JP2018037557A - Power converter and rolling stock mounting power converter - Google Patents

Power converter and rolling stock mounting power converter Download PDF

Info

Publication number
JP2018037557A
JP2018037557A JP2016170271A JP2016170271A JP2018037557A JP 2018037557 A JP2018037557 A JP 2018037557A JP 2016170271 A JP2016170271 A JP 2016170271A JP 2016170271 A JP2016170271 A JP 2016170271A JP 2018037557 A JP2018037557 A JP 2018037557A
Authority
JP
Japan
Prior art keywords
fin
receiving member
guide plate
power semiconductor
heat receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016170271A
Other languages
Japanese (ja)
Other versions
JP6652467B2 (en
Inventor
舟越　砂穂
Saho Funakoshi
砂穂 舟越
敬介 堀内
Keisuke Horiuchi
敬介 堀内
秀一 寺門
Shuichi Terakado
秀一 寺門
陽介 安田
Yosuke Yasuda
陽介 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2016170271A priority Critical patent/JP6652467B2/en
Publication of JP2018037557A publication Critical patent/JP2018037557A/en
Application granted granted Critical
Publication of JP6652467B2 publication Critical patent/JP6652467B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a power converter having a cooling structure capable of cooling power semiconductor elements, having high mounting density and located at a place of high air temperature, efficiently, and to provide a rolling stock mounting the power converter.SOLUTION: A power converter having power semiconductor elements includes a heat receiving member for dissipating heat of the power semiconductor elements, multiple power semiconductor elements provided on one side of the heat receiving member, and heat dissipation fin provided on the other side of the heat receiving member. The tip of the fin includes an air intake guide inclining in the flow direction of cooling air, so that the flow path becomes narrower from the windward of fin and the lee side of fin to the central part of fin, and a guide plate for guiding the cooling air from the lateral face to the center of the flow path.SELECTED DRAWING: Figure 2

Description

本発明は、電力変換装置および電力変換装置を搭載した鉄道車両に関し、例えば省スペースの電力変換装置に適用して好適なものである。   The present invention relates to a power conversion device and a railway vehicle equipped with the power conversion device, and is suitable for application to, for example, a space-saving power conversion device.

従来の電力変換装置においては、特許文献１のように、半導体素子を受熱部材に取付け、受熱部材の反対側にはフィンを取付け、車両の走行により生じる風をフィンに当てることによって半導体素子の熱を空気に放熱する構造が知られている。   In the conventional power conversion device, as disclosed in Patent Document 1, the semiconductor element is attached to the heat receiving member, the fin is attached to the opposite side of the heat receiving member, and the heat generated by the traveling of the vehicle is applied to the fin. A structure for radiating heat to air is known.

また、特許文献２のように、ヒートシンクに冷却空気を流通させ発熱部品の冷却を行う電子機器の冷却構造において、ヒートシンクのフィン先端の両端部がフィンより離反方向に屈曲する導風カバーを取付けた構造が知られている。   Further, as in Patent Document 2, in a cooling structure for an electronic device in which cooling air is circulated through a heat sink to cool a heat-generating component, a wind guide cover in which both ends of the fin tip of the heat sink are bent away from the fin is attached. The structure is known.

特開２０００−０９２８１９号公報JP 2000-092819 A 特開２０００−２７７９５５号公報JP 2000-277955 A

本願発明者が、電力変換装置のパワー半導体素子を効率的に冷却することについて鋭意検討した結果、次の知見を得るに至った。   The inventor of the present application diligently studied to efficiently cool the power semiconductor element of the power converter, and as a result, the following knowledge was obtained.

電力変換装置は、電気鉄道車両等の車両を駆動する電動機を制御するためのもので、車両の床下等に設置されている。車両の床下等のスペースは限られているため、できるだけ小型の冷却構造で効率的に電力変換装置のパワー半導体素子を冷却することが望ましい。   The power conversion device is for controlling an electric motor that drives a vehicle such as an electric railway vehicle, and is installed under the floor of the vehicle. Since the space under the floor of the vehicle is limited, it is desirable to efficiently cool the power semiconductor element of the power converter with a cooling structure that is as small as possible.

特許文献１のように、半導体素子を受熱部材に取付け、受熱部材の反対側にはフィンを取付け、車両の走行により生じる風をフィンに当てることによって半導体素子の熱を空気に放熱する構造では、車両の走行によって生じる走行風がフィン先端部より逃げてしまい、走行風でフィンを十分に冷却することができないという問題がある。   As in Patent Document 1, the semiconductor element is attached to the heat receiving member, the fin is attached to the opposite side of the heat receiving member, and the heat generated by the traveling of the vehicle is applied to the fin to radiate the heat of the semiconductor element to the air. There is a problem that the traveling wind generated by the traveling of the vehicle escapes from the tip of the fin and the fins cannot be sufficiently cooled by the traveling wind.

また、特許文献２のように、ヒートシンクのフィン先端の両端部がフィンより離反方向に屈曲する導風カバーを取付けた構造では、ある程度フィン溝の方に冷却空気を誘導することはできるが、発熱部品の実装密度が高くかつ空気温度の高い場所にある下流側の受熱部材中央付近にある部品を狙って風を導く構造とはなっておらず、高い温度の部品を必ずしも効率よく冷却することができないという問題もある。   Further, as in Patent Document 2, in the structure in which the wind guide cover in which both ends of the fin tips of the heat sink are bent away from the fins, the cooling air can be guided to the fin groove to some extent, The structure is not designed to guide the wind near the center of the heat receiving member on the downstream side in a place where the mounting density of the parts is high and the air temperature is high, and high temperature parts are not necessarily cooled efficiently. There is also a problem that it cannot be done.

本発明は以上の点を考慮してなされたもので、実装密度が高くかつ空気温度の高い場所にあるパワー半導体素子を効率良く冷却することができる冷却構造を有する電力変換装置および電力変換装置を搭載した鉄道車両を提案しようとするものである。   The present invention has been made in consideration of the above points, and includes a power conversion device and a power conversion device having a cooling structure capable of efficiently cooling a power semiconductor element in a place where the mounting density is high and the air temperature is high. It is intended to propose a railway vehicle installed.

かかる課題を解決するため本発明においては、パワー半導体素子を有する電力変換装置において、パワー半導体素子の熱を放熱する受熱部材と、受熱部材の一方の面に設けられた複数のパワー半導体素子と、受熱部材の他方の面に設けられた放熱用のフィンとを有し、フィンの先端部は、冷却風の流れ方向に沿って、フィン風上部およびフィン風下部からフィン中央部にかけて流路が狭くなるように傾斜した導風板と、流路側面から流路中央へ冷却風を案内する案内板とを備えるようにした。   In order to solve such a problem, in the present invention, in a power conversion device having a power semiconductor element, a heat receiving member that dissipates heat of the power semiconductor element, and a plurality of power semiconductor elements provided on one surface of the heat receiving member, A fin for heat dissipation provided on the other surface of the heat receiving member, and the tip of the fin has a narrow flow path from the fin wind upper part and the fin wind lower part to the fin central part along the cooling air flow direction. An air guide plate inclined so as to be provided and a guide plate for guiding cooling air from the side surface of the flow channel to the center of the flow channel are provided.

また本発明においては、パワー半導体素子を有する電力変換装置を搭載した鉄道車両において、電力変換装置は、パワー半導体素子の熱を放熱する受熱部材と、受熱部材の一方の面に設けられた複数のパワー半導体素子と、受熱部材の他方の面に設けられた放熱用のフィンとを有し、フィンの先端部は、冷却風の流れ方向に沿って、フィン風上部およびフィン風下部からフィン中央部にかけて流路が狭くなるように傾斜した導風板と、流路側面から流路中央へ冷却風を案内する案内板とを備えるようにした。   In the present invention, in the railway vehicle equipped with the power conversion device having the power semiconductor element, the power conversion device includes a heat receiving member that dissipates heat of the power semiconductor element, and a plurality of heat receiving members provided on one surface of the heat receiving member. A power semiconductor element and a heat dissipating fin provided on the other surface of the heat receiving member, and the tip of the fin extends from the fin wind upper portion and the fin wind lower portion to the fin central portion along the cooling air flow direction. And a guide plate that guides the cooling air from the side surface of the flow path to the center of the flow path.

本電力変換装置および電力変換装置を搭載した鉄道車両によれば、フィンの先端部に導風板を備え、当該導風板を冷却風の流れ方向に沿って、フィン風上部およびフィン風下部からフィン中央部にかけて流路が狭くなるように傾斜させることにより、空気温度の上昇で素子の温度が上がりやすい下流側フィンに走行風を取り込むとともに、流路側面から流路中央へ冷却風を案内する案内板を設けることにより、パワー半導体素子の実装密度が高い受熱部材中央付近にあるフィン周囲の風速が増加してフィンを効率よく冷却することができるので、温度が高くなりやすい下流側中央部の素子の温度を下げることが可能である。   According to the power converter and the railway vehicle equipped with the power converter, the fin has a wind guide plate at the tip of the fin, and the wind guide plate is arranged along the flow direction of the cooling wind from the fin wind upper part and the fin wind lower part. By tilting so that the flow path becomes narrower toward the fin center, the running air is taken into the downstream fin, where the temperature of the element is likely to rise due to an increase in air temperature, and the cooling air is guided from the side surface of the flow path to the flow path center. By providing the guide plate, the wind speed around the fin in the vicinity of the center of the heat receiving member where the mounting density of the power semiconductor elements is high can be increased and the fin can be cooled efficiently. It is possible to reduce the temperature of the element.

本発明によれば、実装密度が高くかつ空気温度の高い場所にあるパワー半導体素子を効率良く冷却することができる冷却構造を有する電力変換装置および電力変換装置を搭載した鉄道車両を実現できる。   ADVANTAGE OF THE INVENTION According to this invention, the railroad vehicle carrying the power converter device which has a cooling structure which can cool efficiently the power semiconductor element in a place with high mounting density and high air temperature, and a power converter device is realizable.

本発明の電力変換装置を鉄道車両に設置した状態を示す図である。It is a figure which shows the state which installed the power converter device of this invention in the rail vehicle. 本発明の一実施形態における電力変換装置の構成を示す図である。It is a figure which shows the structure of the power converter device in one Embodiment of this invention. 本発明の一実施形態における電力変換装置の冷却部の斜視図である。It is a perspective view of the cooling unit of the power converter in one embodiment of the present invention. 本発明の一実施形態における電力変換装置の冷却部に設けられた整流板、冷却風の流れ方向に沿って流路が狭くなるように傾斜した導風板および流路側面から流路中央へ冷却風を案内する案内板の外観図である。Cooling from the rectifying plate provided in the cooling unit of the power converter in one embodiment of the present invention, the air guide plate inclined so that the flow path becomes narrower along the flow direction of the cooling air, and the flow path side surface to the flow path center It is an external view of the guide plate which guides a wind. 本発明の一実施形態における電力変換装置の受熱部材上におけるパワー半導体素子の配置の一例を示す図である。It is a figure which shows an example of arrangement | positioning of the power semiconductor element on the heat receiving member of the power converter device in one Embodiment of this invention. 電力変換装置のフィンの先端部を平板状の板材で塞いだときのフィン間の風速分布を示す図である。It is a figure which shows the wind speed distribution between fins when the front-end | tip part of the fin of a power converter device is block | closed with the flat plate-shaped board | plate material. 本発明の一実施形態における電力変換装置のフィン間の風速分布を示す図である。It is a figure which shows the wind speed distribution between the fins of the power converter device in one Embodiment of this invention. 本発明の一実施形態における電力変換装置の構成を示す図である。It is a figure which shows the structure of the power converter device in one Embodiment of this invention. 本発明の他の実施形態における電力変換装置の構成を示す図である。It is a figure which shows the structure of the power converter device in other embodiment of this invention.

以下図面について、本発明の一実施の形態を詳述する。   Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

（１）第１の実施の形態
（１−１）本実施の形態による電力変換装置の構成
図１に本発明の一実施形態（第１の実施の形態）における電力変換装置５００を鉄道車両に搭載したときの構成を示す。本発明の電力変換装置５００は鉄道車両の床下等に設けられ、車両を駆動する電動機に供給する電力の周波数を変えることにより、電動機の回転速度の制御を行う。図１において、電力変換装置５００は、車体５０１に吊り下げられた状態で固定されている。 (1) First Embodiment (1-1) Configuration of Power Conversion Device According to this Embodiment FIG. 1 shows a power conversion device 500 according to one embodiment (first embodiment) of the present invention in a railway vehicle. The configuration when installed is shown. The power conversion apparatus 500 of the present invention is provided under the floor of a railway vehicle and controls the rotation speed of the electric motor by changing the frequency of electric power supplied to the electric motor driving the vehicle. In FIG. 1, the power conversion device 500 is fixed in a state of being suspended from a vehicle body 501.

図２および図３に本実施形態における電力変換装置５００の構造を示す。図２における矢印１０１と１０２は車両の進行により生じる走行風の方向を示す。車両は前後いずれの方向にも移動するので、それに伴って、矢印１０１と１０２のいずれかの方向に走行風が生じることになる。   2 and 3 show the structure of the power conversion apparatus 500 according to this embodiment. Arrows 101 and 102 in FIG. 2 indicate the direction of traveling wind generated by the traveling of the vehicle. Since the vehicle moves in either of the front and rear directions, a traveling wind is generated in either direction of arrows 101 and 102 accordingly.

図２において、アルミニウム合金等の金属からなる受熱部材１の一方の側には、複数のＩＧＢＴ(Insulated Gate Bipolar Transistor)等のパワー半導体素子２を含むパワー半導体モジュールが設置されており、複数のパワー半導体モジュールが電力変換装置５００を構成している。以下、これらのパワー半導体モジュールについてもパワー半導体素子２と呼称する。   In FIG. 2, a power semiconductor module including a power semiconductor element 2 such as a plurality of IGBTs (Insulated Gate Bipolar Transistors) is installed on one side of a heat receiving member 1 made of a metal such as an aluminum alloy. The semiconductor module constitutes the power conversion device 500. Hereinafter, these power semiconductor modules are also referred to as power semiconductor elements 2.

パワー半導体素子２は、グリース等の部材(図示せず)を介して受熱部材１とねじ等(図示せず)によって固定される。受熱部材１のパワー半導体素子２の側には、密閉されたケース４が設けられ、ケース内にはフィルタコンデンサやＩＧＢＴ駆動回路等の電気部品５が設置されている。   The power semiconductor element 2 is fixed to the heat receiving member 1 by screws or the like (not shown) through a member (not shown) such as grease. A sealed case 4 is provided on the power semiconductor element 2 side of the heat receiving member 1, and an electrical component 5 such as a filter capacitor or an IGBT drive circuit is installed in the case.

フィンベースである受熱部材１のパワー半導体素子設置面の反対側には、アルミニウム合金等の平板状の放熱用のフィン３が多数設置されている。受熱部材１とフィン３とは、ろう付け等により接合される。受熱部材１とフィン３を一体成型して製作してもよい。   A large number of plate-shaped heat radiation fins 3 made of aluminum alloy or the like are installed on the opposite side of the power semiconductor element installation surface of the heat receiving member 1 that is a fin base. The heat receiving member 1 and the fin 3 are joined by brazing or the like. The heat receiving member 1 and the fin 3 may be integrally formed.

受熱部材１に設置されたパワー半導体素子２が動作するとパワー半導体素子２が発熱し、その熱は受熱部材１を介してフィン３に伝えられる。フィン間には、車両の走行に伴って生じる走行風が流れ、フィン３の熱が空気に放熱されることにより、パワー半導体素子２が冷却される。   When the power semiconductor element 2 installed in the heat receiving member 1 operates, the power semiconductor element 2 generates heat, and the heat is transmitted to the fins 3 through the heat receiving member 1. A traveling wind generated as the vehicle travels flows between the fins, and heat of the fins 3 is radiated to the air, thereby cooling the power semiconductor element 2.

図４に導風板１１、案内板１２および整流板１３が設けられた冷却部である導風部の斜視図を示す。図２〜図４において、フィン３の先端部には導風板１１を備え、導風板１１は、冷却風の流れ方向に沿って、フィン風上部およびフィン風下部からフィン中央部にかけて流路が狭くなるように傾斜した構成とした。   FIG. 4 shows a perspective view of the air guide part which is a cooling part provided with the air guide plate 11, the guide plate 12 and the rectifying plate 13. 2 to 4, the fin 3 is provided with a wind guide plate 11 at the tip thereof, and the wind guide plate 11 has a flow path from the fin wind upper part and the fin wind lower part to the fin central part along the flow direction of the cooling wind. It was set as the structure inclined so that might become narrow.

さらに、フィン３の先端部には、流路側面から流路中央へ冷却風を案内する案内板１２を設けた。また、フィン３の先端部には、冷却風の流れを整える整流板１３を設けた。   Furthermore, a guide plate 12 that guides cooling air from the side surface of the channel to the center of the channel is provided at the tip of the fin 3. Further, a rectifying plate 13 for adjusting the flow of the cooling air is provided at the tip of the fin 3.

図５に受熱部材１におけるパワー半導体素子２０１〜２０９の配置例を示す。走行風は矢印１０１、１０２の両方向に流れるので、下流側となる両端のパワー半導体素子（２０１〜２０３と２０７〜２０９）の温度が空気温度の上昇の影響により高くなりやすい。導風板１１はこれらの位置に冷却風を導くことにより、冷却効率を高める効果がある。   FIG. 5 shows an arrangement example of the power semiconductor elements 201 to 209 in the heat receiving member 1. Since the traveling wind flows in both directions indicated by arrows 101 and 102, the temperatures of the power semiconductor elements (201 to 203 and 207 to 209) at both ends on the downstream side are likely to increase due to the influence of the increase in air temperature. The air guide plate 11 has an effect of increasing the cooling efficiency by guiding the cooling air to these positions.

また、パワー半導体素子２をできるだけコンパクトに配置しようとすると、両端の素子の中でも、中央部のパワー半導体素子（２０２と２０８）の付近の実装密度が高くなるため、特にこれらの素子の温度が高くなりやすい。案内板１２によってこれらの素子の付近に冷却風を導くことができるので、これらの素子を効率的に冷却することが可能である。   Further, if the power semiconductor element 2 is arranged as compactly as possible, among the elements at both ends, the mounting density in the vicinity of the power semiconductor elements (202 and 208) in the central portion is increased, so that the temperature of these elements is particularly high. Prone. Since the cooling air can be guided to the vicinity of these elements by the guide plate 12, these elements can be efficiently cooled.

図６と図７とは、フィン先端部を平らな塞ぎ板１４で塞いだ構造と、本実施形態の構造とにおける、下流部中央付近のフィン間風速をシミュレーションにより比較したものである。フィン３と塞ぎ板１４や導風板１１を含めた全体の高さが同一になるようにした。   FIG. 6 and FIG. 7 compare the wind speed between fins in the vicinity of the center of the downstream portion in the structure in which the fin tip is closed with a flat closing plate 14 and the structure of this embodiment by simulation. The entire height including the fin 3, the closing plate 14 and the air guide plate 11 is made the same.

本実施形態の構造により、フィン間の平均流速である平均風速が図６の９２．５から図７の１００となり、約８％増加する。これにより空気によるフィン３の冷却効率が高まり、パワー半導体素子２を効率的に冷却することができる。   With the structure of this embodiment, the average wind speed, which is the average flow velocity between the fins, is increased from about 92.5 in FIG. 6 to 100 in FIG. 7, increasing by about 8%. Thereby, the cooling efficiency of the fin 3 by air increases and the power semiconductor element 2 can be cooled efficiently.

図８に導風板１１および案内板１２を取り付ける構造の一例を示す。フィン３の周囲を金属製のカバー１５、１６および１７で囲むようにする。カバー１６は、走行風を取り込めるように、金網状や多孔板状の構造とする。   FIG. 8 shows an example of a structure for attaching the air guide plate 11 and the guide plate 12. The periphery of the fin 3 is surrounded by metal covers 15, 16 and 17. The cover 16 has a wire mesh-like or perforated plate-like structure so as to capture the traveling wind.

導風板１１および案内板１２は、カバー１５、１６および１７に溶接やねじ止め等によって固定される。さらに、カバー、導風板１１および案内板１２を一体として、それらが受熱部材１にねじによって固定される。なお、カバー１７を設けずに、導風板１１がカバー１７の一部を兼ねた構造としても良い。   The air guide plate 11 and the guide plate 12 are fixed to the covers 15, 16 and 17 by welding, screwing, or the like. Further, the cover, the air guide plate 11 and the guide plate 12 are integrated with each other and are fixed to the heat receiving member 1 with screws. In addition, it is good also as a structure where the air guide plate 11 also serves as a part of the cover 17 without providing the cover 17.

フィン３にはスリット部６を設けても良い。スリット部６を設けることによりフィン３の熱伝達率を向上させるとともに、導風板１１からの風がスリット部６からフィン間に流入することによる風速増進効果が得られる。また、スリット部６により、停車時における自然対流による冷却性能の向上効果も得られる。   The fin 3 may be provided with a slit portion 6. By providing the slit portion 6, the heat transfer coefficient of the fins 3 is improved, and the wind speed enhancement effect by the wind from the wind guide plate 11 flowing between the fins from the slit portion 6 is obtained. Moreover, the slit part 6 can also improve the cooling performance by natural convection when the vehicle is stopped.

（１−２）本実施の形態の効果
以上のように、本実施形態によれば、空気温度の上昇で素子の温度が上がりやすい下流側フィンに走行風を取り込むとともに、パワー半導体素子２の実装密度が高い場所にある受熱部材中央付近にあるフィン周囲の風速が増加してフィン３を効率よく冷却することができるので、温度が高くなりやすい下流側の中央部のパワー半導体素子（２０２と２０８）の温度を下げることが可能である。 (1-2) Effects of the Present Embodiment As described above, according to the present embodiment, the driving air is taken into the downstream fin where the temperature of the element is likely to rise due to the increase in the air temperature, and the power semiconductor element 2 is mounted. Since the wind speed around the fin near the center of the heat receiving member in the high density area can be increased and the fin 3 can be efficiently cooled, the power semiconductor element (202 and 208 in the central portion on the downstream side where the temperature tends to be high tends to increase. ) Can be lowered.

（２）第２の実施の形態
第１の実施の形態においては、フィン３の先端部から冷却風がフィンの外側に漏れていたが、冷却効率を高めるために、冷却風を漏らさないようにしてもよい。図９に本発明の他の実施の形態（第２の実施の形態）における電力変換装置６００の構造を示す。図９において、フィン３の入口部および出口部のフィン上部に塞ぎ板１８を設けた。他の部分の構造は第１の実施形態と同様である。 (2) Second Embodiment In the first embodiment, the cooling air leaks from the tip of the fin 3 to the outside of the fin. However, in order to increase the cooling efficiency, the cooling air should not be leaked. May be. FIG. 9 shows the structure of power conversion apparatus 600 according to another embodiment (second embodiment) of the present invention. In FIG. 9, a closing plate 18 is provided on the fin upper portion of the inlet portion and the outlet portion of the fin 3. The structure of other parts is the same as that of the first embodiment.

フィン３の最下流部において、フィン３の先端部から冷却風がフィン３の外側に漏れることを塞ぎ板１８が防止する。このことにより、冷却風の温度上昇の影響でパワー半導体素子２の温度が高い最下流部に多くの冷却風を流すことができ、パワー半導体素子２を十分に冷却することが可能である。   The closing plate 18 prevents the cooling air from leaking from the tip of the fin 3 to the outside of the fin 3 at the most downstream portion of the fin 3. As a result, a large amount of cooling air can flow through the most downstream portion where the temperature of the power semiconductor element 2 is high due to the rise in temperature of the cooling air, and the power semiconductor element 2 can be sufficiently cooled.

以上詳細に説明したように、本発明によればフィン３の間に十分に走行風を取り込むことにより、パワー半導体素子２を効率的に冷却することが可能である。   As described above in detail, according to the present invention, it is possible to efficiently cool the power semiconductor element 2 by sufficiently taking in the traveling air between the fins 3.

１……受熱部材、２……パワー半導体素子、３……フィン、４……ケース、５……電気部品、６……スリット部、１１……導風板、１２……案内板、１３……整流板、１５、１６、１７……カバー。   DESCRIPTION OF SYMBOLS 1 ... Heat receiving member, 2 ... Power semiconductor element, 3 ... Fin, 4 ... Case, 5 ... Electrical component, 6 ... Slit part, 11 ... Air guide plate, 12 ... Guide plate, 13 ... ... rectifier plate, 15, 16, 17 ... cover.

Claims (8)

パワー半導体素子を有する電力変換装置において、
前記パワー半導体素子の熱を放熱する受熱部材と、
前記受熱部材の一方の面に設けられた複数の前記パワー半導体素子と、
前記受熱部材の他方の面に設けられた放熱用のフィンと
を有し、
前記フィンの先端部は、
冷却風の流れ方向に沿って、フィン風上部およびフィン風下部からフィン中央部にかけて流路が狭くなるように傾斜した導風板と、
流路側面から流路中央へ冷却風を案内する案内板と
を備える
ことを特徴とする電力変換装置。 In a power conversion device having a power semiconductor element,
A heat receiving member for radiating heat of the power semiconductor element;
A plurality of the power semiconductor elements provided on one surface of the heat receiving member;
A heat dissipating fin provided on the other surface of the heat receiving member,
The tip of the fin is
A wind guide plate inclined along the flow direction of the cooling air so that the flow path becomes narrower from the fin wind upper part and the fin wind lower part to the fin center part,
A power conversion device comprising: a guide plate that guides cooling air from a flow path side surface to a flow path center. 前記フィンの入口部および出口部の前記フィンの前記先端部を塞ぐ塞ぎ板を設けた
ことを特徴とする請求項１記載の電力変換装置。 The power converter according to claim 1, further comprising: a closing plate that closes the tip of the fin at the inlet and the outlet of the fin. 前記フィンの周囲にカバーを設け、
前記カバーに前記導風板および前記案内板を固定した
ことを特徴とする請求項１または請求項２記載の電力変換装置。 A cover is provided around the fin,
The power conversion device according to claim 1, wherein the air guide plate and the guide plate are fixed to the cover. 前記フィンにスリット部を設けた
ことを特徴とする請求項１または請求項２記載の電力変換装置。 The power converter according to claim 1, wherein a slit portion is provided in the fin. パワー半導体素子を有する電力変換装置を搭載した鉄道車両において、
前記電力変換装置は、
前記パワー半導体素子の熱を放熱する受熱部材と、
前記受熱部材の一方の面に設けられた複数の前記パワー半導体素子と、
前記受熱部材の他方の面に設けられた放熱用のフィンと
を有し、
前記フィンの先端部は、
冷却風の流れ方向に沿って、フィン風上部およびフィン風下部からフィン中央部にかけて流路が狭くなるように傾斜した導風板と、
流路側面から流路中央へ冷却風を案内する案内板と
を備える
ことを特徴とする電力変換装置を搭載した鉄道車両。 In a railway vehicle equipped with a power conversion device having a power semiconductor element,
The power converter is
A heat receiving member for radiating heat of the power semiconductor element;
A plurality of the power semiconductor elements provided on one surface of the heat receiving member;
A heat dissipating fin provided on the other surface of the heat receiving member,
The tip of the fin is
A wind guide plate inclined along the flow direction of the cooling air so that the flow path becomes narrower from the fin wind upper part and the fin wind lower part to the fin center part,
A rail vehicle equipped with a power conversion device comprising: a guide plate that guides cooling air from a side surface of the flow channel to a center of the flow channel. 前記フィンの入口部および出口部の前記フィンの前記先端部を塞ぐ塞ぎ板を設けた
ことを特徴とする請求項５記載の電力変換装置を搭載した鉄道車両。 The railway vehicle equipped with the power conversion device according to claim 5, further comprising a closing plate that closes the tip portion of the fin at the inlet portion and the outlet portion of the fin. 前記フィンの周囲にカバーを設け、
前記カバーに前記導風板および前記案内板を固定した
ことを特徴とする請求項５または請求項６記載の電力変換装置を搭載した鉄道車両。 A cover is provided around the fin,
The railcar equipped with the power converter according to claim 5 or 6, wherein the wind guide plate and the guide plate are fixed to the cover. 前記フィンにスリット部を設けた
ことを特徴とする請求項５または請求項６記載の電力変換装置を搭載した鉄道車両。 A rail vehicle equipped with the power conversion device according to claim 5 or 6, wherein a slit portion is provided in the fin.
JP2016170271A 2016-08-31 2016-08-31 Power conversion device and railway vehicle equipped with power conversion device Active JP6652467B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016170271A JP6652467B2 (en) 2016-08-31 2016-08-31 Power conversion device and railway vehicle equipped with power conversion device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016170271A JP6652467B2 (en) 2016-08-31 2016-08-31 Power conversion device and railway vehicle equipped with power conversion device

Publications (2)

Publication Number Publication Date
JP2018037557A true JP2018037557A (en) 2018-03-08
JP6652467B2 JP6652467B2 (en) 2020-02-26

Family

ID=61567550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016170271A Active JP6652467B2 (en) 2016-08-31 2016-08-31 Power conversion device and railway vehicle equipped with power conversion device

Country Status (1)

Country Link
JP (1) JP6652467B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019181413A1 (en) * 2018-03-19 2019-09-26 株式会社ナイルワークス Industrial drone
WO2023188501A1 (en) * 2022-03-31 2023-10-05 三菱重工業株式会社 Cooling device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49121465U (en) * 1973-02-15 1974-10-17
JP2000092819A (en) * 1998-09-10 2000-03-31 Toshiba Corp Semiconductor cooling apparatus
JP2006224796A (en) * 2005-02-17 2006-08-31 Mitsubishi Electric Corp Vehicular equipment
JP2007184464A (en) * 2006-01-10 2007-07-19 Toshiba Corp Railroad vehicle control unit
US20100079944A1 (en) * 2008-09-26 2010-04-01 Rockwell Automation Technologies, Inc. Power electronic module cooling system and method
JP2013103506A (en) * 2011-11-10 2013-05-30 Hitachi Ltd Cooler for vehicle control device
CN103929077A (en) * 2013-01-16 2014-07-16 株式会社日立制作所 Drive device for railway vehicle

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49121465U (en) * 1973-02-15 1974-10-17
JP2000092819A (en) * 1998-09-10 2000-03-31 Toshiba Corp Semiconductor cooling apparatus
JP2006224796A (en) * 2005-02-17 2006-08-31 Mitsubishi Electric Corp Vehicular equipment
JP2007184464A (en) * 2006-01-10 2007-07-19 Toshiba Corp Railroad vehicle control unit
US20100079944A1 (en) * 2008-09-26 2010-04-01 Rockwell Automation Technologies, Inc. Power electronic module cooling system and method
JP2013103506A (en) * 2011-11-10 2013-05-30 Hitachi Ltd Cooler for vehicle control device
CN103929077A (en) * 2013-01-16 2014-07-16 株式会社日立制作所 Drive device for railway vehicle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019181413A1 (en) * 2018-03-19 2019-09-26 株式会社ナイルワークス Industrial drone
WO2023188501A1 (en) * 2022-03-31 2023-10-05 三菱重工業株式会社 Cooling device

Also Published As

Publication number Publication date
JP6652467B2 (en) 2020-02-26

Similar Documents

Publication Publication Date Title
JP5560182B2 (en) Cooling device and power conversion device including the same
JP4848209B2 (en) Power converter
US20180158748A1 (en) Heat dissipation apparatus for semiconductor module
JP4929325B2 (en) Power converter
JP6482954B2 (en) Liquid cooling system
JP6741561B2 (en) Electric power conversion device for railway vehicles
JP5581119B2 (en) Cooling device, power converter, railway vehicle
JP2008140803A (en) Heat sink
JP2013103506A (en) Cooler for vehicle control device
JP6482955B2 (en) Liquid cooling system
JP6534873B2 (en) Liquid cooling system
JPH0213266A (en) Inverter
JP6652467B2 (en) Power conversion device and railway vehicle equipped with power conversion device
JP5930911B2 (en) Power converter
JP2016504236A (en) Ventilation device for ventilation, heating and / or air conditioning units
CN210956653U (en) Device for cooling power semiconductor devices of converter and rail vehicle
JP5078794B2 (en) Cooker
JP2017216293A (en) Fluid-cooling type cooling device
JP2020171196A (en) Electric power conversion apparatus of railway vehicle
JP2002368473A (en) Heat dissipating apparatus for heat generating electronic component, electronic apparatus and electronic device having heat dissipating structure
JP6837565B2 (en) Railroad vehicle power converters and railroad vehicles equipped with power converters
GB2523625A (en) Power conversion device and railway vehicle equipped with the same
JP2016078654A (en) Electric power conversion system and railway vehicle mounted with the same
JP2011135649A (en) Inverter device
JP5939329B1 (en) Cooling structure and apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190306

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191017

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191023

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191219

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200114

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200123

R150 Certificate of patent or registration of utility model

Ref document number: 6652467

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150