JP2003273299A - Semiconductor cooling device for vehicle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor cooling device for a vehicle which enables reduction in the size of the device with excellent cooling efficiency. <P>SOLUTION: A semiconductor cooling device for a vehicle has: a heat- receiving part made of a metal for receiving heat generated by power- transforming a semiconductor element; a heat pipe which is engaged with the heat-receiving part made of a metal; a first radiator fin which is engaged with a part of the heat pipe; and a second radiator fin which is engaged with a part of the heat pipe, and the width of the second radiator fin is shorter than the width of the first radiator fin. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vehicle semiconductor cooling device.

[0002]

2. Description of the Related Art Regarding a conventional semiconductor cooling device for a vehicle,
This will be described in detail with reference to the drawings. FIG. 5 is a front view of a conventional vehicle semiconductor cooling device. FIG. 6 is a top view of a conventional vehicle semiconductor cooling device. A semiconductor cooling device for a vehicle is installed in the power conversion device 1. A conventional semiconductor cooling device for a vehicle includes a heat receiving portion 2, a semiconductor element 3, a heat pipe 4, and a heat radiating plate 5. In the semiconductor cooling device for a vehicle configured as described above, the semiconductor element 3 is screwed to the heat receiving portion 2 made of copper through the compound.
A heat pipe 4 made of copper is embedded in the heat receiving section 2. A plurality of copper radiator plates 5 engage the heat pipe 4 at equal intervals. A refrigerant (not shown) is sealed inside the heat pipe 4. In the semiconductor cooling device for a vehicle configured as above, heat is always generated when the semiconductor element 3 is driven. The heat generated from the semiconductor element 3 is transferred to the refrigerant enclosed in the heat pipe 4 via the cooling block 2. The heat generated by the semiconductor element 3 is transferred to the refrigerant, causing a phase change from liquid to gas. The gasified refrigerant rises in the heat pipe 4. The refrigerant exchanges heat with the air through the heat pipe 4 and the heat dissipation plate 5,
The refrigerant undergoes a phase change from gas to liquid. The liquefied refrigerant is
It descends in the heat pipe 4. The refrigerant that has descended in the heat pipe 4 is vaporized again by the heat generated by the semiconductor element 3 and rises in the heat pipe 4. In this way, in the vehicle semiconductor cooling device, the phase change of the refrigerant is used to cool the semiconductor 3.

[0003]

However, when the conventional semiconductor cooling device for a vehicle is used and the cooling efficiency is to be further increased, there is no other way but to enlarge the device itself. Therefore, when the cooling capacity is required to be improved with the increase in the capacity of the power conversion device in recent years, it has not been possible to cope with it for a railway vehicle having a limited space for installing the device. Therefore, it is an object of the present invention to realize downsizing of the device and to provide a semiconductor cooling device for a vehicle with good cooling efficiency.

[0004]

According to another aspect of the present invention, there is provided a vehicle semiconductor cooling device including a heat receiving portion, a heat pipe engaging with the heat receiving portion, and a first heat radiation fin engaging with a part of the heat pipe. And a second engaging part of the heat pipe
And a width of the second heat radiation fin is shorter than a width of the first heat radiation fin.
A vehicle semiconductor cooling device according to the present invention includes a heat receiving portion, a first heat radiating plate that engages with the heat receiving portion, and a second heat radiating fin that engages with the heat receiving portion. The width of the radiation fin is shorter than the width of the first radiation fin.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) A semiconductor cooling device for a vehicle according to a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a front view of a semiconductor cooling device for a vehicle according to a first embodiment of the present invention. FIG. 2 is a side view of the semiconductor cooling device for a vehicle according to the first embodiment of the present invention. Note that FIG. 5 and FIG.
Components that are the same in structure as those described are denoted by the same reference numerals and description thereof will be omitted. The vehicle semiconductor cooling device according to the first embodiment of the present invention includes a heat receiving portion 2, a semiconductor element 3, a heat pipe 4, a first heat radiating plate 5, and a second heat radiating plate 6. In the semiconductor cooling device for a vehicle configured as above, the thickness and the length in the longitudinal direction of the second heat dissipation plate 6 are the same as those of the first heat dissipation plate 5, but the second heat dissipation plate 6 is used.
Has a width smaller than that of the first heat dissipation plate. In the vehicle semiconductor cooling device configured as described above, the heat pipe 4
The first heat radiating plate 5 and the second heat radiating plate 6 are alternately engaged with each other at equal intervals. In the vehicle semiconductor cooling device configured in this manner, the first heat dissipation plate 5 and the second heat dissipation plate 6 having a width smaller than that of the first heat dissipation plate 5 are alternately installed,
Cooling air blowing resistance is reduced. Since the ventilation resistance of the cooling air is reduced, the vehicle semiconductor cooling device of the present embodiment is
The cooling efficiency is higher than that of the conventional semiconductor cooling device for a vehicle.

(Second Embodiment) Second Embodiment Based on the Present Invention
The semiconductor cooling device for a vehicle according to the embodiment will be described in detail with reference to the drawings. FIG. 3 is a front view of a vehicle semiconductor cooling device according to a second embodiment of the present invention. Figure 4
FIG. 6 is a side view of a semiconductor cooling device for a vehicle according to a second embodiment of the present invention. The same structural elements as those shown in FIGS. 1 and 2 are designated by the same reference numerals and the description thereof will be omitted. The semiconductor cooling device for a vehicle according to the second embodiment of the present invention includes a heat receiving portion 2, a semiconductor element 3, a heat pipe 4, a first heat radiating plate 5, and a second heat radiating plate 6. In the semiconductor cooling device for a vehicle configured as described above, a plurality of first heat dissipation plates 5 are attached to the tip side of the heat pipe 4. A plurality of second heat radiation plates 6 are attached to the heat receiving portion 2 side of the heat pipe 4. The semiconductor cooling device for a vehicle configured as described above is provided with the heat pipe 4
Since a plurality of narrow second heat dissipation plates 6 are provided on the heat receiving portion 2 side, the ventilation resistance on the heat receiving portion 2 side is reduced. Since the ventilation resistance on the heat receiving portion 2 side of the heat pipe 4 is reduced, the heat radiating plate 6 on the heat receiving portion 2 side of the heat pipe 4 can be used as a cooler or in a place where the air volume is small. Therefore, there is a merit that the skirt (not shown) can be applied to a high-speed vehicle installed under the floor of the vehicle body.

In the semiconductor cooling device for a vehicle thus configured, the width of the second heat radiating plate is smaller than that of the first heat radiating plate. In the present invention, the arrangement of the heat radiating plates may be changed, such as arranging the first heat radiating plate on the heat receiving portion side of the heat pipe and the second heat radiating plate on the tip end side of the heat pipe, innumerable combinations. Therefore, the invention is not limited to the arrangement of the radiator plates of the vehicle semiconductor cooling devices of the first and second embodiments.

[0008]

According to the semiconductor cooling device for a vehicle of the present invention, it is possible to realize the downsizing of the device and to provide the semiconductor cooling device for a vehicle having a high cooling efficiency.

[Brief description of drawings]

FIG. 1 is a front view of a first vehicle semiconductor cooling device according to the present invention.

FIG. 2 is a top view of a first vehicle semiconductor cooling device according to the present invention.

FIG. 3 is a front view of a second semiconductor cooling device for a vehicle according to the present invention.

FIG. 4 is a top view of a second vehicle semiconductor cooling device according to the present invention.

FIG. 5 is a front view of a conventional vehicle semiconductor cooling device.

FIG. 6 is a top view of a conventional semiconductor cooling device for a vehicle.

[Explanation of symbols]

1 ... Power converter 2 Heat receiving part 3 ... Semiconductor element 4 ... Heat pipe 5: Heat sink 6 ... Heat sink

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Claims (2)

[Claims] 1. A heat receiving portion that receives heat generated by a semiconductor element that converts electric power, and a heat pipe that engages with the heat receiving portion.
It has a 1st radiation fin which engages with a part of this heat pipe, and a 2nd radiation fin which engages with a part of the above-mentioned heat pipe, and the width of the 2nd radiation fin is the 1st above-mentioned. A semiconductor cooling device for a vehicle, which is shorter than the width of the radiation fins. 2. A heat receiving portion that receives heat generated by a semiconductor element that converts electric power, and a first heat radiating plate that engages with this heat receiving portion.
A semiconductor cooling device for a vehicle, comprising: a second heat radiation fin that engages with the heat receiving portion, wherein a width of the second heat radiation fin is shorter than a width of the first heat radiation fin.