heat transported from the wall surface and the radiator 11 is radiated to the outside.

  And the 1st electronic component 12 is directly attached to the inner wall by which the heat radiator 11 of this apparatus housing | casing 10 is arrange | positioned, for example. As a result, the first electronic component 12 is thermally coupled to the radiator 11 via the device casing 10, and heat associated with the driving is radiated from the device casing 10 and the radiator 11 to the outside.

  In addition, the first electronic component 12 is configured so as to be housed and disposed in the apparatus housing 10 through a printed board (not shown), for example, or directly to the radiator 11. It may be configured to be combined and accommodated in the device housing 10.

  In addition, the device housing 10 accommodates and arranges a printed board 14 and a mounting component 15 on which the second electronic component 13 is mounted. The second electronic component 13 mounted on the printed circuit board 14 has an air gap with respect to the inner wall of the device housing 10 using an internal space such as a dead space in the device housing 10 and is thermally formed. Separated and placed.

  On the second electronic component 13, an intermediate portion of, for example, a substantially U-shaped heat radiating member 16 made of a metal material such as aluminum, for example, heat having excellent thermal conductivity such as a thermal sheet or a thermal compound. Thermally coupled via the conductive material 17. The heat dissipating member 16 is provided with attachment portions 161 and 161 at both ends thereof, and the attachment portions 161 and 161 are screwed to the inner wall of the device housing 10 using screw members 18 and 18, for example. The intermediate portion is elastically engaged with the second electronic component 13 via the heat conductive material 17. As a result, the second electronic component 13 is thermally coupled to the device casing 10 and the radiator 11 via the heat conductive material 17 and the heat radiating member 16, thereby enabling efficient heat transport.

  In addition, this heat radiating member 16 is not attached by screwing to the device casing 10 using the screw member 18, but is attached to the radiator 11 by a method such as screwing directly, for example, in the second state. You may provide so that it may couple | bond with the electronic component 13 thermally. Moreover, it is preferable that the heat radiating member 16 is configured to be attached to the device housing 10 with the heat conductive material 17 interposed therebetween, similarly to the heat coupling configuration with the second electronic component 13. As a result, it is possible to further improve the heat conduction characteristics.

  With the above configuration, the heat generated when the first electronic component 12 in the device housing 10 is driven is transported to the device housing 10 and the radiator 11 to be dissipated to the outside of the device housing 10. One electronic component 12 is cooled and thermally controlled. On the other hand, the heat associated with the driving of the second electronic component 13 in the device housing 10 is transported by heat to the device housing 10 and the radiator 11 via the heat conductive material 17 and the heat radiation n1 member 16, and the device housing 10. The second electronic component 13 is cooled and thermally controlled here.

  And in the drive state of these 1st and 2nd electronic components 12 and 13, the heat radiating member 16 heat-transports the calorie | heat amount of the 2nd electronic component 13 to the apparatus housing | casing 10 and the heat radiator 11, and this 2nd The upper surface of the electronic component 13 is covered to shield intrusion or emission of electromagnetic waves from the outside. Thereby, each of the first and second electronic components 12 and 13 has a desired performance characteristic.

  As described above, the heat dissipation structure of the electronic device is configured such that the first electronic component 12 is thermally coupled to the device housing 10 and the heat radiator 11 and accommodated in the device housing 10, and the second electronic component 13 is disposed. Are thermally separated and housed in the device housing 10, and are thermally coupled to the device housing 10 and the radiator 11 via the heat radiating member 16.

  According to this, the heat accompanying the driving of the first electronic component 12 is directly transported to the device casing 10 and the radiator 11 to be radiated, and the heat accompanying the driving of the second electronic component 13 is radiated. The heat is transported to the device casing 10 and the radiator 11 via the member 16, and is similarly radiated to the outside of the device casing 10.

  As a result, it is possible to set the internal space to a minimum by using the dead space of the device casing 10, and furthermore, after realizing high-density mounting of electronic components in the device casing 10, Efficient thermal control is realized. As the device casing 10 can be made smaller and the component mounting density can be increased, it is possible to easily increase the capacity of the electronic device. Is improved.

  In the above embodiment, the heat radiating member 16 is configured to be thermally coupled to the second electronic component 13 with the heat conducting material 17 interposed therebetween. However, the present invention is not limited to this. In addition, it is possible to configure as shown in FIG. 2, for example, and substantially the same effect is expected. However, in FIG. 2, the same parts as those in FIG.

  That is, in FIG. 2, a conductive pattern 141 that is thermally coupled to the second electronic component 13 is provided on the printed board 14, and a heat radiating member 19 is thermally coupled to the conductive pattern 141. Thus, the device casing 10 and the radiator 11 are thermally coupled to each other through the heat radiating member 19. The heat dissipating member 19 is attached by being screwed to the printed circuit board 14 using a screw member 20, for example, and both ends thereof are elastically engaged with, for example, the device casing 10 or the radiator 11 to be heated. Combined. Also in this case, it is preferable that the heat conductive material 17 is interposed between the heat radiation member 19 and the conductive pattern 141 of the printed board.

  Further, in the above-described embodiment, the second electronic component 13 that is thermally separated in the device housing 10 is attached to the device housing using the plate-like substantially U-shaped heat radiation members 16 and 19. Although the case where it comprised so that it might couple | bond with the body 10 and the heat radiator 11 was demonstrated, as a shape structure of these heat radiating members 16 and 19, it is not restricted to the said shape structure, In addition, the thing of various shapes is used. It can be configured by using, and the same effect is expected.

  Furthermore, in the above-described embodiment, the first electronic component 12 is described as being configured to be thermally coupled to and housed in the inner wall of the equipment housing 10 to which the radiator 11 is attached. For example, the radiator 11 can be configured to be thermally coupled to the outer peripheral portion of the device housing 10 where the first electronic component 12 is not attached. Expected to be effective.

  Further, in the above-described embodiment, the case where it is configured to be applied to the device casing 10 having a sealed structure has been described. However, the present invention is not limited to this, and can be applied to other casing structures, and the same effect is expected. Is done.

  Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the effect of the invention can be obtained. In such a case, a configuration in which this configuration requirement is deleted can be extracted as an invention.

It is the figure shown in order to demonstrate the thermal radiation structure of the electronic device which concerns on one embodiment of this invention. It is the figure which extracted and showed the principal part of the thermal radiation structure of the electronic device which concerns on other embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Equipment housing | casing, 11 ... Radiator, 111 ... Radiation fin, 12 ... 1st electronic component, 13 ... 2nd electronic component, 14 ... Printed circuit board, 141 ... Conductive pattern, 15 ... Mounting component, 16 ... Heat dissipation Reference numeral 161: mounting portion 17: heat conducting material 18: screw member 19: heat dissipation member 20: screw member

Claims (5)

A first electronic component that is thermally coupled to the device housing and disposed;
A radiator provided on the outer peripheral wall of the device casing;
A second electronic component that is thermally separated and accommodated in the device casing;
A heat dissipation member that thermally couples the second electronic component to the radiator;
A heat dissipation structure for an electronic device, comprising:   The heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation member is thermally coupled to at least the second electronic component via a heat conductive material.   The heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation member is formed of a metal plate.   4. The heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation member magnetically isolates the first electronic component and the second electronic component. 5.   The heat dissipation structure for an electronic device according to any one of claims 1 to 4, wherein the device housing has a sealed structure.

Images