JPH11251499A - Power-conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve cooling performance and hence miniaturize a power unit, facilitate the maintenance inspection operation of semiconductor elements, improve reliability, as well as miniaturize an overall device. SOLUTION: A plurality of semiconductor element 5, 6, and 7 are mounted to one side of a heat receiving member 3, a plurality of heat pipes 1 are mounted to the other side of the heat receiving member 3, the heat pipe 1 is provided with a heat receiving part 1a that is thermally connected to the heat reception member 3 and is extended and a cooling part 1b that is started from the heat reception part 1a. A cooling part 1b of the heat pipe 1 is arranged in a zigzag manner in a different direction and is provided at the inside of the end part of the heat receiving member 3, and a plurality of cooling fins 2 are mounted to the cooling part 1b of the heat pipe 1, thus constituting a power conversion device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power converter, for example, a power converter installed under the floor of an electric railway vehicle for controlling an electric motor.

[0002]

2. Description of the Related Art As a conventional power converter installed below the floor of an electric railway vehicle, for example, Japanese Patent Application Laid-Open No.
No. 0, a plurality of semiconductor elements,
A heat receiving plate, having a plurality of heat pipes and a plurality of radiating fins, the plurality of semiconductor elements are mounted on one side of the heat receiving member, and the plurality of heat pipes are mounted on the other side of the heat receiving plate;
The heat pipe includes a heat receiving portion that extends thermally connected to the heat receiving plate and a heat radiating portion that extends vertically from the heat receiving portion and protrudes into the ventilation chamber, and heat pipes of the same shape are parallel in the same direction. It is known that a plurality of heat radiation fins are attached to a heat radiation portion of a heat pipe.

[0003]

According to such a power converter, since a plurality of heat pipes having the same shape are simply arranged in parallel in the same direction, the heat radiating portion of the heat pipe is attached to the heat radiating fins. As a result, heat transfer to the entire radiation fin was not good. In addition, the heat receiving portion of the heat pipe comes into contact with the heat receiving member in a biased manner, and the heat receiving performance is not good. In other words, the heat receiving portion of the heat pipe has substantially no heat transfer performance because the bent portion to the heat radiating portion does not contact the heat receiving member. Met. These have led to an increase in the size of the device. In addition, the radiation fins attached to the heat radiating portion of the heat pipe are larger than the outer diameter of the projection surface of the heat receiving member, which hinders attachment and detachment. Moreover,
Since the power unit is attached to the opening of the housing from the side having the heat pipe, maintenance and inspection of semiconductor elements cannot be performed without removing the power unit, and the space required for attaching and detaching the power unit, Since the space required for the wiring work has not been shared, the whole had to be enlarged. In addition,
No consideration was given to reducing the overall size, including the housing.

An object of the present invention is to provide a power conversion device,
The heat radiation performance is remarkably improved, the power unit can be downsized, the maintenance and inspection work of the semiconductor elements can be easily performed from the outside of the ventilation chamber, and the partition between the ventilation chamber and the closed chamber is simplified. It is an object of the present invention to provide a power conversion device that can significantly improve the reliability of semiconductor elements in a closed chamber and can make the whole including a housing compact.

[0005]

An object of the present invention is to provide a power converter having a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes and a plurality of radiating fins, wherein the plurality of semiconductor elements are one of the heat receiving members. Side, a plurality of the heat pipes are mounted on the other side of the heat receiving member, the heat pipe is a heat receiving portion that is thermally connected to the heat receiving member and extends, and a heat radiating portion that is raised from the heat receiving portion. The heat radiating portion of the heat pipe is provided in a staggered arrangement,
The heat radiation fins are achieved by a configuration in which a plurality of heat radiation fins are attached to the heat radiation portion of the heat pipe.

An object of the present invention is to provide a power conversion device having a plurality of semiconductor elements, a heat receiving member, and a plurality of heat pipes, wherein the plurality of semiconductor elements are attached to one side of the heat receiving member, and the plurality of heat pipes are provided. The heat pipe is attached to the other side of the heat receiving member, the heat pipe includes a heat receiving portion extending thermally connected to the heat receiving member and a heat radiating portion raised from the heat receiving portion, and the heat receiving portion of the heat pipe faces Is achieved by a configuration provided differently.

An object of the present invention is to provide a power conversion device having a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes and a plurality of radiating fins, wherein the plurality of semiconductor elements are attached to one side of the heat receiving member. The heat pipe is attached to the other side of the heat receiving member, and the heat pipe includes a heat receiving portion that is thermally connected to the heat receiving member and extends, and a heat radiating portion that is raised from the heat receiving portion. The heat radiating portion is provided on the inner side of the end of the heat receiving member, and the heat radiating fins are achieved by a plurality of heat radiating portions attached to the heat radiating portion of the heat pipe.

An object of the present invention is to provide a power conversion device having a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes, a plurality of radiating fins, and a ventilation chamber, wherein the plurality of semiconductor elements are mounted on one side of the heat receiving member. The plurality of heat pipes are attached to the other side of the heat receiving member, the heat pipe includes a heat receiving portion extending thermally connected to the heat receiving member and a heat radiating portion raised from the heat receiving portion, A plurality of the heat radiating fins are attached to a heat radiating portion of the heat pipe in a size within a projected area of the heat receiving member, and a power unit is integrally formed by the semiconductor element, the heat receiving member, and the heat pipe; The power unit is detachably attached to the opening from the outside of the ventilation chamber, and the heat pipe and the heat pipe are connected to the opening. Fins disposed on the ventilation chamber side, wherein the semiconductor element is achieved by a configuration that is disposed outside the ventilation chamber.

An object of the present invention is to provide a power conversion device having a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes, a plurality of radiating fins, a ventilation chamber, and a closed chamber. A plurality of heat pipes are attached to one side, and the plurality of heat pipes are attached to the other side of the heat receiving member. The heat pipe is thermally connected to the heat receiving member and extends. A heat radiating fin protruding into the heat pipe, wherein a plurality of the heat radiating fins are attached to the heat radiating portion of the heat pipe in a size within a projected area of the heat receiving member, and a power unit is formed by the heat receiving member and the heat pipe. Are integrally formed, the ventilation chamber and the closed chamber are provided adjacent to each other, an opening is provided in a member that separates the ventilation chamber and the closed chamber, and the heat receiving member is provided. The heat pipe and the radiating fins are disposed on the ventilation chamber side, the semiconductor element is disposed on the sealing chamber side, and the sealing chamber inserts and removes the power unit. This is achieved by providing a configuration in which a retractable storage cover is provided.

The object is to provide a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes, a plurality of radiating fins, a ventilation chamber,
In a power conversion device having a closed chamber, a housing, and a blower, the housing is mounted under a floor of a vehicle body of an electric car, an intake port is provided on one side surface, and an exhaust port is provided on another side surface. Is provided, the ventilation chamber is provided between the intake port and the exhaust port to form a part of a ventilation path for cooling air, and the blower is provided in a ventilation path communicating the intake port and the exhaust port. A plurality of the semiconductor elements are attached to one side of the heat receiving member; a plurality of the heat pipes are attached to the other side of the heat receiving member; and the heat pipe extends thermally connected to the heat receiving member. And a heat radiating portion that is raised from the heat receiving portion and protrudes into the ventilation chamber, and the heat radiating fins are attached to the heat radiating portion of the heat pipe with a plurality of pieces having a size within the projected area of the heat receiving member, The semiconductor element, the heat receiving member and The power unit is integrally formed with the heat pipe, the ventilation chamber and the closed chamber are provided in the housing vertically adjacent to each other, and an opening is provided in a member that separates the ventilation chamber and the closed chamber, The power unit is detachably attached to the opening from the outside of the ventilation chamber, the heat pipe and the radiation fins are disposed on the ventilation chamber side, and the semiconductor element is disposed on the closed chamber side,
The closed chamber is achieved by a configuration in which an openable and closable storage cover for taking in and out the power unit is provided on a lower surface.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

First, a power converter according to the present invention will be described with reference to FIG. FIG. 9 is a main circuit diagram of a power conversion device installed under the floor of an electric railway vehicle traveling in an AC feeding section.
The main circuit is connected to the pantograph 208, and the alternating current collected from the pantograph 208 is supplied to a plurality of transformers 20.
6 and are input to the corresponding AC input terminals of the corresponding single-phase three-level converter 202. The converter 202 outputs three levels of direct currents, positive, negative and neutral. The DC side of the converter 202 is connected in parallel via the filter capacitor 9 and is connected to the three-phase three-level inverter 2.
01 is input to the DC side. Note that a filter capacitor 9 is connected to the DC side of the inverter 201 for each of the U, V, and W phases. The inverter 201 outputs a pulse having three levels, positive, negative and neutral, of the input direct current, thereby outputting a PWM-modulated variable voltage variable frequency three-phase alternating current. The rotation of the AC motor 207 is controlled by inputting an AC having a variable voltage and a variable frequency, and the electric vehicle runs in power. AC motor 2
At the time of regeneration in which the 07 operates as a generator, energy flows to the pantograph 208 in a manner opposite to that at the time of powering. The overvoltage suppression circuit 205 connected in parallel between the converter 202 and the inverter 201, when the DC voltage becomes excessive for some reason, is short-circuited via a resistor to drop the voltage, or the potential of the neutral point is positive or negative. If it becomes imbalanced, it will work.

The inverter 201 and the converter 20
2, the switching element 203 is an IGBT
(Insulated gate bipolar transistor) and GTO (gate turn-off thyristor). The IGBT used in this embodiment is modularized integrally with the flywheel diode 204 connected in parallel to each other to form an IGBT module 5. A diode connected in parallel to two of the four switching elements 203 connected in series is a clamp diode 6, which is specific to a three-level power converter for generating a neutral point potential. Furthermore, although not shown in the figure, the switching element is provided with a snubber circuit for absorbing an excessive voltage generated when self-extinguishing, and this circuit includes a snubber diode, a snubber resistor and Has a snubber capacitor.

Each element constituting the main circuit of such a power converter is a heating element from the viewpoint of the cooling system, and if these elements are densely mounted, they become thermally severe. On the other hand, it is necessary to prevent each element from being exposed to the outside air in which dust and moisture are mixed. Further, easiness of maintenance work and securing of a work space are also important factors. The power converter according to the present embodiment described below can meet these requirements.

Next, the power converter of the present invention will be described with reference to FIGS. 1 is a side sectional view of the power converter of the present invention, FIG. 2 is a sectional view taken along line AA of FIG. 1, FIG. 3 is a sectional view taken along line BB of FIG. 1, and FIG. is there.

In the cooling device according to the present embodiment, a plurality of heat receiving members 1 a of a plurality of substantially L-shaped heat pipes 1 are thermally connected to a heat receiving member 3.
The heat radiation fin 2 is attached to b.
As will be described later, a system is adopted in which the outside air is forcibly taken in by the blower or the like and is used as cooling air. Further, as the refrigerant to be sealed in the heat pipe, for example, water, a CFC-based fluid, or a fluorocarbon-based fluid is used. On the other side of the heat receiving member 3, the IGBT module 5, the clamp diode 6, and the snubber resistor 7, which constitute the inverter 201 of the main circuit of the power converter, are thermally connected and mounted. Inverter 2
The support frame 10 to which the gate drive device 8 and the filter capacitor 9 constituting the component 01 are attached is attached to the heat receiving member 3. The inverter 201 and the cooling device constitute an inverter power unit 301.

The inverter power unit 301 includes a ventilation chamber 101 for introducing outside air and a closed chamber 10 for introducing no outside air.
2 are arranged. The member 11 that separates the ventilation chamber 101 and the closed chamber 102 has an opening 11a at the center. The heat receiving member 3 constituting the power unit 301 is attached so as to close the opening 11a, and also serves as a partition between the ventilation chamber 101 and the closed chamber 102. A plurality of heat pipes 1, radiation fins 2, and a holding plate 4 for fixing the heat pipes 1 are arranged on the ventilation chamber 101 side. On the side of the closed chamber 102, electric components such as an IGBT module 5, a clamp diode 6, a snubber resistor 7, a gate drive device 8, and a filter capacitor 9, and a support frame 10 for supporting these components are arranged. The inverter power unit 301 is suspended by being supported by the outer frame 11 that forms the upper surface of the closed chamber 102. On the lower surface of the closed chamber 102, a storage cover 103 for incorporating the inverter power unit 301 from the closed chamber 102 side is detachably attached.

As shown in FIG. 3, an IGBT module 5, a clamp diode 6, and a snubber resistor 7 are densely arranged on the heat receiving member 3 at a central portion of a surface located on the side of the closed chamber 102 with little space therebetween. Has been implemented. this is,
This is because not only miniaturization of the device but also shortening of each electric wiring has an effect of reducing inductance, for example.

As shown in FIG. 4, a plurality of substantially L-shaped heat pipes 1 are provided on the surface of the heat receiving member 3 located on the side of the ventilation chamber 101 at the end of the heat receiving portion 1a along the plate surface of the heat receiving member 3. The heat pipes 1 are arranged so that their directions are different from each other. With this arrangement, the contact portions of the heat pipe heat receiving portion 1a with the heat receiving member 3 are averaged in the element mounting surface and come into contact with the heat receiving member 3, so that even in the high-density mounting as shown in FIG. Sufficient cooling capacity can be secured. Further, the other heat receiving portions 1 b to which the heat radiation fins 2 are attached are arranged in a staggered manner so as to be inside the heat receiving member 3. With this arrangement, the heat dissipating fins 2 can be centralized in the central portion of the heat receiving member 3, so that the device can be downsized. Moreover, in this configuration, since the outer dimensions of the radiation fins 2 can be made smaller than the outer dimensions of the heat receiving member 3, the inverter power unit 301 is installed from the closed chamber 102 side, and the heat pipe 1 and the radiating fins 2 are connected to the opening 11a of the closed chamber frame 11. It becomes possible to be exposed to the ventilation room 101 side through the. In this installation method, the installation of the power unit and the wiring connection operation, which is an operation associated therewith, are performed by the storage cover 103.
It becomes possible only by removing. That is, since only one work space is required, the size of the apparatus can be reduced.

The arrangement of the heat pipes 1 shown in FIG. 4 shows an example in which heat pipes of the same length are arranged. Depending on the layout of the semiconductor element to be mounted, etc.
Appropriate cooling performance and miniaturization can be realized by making the necessary heat pipe heat receiving portions 1a having different lengths as shown in FIG. 7, for example.

In this embodiment, the radiation fins 2
Are arranged horizontally, it is necessary to ventilate the cooling air 100 in order to improve the cooling capacity. So figure
As shown in FIG. 1, FIG. 2 and FIG.
Are parallel to the radiation fins 2 and the heat pipe straight portions 1
Air is blown in a direction perpendicular to 01b. This is because, while the number of heat pipe rows seen from the direction perpendicular to the heat pipe straight part 101b is four, the minimum cross-sectional area when air is blown is eight when the air is blown horizontally. Since the cross-sectional area of the ventilation passage is larger than the minimum cross-sectional area, the pressure loss due to expansion and contraction caused by the pipe row is significantly reduced.

Next, a fixing structure between the heat pipe 1 and the heat receiving member 3 and a fixing structure between the power unit and the closed chamber frame in the power converter of the present invention will be described with reference to FIG.
The partition between the ventilation chamber 101 and the closed chamber 102 is basically performed by the heat receiving member 3 to which the IGBT module 5 and the heat pipe 1 are attached. As a material of the heat receiving member 3, for example, an aluminum alloy or the like is used. The heat receiving member 3 is provided with a bolt 14 on an outer portion thereof, and is fastened to the closed chamber frame 11 using the bolt 14 so as to close the opening 11a. At this time, a packing 12 is inserted between the heat receiving member 3 and the closed chamber frame 11 in order to prevent dust and moisture mixed in the ventilation chamber 101 from entering the closed chamber 102. , A reliable seal is performed.

The fixing structure between the heat pipe 1 and the heat receiving member 3 is basically such that a heat pipe pressing plate 4 is prepared, and the heat pipe 1 is arranged between the heat pipe pressing plate 4 and the heat receiving member 3. And the heat receiving member 3 is fastened by bolts 13. In this case, although not shown, it is preferable to apply heat conduction grease to the contact portion between the heat receiving member 3 and the heat pipe 1 in order to reduce the contact thermal resistance. When copper is used as the container material of the heat pipe 1 and aluminum is selected as the material of the heat receiving member 3, it is preferable that the surface of the heat pipe 1 be Ni-plated to prevent electrolytic corrosion. The press plate 4 of the heat pipe 1 is formed by fitting a portion corresponding to the heat receiving portion 1a of the heat pipe 1 into a semicircular shape and fitting. However, as shown in FIG. 6, for example, a structure may be employed in which a portion corresponding to the heat receiving portion 1a of the heat pipe 1 is a flat surface and pressed so as to deform the outer shape of the heat pipe 1. In this case, a larger pressing force is applied as compared with the case of FIG. 5, which is effective in reducing the contact thermal resistance and the processing cost of the holding plate 4.

Next, a configuration in which the power converter of the present invention is applied to an electric railway vehicle will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view of a vehicle equipped with a power conversion device as viewed from a traveling direction of an electric vehicle. A housing 400 of the power converter is mounted under the floor of the body 107 of the electric vehicle. Case 4
In 00, an intake port 105 is provided at a lower portion of one side surface, and an exhaust port 106 is provided at an upper portion of the other side surface. Case 400
Is partitioned into a ventilation chamber 101 and a closed chamber 102. The ventilation chamber 101 has one side communicating with the blower 104 and the other side communicating with the exhaust port 106. The blower 104 is provided so that the cooling air 100 is sucked in from the air supply port 105 and discharged from the exhaust port 106 through the ventilation chamber 101.
Converter power unit 301 and inverter power unit 302 are arranged in series in a direction in which cooling air passes. In this configuration, the converter power unit 301 and the inverter power unit 302
Since the structure is such that the work can be connected from the lower surface of the vehicle and the electric wiring can be connected in this state, the entire apparatus is downsized.

According to the power converter, the IGBT module 5, the clamp diode 6, and the snubber resistor 7 constituting a plurality of semiconductor elements are mounted on one side of the heat receiving member 3, and the plurality of heat pipes 1 are connected to the heat receiving member 3. The heat pipe 1 includes a heat receiving portion 1a that is thermally connected to the heat receiving member 3 and extends, and a heat radiating portion 1b that rises from the heat receiving portion 1a. The portions 1b are provided in a staggered arrangement, and a plurality of radiating fins 2 are attached to the radiating portion 1b of the heat pipe 1. Therefore, the radiating portions 1b of the heat pipe 1 are attached to the radiating fin 2 in an averaged manner. The heat transfer to the entire radiating fins 2 is improved, thereby significantly improving the radiating performance of the radiating fins 1b.

Further, since the heat receiving portion 1b of the heat pipe 1 is provided so as to have a different direction, the heat receiving portion 1b comes into contact with the heat receiving member 3 evenly, and the heat receiving performance is remarkably improved. That is, the heat receiving portion 1 b of the heat pipe 1 is
Since the bent portion to “a” does not contact the heat receiving member 3, only the linear portion substantially contacts the heat receiving member 3. By changing the direction, the positions of the contacting linear portions are shifted and averaged. Will be. Thereby, the heat transfer performance from the heat receiving member 3 to the heat receiving portion 1b of the heat pipe 1 is remarkably improved. In addition, since the heat radiating portion 1b of the heat pipe 1 is provided inside the end portion of the heat receiving member 3, the heat radiating portion 1b is attached to the inside of the heat radiating fin 2, so that the heat radiating fin 2 is averaged over the entire heat radiating fin 2. As a result, the heat radiation performance of the heat radiation fin 1b is significantly improved.

As a result, sufficient heat radiation characteristics can be obtained even when the semiconductor elements 5, 6, and 7 mounted on one side of the heat receiving member 3 are mounted at high density, so that the power unit 301 can be downsized and the heat receiving member 3 Of the heat pipe 1 and the radiation fins 2 can be made smaller than the outside diameter of the projection plane. According to the power converter, a plurality of radiating fins 2 are attached to the radiating portion 1b of the heat pipe 1 in a size within the projection area of the heat receiving member 3, and the semiconductor elements 5, 6, 7, the heat receiving member 3, and the heat pipe 1 and power unit 301
Are integrally formed, and the member 11 forming the ventilation chamber 101 is
Is provided with an opening 11a, the power unit 301 is detachably attached to the opening 11a from the outside of the ventilation chamber 101, and the heat pipe 1 and the radiation fins 2 are connected to the ventilation chamber 101.
And the semiconductor elements 5, 6, and 7 are arranged outside the ventilation chamber 101, so that the semiconductor elements 5, 6, and 7
Can be easily performed from outside the ventilation chamber 101.

According to the above power converter, the radiation fins 2
Are mounted on the heat radiating portion 1b of the heat pipe 1 in a size within the projected area of the heat receiving member 3, and the semiconductor elements 5, 6, 7,.
A power unit is integrally formed by the heat receiving member 3 and the heat pipe 1, the ventilation chamber 101 and the closed chamber 102 are provided adjacent to each other, and the member 11 that separates the ventilation chamber 101 and the closed chamber 102 is provided with an opening 11a. The heat receiving member 3 is detachably attached from the closed chamber 102 side so as to close the opening 11a.
01, and the semiconductor elements 5, 6, 7
2 side, the closed chamber 102 is a power unit 301
Is provided with an openable and closable storage cover for taking in and out, so that the ventilation chamber 101 and the closed chamber 102 can be easily separated from each other.
The reliability of the semiconductor devices 6, 7 can be easily improved by opening the storage cover 103 from the outside of the closed chamber 102.
In this case, the space required for attaching and detaching the power unit 301 and the space necessary for wiring work can be shared,
The entire power converter can be reduced in size.

According to the power converter, the housing 400 is mounted under the floor of the vehicle body 107 of the electric vehicle.
An intake port 105 is provided on one side surface, and an exhaust port 106 is provided on the other side surface, and the ventilation chamber 101 is provided between the intake port 105 and the exhaust port 106 so that a part of a ventilation path of the cooling air 100 is provided. The blower 104 has an inlet 105 and an outlet 10
6 are provided in a ventilation path that communicates with the semiconductor elements 5, 6,
7. The power unit 301 is integrally formed by the heat receiving member 3 and the heat pipe 1, and the ventilation chamber 101 and the closed chamber 10
2 are provided in the housing 400 vertically adjacent to each other,
01 and the closed chamber 102 are provided with an opening 11a.
Is provided, the power unit 301 is detachably attached to the opening 11a from the outside of the ventilation chamber 101, and the heat pipe 1 and the radiation fins 2 are disposed on the ventilation chamber 101 side.
Since the semiconductor elements 5, 6, and 7 are arranged on the closed chamber 102 side, and the closed chamber 102 has an openable and closable storage cover for inserting and removing the power unit 301 on the lower surface, the housing 40
0 and the entire body can be made compact.
7 can be stored under the floor.

The embodiment of the power converter in the converter / inverter system for driving an induction motor which is an AC motor by feeding an AC has been described above.
The present invention is not limited to this, and can be applied to an inverter system that drives an induction motor by feeding a direct current. Further, the inverter or converter described above is a three-level power converter, but may be a two-level power converter. Furthermore, although only the configuration employing an IGBT as the switching element has been described, the invention can be applied to all switching elements employing a planar mounting and single-sided cooling package structure such as a power transistor or MOSFET.

[0031]

According to the power converter of the present invention, the heat radiation performance is remarkably improved, the power unit can be downsized, and the maintenance and inspection work of the semiconductor elements can be easily performed from outside the ventilation chamber. Further, the partition between the ventilation chamber and the closed chamber can be simplified, and the reliability of the semiconductor elements in the closed chamber can be significantly improved. In addition, the whole body including the housing can be made compact.

[Brief description of the drawings]

FIG. 1 is a side sectional view of a power converter according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view taken along line BB of FIG. 1;

FIG. 4 is a sectional view taken along the line CC of FIG. 1;

FIG. 5 is a sectional view illustrating a fixing structure of a heat pipe and a heat receiving member of the power converter according to the first embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating a fixing structure of a heat pipe and a heat receiving member of a main circuit portion of a power converter according to a second embodiment of the present invention.

FIG. 7 is a sectional view corresponding to a section taken along the line CC of FIG. 1 of the power converter according to the third embodiment of the present invention.

FIG. 8 is a cross-sectional view of a state where the power converter according to the first embodiment of the present invention is mounted on an electric vehicle.

FIG. 9 is a main circuit diagram of the power converter according to the first embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Heat pipe, 1a ... Heat receiving part, 1b ... Heat radiating part, 2 ... Heat radiating fin, 3 ... Heat receiving member, 4 ... Heat pipe holding plate,
5 ... IGBT module, 6 ... Clamp diode, 7
... Snubber resistor, 8 ... Gate drive device, 9 ... Filter capacitor, 10 ... Support frame, 11 ... Outside frame of closed room, 11
a: Opening, 12: Packing, 13: Bolt for fixing heat pipe, 14: Bolt for fixing main circuit part, 100: Cooling air, 101: Ventilation room, 102: Sealed room, 103: Storage cover, 104: Blower, 105 ... intake port, 106 ... exhaust port, 107 ... body, 108 ... wheels, 201 ... inverter, 202 ... converter, 203 ... switching element,
204: flywheel diode, 205: overvoltage suppression circuit, 206: transformer, 207: AC motor, 20
8: Pantograph, 301: Inverter power unit, 302: Converter power unit, 400: Housing.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshio Takasaki 1070 Ma, Hitachinaka City, Ibaraki Prefecture Inside Mito Plant, Hitachi, Ltd. Mito Plant (72) Inventor Yasuhiro Hara 1070 Ma, Hitachinaka City, Ibaraki Prefecture Hitachi Ltd.Mito Plant

Claims (7)

[Claims] 1. A power conversion device having a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes, and a plurality of radiating fins, wherein the plurality of semiconductor elements are attached to one side of the heat receiving member. The heat pipe is attached to the other side of the heat receiving member, and the heat pipe includes a heat receiving portion that is thermally connected to the heat receiving member and extends, and a heat radiating portion that rises from the heat receiving portion. The power conversion device is characterized in that the portions are provided in a staggered arrangement, and a plurality of the radiation fins are attached to a radiation portion of the heat pipe. 2. A power converter having a plurality of semiconductor elements, a heat receiving member, and a plurality of heat pipes, wherein the plurality of semiconductor elements are attached to one side of the heat receiving member, and the plurality of heat pipes are connected to the heat receiving member. Attached to the other side of the member, the heat pipe includes a heat receiving portion extending thermally connected to the heat receiving member and a heat radiating portion raised from the heat receiving portion, and the heat receiving portion of the heat pipe has a different direction. A power converter characterized by being provided as follows. 3. A power converter having a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes and a plurality of radiating fins, wherein the plurality of semiconductor elements are mounted on one side of the heat receiving member. The heat pipe is attached to the other side of the heat receiving member, and the heat pipe includes a heat receiving portion that is thermally connected to the heat receiving member and extends, and a heat radiating portion that rises from the heat receiving portion. The power conversion device, wherein the portion is provided inside the end of the heat receiving member, and a plurality of the radiating fins are attached to a radiating portion of the heat pipe. 4. The heat receiving section of the adjacent heat pipe is provided so as to be different in direction, and the heat radiating section of the heat pipe is provided inside the end of the adjacent heat receiving section. The power converter according to claim 1. 5. A power converter having a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes, a plurality of radiating fins, and a ventilation chamber, wherein the plurality of semiconductor elements are attached to one side of the heat receiving member. The plurality of heat pipes are attached to the other side of the heat receiving member, and the heat pipe includes a heat receiving portion that is thermally connected to the heat receiving member and extends, and a heat radiating portion that is raised from the heat receiving portion. A plurality of fins are attached to a heat radiating portion of the heat pipe in a size within a projected area of the heat receiving member, and a power unit is integrally formed by the semiconductor element, the heat receiving member, and the heat pipe, and forms the ventilation chamber. The power unit is detachably attached to the opening from the outside of the ventilation chamber, and the heat pipe and the radiation fins are Arranged ventilation chamber side, the power converter, wherein the semiconductor device is disposed outside the ventilation chamber. 6. A power converter having a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes, a plurality of radiating fins, a ventilation chamber, and a closed chamber, wherein the plurality of semiconductor elements are on one side of the heat receiving member 3. A plurality of the heat pipes are attached to the other side of the heat receiving member, and the heat pipe is thermally connected to the heat receiving member and extends and heats up from the heat receiving portion to be inserted into the ventilation chamber. A plurality of radiating fins are attached to the radiating portion of the heat pipe in a size within a projected area of the heat receiving member, and a power unit is integrated with the heat receiving member and the heat pipe. The ventilation chamber and the closed chamber are provided adjacent to each other, an opening is provided in a member that separates the ventilation chamber and the closed chamber, and the heat receiving member closes the opening. The heat pipe and the radiating fins are disposed on the ventilation chamber side, the semiconductor element is disposed on the sealing chamber side, and the sealing chamber is openable and closable for taking in and out the power unit. A power conversion device characterized by having a simple storage cover. 7. A power converter having a plurality of semiconductor elements, a heat receiving member, a plurality of heat pipes, a plurality of radiating fins, a ventilation chamber, a closed chamber, a housing, and a blower, wherein the housing is an electric vehicle. It is attached under the floor of the vehicle body, an intake port is provided on one side surface, an exhaust port is provided on the other side surface, and the ventilation chamber is provided between the intake port and the exhaust port, and cooling air is provided. Forming a part of a ventilation path, the blower is provided in a ventilation path communicating the intake port and the exhaust port, a plurality of the semiconductor elements are attached to one side of a heat receiving member, a plurality of the heat pipes Attached to the other side of the heat receiving member,
The heat pipe includes a heat receiving portion that is thermally connected to the heat receiving member and extends, and a heat radiating portion that is raised from the heat receiving portion and protrudes into the ventilation chamber. A plurality of the heat receiving members are attached in a size within the projected area of the heat receiving member, a power unit is integrally formed by the semiconductor element, the heat receiving member and the heat pipe, and the ventilation chamber and the closed chamber are vertically adjacent to each other. An opening is provided in a member that is provided in the housing, and separates the ventilation chamber and the closed chamber, the power unit is detachably attached to the opening from the outside of the ventilation chamber, and the heat pipe and the radiation fin are provided in the housing. The semiconductor device is disposed on the ventilation chamber side, the semiconductor element is disposed on the closed chamber side, and the closed chamber is provided with an openable and closable storage cover for taking in and out the power unit on a lower surface. Power converter, characterized in that is.