JP2011259536A - Cooling device, power conversion device, and railway vehicle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow miniaturization of a device by efficiently cooling a power semiconductor of the power conversion device.SOLUTION: The power conversion device includes a plurality of power semiconductor elements, a heat receiving member, a plurality of heat pipes, and a plurality of heat radiation fins. The plurality of power semiconductor elements are attached to one side of the heat receiving member. The plurality of heat pipes are attached to the other side of the heat receiving member. At least a part of the plurality of heat pipes has a heat radiation part which is raised from the heat receiving member to the outside of the heat receiving member. The power conversion device comprises the heat pipe installed in such manner that a length direction of a portion of the heat pipe attached to the heat receiving member is in almost the same direction as a flowing direction of a cooling air, and the heat pipe installed in such manner that the length direction of the portion of the heat pipe attached to the heat receiving member is in a direction almost vertical to the flowing direction of the cooling air.

Description

  The present invention relates to improving the cooling performance of a cooling device. In particular, it is related with a power converter device.

  The power conversion device is for controlling an electric motor, and it is desired that the power conversion device be improved in cooling performance and downsized. The conventional power converter is arranged such that the heat receiving part of the L-shaped heat pipe is in thermal contact with the heat receiving member as in Patent Document 1, and the heat radiating parts rising from the heat pipe heat receiving part are arranged in a staggered manner. Thus, a structure with improved heat dissipation performance is known.

JP-A-11-251499

  In recent years, improving the cooling performance of the cooling device has become an important issue, and particularly in power conversion devices that require high output such as high-speed vehicles, power semiconductor elements with high heat generation density tend to be closely arranged. It is important to cool the high heat generation to suppress the temperature rise of the element. In the conventional structure, since the heat receiving portion of the heat pipe is arranged only in the flow direction of the cooling air, when there is a large heat generation distribution in the direction perpendicular to the flow of the cooling air, the portion where the heat generation is large to the portion where the heat generation is small Since heat is not necessarily sufficiently transferred to the heat sink, there is a problem that the cooling device is increased in size.

  An object of the present invention is to provide a cooling device or power conversion capable of sufficiently transferring heat from a large heat generation portion to a small portion even when the heat generation of the heat generating element is distributed in a direction different from the flow direction of the cooling air. To provide an apparatus.

  In order to achieve the above object, in the power conversion device of the present invention, the plurality of heat pipes are connected to the heat receiving member such that portions of the plurality of heat pipes attached to the heat receiving member form a predetermined angle or more. It is attached.

  In the cooling device of the present invention, the plurality of heat pipes are connected to the heat receiving member such that portions of the plurality of heat pipes connected to the heat receiving member form a predetermined angle or more.

  Even when the heat generation of the heating element is distributed in a direction different from the flow direction of the cooling air, the heat moves from the part where the cooling air temperature is high and the element temperature easily rises to the part where the cooling air temperature is relatively low, and the heat generation amount Since heat moves from a portion with a large amount to a portion with a small amount, the heat generated by the heat generating element is effectively dispersed and the cooling performance of the cooling device is improved.

It is vertical direction sectional drawing parallel to the flow direction of the cooling wind of the power converter device in one Embodiment of this invention. It is the vertical direction sectional view seen from the flow direction of the cooling wind of the power converter in one embodiment of the present invention. It is a figure which shows arrangement | positioning of the heat pipe and semiconductor module of the power converter device in one Embodiment of this invention. It is vertical direction sectional drawing parallel to the flow direction in another position of the power converter device in one Embodiment of this invention. It is the vertical direction sectional view seen from the perpendicular direction with the flow direction of the cooling wind in another position of the power converter in one embodiment of the present invention. It is a figure which shows the other arrangement | positioning method of arrangement | positioning of the heat pipe and semiconductor module of the power converter device in one Embodiment of this invention. It is a figure which shows arrangement | positioning of the heat pipe and semiconductor module of the power converter device in other embodiment (2nd Embodiment) of this invention. It is vertical direction sectional drawing of the orthogonal | vertical direction with the flow direction of the cooling wind of the power converter device in other embodiment (2nd Embodiment) of this invention. It is vertical direction sectional drawing along the flow direction of the cooling wind of the power converter device in further another embodiment (3rd Embodiment) of this invention. It is vertical direction sectional drawing along the flow direction of the cooling wind of the power converter device in further another embodiment (3rd Embodiment) of this invention. It is a figure which shows arrangement | positioning of the heat pipe and semiconductor module of the power converter device in further another embodiment (4th Embodiment) of this invention. It is a figure which shows the structure which mounted the power converter device of this invention in the rail vehicle. It is a figure which shows the arrangement configuration of each module of the power converter device in one Embodiment of this invention. It is a figure which shows an example of the emitted-heat amount and temperature distribution of each module in the power converter device in one Embodiment of this invention. It is a figure which shows the circuit diagram for 1 phase of the power converter device in one Embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 12 shows a configuration when the power conversion device according to one embodiment of the present invention is mounted on a railway vehicle. The power conversion device of the present invention is provided under the floor of a railway vehicle and controls the rotation speed of the electric motor by controlling the frequency of electric power supplied to the electric motor that drives the vehicle. In FIG. 12, power conversion apparatus 1000 is fixed to vehicle body 1002. An arrow 30 indicates the flow of cooling air. The cooling air is sucked from the suction grille 41 by the blower 40 and supplied to the cooling device 1001 of the power conversion device 1000.

  FIG. 15 shows a circuit configuration for one phase of the power conversion device of this embodiment. The power conversion device includes a power semiconductor element such as an insulated gate bipolar transistor (IGBT) or a clamp diode, and a capacitor, and includes the circuit shown in FIG. 15 for three phases U, V, and W. When the power converter is driven as an inverter, a DC voltage can be received from the primary side and a three-level voltage waveform can be output to the secondary side.

  FIG. 13 shows an arrangement configuration of each module of the power conversion device according to the present embodiment. The plurality of IGBT modules 6 and 8 and the clamp diode module 7 are arranged on one surface of the heat receiving member 4 made of a metal such as an aluminum alloy.

  FIG. 14 shows an example of the heat generation amount and temperature distribution of each module when the power conversion device of this embodiment is driven. From this figure, the heat generation amount of the clamp diode module 7 is lower than the heat generation amount of the IGBT modules 6 and 8, and the temperature distribution is similarly low in the clamp diode module 7 as compared with the IGBT modules 6 and 8. I understand. Actually, the maximum heat generation amount of the IGBT modules 6 and 8 is as large as about 10 times the maximum heat generation amount of the clamp diode module 7.

  FIG. 1 is a vertical sectional view parallel to the cooling air flow direction of the power conversion device in the present embodiment (first embodiment), and FIG. 2 is a vertical sectional view seen from a direction perpendicular to the cooling air flow direction. Show. Since the power converter of the present embodiment is arranged so that the modules are arranged symmetrically on the heat receiving member, FIG. 2 shows a half structure of the apparatus.

  In FIG. 1, reference numeral 1000 denotes an entire power converter, and 1001 denotes a cooling device for the power converter. The cooling device includes a heat receiving member 4, heat pipes 1, 2, fins 5 and the like. The modules 6, 7, 8, 61, 62 and the like are fixed by a heat receiving member 4 and screws (not shown) via a member (not shown) such as grease. Electronic components such as an IGBT drive circuit 9 and a filter capacitor 10 are installed on the heat receiving member 4 side of the power semiconductor module. The periphery of the power semiconductor module mounted on the heat receiving member 4 is sealed with cases 11 and 12. On the opposite side of the power semiconductor module installation surface of the heat receiving member 4, the heat receiving portion 101 of the U-shaped heat pipe 1 is embedded so as to be substantially in the same direction as the cooling air flow direction. Thus, the heat receiving member 4 is thermally connected. Here, the direction substantially the same as the flow direction of the cooling air is intended to be in the direction of about −10 degrees to about 10 degrees with respect to the flow direction of the cooling air. However, they do not necessarily have to be in substantially the same direction, and may be in the range of about −45 degrees to about 45 degrees. From both sides of the heat receiving part 101 of the U-shaped heat pipe 1, a heat radiating part 102 stands up. Similarly, the heat receiving portion 201 of the L-shaped heat pipe 2 is embedded in the heat receiving member 4 so as to be substantially in the same direction as the flow direction of the cooling air, and is connected to the heat receiving portion by soldering or the like. From one side of the heat receiving part 201 of the L-shaped heat pipe 2, a heat radiating part 202 rises. A plurality of fins 5 made of a metal such as aluminum or copper are connected to the heat radiating portions 102 and 202 by press fitting or the like.

  Furthermore, the heat receiving member 4 is provided with the heat pipe 3 so that the flow direction of the cooling air and the longitudinal direction thereof are substantially perpendicular. That is, the longitudinal direction of the heat pipe 3 is arranged in a direction substantially perpendicular to the longitudinal direction of the U-shaped heat pipe 1 or the L-shaped heat pipe 2. Here, the direction in which the flow direction of the cooling air and the longitudinal direction thereof are substantially perpendicular is intended to be the direction that forms an angle of about 80 degrees to about 100 degrees with respect to the flow direction of the cooling air. However, they do not necessarily have to be in substantially the same direction, and may be in the range of about 45 degrees to about 135 degrees.

  The arrangement of the heat receiving member 4, the heat pipe, and the power semiconductor module is shown in FIG. In FIG. 3, 6, 8, 61, 62, 81 and 82 indicate IGBT modules, and 7, 71 and 72 indicate clamp diode modules. Since each power semiconductor module is installed on the surface opposite to the heat pipe, it is indicated by a broken line in FIG. 4 and 5 are vertical cross-sectional views taken along a plane cut through the central axis of the heat pipe 3. 4 shows a cross section parallel to the flow of cooling air, and FIG. 5 shows a cross section perpendicular to the flow of cooling air. Note that cut planes AA, BB, CC, and DD in FIG. 3 correspond to the cross-sectional views of FIGS. 1, 2, 4, and 5, respectively. A heat receiving portion 301 of the heat pipe 3 is embedded in the heat receiving member 4, and a heat radiating portion 302 rises from one side of the heat receiving portion 301 and is connected to the fin 5. Heat pipes 15 and 16 having no rising portions are provided in the vicinity of the end portions that cannot be raised to the fin side.

  A duct 14 is provided around the cooling device 1001, and cooling air is sent to the duct 14 by the blower 40 as shown in FIG. 12. In the present embodiment, the structure for forcibly blowing the cooling air with the cooling fan will be described. However, the structure for cooling the power conversion device by the traveling air generated when the vehicle travels, and the heated air rises. The present invention can also be applied to a structure that cools the power converter using natural convection. In the case of a structure using traveling air, the cooling air is substantially in the same direction as the traveling direction, so that the heat pipes 1 and 2 are arranged along substantially the same direction as the traveling direction of the vehicle. Further, in the structure using natural convection, the heat pipes 1 and 2 are arranged along substantially the same direction as the vertical direction (gravity direction) of the railway vehicle.

  Next, the operation of cooling each power semiconductor module will be described taking the IGBT module 82 as an example. Heat generated by the operation of a power semiconductor or the like provided in the IGBT module 82 is transmitted to the heat receiving member 4 and reaches the heat receiving portion 101 of the U-shaped heat pipe 1. A refrigerant (pure water, hydrofluorocarbon, etc.) is sealed in the U-shaped heat pipe 1. The refrigerant heated in the heat receiving unit 101 evaporates into a gas and moves to the heat radiating unit 102. The refrigerant cooled by the air in the heat radiating unit 102 is condensed and returned to the liquid. The refrigerant condensed in the heat radiating unit 102 returns to the heat receiving unit 101 by gravity. Thus, by repeating evaporation and condensation, the refrigerant moves, so that the heat of the heat receiving member 4 is dissipated outside the power conversion device such as the atmosphere. The heat pipes 2 and 3 are also filled with a refrigerant (pure water, hydrofluorocarbon, etc.). Similarly, the refrigerant moves through repeated evaporation and condensation, so that the heat of the heat receiving member 4 is transferred to the power conversion device such as the atmosphere. Heat is released to the outside. A refrigerant (pure water, hydrofluorocarbon, etc.) is also sealed in the heat pipes 15 and 16 that do not have a rising portion.

  Due to the heat generated by the power semiconductor module, the temperature of the cooling air rises from the windward side toward the leeward side. Therefore, even if the heat generation amount is the same, the junction temperature of the leeward power semiconductor module tends to be higher than the junction temperature of the leeward power semiconductor module. 1 to 5, U-shaped and L-shaped heat pipes 1 and 2 arranged in the longitudinal direction in the direction of cooling air have heat receiving portions 101 and heat radiating portions 102 arranged along the flow of cooling air. By moving heat from the leeward side to the leeward side, the temperature rise of the power semiconductor module on the leeward side is suppressed.

  On the other hand, as shown in FIG. 14, the heat generation amount of the IGBT modules 8, 81, 82 is significantly larger than the heat generation amount of the clamp diode modules 7, 71, 72, and the heat generation amount of the IGBT modules 8, 81, 82 is IGBT module. When it is relatively larger than 6, 61, 62, the heat pipe 3 having a longitudinal direction arranged in a direction substantially perpendicular to the direction of the traveling wind heats the heat from the larger amount of heat generation in the direction substantially perpendicular to the cooling wind. Therefore, it is possible to suppress the temperature rise of the IGBT modules 8, 81, and 82 that generate a large amount of heat. Here, the heat pipe 3 is arranged so as to straddle the IGBT module having a large calorific value and the clamp diode module having a relatively small calorific value, thereby facilitating heat transfer from the larger calorific value to the smaller calorific value. Furthermore, the heat pipes 15 and 16 that do not have a rising portion also have a soaking action that averages by moving heat from a high temperature portion to a low temperature portion.

  When the heat generation amounts of the IGBT modules 6, 61, 62 and the IGBT modules 8, 81, 82 are about the same and are significantly larger than the heat generation amounts of the clamp diode modules 7, 71, 72, as shown in FIG. A heat pipe 3 having a longitudinal direction arranged in a direction substantially perpendicular to the direction of the traveling wind may be arranged in each of the parts 6, 8, 61, 62, 81, 82. A heat pipe installed in a direction in which the longitudinal direction is substantially perpendicular to the flow direction of the cooling air so as to straddle between a portion with a large amount of heat generation on the corresponding element side and a portion with a small amount of heat generation or a portion without a heating element. The structure will be installed.

  As described above, according to the present embodiment, a power semiconductor module is obtained by combining a heat pipe having a longitudinal direction arranged in substantially the same direction as the cooling air and a heat pipe having a longitudinal direction arranged substantially perpendicular to the cooling air. Since the cooling performance can be improved by effectively dispersing the heat generation, it is possible to reduce the size of the cooling device. In addition, as the cooling device is downsized, one side of the heat receiving member is covered with a heat generating module, so that it straddles the position corresponding to the module that generates a relatively large amount of heat and the module that generates a relatively small amount of heat. Thus, it is possible to improve the soaking effect by arranging the heat pipe.

  7 and 8 show a power conversion device according to another embodiment (second embodiment) of the present invention. FIG. 7 shows the arrangement of the heat receiving member 4, the heat pipe, and the power semiconductor module, and FIG. 8 shows a cross section perpendicular to the flow direction of the cooling air (cross section corresponding to EE in FIG. 7). The structure of other parts is the same as that of the first embodiment. In the present embodiment, both end portions 312 and 313 of the heat receiving portion 311 of the heat pipe 31 in a direction substantially perpendicular to the flow of cooling air are raised to the fin side. By adopting such a structure, the heat generation of the high temperature IGBT modules 6, 61, 62 is moved to a relatively low part, and the cooling performance is improved by dissipating heat to the fins in the high temperature power semiconductor module part. is doing. According to this embodiment, by combining a heat pipe in which the heat receiving portion is arranged so that the substantially same direction as the cooling air is the longitudinal direction, and a U-shaped heat pipe in which the heat receiving portion is arranged in a direction substantially perpendicular to the cooling air Since the heat generation of the power semiconductor module can be effectively dispersed to improve the cooling performance, the cooling device can be downsized.

  FIG. 9 shows a power conversion apparatus according to still another embodiment (third embodiment) of the present invention. In the present embodiment, the pitch of the fins 5 on the upstream side of the cooling air is widened, and the fin pitch is reduced by the fins 5 and 50 on the downstream side. As the configuration of the fins, as shown in FIG. 10, the fins may be divided into upstream fins 51 and downstream fins 52, and the respective fin pitches may be changed. Further, the material of the upstream fin and the downstream fin may be changed so that the thermal conductivity of the downstream fin is higher than the thermal conductivity of the upstream fin. For example, the material of the upstream fin is aluminum and the material of the downstream fin is copper.

  According to this embodiment, the windward part where the temperature of the cooling air is low widens the fin pitch to reduce the ventilation resistance, and the part of the leeward where the temperature of the cooling air is high narrows the fin pitch to increase heat dissipation. As a result, the entire cooling device can dissipate heat in a well-balanced manner, and the cooling device can be downsized.

  FIG. 11 shows a power conversion device according to still another embodiment (fourth embodiment) of the present invention. In the present embodiment, the interval between the pipes (radiating portions) that rise to the fin side of the upstream heat pipes 401 and 402 is large, and the interval between the pipes (radiating portions) that rises to the fin side of the downstream heat pipes 403 and 404. The pipe (heat dissipating part) raised to the fin side of the heat pipe is arranged densely toward the downstream. According to this embodiment, the windward portion of the windward where the temperature of the cooling air is low widens the interval between the pipes to reduce the ventilation resistance of the pipe, and the portion of the leeward where the temperature of the cooling air is high reduces the interval of the pipe By installing many pipes that radiate heat to the fins, heat can be radiated in a well-balanced manner as the entire cooling device, and the cooling device can be downsized.

  In addition, by combining the structure of FIG. 9 or FIG. 10 in the third embodiment and the structure of FIG. 11 in the fourth embodiment, the module can be radiated more effectively, and the cooling device can be downsized. Is possible.

  In each of the above-described embodiments, an example in which the U-shaped heat pipe 1 and the L-shaped heat pipe 2 are arranged along substantially the same direction as the cooling air is shown. However, the present invention is not limited to the embodiment, and U Of course, the present invention can also be applied to the case where the heat radiating portion is configured only by the letter-shaped heat pipe 1 or the case where the heat radiating portion is configured only by the L-shaped heat pipe 2.

  Further, in each of the above-described embodiments, the example in which the heat radiating portions are arranged in a staggered manner has been described. However, the present invention is not limited to the embodiment, and the heat radiating portions of the heat pipes adjacent to the cooling direction are substantially in the cooling direction. The present invention can also be applied to a configuration in which the heat dissipating portions are aligned so as to overlap each other when viewed in a substantially vertical direction.

  In each of the above-described embodiments, the description has been given of combining the heat pipe having the longitudinal direction arranged in the substantially same direction with the cooling air and the heat pipe 3 having the longitudinal direction arranged in the substantially vertical direction with the cooling air. There is no need to be aware of the direction of the cooling air, and if the heat receiving parts of the plurality of heat pipes are arranged on the heat receiving member 4 so as to have an angle of a predetermined angle or more, the heat generation of the power semiconductor module is dispersed to improve the cooling performance. The effect of making it possible can be produced. Here, the predetermined angle or more may be, for example, 30 degrees or more and 150 degrees or less.

  In the above-described embodiments, the IGBT module and the clamp diode module are shown as examples of the power semiconductor modules having different maximum heat generation amounts. However, even among IGBT modules, the maximum heat generation amount is different and the temperature distribution is inclined. In some cases, the present invention is applicable.

DESCRIPTION OF SYMBOLS 1 U-shaped heat pipe 2 L-shaped heat pipe 3 Heat pipe 4 Heat receiving member 5 Fin 6, 8, 61, 62, 81, 82 IGBT module 7, 71, 72 Clamp diode module 9 IGBT drive circuit 10 Filter capacitor 11, 12, 13 Case 14 Duct 15, 16 Heat pipe 40 having no rising part Blower 101, 201, 301 Heat pipe heat receiving part 102, 202, 302 Heat pipe heat radiating part

Claims (17)

A plurality of power semiconductor elements, a heat receiving member, and a plurality of heat pipes;
The plurality of power semiconductor elements are attached to one surface of the heat receiving member,
The plurality of heat pipes are attached to the other surface of the heat receiving member,
The plurality of heat pipes, in a power converter including a heat radiating unit raised outside the heat receiving member, and a heat receiving unit in contact with the heat receiving member,
The plurality of heat pipes include at least a first heat pipe and a second heat pipe,
The electric power is arranged on the heat receiving member such that the longitudinal direction of the heat receiving portion of the first heat pipe and the longitudinal direction of the heat receiving portion of the second heat pipe form an angle of about 30 degrees or more. Conversion device. The power conversion device according to claim 1,
In the first heat pipe, the longitudinal direction of the heat receiving portion is installed in substantially the same direction as the flow direction of the cooling air,
The power converter according to claim 2, wherein the second heat pipe is installed such that a longitudinal direction of the heat receiving portion is substantially perpendicular to a cooling air flow direction. The power conversion device according to claim 2,
The power receiving device of the second heat pipe is disposed across a position corresponding to the IGBT module and the diode module. The power conversion device according to claim 2,
At least a part of the second heat pipe installed in a direction in which the longitudinal direction is substantially perpendicular to the flow direction of the cooling air is raised at least one side to the outside of the heat receiving member. The power conversion device according to claim 2,
Including fins attached to the heat radiating portion;
The said fin is changing the space | interval in the upstream and downstream of a cooling wind, and narrowed the space | interval of the said fin toward the downstream, The power converter device characterized by the above-mentioned. The power conversion device according to claim 2,
A power conversion device characterized in that the space between the heat radiating portions is changed between the upstream side and the downstream side of the cooling air, and the space between the heat radiating portions is narrowed toward the downstream side. The power conversion device according to claim 5, wherein
The power conversion device according to claim 1, wherein a material of the fin is changed between the upstream side and the downstream side of the cooling air so that the thermal conductivity of the fin on the downstream side is larger than the thermal conductivity of the fin on the upstream side. A heat receiving member for connecting a plurality of heating elements on one surface;
A plurality of heat pipes connected to the other surface of the heat receiving member,
The plurality of heat pipes, in a cooling device including a heat radiating portion raised outside the heat receiving member, and a heat receiving portion that contacts the heat receiving member,
The plurality of heat pipes include at least a first heat pipe and a second heat pipe,
The longitudinal direction of the heat receiving part of the first heat pipe and the longitudinal direction of the heat receiving part of the second heat pipe are arranged on the heat receiving member so as to form an angle of about 30 degrees or more. Cooling system. The cooling device according to claim 8, wherein
In the first heat pipe, the longitudinal direction of the heat receiving portion is installed in substantially the same direction as the flow direction of the cooling air,
The cooling device, wherein the second heat pipe is installed in a direction in which a longitudinal direction of the heat receiving portion is substantially perpendicular to a flow direction of cooling air. The cooling device according to claim 9, wherein
At least a part of the plurality of second heat pipes includes the heat radiating unit on at least one side of the pipes. The cooling device according to claim 9, wherein
Including fins attached to the heat radiating portion;
The cooling device is characterized in that the fins have different intervals between the upstream side and the downstream side of the cooling air, and the intervals between the fins are narrower toward the downstream side. The cooling device according to claim 9, wherein
The cooling apparatus characterized by changing the space | interval of the said heat radiating part in the upstream and downstream of a cooling wind, and narrowing the space | interval of the said heat radiating part toward the downstream. The cooling device according to claim 11, wherein
A cooling device, wherein the fin material is changed between the upstream side and the downstream side of the cooling air so that the thermal conductivity of the fin on the downstream side is larger than the thermal conductivity of the fin on the upstream side. Driven by a power converter including a heat receiving member, a plurality of power semiconductor elements attached to one side of the heat receiving member, and a plurality of heat pipes attached to the other side of the heat receiving member, and the power converter In a railway vehicle equipped with an electric motor for driving a vehicle,
The plurality of heat pipes include at least a first heat pipe and a second heat pipe,
The longitudinal direction of the heat receiving part of the first heat pipe and the longitudinal direction of the heat receiving part of the second heat pipe are arranged on the heat receiving member so as to form an angle of about 30 degrees or more. Railway vehicle. The railway vehicle according to claim 14, wherein
Equipped with a blower that blows cooling air of the power conversion device in a direction substantially perpendicular to the traveling direction of the railway vehicle,
In the first heat pipe, the longitudinal direction of the heat receiving portion is installed in substantially the same direction as the blowing direction of the blower,
The second heat pipe is mounted with a power conversion device in which a longitudinal direction of the heat receiving portion is installed in a direction substantially perpendicular to a blowing direction of the blower. The railway vehicle according to claim 14, wherein
In the first heat pipe, the longitudinal direction of the heat receiving portion is installed in substantially the same direction as the traveling direction of the railway vehicle,
The second heat pipe is mounted with a traveling wind-cooled power conversion device in which the longitudinal direction of the heat receiving portion is installed in a direction substantially perpendicular to the traveling direction of the railway vehicle. The railway vehicle according to claim 14, wherein
The first heat pipe is a first heat pipe in which the longitudinal direction of the heat receiving portion is installed in substantially the same direction as the vertical direction of the railway vehicle,
The second heat pipe is mounted with a natural convection cooling type power converter including a second heat pipe in which the longitudinal direction of the heat receiving portion is installed in a direction substantially perpendicular to the vertical direction of the railway vehicle. A railway vehicle characterized by that.

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