JP2000161880A - Heat pipe type cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make uniform temperature rise of a heat reception portion block even when there are arranged and mounted a plurality of semiconductor devices in a flow direction of cold air. SOLUTION: A natural ventilating heat pipe type condenser is adapted to include a plurality of heat radiation fins 3, 3a installed substantially vertically for radiating heat with the aid of natural ventilation to the atmosphere, a single heat reception portion block 5 installed substantially vertically and including a plurality of semiconductor devices 4 mounted vertically, and a plurality of heat pipes 6 for connecting the heat radiation fins 3, 3a and the heat reception portion block 5. In the condenser, the heat pipes 6 are inclined horizontally such that a boiling section side is located below a condensing section and installed substantially parallely vertically. The heat radiation fins 3, 3a are installed at a predetermined interval such that an upper side heat radiation fin interval is smaller than a lower heat radiation fin interval and each heat pipe 6 is connected and penetrated through the heat radiation fins 3, 3a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe type cooler comprising a radiating fin, a heat receiving unit block and a heat pipe, for cooling a plurality of semiconductor elements constituting a power converter, for example. The present invention relates to a heat pipe type cooler capable of achieving a uniform rise in temperature of a heat receiving unit block even when a plurality of semiconductor elements are mounted side by side in a direction in which cooling air flows.

[0002]

2. Description of the Related Art In general, when a power converter is constructed using semiconductor elements that perform switching at a high frequency,
In order to reduce the wiring inductance due to component mounting,
It is necessary to collectively arrange a plurality of semiconductor elements constituting the conversion circuit and their peripheral circuit components.

Of course, this is important also from the point of miniaturization of the device. For example, when a conversion circuit is formed by a module package type semiconductor element, the circuit is formed by arranging the semiconductor element close to one surface. Often do.

On the other hand, a semiconductor element generates heat loss due to energization and switching. In order to obtain good switching characteristics, the generated heat loss is efficiently released to the outside air.
It is necessary to keep the temperature rise of the semiconductor element below the allowable temperature, and a cooling means such as a cooler using a heat pipe is required.

As described above, in many cases, a plurality of semiconductor elements are simultaneously mounted on a block portion of one cooler.

FIG. 15A is a side view showing a configuration example of a natural ventilation type heat pipe type cooler for cooling a semiconductor element of a power converter installed under the floor of a railway car, and FIG.
5 (b) is a perspective view showing a configuration example of the heat pipe type cooler of the natural ventilation system.

In FIG. 15A and FIG. 15B, a power converter 2 is installed under the floor of the vehicle body 1.
When heat is radiated by natural cooling, the cooler is generally housed in the power converter 2 such that the heat radiator side of the cooler is on the side of the vehicle body 1.

The cooler is constituted as a heat pipe type cooler 7 in which a large number of radiating fins 3 and a heat receiving section block 5 to which a plurality of semiconductor elements 4 are attached are connected by a plurality of heat pipes 6. I have.

The heat dissipating fins 3 dissipate heat by natural ventilation into the atmosphere. A large number of the heat dissipating fins 3 are installed in the open portion 8 of the power conversion device 2 in a substantially vertical direction and at predetermined intervals substantially parallel to each other. I have.

On the other hand, a plurality of semiconductor elements 4 are mounted on one side of the heat receiving section block 5 in a plane.
On the opposite side, a boiling portion of the heat pipe 6 is buried.

The heat pipe 6 is installed so as to be slightly inclined from the horizontal so that the condensing part thereof is higher than the boiling part, and this part is penetrated and connected to the radiating fins 3 described above.

The plurality of semiconductor elements 4 attached to the heat receiving unit block 5 need to realize electrical connection with the peripheral circuit parts 9 or connection between the semiconductor elements in the shortest distance, and reduce wiring inductance in mounting. Because there is
It is required that a group of four semiconductor elements be closely arranged.

In consideration of increasing the mounting efficiency of the components in the sealed portion 10 of the power converter 2 and miniaturizing the device, the heat receiving block 5 separates the open portion 8 and the sealed portion 10 of the power converter 2 from each other. It is desirable that it be a part and be installed almost vertically.

[0014]

However, in the heat pipe type cooler 7 of such a natural ventilation system, the temperature rise value tends to vary in the vertical direction.

That is, the vertical dimension of the radiating fins 3 is close to the height dimension of the power converter 2, and the cooling air flows upward between the radiating fins 3 by natural ventilation. The heat is received from the fins 3 and the air temperature rises upward.

In particular, in the case of natural ventilation, the flow velocity of air is slow, and the degree of temperature rise in the upper part is large.

That is, the rise in the air temperature is determined by the amount of heat transferred from the radiation fins 3 to the air and the heat capacity of the air. If the air flow rate is low, the amount of air passing per unit time is small and the heat capacity is low. Since it becomes smaller, the temperature of the air rises significantly with the same amount of heat.

A plurality of heat pipes 6 are arranged side by side in the vertical direction, but the cooling systems are independent of each other.
The difference in the temperature rise value in the vertical direction at the radiation fins 3 is the temperature difference in the vertical direction of the heat receiving unit block 5.

That is, among the plurality of semiconductor elements 4 mounted in the vertical direction on the heat receiving section block 5, those at the lowest position and those at the uppermost position have significantly different temperature rise values. The semiconductor element 4 at the highest temperature where the temperature rises is used so that the temperature rise value is equal to or less than the allowable value. Further, the rating of the device determined from the temperature rise value due to heat loss is also determined by the uppermost semiconductor element 4.

This is a problem that occurs because the temperature rise value of the heat receiving unit block 5 has a large difference in the vertical direction although the lower semiconductor element 4 has a sufficient margin for the allowable value. .

Although the problem described above is a problem with the heat pipe type cooler of the natural ventilation type, even with the heat pipe type cooler of the forced ventilation type, the temperature rise of the heat receiving unit block is not uneven. Occurs.

In this case, since the air flow velocity is higher than that of natural ventilation, the amount of air flowing between the radiating fins per unit time is large, and thus the heat capacity is large, and the temperature rise relative to the amount of heat received from the radiating fins is large. Although the value is small as compared with natural ventilation, it is needless to say that the temperature rise value of the heat receiving unit block is preferably uniform.

An object of the present invention is to provide a heat pipe type cooler capable of achieving a uniform rise in temperature of a heat receiving section block even when a plurality of semiconductor elements are mounted side by side in a direction in which cooling air flows. Is to do.

[0024]

In order to achieve the above object, a plurality of radiating fins which are installed substantially vertically and dissipate heat by natural ventilation to the atmosphere, and a plurality of fins which are installed almost vertically and are arranged vertically. 2. A natural-ventilation heat pipe type cooler comprising one heat receiving unit block to which said semiconductor element is attached, and a plurality of heat pipes connecting each heat radiation fin and the heat receiving unit block. In the invention, each heat pipe is tilted from the horizontal so that the boiling portion side is lower than the condensing portion, and arranged in parallel with each other in the up and down direction, and each radiating fin is disposed at a distance from the lower radiating fin interval. Also, the heat radiation fins on the upper side are installed at predetermined intervals so as to be smaller, and each heat pipe is connected through each heat radiation fin.

Therefore, in the heat pipe type cooler according to the first aspect of the present invention, the plurality of radiating fins are arranged at predetermined intervals such that the interval between the upper radiating fins is smaller than the interval between the lower radiating fins. By installing, the area of the upper radiating fin is larger, the cooling capacity is higher in the upper side, and the upper side where the cooling air condition is bad (the air inlet temperature is higher than the radiating fin) is more effectively cooled. can do.

According to the second aspect of the present invention, each heat pipe is inclined from the horizontal so that the boiling portion side thereof is lower than the condensing portion, and the heat pipes are arranged substantially parallel to each other in the vertical direction. Instead of connecting through all the heat pipes, the number of radiating fins connected through the upper heat pipe is larger than that of the lower heat pipe.

Therefore, in the heat pipe type cooler according to the second aspect of the present invention, the heat radiation fins are not connected to all the heat pipes, but the upper heat pipe is connected to the lower heat pipe more than the lower heat pipe. By increasing the number of radiating fins, the temperature rise of the heat receiving unit block can be made uniform.

Further, according to the third aspect of the present invention, each of the heat pipes is inclined from the horizontal so that the boiling portion side thereof is lower than the condensing portion, and the heat pipes are arranged so as to be substantially parallel to each other in the vertical direction. The intervals between the heat pipes are set such that the upper interval is smaller than the lower interval.

Therefore, in the heat pipe type cooler according to the third aspect of the present invention, the distance between the heat pipes arranged in the vertical direction is smaller at the upper side than at the lower side, so that the radiating fins can be formed. The number of heat pipes to be penetrated is higher in the upper part, and the fin efficiency of the radiating fin is higher in the upper part, so that the temperature rise of the heat receiving unit block can be made uniform.

According to the fourth aspect of the present invention, each of the heat pipes is tilted from the horizontal so that the boiling portion side thereof is lower than the condensing portion, and the heat pipes are arranged so as to be substantially parallel to each other in the vertical direction. In each of the heat pipes, the diameter of the upper heat pipe is larger than the diameter of the lower heat pipe.

Therefore, in the heat pipe type cooler according to the fourth aspect of the present invention, the diameter of the upper heat pipe is made larger than the diameter of the lower heat pipe among the vertically arranged heat pipes. Not only is the performance of the heat pipe higher in the upper part, but also the penetrating connection with the radiator fin is larger in the upper part, and the fin efficiency of the radiator fin is higher in the upper part. Can be achieved.

Further, according to the fifth aspect of the present invention, the heat pipes are tilted from the horizontal so that the boiling portion side thereof is lower than the condensing portion, and are arranged side by side in parallel with each other in the vertical direction, and are arranged in the vertical direction. Of the radiating fins connected to each heat pipe, the radiating fin connected to the upper heat pipe and the radiating fin connected to the lower heat pipe are separate and connected to the upper heat pipe. The thickness of the radiation fin is set to be larger than the thickness of the radiation fin connected to the lower heat pipe.

Therefore, in the heat pipe type cooler according to the fifth aspect of the present invention, the radiation fin connected to the upper heat pipe and the radiation fin connected to the lower heat pipe are separated from each other. By making the plate thickness of the radiation fin connected to the pipe larger than the plate thickness of the radiation fin connected to the lower heat pipe, the fin efficiency of the radiation fin is higher at the upper side, The temperature rise can be made uniform.

On the other hand, according to the invention of claim 6, the above-mentioned claim 1 is provided.
In the heat pipe type cooler according to any one of claims 4 to 6, each of the heat radiation fins is made of two or more kinds of heat radiation fins having different sizes, and the heat radiation fins having a large size are vertically arranged. The heat radiation fins, which are penetratingly connected to all the heat pipes and small in size, are penetratingly connected only to the upper heat radiation fins.

Therefore, in the heat pipe type cooler according to the present invention, the plurality of radiating fins are two or more types of radiating fins having different sizes from each other, and the large radiating fins are vertically arranged. By penetrating through all the heat pipes lined up and connecting the smaller radiating fins only to the upper radiating fins, the area of the upper radiating fins is larger and the temperature rise of the heat receiving block is uniform. Can be achieved.

According to the seventh aspect of the present invention, in the first aspect,
The heat pipe type cooler according to any one of claims 4 to 4, wherein a predetermined number of the heat radiation fins is set such that a hole diameter of a portion through which the lower heat pipe penetrates is larger than the heat pipe diameter. , So as not to connect at the lower heat pipe penetration portion.

Therefore, in the heat pipe type cooler according to the invention of claim 7, a predetermined number of the plurality of radiating fins are formed such that the hole diameter of the lower heat pipe penetrating portion is larger than the heat pipe diameter. However, by preventing connection at the lower heat pipe penetrating portion, the heat radiation fins penetrating only to the upper heat pipe have the same dimensions in the vertical direction and contribute to heat radiation only to the upper heat pipe. Therefore, the upper heat radiation performance can be further improved, leading to a uniform temperature rise of the heat receiving unit block.

Further, in the invention according to claim 8, in the heat pipe type cooler according to any one of claims 1 to 7, each semiconductor element is attached to one surface of the heat receiving block. The boiling part of each heat pipe is buried on the other surface on the opposite side, each radiating fin is connected to the condensing part of each heat pipe, and the heat receiving part so that the surface on which each semiconductor element is attached faces obliquely downward Tilt the block.

Therefore, in the heat pipe type cooler according to the present invention, the heat receiving portion block is inclined so that the surface on which the semiconductor element is mounted is obliquely downward, so that the open portion is higher at the upper side than at the lower side. Also, the number of radiating fins connected can be increased upward, which leads to a uniform temperature rise of the heat receiving unit block.

On the other hand, in order to achieve the above object, a plurality of radiating fins which are installed substantially in parallel to the direction of ventilation and dissipate heat by forced ventilation to the atmosphere, and a single fin having a plurality of semiconductor elements mounted thereon In the heat pipe type cooler of the forced ventilation system composed of a heat receiving unit block and a plurality of heat pipes connecting each heat radiation fin and the heat receiving unit block, in the invention of claim 9, each heat pipe is: Installed in a direction substantially perpendicular to the direction in which the wind flows, and arranged side by side in the direction of the flow of the wind, and set each radiating fin at a predetermined spacing so that the fin spacing on the leeward side is smaller than the spacing on the leeward side. And each heat pipe is connected through each heat radiation fin.

Therefore, in the heat pipe type cooler according to the ninth aspect of the present invention, in the case of the forced ventilation system, the predetermined distance between the heat radiation fins on the leeward side is smaller than that on the windward side. By installing in the leeway, the area of the radiating fins on the leeward side is larger, the cooling capacity is higher on the leeward side, and the cooling leeway is more effective on the leeward side where the cooling air condition is poor (the inlet air temperature is higher than the radiating fins) Cooling.

According to the tenth aspect of the present invention, the heat pipes are arranged in a direction substantially perpendicular to the direction in which the wind flows, and are arranged in the direction in which the wind flows, and the radiation fins are connected through all the heat pipes. Instead, the number of radiating fins that penetrate and connect to the leeward heat pipe is larger than that of the leeward heat pipe.

Therefore, in the heat pipe type cooler according to the tenth aspect of the present invention, in the case of the forced ventilation system, each radiating fin does not penetrate through all the heat pipes, but flows through the heat pipe on the leeward side. By increasing the number of heat dissipating fins connected through the heat pipes more than the heat pipe on the upper side, the temperature rise of the heat receiving unit block can be made uniform.

Further, according to the present invention, the heat pipes are arranged in a direction substantially perpendicular to the direction in which the air flows and in the direction in which the air flows, and the intervals between the heat pipes arranged in the direction of the air flow are reduced. The distance on the leeward side is smaller than the distance on the leeward side.

Therefore, in the heat pipe type cooler according to the eleventh aspect of the present invention, in the forced ventilation system, the interval between the heat pipes in the ventilation direction is smaller than the interval on the leeward side. Accordingly, the number of heat pipes penetrating and connecting the radiating fins is larger on the leeward side, and the fin efficiency of the radiating fins is higher on the leeward side, and the temperature rise of the heat receiving unit block can be made uniform.

According to the twelfth aspect of the present invention, the heat pipes are arranged in a direction substantially perpendicular to the direction in which the wind flows and in the direction in which the wind flows. The diameter of the heat pipe on the leeward side is
It is made larger than the diameter of the heat pipe on the windward side.

Therefore, in the heat pipe type cooler according to the twelfth aspect of the present invention, the diameter of the heat pipe on the leeward side in the ventilation direction is made larger than the diameter of the heat pipe on the leeward side in the forced ventilation system. In addition to the better performance of the heat pipe itself on the leeward side, the penetrating connection with the radiating fins is larger on the leeward side, the fin efficiency of the radiating fins is higher on the leeward side, and the temperature of the heat receiving part block is higher. The rise can be made uniform.

Further, according to the invention of claim 13, the heat pipes are arranged in a direction substantially perpendicular to the direction in which the wind flows and arranged in the direction in which the wind flows, and connected to the heat pipes arranged in the ventilation direction. Of the radiating fins, the radiating fin connected to the heat pipe on the leeward side in the ventilation direction and the radiating fin connected to the heat pipe on the leeward side are separate, and the plate of the radiating fin connected to the heat pipe on the leeward side The thickness is set to be larger than the thickness of the radiation fin connected to the heat pipe on the windward side.

Therefore, in the heat pipe type cooler according to the thirteenth aspect of the present invention, in the forced ventilation system, the heat radiation fin connected to the leeward heat pipe and the heat radiation fin connected to the leeward heat pipe are provided. And the thickness of the radiation fins connected to the heat pipe on the leeward side is made larger than the thickness of the radiation fins connected to the heat pipe on the leeward side. The side is higher, and the temperature rise of the heat receiving unit block can be made uniform.

On the other hand, according to a fourteenth aspect of the present invention, in the heat pipe type cooler according to any one of the ninth to twelfth aspects, each radiating fin is provided with at least two types of radiating fins having different sizes. The fins are configured such that the larger radiating fins are penetratingly connected to all the heat pipes arranged in the direction in which the wind flows, and the smaller radiating fins are penetratingly connected only to the leeward radiating fins.

Therefore, in the heat pipe type cooler according to the fourteenth aspect of the present invention, in the case of the forced ventilation system, the plurality of radiating fins are made of two or more radiating fins having different sizes from each other. By connecting the radiating fins through to all the heat pipes arranged in the ventilation direction, and connecting the smaller radiating fins only to the radiating fins on the leeward side, the radiating fin area on the leeward side becomes larger. ,
The temperature rise of the heat receiving unit block can be made uniform.

According to a fifteenth aspect of the present invention, in the heat pipe type cooler according to any one of the ninth to twelfth aspects, a predetermined number of the heat radiation fins are connected to the heat pipe on the windward side. Is made larger than the diameter of the heat pipe, so that it is not connected at the heat pipe penetrating part on the windward side.

Therefore, in the heat pipe type cooler according to the fifteenth aspect of the present invention, in the case of the forced ventilation system, a predetermined number of the heat radiation fins are provided with a hole diameter of a portion penetrating the heat pipe on the windward side. Is larger than the heat pipe diameter, so that it is not connected at the leeward side heat pipe penetration part, the radiation fins that are connected only to the leeward side heat pipe have the same dimensions in the ventilation direction, and Therefore, the heat dissipation performance on the leeward side can be further improved, leading to a uniform rise in temperature of the heat receiving unit block.

[0054]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is directed to a heat receiving portion even when a plurality of semiconductor elements are mounted side by side in a direction in which cooling air flows by changing the area of a radiating fin contributing to heat radiation for each heat pipe. This is to make the temperature rise of the block uniform.

Hereinafter, embodiments of the present invention based on the above concept will be described in detail with reference to the drawings.

(First Embodiment: Corresponding to Claims 1, 2, and 6) FIG. 1 shows that a heat pipe type cooler of a natural ventilation type according to the present embodiment is a power conversion device under a vehicle body floor. 15 is a side view (a cross-sectional view of the power conversion device) illustrating a configuration example when incorporated in FIG. 15, and the same elements as those in FIG. 15 are denoted by the same reference numerals.

In FIG. 1, a power converter 2 is installed under the floor of the vehicle body 1, and a heat pipe type cooler 7a is housed in the power converter 2 so that the heat radiating side is on the side of the vehicle 1. I have.

The heat pipe type cooler 7a has a large number of 2
This is a cooler configured by connecting a plurality of types of radiation fins 3 and 3 a and a heat receiving unit block 5 to which a plurality of semiconductor elements 4 are attached by a plurality of heat pipes 6.

The radiating fins 3 and 3a dissipate heat by natural ventilation to the atmosphere. The radiating fins 3 have a larger size in a substantially vertical direction, are substantially parallel at a predetermined interval, and have a larger size. The smaller heat radiation fins 3 a are alternately arranged, and are installed in the opening 8 of the power converter 2.

On the other hand, a plurality of semiconductor elements 4 are mounted on one side of the heat receiving section block 5 in a plane.
On the opposite side, the boiling portion of the heat pipe 6 is buried.

The heat pipe 6 is slightly inclined (for example, about 10 degrees) so that the condensing part thereof is higher than the boiling part.
Through connection.

The plurality of semiconductor elements 4 attached to the heat receiving block 5 are electrically connected to peripheral circuit components 9 housed near the semiconductor elements 4.

The heat receiving block 5 serves as a partition between the open part 8 and the closed part 10 of the power converter 2 and is installed substantially vertically.

Next, the operation of the heat pipe type cooler 7a of the present embodiment configured as described above will be described.

In FIG. 1, the semiconductor element 4 generates heat loss due to energization and switching, and this heat is transmitted to the radiating fins 3 and 3 a by the heat pipe 6 via the heat receiving unit block 5, The heat is radiated from the surface of 3a to the atmosphere by natural ventilation, and the temperature rise of the semiconductor element 4 is suppressed.

In this case, the radiating fins 3 are connected to all the heat pipes 6 arranged in the vertical direction, so that all the heat radiation of the semiconductor elements 4 arranged in the vertical direction is taken. The heat radiation fins 3a having a smaller outer shape are connected through only to the upper heat pipes 6 of the heat pipes 6 arranged in the vertical direction, and the upper heat generation components of the semiconductor elements 4 arranged in the vertical direction. It will be responsible for heat dissipation. Therefore, the heat pipe type cooler 7a has a larger heat radiation area above the heat receiving block 5.

On the other hand, since heat is radiated from the radiating fins 3 and 3a to the atmosphere by natural ventilation, as the cooling air moves from below to above, the air temperature rises due to generated heat loss. Become.

The heat dissipation from the radiating fins 3 and 3a to the atmosphere depends on the difference between the air temperature and the temperature of the radiating fin surface.
Since heat is transferred, the heat transfer performance deteriorates on the upper side where the temperature difference is small, and a larger heat dissipation area is required.

In this respect, in the heat pipe type cooler 7a of the present embodiment, since the upper side has a larger heat radiating area as described above, the difference in temperature rise between the upper side and the lower side is small. Few.

Further, in the portion where the lower radiating fins 3 are arranged, which is the cooling air inlet portion of the entire radiator of the cooler, the interval between the fins is large by the amount of the radiating fins 3a, and the cooling air enters between the radiating fins. The air resistance is low when the wind is blown, and good natural ventilation is achieved.

As described above, the temperature rise value of the heat receiving unit block 5 is made uniform, and the difference in the temperature rise value between the semiconductor elements 4 arranged vertically is reduced.

Therefore, all the semiconductor elements 4 have a margin about the same as the allowable value, and only the semiconductor element 4 at a specific position has a large temperature rise. Without the rating being suppressed,
It is possible to realize a heat pipe type cooler that efficiently uses the entire radiator.

As described above, in the heat pipe type cooler 7a of the present embodiment, the plurality of radiating fins are set so that the interval between the upper radiating fins is smaller than the interval between the lower radiating fins. Since the space is set at intervals, the area of the upper radiating fins is larger, the cooling capacity is higher in the upper side, and the cooling air condition is poor (the air inlet temperature is higher than that of the radiating fins). It becomes possible to cool it.

Further, since the heat radiation fins are not connected to all the heat pipes, the number of the heat radiation fins connected to the upper heat pipe is larger than that of the lower heat pipe. Temperature rise can be made uniform.

Further, the plurality of radiating fins are two or more types of radiating fins having different sizes from each other, and the radiating fins having the larger size are penetrated and connected to all the heat pipes arranged in the vertical direction. Since the small heat dissipating fins are connected through only the upper heat dissipating fins, the area of the heat dissipating fins on the upper side is larger, and the temperature rise of the heat receiving unit block can be made uniform.

(Second Embodiment: Corresponding to Claim 3) FIG. 2 shows an example of a configuration in which a heat pipe type cooler of a natural ventilation type according to the present embodiment is incorporated in a power converter under a vehicle body floor. (The power conversion device is a cross-sectional view.) The same elements as those in FIG. 1 are denoted by the same reference numerals, and the description thereof will be omitted. Only different parts will be described here.

In FIG. 2, the vertical intervals of a plurality of vertically arranged heat pipes 6 are not the same, and the upper intervals are smaller than the lower intervals (the mounting pitch of the heat pipes 6 is smaller). Small) configuration.

Also, the radiation fins 3, 3 a, 3 b having three different sizes are provided, and the radiation fin 3 a having the smallest size is provided only on the upper heat pipe 6, similarly to the first embodiment. The heat pipe 6 is connected through, the heat radiating fin 3 having the largest size is connected through all the heat pipes 6, and the heat radiating fin 3b having an intermediate size is connected through.
Is the number in the middle.

Next, the operation of the heat pipe type cooler 7b of the present embodiment configured as described above will be described.

In FIG. 2, the relationship between the difference in the size of the heat radiation fins and the difference in the number of heat pipes 6 connected is similar to the first embodiment described above, in which the upper heat pipe 6 has a larger heat radiation. In addition to this, the number of the heat pipes 6 buried in the heat receiving unit block 5 increases in the upper part, and the heat transport ability by the heat pipe 6 is more excellent in the upper part.

Further, since the portion connected through the radiating fins also increases in the upper part, the upper radiating fins have better heat conduction in the fins and have a higher fin efficiency and a higher cooler.

As described above, it is expected that a larger temperature difference will be generated in the vertical direction of the radiating fins due to a large amount of heat generated by the semiconductor element 4 or a poor natural ventilation condition and a further decrease in the air flow velocity. At this time, by applying the heat pipe type cooler 7b of the present embodiment, the heat radiation performance above the heat receiving unit block 5 is further improved, which can contribute to uniform temperature rise.

As described above, in the heat pipe type cooler 7b of this embodiment, the interval between the heat pipes arranged in the vertical direction is smaller at the upper interval than at the lower interval. The number of heat pipes penetrating and connecting the radiating fins is higher in the upper part, and the fin efficiency of the radiating fins is higher in the upper part, so that the temperature rise of the heat receiving unit block can be made uniform.

(Third Embodiment: Corresponding to Claim 6) FIG. 3 shows an example of a configuration in which a heat pipe type cooler of a natural ventilation type according to the present embodiment is incorporated in a power converter under a vehicle body floor. (The power conversion device is a cross-sectional view.) The same elements as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

In FIG. 3, in addition to the above-described first embodiment, the number of types of radiating fins is further increased, and radiating fins 3, 3a, 3b, 3c having different external shapes are arranged in a heat pipe in the up-down direction. 6, the number of radiating fins connected through the heat pipe increases as the heat pipe increases.

Next, in the heat pipe type cooler 7c of the present embodiment configured as described above, the area of the upper radiating fin is larger, and the temperature rise of the heat receiving unit block 5 can be further uniformed. Can be planned.

As described above, in the heat pipe type cooler 7c of this embodiment, the plurality of radiating fins are two or more types of radiating fins having different sizes, and Because the heat radiation fins of smaller size are penetratingly connected only to the upper heat radiation fins, the area of the upper heat radiation fins is larger and the temperature of the heat receiving part block is higher. It is possible to achieve a uniform rise.

(Fourth Embodiment: Claims 1 and 2)
FIG. 4 is a side view (a cross-sectional view of the power conversion device) showing a configuration example when the heat pipe type cooler of the natural ventilation type according to the present embodiment is incorporated in a power conversion device under the vehicle floor. 1, the same elements as those of FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described here.

In FIG. 4, the radiating fins 3d are different in shape and size, and are arranged at predetermined intervals. However, the intervals between the radiating fins 3d are not parallel. Heat pipe 6
And through-connected.

Next, in the heat pipe type cooler 7d of the present embodiment configured as described above, the heat radiation area increases as it goes up, as in the above-described embodiments. Cooling air can enter from the middle stage, and becomes narrower as the radiating fin spacing increases,
Since the flow velocity of the rising air increases upward, the heat transfer coefficient of the heat radiation fin wall surface is improved.

As described above, in the heat pipe type cooler 7d of the present embodiment, in addition to the effects of the first embodiment, it is possible to improve the heat transfer coefficient of the radiation fin wall surface. .

(Fifth Embodiment: Corresponding to Claim 7) FIG. 5 (a) shows a case in which a heat pipe type cooler of a natural ventilation type according to the present embodiment is incorporated in a power converter under a vehicle body floor. Side view showing a configuration example (a power conversion device is a cross-sectional view),
FIG. 5B is an enlarged cross-sectional view showing the heat radiation fin portion in FIG. 5A, and the same elements as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described here.

In FIG. 5, out of the plurality of radiating fins, some of the radiating fins 3e have the same outer shape and size as the radiating fins 3 connected through all the heat pipes 6, and the lower fins 3e A hole 11 having a diameter larger than the diameter of the heat pipe 6 is provided in a portion where the heat pipe 6 penetrates, and the heat pipe 6 and the radiation fin 3e are not connected in this portion.

Next, in the heat pipe type cooler 7e of the present embodiment configured as described above, the radiating fin 3e connected only to the upper heat pipe 6 has a size covering the entire radiating portion. As compared with the above-described embodiments, the heat dissipation area has a larger heat dissipation area, and the heat dissipation performance in the upper part can be further improved.

As described above, in the heat pipe type cooler 7e of the present embodiment, a predetermined number of the plurality of radiating fins are set such that the hole diameter of the lower heat pipe penetrating portion is determined by the heat pipe diameter. Radiating fins that are connected only to the upper heat pipe have the same dimensions in the vertical direction, and contribute to heat radiation only to the upper heat pipe. Therefore, the upper heat radiation performance can be further improved, leading to a uniform rise in temperature of the heat receiving unit block.

(Sixth Embodiment: Corresponding to Claim 4) FIG. 6 shows a configuration example in which a heat pipe type cooler of a natural ventilation type according to the present embodiment is incorporated in a power converter under a vehicle body floor. (The power conversion device is a cross-sectional view.) The same elements as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

In FIG. 6, in addition to the above-described first embodiment, the upper heat pipe 6a is configured to have a larger diameter than the lower heat pipe 6.

Next, in the heat pipe type cooler 7f according to the present embodiment configured as described above, in addition to the effect that the heat transfer capacity at the top is high, the heat radiation fins are large due to the large diameter. The connection portion with 3, 3a is also large in the upper part, and the fin efficiency can be further improved.

As described above, in the heat pipe type cooler 7f of the present embodiment, of the heat pipes arranged vertically, the diameter of the upper heat pipe is made larger than the diameter of the lower heat pipe. As a result, not only is the performance of the heat pipe itself better in the upper part, but also the penetrating connection with the radiating fin is larger in the upper part, and the fin efficiency of the radiating fin is higher in the upper part, increasing the temperature of the heat receiving part block. Can be made uniform.

(Seventh Embodiment: Corresponding to Claim 5) FIG. 7 shows a configuration example in which the heat pipe type cooler of the natural ventilation type according to the present embodiment is incorporated in a power converter under the floor of a vehicle body. (The power conversion device is a cross-sectional view.) The same elements as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

In FIG. 7, the radiation fins are divided into upper and lower parts, and the radiation fins 3g penetratingly connected to the upper heat pipe 6 are thicker than the plate thickness of the radiation fins 3f penetrating to the lower heat pipe 6. Is made thicker.

Next, in the heat pipe type cooler 7g of the present embodiment configured as described above, the upper radiation fin 3g has a higher fin efficiency than the lower radiation fin 3f (to the periphery of the radiation fin). Has good thermal conductivity), and has good heat dissipation performance in the upper direction, so that the entire temperature rise can be made uniform.

As described above, in the heat pipe type cooler 7g of the present embodiment, the radiation fin connected to the upper heat pipe and the radiation fin connected to the lower heat pipe are separated. The thickness of the fins connected to the heat pipe is larger than the thickness of the fins connected to the lower heat pipe. It is possible to make the temperature rise of the unit block uniform.

(Eighth Embodiment: Corresponding to Claim 8) FIG. 8 shows a configuration example in which a heat pipe type cooler of a natural ventilation type according to the present embodiment is incorporated in a power converter under a vehicle body floor. (The power conversion device is a cross-sectional view.) The same elements as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

In FIG. 8, the heat receiving section block 5a is
The semiconductor element 4 is inclined more obliquely than vertically in a direction in which the mounting surface of the semiconductor element 4 faces downward.

Further, the heat pipes 6b, 6c, 6d, and 6e have different lengths in the vertical direction.
Is connected to the heat receiving unit block 5a.

Further, the heat radiating fins are also formed by using several types of heat radiating fins 3, 3 a, 3 b, and 3 c having different sizes from each other, and by effectively using the open portion 8 having a large upper space, the heat pipes 6 b and 6 c , 6d, 6e.

Next, in the heat pipe type cooler 7h of the present embodiment configured as described above, since the heat radiating portion space itself is widened upward, it has been described in each of the above-described embodiments. By using several types of radiating fins, it is possible to secure a large radiating area on the upper heat pipe side.

Also, since the heat receiving section block 5a to which the semiconductor element 4 is attached is inclined, the mountable range of the semiconductor element 4 can be expanded even when the height of the power converter 2 is limited. it can. Therefore, even if the semiconductor device 4 has an enlarged outer shape, it can be mounted.

As described above, in the heat pipe type cooler 7h of the present embodiment, since the heat receiving section block is inclined so that the surface on which the semiconductor element is mounted is inclined obliquely downward, the opening is upward. Can be configured wider than below, and the number of connected radiating fins can be increased above,
This leads to a uniform rise in temperature of the heat receiving block.

(Ninth Embodiment: Corresponding to Claim 8) FIG. 9 shows a configuration example in which a heat pipe type cooler of a natural ventilation type according to the present embodiment is incorporated in a power converter under a vehicle body floor. 8 is a side view (a cross-sectional view of the power conversion device). The same elements as those in FIG. 8 are denoted by the same reference numerals, and description thereof is omitted.

In FIG. 9, as in the eighth embodiment, the heat receiving unit block 5b is inclined obliquely, and the heat receiving unit block 5b and the heat pipe 6 are orthogonal to each other.

Next, in the heat pipe type cooler 7i of the present embodiment configured as described above, the mounting space of the semiconductor element 4 is increased by inclining the heat receiving unit block 5b. Can be.

Further, since the heat receiving section block 5b and the heat pipe 6 are orthogonal to each other, when the heat pipe 6 is connected to the heat receiving section block 5b, manufacturing is facilitated, for example, the dimensions are easily obtained.

As described above, in the heat pipe type cooler 7f of the present embodiment, in addition to the effects of the eighth embodiment, the size of the heat pipe cooler 7f is reduced when the heat pipe is connected to the heat receiving section block 5b. , And can be easily manufactured.

(Tenth Embodiment: Corresponding to Claims 9, 10 and 14) FIG. 10 shows a heat-pipe type cooler of a forced ventilation type according to the present embodiment, which is a power converter under the floor of a vehicle body. FIG. 10 is a side view showing an example of a configuration in which the power conversion device is incorporated into a power conversion device (the power conversion device is a cross-sectional view). The same elements as those in FIGS. Only mentioned.

In FIG. 10, the lower part of the power converter 2a is a closed part 10a, the upper part is an open part 8a, and a cooler radiator is arranged in the open part 8a.

Further, the radiation fins 3 are
h and 3i are forcibly blown and cooled.

Next, in the heat pipe type cooler 7j of the present embodiment configured as described above, even in the case of forced ventilation, although it is smaller than the natural ventilation system, the air temperature is more leeward than the windward side. The temperature rise of the heat receiving portion block 5c can be made uniform by improving the heat radiation performance on the leeward side.

That is, in the present embodiment, the radiation fins 3h and 3j are different in size from each other. By penetrating both of them, the heat radiation area on the leeward side is increased, and the temperature rise on the leeward and leeward sides of the heat receiving unit block 5c is made uniform as in the case of the natural ventilation described above. Can be.

As described above, in the heat pipe type cooler 7j of the present embodiment, in the case of the forced ventilation system, the predetermined distance is set such that the space between the heat radiation fins on the leeward side is smaller than the space between the heat radiation fins on the windward side. , The area of the radiating fins on the leeward side is larger, the cooling capacity is higher on the leeward side, and the cooling air condition is poor (the inlet air temperature is higher than the radiating fins). Can be cooled more effectively.

Further, in the case of the forced ventilation system, each radiating fin does not penetrate through all the heat pipes, and the number of radiating fins through which the leeward heat pipe is penetratingly connected is larger than that of the leeward heat pipe. Therefore, it is possible to make the temperature rise of the heat receiving unit block uniform.

Further, in the case of the forced ventilation system, a plurality of radiating fins are made of two or more types of radiating fins having different sizes from each other. Since the radiating fins of small size are penetratingly connected only to the radiating fins on the leeward side, the area of the radiating fins on the leeward side is larger, and the temperature rise of the heat receiving block should be uniform. Becomes possible.

(Eleventh Embodiment: Corresponding to Claim 15) FIG. 11 shows an example of a configuration in which a forced-pipe heat pipe type cooler according to this embodiment is incorporated in a power converter under a vehicle body floor. FIG. 10 is a side view (a power conversion device is a cross-sectional view), and the same elements as those in FIG.

In FIG. 11, the heat radiation fin 3j has the same size as the heat radiation fin 3h, and a hole having a diameter larger than the diameter of the heat pipe 6 is provided at the penetrating portion of the heat pipe 6 on the windward side. It does not have a configuration.

Next, in the heat pipe type cooler 7k of the present embodiment configured as described above, all the heat radiation fins 3h and 3j are connected to the heat pipe 6 on the leeward side. Since the heat dissipation area is larger on the leeward side, the heat dissipation performance on the leeward side can be further improved.

As described above, in the heat pipe type cooler 7k of the present embodiment, in the case of the forced ventilation system, a predetermined number of the heat radiating fins are provided at a portion penetrating the windward heat pipe. Since the hole diameter is larger than the heat pipe diameter and it is not connected at the leeward heat pipe penetration part, the radiation fins that are connected only to the leeward heat pipe have the same dimensions in the ventilation direction, and the leeward heat This contributes to the heat radiation only to the pipe, so that the heat radiation performance on the leeward side can be further improved, leading to a uniform temperature rise of the heat receiving unit block.

(Twelfth Embodiment: Corresponding to Claim 11) FIG. 12 shows a configuration example in which a forced-pipe heat pipe cooler according to the present embodiment is incorporated in a power converter under a vehicle body floor. FIG. 10 is a side view (a power conversion device is a cross-sectional view), and the same elements as those in FIG. 10 are denoted by the same reference numerals, and description thereof will be omitted.

In FIG. 12, the number of the heat pipes 6 arranged in the ventilation direction is increased so that the mutual interval is reduced on the leeward side.

Next, in the heat pipe type cooler 71 of the present embodiment configured as described above, the number of the heat pipes 6 is increased so that the mutual interval is reduced on the leeward side. Thus, the heat transport ability on the leeward side can be improved.

As described above, in the heat pipe type cooler 71 of the present embodiment, in the case of the forced ventilation system, the interval between the heat pipes in the ventilation direction is smaller than the interval on the leeward side than the interval on the leeward side. Therefore, the number of heat pipes penetrating and connecting the radiating fins is larger on the leeward side, and the fin efficiency of the radiating fins is higher on the leeward side, making it possible to achieve uniform temperature rise of the heat receiving block. Become.

(Thirteenth Embodiment: Corresponding to Claim 12) FIG. 13 shows a configuration example in which a heat pipe type cooler of a forced ventilation type according to the present embodiment is incorporated in a power converter under a vehicle body floor. FIG. 10 is a side view (a power conversion device is a cross-sectional view), and the same elements as those in FIG. 10 are denoted by the same reference numerals, and description thereof will be omitted.

In FIG. 13, heat pipes 6 and 6a having different diameters are arranged in the ventilation direction, and the heat pipe 6a has a large diameter on the leeward side.

Next, in the heat pipe type cooler 7m of the present embodiment configured as described above, heat pipes 6 and 6a having different diameters are arranged in the ventilation direction, and the heat pipe 6a having a larger diameter on the leeward side is used. By doing so, the heat transfer capacity on the leeward side is improved, and the fin efficiency can be improved.

As described above, in the heat pipe type cooler 7m of the present embodiment, the diameter of the heat pipe on the leeward side in the ventilation direction is set to be larger than the diameter of the heat pipe on the leeward side in the forced ventilation system. As a result, not only is the performance of the heat pipe itself better on the leeward side, but the penetrating connection with the radiating fins is larger on the leeward side, and the fin efficiency of the radiating fins is higher on the leeward side. It is possible to make the temperature rise of the unit block uniform.

(Fourteenth Embodiment: Corresponding to Claim 13) FIG. 14 shows a configuration example in which a forced-pipe heat pipe cooler according to the present embodiment is incorporated in a power converter under a vehicle body floor. FIG. 10 is a side view (a power conversion device is a cross-sectional view), and the same elements as those in FIG. 10 are denoted by the same reference numerals, and description thereof will be omitted.

In FIG. 14, the radiation fins are divided into two on the leeward side and the leeward side, and the thickness of the radiation fin 3l on the leeward side is made larger than the thickness of the radiation fin 3k on the leeward side. I have.

Next, in the heat pipe type cooler 7n of the present embodiment configured as described above, the radiation fins are divided into two on the windward side and the leeward side, and the radiation fins 3k on the windward side are divided.
By making the thickness of the fins 31l on the leeward side larger than on the leeward side, the fin efficiency on the leeward side is increased, and the temperature rise of the heat receiving unit block 5c can be made uniform.

As described above, in the heat pipe type cooler 7n of the present embodiment, in the case of the forced ventilation system, the radiating fins connected to the leeward heat pipe and the fins connected to the leeward heat pipe are used. The radiation fins are separated from the radiation fins, and the thickness of the radiation fins connected to the leeward heat pipe is made larger than the thickness of the radiation fins connected to the leeward heat pipe. Efficiency is higher on the leeward side, and the temperature rise of the heat receiving unit block can be made uniform.

[0140]

As described above, according to the heat pipe type cooler of the present invention, even when a plurality of semiconductor elements are mounted side by side in the direction in which the cooling air flows, the temperature rise of the heat receiving section block is uniform. Can be achieved.

In other words, the temperature rise of the semiconductor element mounting surface of the heat pipe type cooler can be made uniform, the margins of all the semiconductor elements with respect to the rated value can be made uniform, and the device rating determined by thermal constraints can be reduced. In addition to eliminating waste, the cooling system can efficiently utilize space and contribute to downsizing and weight reduction of the device.

[Brief description of the drawings]

FIG. 1 is a side view showing a first embodiment in which a natural ventilation type heat pipe type cooler according to the present invention is incorporated in a power converter.

FIG. 2 is a side view showing a second embodiment in which a heat pipe type cooler of a natural ventilation type according to the present invention is incorporated in a power converter.

FIG. 3 is a side view showing a third embodiment in which a natural ventilation type heat pipe type cooler according to the present invention is incorporated in a power converter.

FIG. 4 is a side view showing a fourth embodiment in which a natural ventilation type heat pipe type cooler according to the present invention is incorporated in a power converter.

FIG. 5 is a side view and a cross-sectional view showing a fifth embodiment in which a natural ventilation type heat pipe cooler according to the present invention is incorporated in a power converter.

FIG. 6 is a side view showing a sixth embodiment in which a natural ventilation type heat pipe type cooler according to the present invention is incorporated in a power converter.

FIG. 7 is a side view showing a seventh embodiment in which a natural ventilation type heat pipe cooler according to the present invention is incorporated in a power converter.

FIG. 8 is a side view showing an eighth embodiment in which a natural ventilation heat pipe type cooler according to the present invention is incorporated in a power converter.

FIG. 9 is a side view and a sectional view showing a ninth embodiment in which a natural ventilation type heat pipe cooler according to the present invention is incorporated in a power converter.

FIG. 10 is a side view showing a tenth embodiment in which a forced-pipe heat pipe cooler according to the present invention is incorporated in a power converter.

FIG. 11 is a side view showing an eleventh embodiment in which a forced draft heat pipe cooler according to the present invention is incorporated in a power converter.

FIG. 12 is a side view showing a twelfth embodiment in which the forced-pipe heat pipe cooler according to the present invention is incorporated in a power converter.

FIG. 13 is a side view and a sectional view showing a thirteenth embodiment in which a forced-pipe heat pipe cooler according to the present invention is incorporated in a power converter.

FIG. 14 is a side view showing a fourteenth embodiment in which a forced-pipe heat pipe cooler according to the present invention is incorporated in a power converter.

FIG. 15 is a side view and a perspective view showing a configuration example when a conventional natural ventilation type heat pipe cooler is incorporated in a power converter.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Vehicle body 2, 2a ... Power converter, 3, 3a, 3b, 3c, 3d, 3e, 3f, 3g, 3
h, 3i, 3j, 3k, 3l: radiation fins, 4: semiconductor element, 5, 5a, 5b, 5c: heat receiving block, 6, 6a, 6b, 6c, 6d, 6e: heat pipe, 7, 7a, 7b , 7c, 7d, 7e, 7f, 7g, 7
h, 7i, 7j, 7k, 7l, 7m, 7n: heat pipe type cooler, 8, 8a: open part, 9: peripheral circuit parts, 10, 10a: sealed part, 11: hole, 12: blower.

Claims (15)

[Claims] 1. A plurality of radiating fins installed in a substantially vertical direction and dissipating heat by natural ventilation to the atmosphere, and one heat receiving unit block installed in a substantially vertical direction and having a plurality of semiconductor elements mounted vertically. And, in the heat pipe type cooler of the natural ventilation system composed of a plurality of heat pipes connecting the respective heat radiation fins and the heat receiving unit block, wherein each heat pipe, the boiling part side is more than the condensing part It is inclined from the horizontal so as to be below, and installed side by side substantially parallel to each other in the vertical direction, and the respective radiating fins are arranged at a predetermined interval such that the interval between the upper radiating fins is smaller than the interval between the lower radiating fins. The heat pipe type cooler, wherein each of the heat pipes is penetrated and connected to each of the heat radiation fins. 2. A plurality of radiating fins installed in a substantially vertical direction and dissipating heat by natural ventilation to the atmosphere, and one heat receiving unit block installed in a substantially vertical direction and having a plurality of semiconductor elements mounted vertically. And, in the heat pipe type cooler of the natural ventilation system composed of a plurality of heat pipes connecting the respective heat radiation fins and the heat receiving unit block, wherein each heat pipe, the boiling part side is more than the condensing part Incline from the horizontal so as to be below, and set up substantially parallel to each other in the vertical direction, without connecting each of the heat radiation fins to all the heat pipes, the upper heat pipe is the lower heat A heat pipe type cooler characterized in that the number of radiating fins to be connected through is larger than that of a pipe. 3. A plurality of heat dissipating fins which are installed substantially vertically and dissipate heat by natural ventilation to the atmosphere, and one heat receiving unit block which is installed almost vertically and has a plurality of semiconductor elements mounted vertically. And, in the heat pipe type cooler of the natural ventilation system composed of a plurality of heat pipes connecting the respective heat radiation fins and the heat receiving unit block, wherein each heat pipe, the boiling part side is more than the condensing part The heat pipes are arranged so as to be inclined downward from the horizontal and are arranged substantially parallel to each other in the up-down direction, and the interval between the heat pipes arranged in the up-down direction is set such that the upper interval is smaller than the lower interval. A heat pipe type cooler characterized by the following. 4. A plurality of heat dissipating fins which are installed in a substantially vertical direction and dissipate heat by natural ventilation to the atmosphere, and one heat receiving unit block which is installed almost vertically and has a plurality of semiconductor elements mounted in a vertical direction. And, in the heat pipe type cooler of the natural ventilation system composed of a plurality of heat pipes connecting the respective heat radiation fins and the heat receiving unit block, wherein each heat pipe, the boiling part side is more than the condensing part Incline from the horizontal so as to be downward, and installed side by side substantially parallel to each other in the vertical direction, among the heat pipes arranged in the vertical direction, the diameter of the upper heat pipe is larger than the diameter of the lower heat pipe. A heat pipe type cooler characterized in that: 5. A plurality of heat dissipating fins which are installed substantially vertically and dissipate heat by natural ventilation to the atmosphere, and one heat receiving unit block which is installed almost vertically and has a plurality of semiconductor elements mounted vertically. And, in the heat pipe type cooler of the natural ventilation system composed of a plurality of heat pipes connecting the respective heat radiation fins and the heat receiving unit block, wherein each heat pipe, the boiling part side is more than the condensing part A heat radiation fin connected to the upper heat pipe among the heat radiation fins connected to the heat pipes arranged in the vertical direction. The radiation fins connected to the lower heat pipe are separate from each other, and the thickness of the radiation fins connected to the upper heat pipe is smaller than that of the lower heat pipe. A heat pipe type cooler characterized in that the thickness is larger than the thickness of the radiation fin connected to the heat pipe. 6. The method according to claim 1, wherein
In the heat pipe type cooler according to the paragraph, the heat radiation fins are two or more types of heat radiation fins having different sizes from each other, and the heat radiation fins having a large size are arranged on all the heat pipes arranged in the vertical direction. A heat pipe type cooler, characterized in that a heat-dissipating fin having a small size is connected through only to an upper heat-dissipating fin. 7. The method according to claim 1, wherein
In the heat pipe type cooler according to the item, a predetermined number of the heat radiation fins, the hole diameter of the portion through which the lower heat pipe penetrates is larger than the heat pipe diameter, the lower heat pipe penetrating A heat pipe type cooler characterized in that it is not connected at a part. 8. The method according to claim 1, wherein
In the heat pipe type cooler according to the item, while attaching each of the semiconductor elements to one surface of the heat receiving unit block, burying a boiling portion of each heat pipe on the other surface on the opposite side, A heat pipe type cooler, wherein each of the heat radiating fins is connected to a condensing part of a heat pipe, and the heat receiving part block is inclined such that a surface on which each of the semiconductor elements is mounted is obliquely downward. 9. A plurality of heat dissipating fins installed substantially parallel to the direction of ventilation and dissipating heat by forced ventilation to the atmosphere, one heat receiving unit block to which a plurality of semiconductor elements are attached, and each of the heat dissipating fins In a heat-pipe type cooler of a forced ventilation system composed of a plurality of heat pipes connecting a fin and the heat receiving unit block, the heat pipes are oriented substantially perpendicular to a direction in which wind flows, and The radiating fins are arranged at predetermined intervals so that the distance between the radiating fins on the leeward side is smaller than the distance between the radiating fins on the leeward side. A heat pipe type cooler characterized by connecting a pipe through. 10. A plurality of heat dissipating fins installed substantially parallel to the direction of ventilation and dissipating heat by forced ventilation to the atmosphere;
In a heat-pipe type cooler of a forced ventilation system comprising one heat-receiving unit block to which a plurality of semiconductor elements are attached, and a plurality of heat pipes connecting the respective heat-radiating fins and the heat-receiving unit block. The heat pipes are arranged in a direction substantially perpendicular to the direction in which the wind flows, and are arranged side by side in the direction in which the wind flows.The heat-radiating fins are not connected through the heat pipes to all the heat pipes. A heat pipe type cooler characterized in that the number of heat dissipating fins connected through the pipe is larger than that of the heat pipe on the windward side. 11. A plurality of radiating fins installed substantially parallel to the direction of ventilation and dissipating heat by forced ventilation to the atmosphere;
In a heat-pipe type cooler of a forced ventilation system comprising one heat-receiving unit block to which a plurality of semiconductor elements are attached, and a plurality of heat pipes connecting the respective heat-radiating fins and the heat-receiving unit block. The heat pipes are arranged in a direction substantially perpendicular to the direction in which the wind flows, and are arranged in the direction in which the wind flows, and the intervals between the heat pipes arranged in the ventilation direction are set such that the interval on the leeward side is A heat pipe type cooler characterized by being smaller than the interval. 12. A plurality of radiating fins installed substantially parallel to the direction of ventilation and dissipating heat by forced ventilation to the atmosphere;
In a heat-pipe type cooler of a forced ventilation system comprising one heat-receiving unit block to which a plurality of semiconductor elements are attached, and a plurality of heat pipes connecting the respective heat-radiating fins and the heat-receiving unit block. The heat pipes are arranged in a direction substantially perpendicular to the direction in which the wind flows, and arranged in the direction in which the wind flows, and among the heat pipes arranged in the ventilation direction, the diameter of the heat pipe on the leeward side in the ventilation direction is smaller. A heat pipe type cooler characterized in that the diameter is larger than the diameter of the heat pipe on the windward side. 13. A plurality of radiating fins installed substantially parallel to the direction of ventilation and dissipating heat by forced ventilation to the atmosphere;
In a heat-pipe type cooler of a forced ventilation system comprising one heat-receiving unit block to which a plurality of semiconductor elements are attached, and a plurality of heat pipes connecting the respective heat-radiating fins and the heat-receiving unit block. The heat pipes are arranged in a direction substantially perpendicular to the direction in which the wind flows, and are arranged side by side in the direction in which the wind flows. Of the radiating fins connected to the heat pipes arranged in the ventilation direction, the leeward side in the ventilation direction The heat radiation fins connected to the heat pipe are separated from the heat radiation fins connected to the heat pipe on the leeward side. A heat pipe type cooler characterized in that the thickness is larger than the thickness of a radiation fin connected to a pipe. 14. The heat pipe type cooler according to any one of claims 9 to 12, wherein each of the radiating fins is at least two types of radiating fins having different sizes. A heat pipe type in which a large radiating fin is penetratingly connected to all the heat pipes arranged in the direction in which the wind flows, and a small radiating fin is penetratingly connected only to the radiating fin on the leeward side. Cooler. 15. The heat pipe type cooler according to claim 9, wherein a predetermined number of the heat radiation fins are formed in a hole in a portion through which a heat pipe on the windward side penetrates. A heat pipe type cooler characterized in that the diameter is larger than the diameter of the heat pipe and the connection is not made at the heat pipe penetrating portion on the windward side.