JP4020833B2

JP4020833B2 - Power converter for vehicle

Info

Publication number: JP4020833B2
Application number: JP2003178383A
Authority: JP
Inventors: 田靖之稲; 入正樹宮
Original assignee: Toshiba Corp
Current assignee: Toshiba Corp
Priority date: 2003-06-23
Filing date: 2003-06-23
Publication date: 2007-12-12
Anticipated expiration: 2023-06-23
Also published as: JP2005019460A

Description

【０００１】
【発明の属する技術分野】
本発明は、鉄道車両の床下に設置される半導体装置を有する車両用電力変換装置に関する。
【０００２】
【従来の技術】
鉄道車両の床下に設置されて車両駆動電力を供給する電力変換器は、図９に示すように、３相ブリッジ接続された６個の半導体素子１と、各相の正極端子及び負極端子間に接続された３個の相コンデンサ２と、直流側の端子Ｐ、Ｎ間に接続されたフィルタコンデンサ３とを備え、図示省略の鉄道架線から直流側の端子Ｐ、Ｎ間に入力される直流電力を、半導体素子１を所定の順序でオン、オフ制御することにより交流電力に変換し、交流側の端子Ｕ、Ｖ、Ｗから出力して図示を省略した車両駆動用の電動機に供給する。この電力変換器は、半導体素子１から発生する熱を効率良く除去するために半導体素子冷却ユニット４内に設けられる。
【０００３】
図１０（ａ）は車体に取り付けられた箱体に半導体素子冷却ユニット４を装着し、箱体の一部を断面で表した側面図であり、図１０（ｂ）はそのＢ−Ｂ矢視断面図である。これら各図において、車体５の底部の側端に箱体６が取り付けられている。箱体６は半導体素子冷却ユニット４の一部を収納し、これを固定するために仕切り板７によって額縁状に囲まれた開口を備えている。
【０００４】
半導体素子冷却ユニット４は、箱体６の開口に装入される密閉部１１と、半導体素子１や相コンデンサ２等を内部に収容する半導体素子冷却フレームユニット１２と、熱放散させるための開放部１３とを備えている。
【０００５】
このうち、密閉部１１は、例えば、山形鋼で形成された枠体の底部に板が取り付けられ、その上にフィルタコンデンサ３及びゲートアンプ９が装着され、箱体６の内部に導入された導体８がフィルタコンデンサ３等に接続されている。半導体素子冷却フレームユニット１２は開放部１３側が稍上向きに傾斜し、その傾斜面に開口が形成された密閉可能な筐体でなり、その開口にスタック２０を構成する境界板２１の縁部が、例えば、ボルトによって締結され、内部が気密に保たれるようになっている。
【０００６】
スタック２０は境界板２１の内側に取り付けられ、それぞれ半導体素子１が装着された３個の冷却器受熱ブロック２３と、これらの冷却器受熱ブロック２３の近傍に配置される３個の相コンデンサ２と、それぞれ基端部が冷却器受熱ブロック２３に接合され、境界板２１を貫通して開放部１３に平行に突出する複数のヒートパイプ２４と、これらのヒートパイプ２４の長手方向に互いに間隔を空けて一体的に嵌着された複数の放熱フィン２５とで構成されている。ここで、半導体素子１及び冷却器受熱ブロック２３が発熱部となり、放熱フィン２５が放熱部となっている。
【０００７】
開放部１３は車両の艤装限界内に形成された枠体でなり、前述したヒートパイプ２４及び放熱フィン２５を内在させ、車両床下にその排熱がこもり床下の配線、配管等を加熱することがないように、通風させて放熱を促進する機能を備えている。
【０００８】
なお、半導体素子冷却フレームユニット１２に収納される半導体素子１からスタック接続導体２６が密閉部１１側に導出され、フィルタコンデンサ３や導体８、あるいは、ゲートアンプ９にボルト等で接続される。
【０００９】
ここで、ヒートパイプ２４は、冷却器受熱ブロック２３側が下方となるよう傾けて取り付けられ、ヒートパイプ２４の内部に封入された冷媒は、冷却器受熱ブロック２３で半導体素子１から発生する熱により蒸発し、放熱フィン２５側で凝縮して大気へ熱放散を行う。凝縮された冷媒はヒートパイプ２４の内部を重力により冷却器受熱ブロック２３側へ戻るようなサイクルを繰り返す。放熱フィン２５は自然冷却により大気へ熱放散を行うため、地面に対してほぼ垂直に設置され、放熱フィン２５間に上昇気流を生じさせるようになっている。
【００１０】
【発明が解決しようとする課題】
上述した従来の車両用電力変換装置においては、３相ブリッジ接続された半導体素子の相毎に１つのスタック２０を設ける構成になっていた。また、冷却器受熱ブロック２３の一方の面に半導体素子１が装着され、他方の面に相コンデンサ２が装着されていた。しかるに、近年は配線を短縮したり、隣接して往復配線にしたりして、インダクタンス成分を低減する実装技術が進歩したことにより、半導体素子１に近接して接続された相コンデンサ２が不要となることから、半導体素子冷却ユニットフレーム１５の片面側が空スペースとなることが多かった。
【００１１】
また、１相につき１つのスタック２０を設ける構成になっていたことから、集中制御システムでは３個のスタックで済むが、個別制御システムでは１２個という数多いスタック２０を設けなければならないため、組立作業やメンテナンスでの作業性が悪く、装置の小型、軽量化を図る上で不利であった。
【００１２】
本発明は、上記の問題点を解決するためになされたもので、スタックの集約化により着脱の作業性を向上させることができ、かつ、空スペースを有効に活用することによって装置の軽量化やメンテナンス性に優れた車両用電力変換装置を提供することを目的とする。
【００１３】
【課題を解決するための手段】
請求項１に係る発明は、それぞれブリッジ接続された２群の半導体素子を有し、車両床下に設置される車両用電力変換装置において、
表裏の関係にある第１及び第２の部品取付面、並びにこれらの部品取付面に対して側端面に当たる第３の部品取付面を有し、第１の部品取付面に一方の群の１相分の半導体素子が装着され、第２の部品取付面に他方の群の１相分の半導体素子が装着された複数の冷却器受熱ブロックと、
冷却器受熱ブロックの第３の部品取付面からそれぞれ突出するように基端部が接合され、冷却器受熱ブロックの熱をそれぞれ先端部に輸送するヒートパイプと、
ヒートパイプに嵌着された放熱フィンと、
前記ヒートパイプの基端部に固着され、周縁部にパッキンが取り付けられた境界板と、
前記ヒートパイプを収納し前記放熱フィンからの熱を放散するための開放部、及び前記半導体素子が装着された複数の冷却器受熱ブロックを内部に装入可能な開口部が形成された半導体素子冷却フレームユニットを有しており、この半導体素子冷却フレームユニットの開口部周縁に形成したパッキンガイドの内周面と前記パッキンの外周面とが当接した状態で前記境界板がネジ部材により前記半導体素子冷却フレームユニットに取り付けられている半導体素子冷却ユニットと、
を備えたことを特徴とする。
【００１４】
請求項２に係る発明は、それぞれブリッジ接続された２群の半導体素子を有し、車両床下に設置される車両用電力変換装置において、
表裏の関係にある第１及び第２の部品取付面、並びにこれらの部品取付面に対して側端面に当たる第３の部品取付面を有し、第１又は第２の部品取付面のいずれか１つに一方の群の１相分の半導体素子と他方の群の１相分の半導体素子とが装着された複数の冷却器受熱ブロックと、
冷却器受熱ブロックの第３の部品取付面からそれぞれ突出するように基端部が接合され、冷却器受熱ブロックの熱をそれぞれ先端部に輸送するヒートパイプと、
ヒートパイプに嵌着された放熱フィンと、
前記ヒートパイプの基端部に固着され、周縁部にパッキンが取り付けられた境界板と、
前記ヒートパイプを収納し前記放熱フィンからの熱を放散するための開放部、及び前記半導体素子が装着された複数の冷却器受熱ブロックを内部に装入可能な開口部が形成された半導体素子冷却フレームユニットを有しており、この半導体素子冷却フレームユニットの開口部周縁に形成したパッキンガイドの内周面と前記パッキンの外周面とが当接した状態で前記境界板がネジ部材により前記半導体素子冷却フレームユニットに取り付けられている半導体素子冷却ユニットと、
を備えたことを特徴とする。
【００１５】
請求項３に係る発明は、請求項１又は２に記載の車両用電力変換装置において、１つの冷却器受熱ブロックに装着される一方の群の負電圧側アームの半導体素子の負極端子と、他方の群の負電圧側アームの半導体素子の負極端子とを相互に電気的に接続したことを特徴とする。
【００１６】
請求項４に係る発明は、請求項１又は２に記載の車両用電力変換装置において、１つの冷却器受熱ブロックに装着される一方の群の負電圧側アームの半導体素子の負極端子と、他方の群の正電圧側アームの半導体素子の正極端子とを相互に電気的に接続したことを特徴とする。
【００１７】
請求項５に係る発明は、インバータ回路を形成するようにブリッジ接続された複数の半導体素子と、インバータ回路の直流側端子間に抵抗器と直列に接続されてチョッパ回路を形成する半導体素子とを有し、車両床下に設置される車両用電力変換装置において、
表裏の関係にある第１及び第２の部品取付面、並びにこれらの部品取付面に対して側端面に当たる第３の部品取付面を有し、第１の部品取付面にインバータ回路を形成する１相分の半導体素子が装着され、第２の部品取付面にチョッパ回路を形成する半導体素子が装着された複数の冷却器受熱ブロックと、
冷却器受熱ブロックの第３の部品取付面からそれぞれ突出するように基端部が接合され、冷却器受熱ブロックの熱をそれぞれ先端部に輸送するヒートパイプと、
ヒートパイプに嵌着された放熱フィンと、
前記ヒートパイプの基端部に固着され、周縁部にパッキンが取り付けられた境界板と、
前記ヒートパイプを収納し前記放熱フィンからの熱を放散するための開放部、及び前記半導体素子が装着された複数の冷却器受熱ブロックを内部に装入可能な開口部が形成された半導体素子冷却フレームユニットを有しており、この半導体素子冷却フレームユニットの開口部周縁に形成したパッキンガイドの内周面と前記パッキンの外周面とが当接した状態で前記境界板がネジ部材により前記半導体素子冷却フレームユニットに取り付けられている半導体素子冷却ユニットと、
を備えたことを特徴とする。
【００１８】
請求項６に係る発明は、インバータ回路を形成するようにブリッジ接続された複数の半導体素子と、インバータ回路の直流側端子間に抵抗器と直列に接続されてチョッパ回路を形成する半導体素子とを有し、車両床下に設置される車両用電力変換装置において、
表裏の関係にある第１及び第２の部品取付面、並びにこれらの部品取付面に対して側端面に当たる第３の部品取付面を有し、第１又は第２の部品取付面にインバータ回路を形成する１相分の半導体素子とチョッパ回路を形成する半導体素子とが装着された複数の冷却器受熱ブロックと、
冷却器受熱ブロックの第３の部品取付面からそれぞれ突出するように基端部が接合され、冷却器受熱ブロックの熱をそれぞれ先端部に輸送するヒートパイプと、
ヒートパイプに嵌着された放熱フィンと、
前記ヒートパイプの基端部に固着され、周縁部にパッキンが取り付けられた境界板と、
前記ヒートパイプを収納し前記放熱フィンからの熱を放散するための開放部、及び前記半導体素子が装着された複数の冷却器受熱ブロックを内部に装入可能な開口部が形成された半導体素子冷却フレームユニットを有しており、この半導体素子冷却フレームユニットの開口部周縁に形成したパッキンガイドの内周面と前記パッキンの外周面とが当接した状態で前記境界板がネジ部材により前記半導体素子冷却フレームユニットに取り付けられている半導体素子冷却ユニットと、
を備えたことを特徴とする。
【００１９】
請求項７に係る発明は、請求項１乃至６のいずれか１項に記載の車両用電力変換装置において、冷却器受熱ブロック毎に複数本のヒートパイプが平行に突出され、放熱フインが複数本のヒートパイプに共通に結合され、かつ、その長手方向に複数個配設されたことを特徴とする。
【００２０】
【発明の実施の形態】
以下、本発明を図面に示す好適な実施形態に基づいて詳細に説明する。図１は本発明に係る車両用電力変換装置の第１の実施形態の概略構成図であり、このうち、図１（ａ）は車体に取り付けられた箱体に半導体素子冷却ユニット４を装着し、箱体の一部を断面で表した側面図であり、図１（ｂ）はそのＡ−Ａ矢視断面図である。図中、従来装置を示す図１０と同一の符号を付したものはそれぞれ同一の要素を示している。これら各図において、車体５の底部の側端に箱体６が取り付けられている。箱体６は半導体素子冷却ユニット４の一部を収納し、これを固定するために仕切り板７によって額縁状に囲まれた開口を備えている。
【００２１】
半導体素子冷却ユニット４は、箱体６の開口に装入される密閉部１１と、半導体素子１及びゲートアンプ９を内部に収容する半導体素子冷却フレームユニット１２と、熱放散させるための開放部１３とを備えている。
【００２２】
このうち、密閉部１１は、例えば、山形鋼で形成された枠体の底部に板が取り付けられ、その上にフィルタコンデンサ３が装着され、箱体６の内部に導入された導体がフィルタコンデンサ３等に接続されている。半導体素子冷却フレームユニット１２は開放部１３側が稍上向きに傾斜し、その傾斜面に開口が形成された密閉可能な筐体でなり、その開口にスタック２０を構成する境界板２１の縁部が、例えば、ボルトによって締結され、内部が気密に保たれるようになっている。
【００２３】
スタック２０は境界板２１の内側に取り付けられ、それぞれ表裏の関係に有る両面に半導体素子１が装着された３個の冷却器受熱ブロック２３と、これらの冷却器受熱ブロック２３の下方に配置される３個のゲートアンプ９と、それぞれ基端部が冷却器受熱ブロック２３に接合され、境界板２１を貫通して外側に平行に突出する複数のヒートパイプ２４と、これらのヒートパイプ２４の長手方向に互いに間隔を空けて一体的に嵌着された複数の放熱フィン２５とで構成されている。
【００２４】
開放部１３は車両の艤装限界内に形成された枠体でなり、前述したヒートパイプ２４及び放熱フィン２５を内在させ、車両床下にその排熱がこもり床下の配線、配管等を加熱することがないように、そこに通風させて放熱を促進する機能を備えている。
【００２５】
なお、半導体素子冷却フレームユニット１２に収納される半導体素子１及びゲートアンプ９からスタック接続導体が密閉部１１側に導出され、フィルタコンデンサ３や外部からの引き込み導体に接続されるが、図面の簡単化のために省略している。
【００２６】
ここで、ヒートパイプ２４は、冷却器受熱ブロック２３側が下方となるよう傾けて取り付けられ、ヒートパイプ２４の内部に封入された冷媒は、冷却器受熱ブロック２３で半導体素子１から発生する熱により蒸発し、放熱フィン２５側で凝縮して大気へ熱放散を行う。凝縮された冷媒はヒートパイプ２４の内部を重力により冷却器受熱ブロック２３側へ戻るようなサイクルを繰り返す。放熱フィン２５は自然冷却により大気へ熱放散を行うため、地面に対してほぼ垂直に設置され、放熱フィン２５間に上昇気流を生じさせるようになっている。
【００２７】
図２は半導体素子冷却ユニット４とスタック２０の詳細な構成及びその組み付け状態を示したもので、図２（ａ）は半導体素子冷却ユニット４の側面図を、図２（ｂ）はスタック２０の側面図をそれぞれ示している。これら各図において、半導体素子冷却ユニット４は前述したように密閉部１１、半導体素子冷却フレームユニット１２及び開放部１３とで構成されている。半導体素子冷却フレームユニット１２の開口の縁部は開放部１３側に突出し、これが矩形のパッキンガイド２８を形成し、このパッキンガイド２８の外側の４隅にはねじ穴が形成された固定部材２９が設けられている。一方、スタック２０を構成する境界板２１の内側には全体が矩形をなすパッキン溝２２が形成され、ここにパッキン２７が嵌挿されている。そこで、スタック２０を矢印Ｋ方向に移動させ、境界板２１の内側に冷却器受熱ブロック２３を介して装着された半導体素子１及びゲートアンプ９を半導体素子冷却フレームユニット１２の開口を通して内部に装入し、パッキンガイド２８の先端にパッキン２７が当接する状態で、例えば、ボルトによって境界板２１を固定部材２９に締結することによって図１に示した状態に組み立てられる。なお、境界板２１に近接する位置に半導体素子１とゲートアンプ９を接続するゲート配線１０が設けられている。
【００２８】
図３（ａ），（ｂ），（ｃ），（ｄ）は境界板２１を貫通して装着されるヒートパイプ２４、放熱フィン２５及び冷却器受熱ブロック２３の結合状態と、冷却器受熱ブロック２３に対する半導体素子１の装着状態を示す正面図、上面図、左側面図及び右側面図である。ここで、冷却器受熱ブロック２３は表裏の関係にある第１及び第２の部品取付面、並びにこれらの部品取付面に対して側端面に当たる第３の部品取付面を有し、第１の部品取付面に、１つのインバータを構成する半導体素子群の１相分（２個）の半導体素子１が装着され、第２の部品取付面にもう一つのインバータを構成する半導体素子群の１相分（２個）の半導体素子１が装着されている。そして、第３の部品取付面は縦に細長くなっており、その長手方向に複数（図面では５個）のヒートパイプ２４の基端部が接合されると共に、互いに平行にして１列に突出している。また、これらのヒートパイプ２４の長手方向に、他の相に対応して設けられたヒートパイプと併せて、複数の放熱フィン２５が一体的に嵌着されている。
【００２９】
このような構成によれば、１つの冷却器で２相分の半導体素子１を冷却することができ、冷却器の数を半分に減らすことができる。したがって、装置の軽量化、低コスト化が図られ、組立作業性、メンテナンス性が向上する等の利点が得られる。また、片群が運転されない時は、冷却器の放熱熱性能に余裕ができることから、残った片群の熱損失をさらに大きく設定することができる。
【００３０】
なお、上記の実施形態では１つの冷却器受熱ブロック２３に５個のヒートパイプ２４を接合し、これらのヒートパイプ２４に７個の放熱フィン２５を嵌着したが、これらの個数は電力変換容量等に応じて適宜変更することも可能である。
【００３１】
図４（ａ），（ｂ），（ｃ），（ｄ）は本発明に係る車両用電力変換装置の第２の実施形態の構成を説明するために、境界板２１を貫通して装着されるヒートパイプ２４、放熱フィン２５及び冷却器受熱ブロック２３の結合状態と、冷却器受熱ブロック２３に対する半導体素子１の装着状態を示す正面図、上面図、左側面図及び右側面図であり、図中、第１の実施形態を示す図３と同一の要素には同一の符号を付してその説明を省略する。この実施形態は冷却器受熱ブロック２３の第１の部品取付面にのみ、互いに異なる半導体素子群のそれぞれ１相分の半導体素子１を略均等な間隔で縦横に近接させて装着したものである。
【００３２】
この構成によれば、第１の実施形態と同様に、２相分の半導体素子１より発生した熱が１つの冷却器受熱ブロック２３を介して放熱フィン２５から放熱されるので、従来装置と比較して冷却器の数を半分に減らすことができ、装置の軽量化、低コスト化が図られ、組立作業性、メンテナンス性が向上する等の利点が得られる。
【００３３】
図５は本発明に係る車両用電力変換装置の第３の実施形態の構成を示す回路図であり、特に、第１及び第２の実施形態の半導体素子１の接続状態を示したものであり、図中、従来装置を示した図９と同一の要素には同一の符号を付してその説明を省略する。
【００３４】
この実施形態は、それぞれフィルタコンデンサ３及び３相ブリッジ接続された６個の半導体素子１を有し、それぞれ電動機３１を駆動する２台のインバータ回路のそれぞれ１相分の半導体素子１のうち、同一の冷却器受熱ブロック２３に装着される一方の半導体素子群の負電圧側アームの半導体素子１の負極端子と、他方の半導体素子群の負電圧側アームの半導体素子１の負極端子とを相互に電気的に接続したものである。この場合、半導体素子１として３．３ｋＶ定格のＩＧＢＴ（Insulated Gate Bipolar Transistor）を用い、直流１５００Ｖの架線電圧を、一方のインバータの直流側端子Ｐ１，Ｎ間に供給すると共に、他方のインバータの直流側端子Ｐ２，Ｎ間に供給する。
【００３５】
この構成によれば、２台分のインバータ回路における負極端子の数が１個になり、箱体との接続箇所を削減することができ、組立作業性、メンテナンス性を一層向上させることができる。
【００３６】
図６は本発明に係る車両用電力変換装置の第４の実施形態の構成を示す回路図であり、特に、第１及び第２の実施形態の半導体素子１の接続状態を示したものであり、図中、第３の実施形態を示した図５と同一の要素には同一の符号を付してその説明を省略する。
【００３７】
この実施形態は、それぞれフィルタコンデンサ３及び３相ブリッジ接続された６個の半導体素子１を有し、それぞれ電動機３１を駆動する２台のインバータ回路のそれぞれ１相分の半導体素子１のうち、同一の冷却器受熱ブロック２３に装着される一方の半導体素子群の負電圧側アームの半導体素子１の負極端子と、他方の半導体素子群の正電圧側アームの半導体素子１の正極端子とを相互に電気的に接続したものである。この場合、半導体素子１として３．３ｋＶのＩＧＢＴを用い、直流１５００Ｖの架線電圧を直流側の端子Ｐ，Ｎ間に供給し、直列接続された２個のフィルタコンデンサ３によって分圧し、１つの冷却器受熱ブロック２３に装着される４個の半導体素子１に１．７ｋＶの電圧が印加されるように構成されている。
【００３８】
このように構成することによって、２群分のインバータ回路における一方の群の負極ともう一方の群の正極が共通となり、箱体との接続箇所を削減することができ、組立作業性、メンテナンス性を一層向上させることができる。
【００３９】
図７（ａ），（ｂ），（ｃ），（ｄ）は本発明に係る車両用電力変換装置の第５の実施形態の構成を説明するために、境界板２１を貫通して装着されるヒートパイプ２４、放熱フィン２５及び冷却器受熱ブロック２３の結合状態と、冷却器受熱ブロック２３に対する半導体素子１の装着状態を示す正面図、上面図、左側面図及び右側面図であり、図中、第１の実施形態を示す図３と同一の要素には同一の符号を付してその説明を省略する。この実施形態は冷却器受熱ブロック２３の第１の部品取付面にインバータ回路を構成する１相分の半導体素子１Ａを装着し、第２の取付面にブレーキチョッパ回路を構成する半導体素子１Ｂを装着したものである。これ以外は第１の実施形態を示す図３と同一に構成されている。
【００４０】
この実施形態によれば、１つの冷却器で２種類の回路の半導体素子１Ａ，１Ｂが装着されることとなり、それによって装置の軽量化、低コスト化が図られ、組立作業性、メンテナンス性が向上する等の利点が得られる。
【００４１】
図８（ａ），（ｂ），（ｃ），（ｄ）は本発明に係る車両用電力変換装置の第６の実施形態の構成を説明するために、境界板２１を貫通して装着されるヒートパイプ２４、放熱フィン２５及び冷却器受熱ブロック２３の結合状態と、冷却器受熱ブロック２３に対する半導体素子１の装着状態を示す正面図、上面図、左側面図及び右側面図であり、図中、第５の実施形態を示す図７と同一の要素には同一の符号を付してその説明を省略する。この実施形態は冷却器受熱ブロック２３の第１の部品取付面のみにインバータ回路を構成する１相分の半導体素子１Ａと、ブレーキチョッパ回路を構成する１相分の半導体素子１Ｂとを略均等な間隔で縦横に近接させて装着したものである。これ以外は第５の実施形態を示す図７と同一に構成されている。
【００４２】
この実施形態によれば、１つの冷却器で２種類の回路要素を装着することが可能となり、装置の軽量化、低コスト化が図られ、組立作業性、メンテナンス性が向上する等の利点が得られる。
【００４３】
【発明の効果】
以上の説明によって明らかなように、本発明によれば、スタックの集約化により着脱の作業性を向上させることができ、かつ、空スペースを有効に活用することによって装置の軽量化やメンテナンス性に優れた車両用電力変換装置が提供される。
【図面の簡単な説明】
【図１】本発明に係る車両用電力変換装置の第１の実施形態の概略構成を、その一部を断面で示した側面図及びそのＡ−Ａ矢視断面図。
【図２】図１に示した第１の実施形態を構成する半導体素子冷却ユニットとスタックの詳細な構成及びその組み付け状態を示した側面図。
【図３】図１に示した第１の実施形態を構成する主要素の結合状態と半導体素子の装着状態を示す正面図、上面図、左側面図及び右側面図。
【図４】本発明に係る車両用電力変換装置の第２の実施形態を構成する主要素の結合状態と半導体素子の装着状態を示す正面図、上面図、左側面図及び右側面図。
【図５】本発明に係る車両用電力変換装置の第３の実施形態の構成を示す回路図。
【図６】本発明に係る車両用電力変換装置の第４の実施形態の構成を示す回路図。
【図７】本発明に係る車両用電力変換装置の第５の実施形態を構成する主要素の結合状態と半導体素子の装着状態を示す正面図、上面図、左側面図及び右側面図。
【図８】本発明に係る車両用電力変換装置の第６の実施形態を構成する主要素の結合状態と半導体素子の装着状態を示す正面図、上面図、左側面図及び右側面図。
【図９】鉄道車両の床下に設置されて車両駆動電力を供給する電力変換器の構成を示す回路図。
【図１０】従来の車両用電力変換装置の概略構成を、その一部を断面で示した側面図及びそのＢ−Ｂ矢視断面図。
【符号の説明】
１，１Ａ，１Ｂ半導体素子
２相コンデンサ
３フィルタコンデンサ
４半導体素子冷却ユニット
５車体
６箱体
１１密閉部
１２半導体素子冷却フレームユニット
１３開放部
２０スタック
２１境界板
２３冷却器受熱ブロック
２４ヒートパイプ
２５放熱フィン
２６スタック接続導体
３１電動機[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vehicular power conversion device having a semiconductor device installed under the floor of a railway vehicle.
[0002]
[Prior art]
As shown in FIG. 9, a power converter installed under the floor of a railway vehicle and supplying vehicle driving power includes six semiconductor elements 1 connected in a three-phase bridge, and a positive terminal and a negative terminal of each phase. DC power input between the DC-side terminals P and N from a railway overhead line (not shown) having three connected phase capacitors 2 and a filter capacitor 3 connected between DC-side terminals P and N Is converted into AC power by controlling the semiconductor element 1 to be turned on and off in a predetermined order, output from the terminals U, V and W on the AC side, and supplied to a motor for driving a vehicle (not shown). This power converter is provided in the semiconductor element cooling unit 4 in order to efficiently remove the heat generated from the semiconductor element 1.
[0003]
FIG. 10A is a side view in which the semiconductor element cooling unit 4 is mounted on a box attached to the vehicle body, and a part of the box is shown in cross section, and FIG. It is sectional drawing. In each of these drawings, a box 6 is attached to the side end of the bottom of the vehicle body 5. The box 6 accommodates a part of the semiconductor element cooling unit 4 and has an opening surrounded by a partition plate 7 in a frame shape in order to fix it.
[0004]
The semiconductor element cooling unit 4 includes a sealed part 11 inserted into the opening of the box 6, a semiconductor element cooling frame unit 12 that houses the semiconductor element 1, the phase capacitor 2, and the like, and an open part for dissipating heat. 13.
[0005]
Among these, the sealing part 11 is a conductor that is attached to the inside of the box 6 with a plate attached to the bottom of a frame formed of angle steel, for example, and the filter capacitor 3 and the gate amplifier 9 mounted thereon. 8 is connected to the filter capacitor 3 and the like. The semiconductor element cooling frame unit 12 is a sealable casing in which the opening 13 side is inclined upward and an opening is formed on the inclined surface, and the edge of the boundary plate 21 constituting the stack 20 is formed in the opening. For example, it is fastened by a bolt so that the inside is kept airtight.
[0006]
The stack 20 is attached to the inside of the boundary plate 21 and includes three cooler heat receiving blocks 23 each having the semiconductor element 1 mounted thereon, and three phase capacitors 2 disposed in the vicinity of these cooler heat receiving blocks 23. The base end portions are joined to the cooler heat receiving block 23, and a plurality of heat pipes 24 that pass through the boundary plate 21 and project parallel to the open portion 13 are spaced apart from each other in the longitudinal direction of the heat pipes 24. And a plurality of heat radiation fins 25 fitted together. Here, the semiconductor element 1 and the cooler heat receiving block 23 are heat generating portions, and the heat radiating fins 25 are heat radiating portions.
[0007]
The open part 13 is a frame formed within the vehicle's outfitting limit, and the heat pipe 24 and the heat radiating fins 25 described above are incorporated, and the exhaust heat is accumulated under the vehicle floor to heat wiring, piping, etc. under the floor. It has a function to promote heat dissipation by ventilating.
[0008]
The stack connection conductor 26 is led out from the semiconductor element 1 housed in the semiconductor element cooling frame unit 12 to the sealed portion 11 side, and is connected to the filter capacitor 3, the conductor 8, or the gate amplifier 9 with a bolt or the like.
[0009]
Here, the heat pipe 24 is attached to be inclined so that the cooler heat receiving block 23 side is downward, and the refrigerant sealed inside the heat pipe 24 evaporates due to heat generated from the semiconductor element 1 in the cooler heat receiving block 23. Then, it condenses on the radiation fin 25 side and dissipates heat to the atmosphere. The condensed refrigerant repeats a cycle in which the inside of the heat pipe 24 returns to the cooler heat receiving block 23 side by gravity. Since the radiation fins 25 dissipate heat to the atmosphere by natural cooling, they are installed substantially perpendicular to the ground, and an upward airflow is generated between the radiation fins 25.
[0010]
[Problems to be solved by the invention]
In the above-described conventional vehicle power converter , one stack 20 is provided for each phase of the semiconductor elements connected in a three-phase bridge. Further, the semiconductor element 1 is mounted on one surface of the cooler heat receiving block 23, and the phase capacitor 2 is mounted on the other surface. In recent years, however, the phase capacitor 2 connected in the vicinity of the semiconductor element 1 is not required due to advances in mounting technology that reduces the inductance component by shortening the wiring or by making it adjacent to the reciprocating wiring. For this reason, one side of the semiconductor element cooling unit frame 15 often becomes an empty space.
[0011]
In addition, since one stack 20 is provided for each phase, three stacks are sufficient in the central control system, but as many stacks 20 as 12 are required in the individual control system, assembly work is required. In addition, workability in maintenance and maintenance is poor, which is disadvantageous in reducing the size and weight of the device.
[0012]
The present invention has been made to solve the above-described problems, and it is possible to improve the workability of attachment / detachment by consolidating the stack, and to reduce the weight of the apparatus by effectively utilizing the empty space. It aims at providing the power converter for vehicles excellent in maintainability.
[0013]
[Means for Solving the Problems]
The invention according to claim 1 has two groups of semiconductor elements each bridge-connected, and is a vehicle power converter installed under a vehicle floor .
There are first and second component mounting surfaces in a front-back relationship, and a third component mounting surface that hits a side end surface with respect to these component mounting surfaces, and one phase of one group on the first component mounting surface A plurality of cooler heat receiving blocks, each having a second semiconductor element mounted on the second component mounting surface,
A heat pipe that joins the base end portion so as to protrude from the third component mounting surface of the cooler heat receiving block, respectively, and transports the heat of the cooler heat receiving block to the tip portion;
Radiating fins fitted to the heat pipe;
A boundary plate fixed to the base end portion of the heat pipe and having a packing attached to the peripheral edge portion,
Semiconductor element cooling in which an opening for accommodating the heat pipe and dissipating heat from the heat radiating fins and an opening for inserting a plurality of cooler heat receiving blocks on which the semiconductor elements are mounted are formed. The semiconductor element has a frame unit, and the boundary plate is screwed by a screw member in a state where the inner peripheral surface of the packing guide formed at the periphery of the opening of the semiconductor element cooling frame unit is in contact with the outer peripheral surface of the packing A semiconductor element cooling unit attached to the cooling frame unit;
It is provided with.
[0014]
The invention according to claim 2 has two groups of semiconductor elements each bridge-connected, and in a vehicle power converter installed under a vehicle floor ,
There are first and second component mounting surfaces in a front-back relationship, and a third component mounting surface that hits a side end surface with respect to these component mounting surfaces, and one of the first and second component mounting surfaces A plurality of cooler heat receiving blocks in which one group of semiconductor elements of one group and one group of semiconductor elements of the other group are mounted;
A heat pipe that joins the base end portion so as to protrude from the third component mounting surface of the cooler heat receiving block, respectively, and transports the heat of the cooler heat receiving block to the tip portion;
Radiating fins fitted to the heat pipe;
A boundary plate fixed to the base end portion of the heat pipe and having a packing attached to the peripheral edge portion,
Semiconductor element cooling in which an opening for accommodating the heat pipe and dissipating heat from the heat radiating fins and an opening for inserting a plurality of cooler heat receiving blocks on which the semiconductor elements are mounted are formed. The semiconductor element has a frame unit, and the boundary plate is screwed by a screw member in a state where the inner peripheral surface of the packing guide formed at the periphery of the opening of the semiconductor element cooling frame unit is in contact with the outer peripheral surface of the packing A semiconductor element cooling unit attached to the cooling frame unit;
It is provided with.
[0015]
The invention according to claim 3 is the vehicle power converter according to claim 1 or 2, wherein the negative electrode terminal of the semiconductor element of the negative voltage side arm of one group attached to one cooler heat receiving block, and the other The negative electrode terminal of the semiconductor element of the negative voltage side arm of the group is electrically connected to each other.
[0016]
The invention according to claim 4 is the vehicle power converter according to claim 1 or 2, wherein the negative electrode terminal of the semiconductor element of the negative voltage side arm of one group mounted on one cooler heat receiving block and the other The positive electrode terminal of the semiconductor element of the positive voltage side arm of the group is electrically connected to each other.
[0017]
The invention according to claim 5 includes a plurality of semiconductor elements bridge-connected to form an inverter circuit, and a semiconductor element connected in series with a resistor between the DC side terminals of the inverter circuit to form a chopper circuit. In a vehicle power converter installed under a vehicle floor ,
The first and second component mounting surfaces that have a front and back relationship, and a third component mounting surface that contacts a side end surface with respect to these component mounting surfaces, and an inverter circuit is formed on the first component mounting surface A plurality of cooler heat receiving blocks each having a semiconductor element mounted thereon and mounted with a semiconductor element forming a chopper circuit on the second component mounting surface;
A heat pipe that joins the base end portion so as to protrude from the third component mounting surface of the cooler heat receiving block, respectively, and transports the heat of the cooler heat receiving block to the tip portion;
Radiating fins fitted to the heat pipe;
A boundary plate fixed to the base end portion of the heat pipe and having a packing attached to the peripheral edge portion,
Semiconductor element cooling in which an opening for accommodating the heat pipe and dissipating heat from the heat radiating fins and an opening for inserting a plurality of cooler heat receiving blocks on which the semiconductor elements are mounted are formed. The semiconductor element has a frame unit, and the boundary plate is screwed by a screw member in a state where the inner peripheral surface of the packing guide formed at the periphery of the opening of the semiconductor element cooling frame unit is in contact with the outer peripheral surface of the packing A semiconductor element cooling unit attached to the cooling frame unit;
It is provided with.
[0018]
The invention according to claim 6 includes a plurality of semiconductor elements bridge-connected so as to form an inverter circuit, and a semiconductor element connected in series with a resistor between the DC side terminals of the inverter circuit to form a chopper circuit. In a vehicle power converter installed under a vehicle floor ,
There are first and second component mounting surfaces in a front-back relationship, and a third component mounting surface that hits a side end surface with respect to these component mounting surfaces, and an inverter circuit is provided on the first or second component mounting surface. A plurality of cooler heat receiving blocks on which a semiconductor element for one phase to be formed and a semiconductor element for forming a chopper circuit are mounted;
A heat pipe that joins the base end portion so as to protrude from the third component mounting surface of the cooler heat receiving block, respectively, and transports the heat of the cooler heat receiving block to the tip portion;
Radiating fins fitted to the heat pipe;
A boundary plate fixed to the base end portion of the heat pipe and having a packing attached to the peripheral edge portion,
Semiconductor element cooling in which an opening for accommodating the heat pipe and dissipating heat from the heat radiating fins and an opening for inserting a plurality of cooler heat receiving blocks on which the semiconductor elements are mounted are formed. The semiconductor element has a frame unit, and the boundary plate is screwed by a screw member in a state where the inner peripheral surface of the packing guide formed at the periphery of the opening of the semiconductor element cooling frame unit is in contact with the outer peripheral surface of the packing A semiconductor element cooling unit attached to the cooling frame unit;
It is provided with.
[0019]
The invention according to claim 7 is the vehicle power conversion device according to any one of claims 1 to 6, wherein a plurality of heat pipes are projected in parallel for each cooler heat receiving block, and a plurality of heat radiation fins are provided. The heat pipes are commonly connected to each other, and a plurality of heat pipes are arranged in the longitudinal direction.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on preferred embodiments shown in the drawings. FIG. 1 is a schematic configuration diagram of a first embodiment of a vehicular power converter according to the present invention. FIG. 1 (a) shows that a semiconductor element cooling unit 4 is mounted on a box attached to a vehicle body. FIG. 1B is a side view showing a part of the box in cross section, and FIG. 1B is a cross-sectional view taken along the line AA. In the figure, the same reference numerals as those in FIG. 10 showing the conventional apparatus denote the same elements. In each of these drawings, a box 6 is attached to the side end of the bottom of the vehicle body 5. The box 6 accommodates a part of the semiconductor element cooling unit 4 and has an opening surrounded by a partition plate 7 in a frame shape in order to fix it.
[0021]
The semiconductor element cooling unit 4 includes a sealed part 11 inserted into the opening of the box 6, a semiconductor element cooling frame unit 12 that houses the semiconductor element 1 and the gate amplifier 9 therein, and an open part 13 for heat dissipation. And.
[0022]
Among these, the sealing part 11 has a plate attached to the bottom of a frame made of angle steel, for example, the filter capacitor 3 is mounted thereon, and the conductor introduced into the box 6 is the filter capacitor 3. Etc. are connected. The semiconductor element cooling frame unit 12 is a sealable casing in which the opening 13 side is inclined upward and an opening is formed on the inclined surface, and the edge of the boundary plate 21 constituting the stack 20 is formed in the opening. For example, it is fastened by a bolt so that the inside is kept airtight.
[0023]
The stack 20 is attached to the inside of the boundary plate 21, and is disposed below the three cooler heat receiving blocks 23, and the three cooler heat receiving blocks 23 each having the semiconductor element 1 mounted on both sides of the front and back sides. Three gate amplifiers 9, a plurality of heat pipes 24 each having a base end joined to the cooler heat receiving block 23, penetrating the boundary plate 21 and projecting outward in parallel, and longitudinal directions of these heat pipes 24 And a plurality of heat dissipating fins 25 that are integrally fitted at intervals.
[0024]
The open part 13 is a frame formed within the vestibule limit of the vehicle, and the heat pipe 24 and the heat radiating fin 25 described above are built in. In order to prevent heat dissipation, it has the function of ventilating it and promoting heat dissipation.
[0025]
The stack connection conductor is led out to the sealed portion 11 side from the semiconductor element 1 and the gate amplifier 9 housed in the semiconductor element cooling frame unit 12, and is connected to the filter capacitor 3 and the lead-in conductor from the outside. It is omitted for the sake of explanation.
[0026]
Here, the heat pipe 24 is attached to be inclined so that the cooler heat receiving block 23 side is downward, and the refrigerant sealed inside the heat pipe 24 evaporates due to heat generated from the semiconductor element 1 in the cooler heat receiving block 23. Then, it condenses on the radiation fin 25 side and dissipates heat to the atmosphere. The condensed refrigerant repeats a cycle in which the inside of the heat pipe 24 returns to the cooler heat receiving block 23 side by gravity. Since the radiation fins 25 dissipate heat to the atmosphere by natural cooling, they are installed substantially perpendicular to the ground, and an upward airflow is generated between the radiation fins 25.
[0027]
FIG. 2 shows a detailed configuration of the semiconductor element cooling unit 4 and the stack 20 and an assembled state thereof. FIG. 2A is a side view of the semiconductor element cooling unit 4, and FIG. Each side view is shown. In each of these drawings, the semiconductor element cooling unit 4 is composed of the sealing part 11, the semiconductor element cooling frame unit 12, and the open part 13 as described above. The edge of the opening of the semiconductor element cooling frame unit 12 protrudes toward the open portion 13, which forms a rectangular packing guide 28, and fixing members 29 having screw holes formed at four corners outside the packing guide 28. Is provided. On the other hand, a packing groove 22 having a rectangular shape as a whole is formed inside the boundary plate 21 constituting the stack 20, and a packing 27 is fitted therein. Therefore, the stack 20 is moved in the direction of the arrow K, and the semiconductor element 1 and the gate amplifier 9 mounted inside the boundary plate 21 via the cooler heat receiving block 23 are inserted into the inside through the opening of the semiconductor element cooling frame unit 12. Then, in a state where the packing 27 abuts on the tip of the packing guide 28, the boundary plate 21 is fastened to the fixing member 29 with a bolt, for example, and the state shown in FIG. A gate wiring 10 for connecting the semiconductor element 1 and the gate amplifier 9 is provided at a position close to the boundary plate 21.
[0028]
3A, 3B, 3C, and 3D show the combined state of the heat pipe 24, the radiating fin 25, and the cooler heat receiving block 23 that are mounted through the boundary plate 21, and the cooler heat receiving block. 23 is a front view, a top view, a left side view, and a right side view showing a mounting state of the semiconductor element 1 to 23. Here, the cooler heat receiving block 23 has first and second component mounting surfaces that are in a front-back relationship, and a third component mounting surface that hits a side end surface with respect to these component mounting surfaces. One phase (two) of semiconductor elements 1 of the semiconductor element group constituting one inverter is mounted on the mounting surface, and one phase of the semiconductor element group constituting another inverter is mounted on the second component mounting surface. (Two) semiconductor elements 1 are mounted. The third component mounting surface is elongated in the vertical direction, and the base end portions of a plurality (five in the drawing) of the heat pipes 24 are joined in the longitudinal direction and protrude in one row in parallel with each other. Yes. Further, in the longitudinal direction of these heat pipes 24, a plurality of radiating fins 25 are integrally fitted together with heat pipes provided corresponding to other phases.
[0029]
According to such a configuration, the semiconductor element 1 for two phases can be cooled with one cooler, and the number of coolers can be reduced to half. Therefore, the apparatus can be reduced in weight and cost, and advantages such as improved assembly workability and maintainability can be obtained. Further, when the one group is not operated, the heat dissipation heat performance of the cooler can be afforded, so that the heat loss of the remaining one group can be set larger.
[0030]
In the above embodiment, five heat pipes 24 are joined to one cooler heat receiving block 23, and seven radiating fins 25 are fitted to these heat pipes 24, but the number of these is the power conversion capacity. It is also possible to change appropriately according to the above.
[0031]
4 (a), (b), (c), and (d) are attached through the boundary plate 21 to explain the configuration of the second embodiment of the vehicle power converter according to the present invention. FIG. 6 is a front view, a top view, a left side view, and a right side view showing a coupling state of the heat pipe 24, the heat radiation fins 25, and the cooler heat receiving block 23, and a mounting state of the semiconductor element 1 to the cooler heat receiving block 23. Among them, the same elements as those in FIG. 3 showing the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. In this embodiment, only the first component mounting surface of the cooler heat receiving block 23 is mounted with the semiconductor elements 1 for one phase of the different semiconductor element groups in close proximity vertically and horizontally at substantially equal intervals.
[0032]
According to this configuration, similarly to the first embodiment, the heat generated from the semiconductor element 1 for two phases is radiated from the heat radiation fins 25 through one cooler heat receiving block 23, so that it is compared with the conventional device. As a result, the number of coolers can be reduced to half, the apparatus can be reduced in weight and cost, and advantages such as improved assembly workability and maintainability can be obtained.
[0033]
FIG. 5 is a circuit diagram showing the configuration of the third embodiment of the vehicular power converter according to the present invention, and particularly shows the connection state of the semiconductor elements 1 of the first and second embodiments. In the figure, the same elements as those in FIG. 9 showing the conventional apparatus are denoted by the same reference numerals, and the description thereof is omitted.
[0034]
This embodiment has six semiconductor elements 1 each connected to a filter capacitor 3 and a three-phase bridge, and is the same among the semiconductor elements 1 for one phase of each of the two inverter circuits that drive the motor 31. The negative electrode terminal of the semiconductor element 1 of the negative voltage side arm of one semiconductor element group and the negative electrode terminal of the semiconductor element 1 of the negative voltage side arm of the other semiconductor element group are connected to each other. Electrically connected. In this case, a 3.3 kV rated IGBT (Insulated Gate Bipolar Transistor) is used as the semiconductor element 1, and a DC 1500V overhead voltage is supplied between the DC side terminals P1 and N of one inverter and the DC of the other inverter. Supply between side terminals P2, N.
[0035]
According to this configuration, the number of negative terminals in the inverter circuit for two units is one, the number of connection points with the box can be reduced, and the assembly workability and the maintainability can be further improved.
[0036]
FIG. 6 is a circuit diagram showing the configuration of the fourth embodiment of the vehicle power converter according to the present invention, and particularly shows the connection state of the semiconductor elements 1 of the first and second embodiments. In the figure, the same elements as those in FIG. 5 showing the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.
[0037]
This embodiment has six semiconductor elements 1 each connected to a filter capacitor 3 and a three-phase bridge, and is the same among the semiconductor elements 1 for one phase of each of the two inverter circuits that drive the motor 31. The negative electrode terminal of the semiconductor element 1 of the negative voltage side arm of one semiconductor element group and the positive terminal of the semiconductor element 1 of the positive voltage side arm of the other semiconductor element group are attached to each other. Electrically connected. In this case, a 3.3 kV IGBT is used as the semiconductor element 1, a DC 1500V overhead voltage is supplied between the terminals P and N on the DC side, divided by two filter capacitors 3 connected in series, and one cooling A voltage of 1.7 kV is applied to the four semiconductor elements 1 mounted on the heat receiving block 23.
[0038]
By configuring in this way, the negative electrode of one group and the positive electrode of the other group in the inverter circuits for the two groups become common, and the number of connection points with the box can be reduced. Can be further improved.
[0039]
7 (a), (b), (c), and (d) are attached through the boundary plate 21 to explain the configuration of the fifth embodiment of the vehicular power converter according to the present invention. FIG. 6 is a front view, a top view, a left side view, and a right side view showing a coupling state of the heat pipe 24, the heat radiation fins 25, and the cooler heat receiving block 23, and a mounting state of the semiconductor element 1 to the cooler heat receiving block 23. Among them, the same elements as those in FIG. 3 showing the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. In this embodiment, the first component mounting surface of the cooler heat receiving block 23 is mounted with the one-phase semiconductor element 1A constituting the inverter circuit, and the second mounting surface is mounted with the semiconductor element 1B constituting the brake chopper circuit. It is a thing. Other than this, the configuration is the same as in FIG. 3 showing the first embodiment.
[0040]
According to this embodiment, the semiconductor elements 1A and 1B of two types of circuits are mounted with one cooler, thereby reducing the weight and cost of the apparatus, and improving assembly workability and maintainability. Advantages such as improvement are obtained.
[0041]
8 (a), (b), (c), and (d) are attached through the boundary plate 21 in order to explain the configuration of the sixth embodiment of the vehicle power converter according to the present invention. FIG. 6 is a front view, a top view, a left side view, and a right side view showing a coupling state of the heat pipe 24, the heat radiation fins 25, and the cooler heat receiving block 23, and a mounting state of the semiconductor element 1 to the cooler heat receiving block 23. Among them, the same elements as those in FIG. 7 showing the fifth embodiment are denoted by the same reference numerals, and the description thereof is omitted. In this embodiment, the one-phase semiconductor element 1A constituting the inverter circuit and the one-phase semiconductor element 1B constituting the brake chopper circuit are substantially equalized only on the first component mounting surface of the cooler heat receiving block 23. It is installed in close proximity vertically and horizontally at intervals. Other than this, the configuration is the same as in FIG. 7 showing the fifth embodiment.
[0042]
According to this embodiment, it is possible to mount two types of circuit elements with a single cooler, and the advantages of reducing the weight and cost of the apparatus, improving the assembly workability and maintainability, etc. can get.
[0043]
【The invention's effect】
As is apparent from the above description, according to the present invention, the workability of attachment / detachment can be improved by consolidating the stack, and the apparatus can be reduced in weight and maintainability by effectively utilizing the empty space. An excellent vehicle power conversion device is provided.
[Brief description of the drawings]
FIG. 1 is a side view showing a schematic configuration of a first embodiment of a power converter for a vehicle according to the present invention, partly in section, and a cross-sectional view taken along line AA.
FIG. 2 is a side view showing a detailed configuration of a semiconductor element cooling unit and a stack constituting the first embodiment shown in FIG. 1 and an assembled state thereof.
3 is a front view, a top view, a left side view, and a right side view showing a coupling state of main elements and a mounting state of semiconductor elements constituting the first embodiment shown in FIG. 1. FIG.
FIG. 4 is a front view, a top view, a left side view, and a right side view showing a coupling state of main elements and a mounting state of a semiconductor element constituting a second embodiment of the vehicle power converter according to the present invention.
FIG. 5 is a circuit diagram showing a configuration of a third embodiment of a vehicle power converter according to the present invention.
FIG. 6 is a circuit diagram showing a configuration of a fourth embodiment of a vehicle power converter according to the present invention.
FIG. 7 is a front view, a top view, a left side view, and a right side view showing a coupling state of main elements and a mounting state of a semiconductor element constituting a fifth embodiment of a vehicle power converter according to the present invention.
FIG. 8 is a front view, a top view, a left side view, and a right side view showing a coupling state of main elements and a mounting state of semiconductor elements constituting a sixth embodiment of a vehicle power converter according to the present invention.
FIG. 9 is a circuit diagram showing a configuration of a power converter that is installed under the floor of a railway vehicle and supplies vehicle driving power.
FIGS. 10A and 10B are a side view showing a schematic configuration of a conventional vehicular power converter and a cross-sectional view taken along line BB in FIG.
[Explanation of symbols]
1, 1A, 1B Semiconductor element 2 Phase capacitor 3 Filter capacitor 4 Semiconductor element cooling unit 5 Car body 6 Box 11 Sealed part 12 Semiconductor element cooling frame unit 13 Opening part 20 Stack 21 Boundary plate 23 Cooler heat receiving block 24 Heat pipe 25 Heat radiation Fin 26 Stack connection conductor 31 Electric motor

Claims

In a vehicular power conversion device that has two groups of semiconductor elements each bridge-connected, and is installed under the vehicle floor ,
There are first and second component mounting surfaces in a front-back relationship, and a third component mounting surface that hits a side end surface with respect to these component mounting surfaces. A plurality of cooler heat receiving blocks in which the semiconductor elements for phases are mounted, and the semiconductor elements for one phase of the other group are mounted on the second component mounting surface;
Heat pipes that have base ends joined so as to protrude from the third component mounting surfaces of the plurality of cooler heat receiving blocks, respectively, and transport heat of the cooler heat receiving blocks to the tip portions,
Radiating fins fitted to the heat pipe;
A boundary plate fixed to the base end portion of the heat pipe and having a packing attached to the peripheral edge portion,
Semiconductor element cooling in which an opening for accommodating the heat pipe and dissipating heat from the heat radiating fins and an opening for inserting a plurality of cooler heat receiving blocks on which the semiconductor elements are mounted are formed. The semiconductor element has a frame unit, and the boundary plate is screwed by a screw member in a state where the inner peripheral surface of the packing guide formed at the periphery of the opening of the semiconductor element cooling frame unit is in contact with the outer peripheral surface of the packing A semiconductor element cooling unit attached to the cooling frame unit;
A vehicle power conversion device comprising:

In a vehicular power conversion device that has two groups of semiconductor elements each bridge-connected, and is installed under the vehicle floor ,
There are first and second component mounting surfaces in a front-back relationship, and a third component mounting surface that hits a side end surface with respect to these component mounting surfaces, and either of the first or second component mounting surfaces A plurality of cooler heat receiving blocks in which the semiconductor elements for one phase of one group and the semiconductor elements for one phase of the other group are mounted;
A base pipe joined so as to protrude from the third component mounting surface of the cooler heat receiving block, and a heat pipe for transporting the heat of the cooler heat receiving block to the tip, respectively;
Radiating fins fitted to the heat pipe;
A boundary plate fixed to the base end portion of the heat pipe and having a packing attached to the peripheral edge portion,
Semiconductor element cooling in which an opening for accommodating the heat pipe and dissipating heat from the heat radiating fins and an opening for inserting a plurality of cooler heat receiving blocks on which the semiconductor elements are mounted are formed. The semiconductor element has a frame unit, and the boundary plate is screwed by a screw member in a state where the inner peripheral surface of the packing guide formed at the periphery of the opening of the semiconductor element cooling frame unit is in contact with the outer peripheral surface of the packing A semiconductor element cooling unit attached to the cooling frame unit;
A vehicle power conversion device comprising:

The negative terminal of the semiconductor element of the negative voltage side arm of one group attached to one of the cooler heat receiving blocks is electrically connected to the negative terminal of the semiconductor element of the negative voltage side arm of the other group. The vehicular power converter according to claim 1, wherein the vehicular power converter is connected.

The negative electrode terminal of the semiconductor element of the negative voltage side arm of one group attached to one cooler heat receiving block and the positive terminal of the semiconductor element of the positive voltage side arm of the other group are electrically connected to each other. The vehicular power converter according to claim 1, wherein the vehicular power converter is connected.

A plurality of semiconductor elements bridge-connected to form an inverter circuit, and a semiconductor element that is connected in series with a resistor between the DC side terminals of the inverter circuit to form a chopper circuit, and is installed under the vehicle floor In the vehicular power converter,
There are first and second component mounting surfaces in a front-back relationship, and a third component mounting surface that hits a side end surface with respect to these component mounting surfaces, and the inverter circuit is formed on the first component mounting surface A plurality of cooler heat receiving blocks, wherein the semiconductor elements for one phase are mounted, and the semiconductor elements for forming the chopper circuit are formed on the second component mounting surface;
A base pipe joined so as to protrude from the third component mounting surface of the cooler heat receiving block, and a heat pipe for transporting the heat of the cooler heat receiving block to the tip, respectively;
Radiating fins fitted to the heat pipe;
A boundary plate fixed to the base end portion of the heat pipe and having a packing attached to the peripheral edge portion,
Semiconductor element cooling in which an opening for accommodating the heat pipe and dissipating heat from the heat radiating fins and an opening for inserting a plurality of cooler heat receiving blocks on which the semiconductor elements are mounted are formed. The semiconductor element has a frame unit, and the boundary plate is screwed by a screw member in a state where the inner peripheral surface of the packing guide formed at the periphery of the opening of the semiconductor element cooling frame unit is in contact with the outer peripheral surface of the packing A semiconductor element cooling unit attached to the cooling frame unit;
A vehicle power conversion device comprising:

A plurality of semiconductor elements bridge-connected to form an inverter circuit, and a semiconductor element that is connected in series with a resistor between the DC side terminals of the inverter circuit to form a chopper circuit, and is installed under the vehicle floor In the vehicular power converter,
There are first and second component mounting surfaces in a front-back relationship, and a third component mounting surface that hits a side end surface with respect to these component mounting surfaces, and the inverter on the first or second component mounting surface A plurality of cooler heat receiving blocks on which the semiconductor elements for one phase forming a circuit and the semiconductor elements forming the chopper circuit are mounted;
A base pipe joined so as to protrude from the third component mounting surface of the cooler heat receiving block, and a heat pipe for transporting the heat of the cooler heat receiving block to the tip, respectively;
Radiating fins fitted to the heat pipe;
A boundary plate fixed to the base end portion of the heat pipe and having a packing attached to the peripheral edge portion,
Semiconductor element cooling in which an opening for accommodating the heat pipe and dissipating heat from the heat radiating fins and an opening for inserting a plurality of cooler heat receiving blocks on which the semiconductor elements are mounted are formed. The semiconductor element has a frame unit, and the boundary plate is screwed by a screw member in a state where the inner peripheral surface of the packing guide formed at the periphery of the opening of the semiconductor element cooling frame unit is in contact with the outer peripheral surface of the packing A semiconductor element cooling unit attached to the cooling frame unit;
A vehicle power conversion device comprising:

A plurality of the heat pipes project in parallel for each cooler heat receiving block, and the heat radiation fins are commonly connected to the plurality of heat pipes, and a plurality of the heat pipes are disposed in the longitudinal direction. The vehicle power converter according to any one of claims 1 to 6.