CN101540187B - On-vehicle sound system and heat dissipating method thereof - Google Patents
On-vehicle sound system and heat dissipating method thereof Download PDFInfo
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- CN101540187B CN101540187B CN 200910106844 CN200910106844A CN101540187B CN 101540187 B CN101540187 B CN 101540187B CN 200910106844 CN200910106844 CN 200910106844 CN 200910106844 A CN200910106844 A CN 200910106844A CN 101540187 B CN101540187 B CN 101540187B
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Abstract
The invention provides an on-vehicle sound system and a heat dissipating method thereof, wherein the on-vehicle sound system comprises a power supply unit, a power amplifier unit, a servo unit, a heat dissipating part, semiconductor chilling plates which are respectively arranged among the power supply unit, the power amplifier unit, the servo unit and the heat dissipating part, and a control unit which controls the current of the semiconductor chilling plates; and the semiconductor chilling plates are supplied with power by the power supply unit. The heat dissipating method of the on-vehicle sound system is that the current of the semiconductor chilling plates is controlled according to the use state of the on-vehicle sound system. The on-vehicle sound system and the heat dissipating method thereof adopt the semiconductor chilling plates for heat dissipating, and control the current of the semiconductor chilling plates by the control unit, thus not only improving the heat dissipating efficiency, but also saving the electrical energy.
Description
Technical field
The present invention relates to the car entertainment device, relate in particular to a kind of heat dissipating method of car audio system.
Background technology
Particularly in the face of these rugged surroundings of automobile, temperature rise is violent, is in duty preferably in order to make system, must take effective cooling provision.Existing methods for cooling mostly adopts radiating groove directly to contact with heater element, by the convection current of radiating groove and air heat is taken away, and keeps component temperature in certain limit.The shortcoming that this technology exists is that element directly contacts with radiating groove, adopts the natural convection mode, heat radiation slowly, it is longer that element bears time of high temperature.
A kind of popular style that becomes automobile along with vehicle entertainment system (comprising vehicle-mounted CD, vehicle-carrying DVD, in-car TV etc.) disposes, and vehicle audio has also obtained using widely.The major function of the power amplifier that comprises in the vehicle audio is the sound signal realization enlarging function to vehicle entertainment system, satisfies passenger's amusement audiovisual demand.Power unit in the car audio system, power amplifier part and servo driving partly are main heater elements, need to adopt effective cooling provision that these heater elements are lowered the temperature, guarantee that it is operated under the normal temperature, especially when vehicle interior temperature is higher, must lower the temperature efficiently rapidly to these heater elements, avoid its temperature too high and damage, especially the thermal value of power amplifier part is bigger, and heat radiation becomes the problem that must solve.Yet, the mode that existing cooling measure mostly adopts radiating groove and power amplifier directly to contact, heat is taken away in natural convection by radiating groove and air, keep the power amplifier temperature in certain limit, this natural convection mode causes the radiating efficiency of existing car audio system very slow, and it is longer that especially power amplifier partly bears time of high temperature.And, when the user constantly transfers big volume, the input audio signal of power amplifier part becomes big, the heating of power amplifier also increases thereupon, if untimely in this case increasing specific heat load and efficient are easy to cause the power amplifier temperature rise, influence the working temperature of car audio system, serious also can cause the damage of car audio system, even burns out perils such as electronic component, initiation fire.Therefore, must take effective cooling provision to guarantee the normal working temperature of car audio system, and the behaviour in service that can may change at any time at the user adjust to the specific heat load of sound system.
Summary of the invention
The purpose of this invention is to provide a kind of car audio system and heat dissipating method thereof, be intended to solve the lower defective of radiating efficiency that exists in the existing car audio system.
Car audio system provided by the invention comprises power supply unit, power amplifier unit, servo unit, thermal component, be separately positioned on the semiconductor chilling plate between power supply unit, power amplifier unit, servo unit and the thermal component, and the control module that the electric current of semiconductor chilling plate is controlled, described semiconductor chilling plate is powered by power supply unit, described power supply unit comprises primary power unit and digital power unit, and described control module control figure power supply unit is to the power supply output current size of the semiconductor chilling plate of power amplifier unit; Described control module control primary power unit is to the current switching of the semiconductor chilling plate of servo unit.
Further, described thermal component comprises base and a plurality of radiating fins that are arranged on the base, and the surface of radiating fin forms the outside surface raceway groove of high-termal conductivity, and described base is close in the hot junction of semiconductor chilling plate.
Further, between described power supply unit and the corresponding semiconductor chilling plate heat-conductive bridges is set and carries out heat conduction.
The heat dissipating method of car audio system provided by the invention may further comprise the steps: the user mode according to car audio system is controlled the electric current of semiconductor chilling plate, wherein, the Current Control of semiconductor chilling plate is comprised to the Current Control of the semiconductor chilling plate of power amplifier unit with to the Current Control of the semiconductor chilling plate of servo unit, the Current Control of the semiconductor chilling plate of power amplifier unit further be may further comprise the steps:
Step a1, the current volume that detects car audio system changes;
Step a2 if volume increases, then increases the electric current of the semiconductor chilling plate of power amplifier unit; If volume reduces, then reduce the electric current of the semiconductor chilling plate of power amplifier unit.
Current Control to the semiconductor chilling plate of servo unit further may further comprise the steps:
Step b1 judges whether servo unit works;
Step b2 is if servo unit is worked the electric current of the semiconductor chilling plate of conducting servo unit then; If servo unit is not worked, then cut off the electric current of the semiconductor chilling plate of servo unit.
Further, described heat dissipating method further may further comprise the steps: the input power supply status according to car audio system is controlled the electric current of the semiconductor chilling plate of power supply unit.
Car audio system provided by the invention and heat dissipating method thereof adopt semiconductor chilling plate to dispel the heat, and the electric current by control module control semiconductor chilling plate, not only improved radiating efficiency, the advantage that also has saves energy, especially heightening volume the user causes under the situation that the power amplifier unit thermal value increases, can strengthen specific heat load, rapidly heat radiation.
Description of drawings
Fig. 1 is the structural representation of car audio system of the present invention;
Fig. 2 is the surface micro-structure synoptic diagram of radiating fin involved in the present invention;
Fig. 3 is the power supply control synoptic diagram of car audio system of the present invention;
Fig. 4 is the synoptic diagram of the heat dissipating method of car audio system of the present invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Referring to shown in Figure 1, the car audio system that preferred embodiment of the present invention provides comprises mainboard 8, and be fixed on power supply unit 1 on the mainboard 8, power amplifier unit 2, servo unit 3, radio reception unit 4, control module 5 (MCU, microprocessor), show and push-button unit 6, bluetooth communication 7, be provided with around the mainboard 8 and enclose frame 9, power supply unit 1, power amplifier unit 2 and servo unit 3 (CD servo module or DVD servo module etc.) are the unit that emphasis need cool off, therefore present embodiment dispels the heat to these three unit respectively by three semiconductor chilling plates, and temperature can be not too high when guaranteeing its work.Semiconductor chilling plate comprises that cold junction, hot junction and galvanic couple are to (being formed by N-type semiconductor material and the connection of P-type semiconductor material), it realizes the heat conduction function by suitable operating voltage, realization, is not given unnecessary details at this because the principle of work of semiconductor chilling plate is a known technology the heat radiation of thermal source.
Concrete, the cold junction of semiconductor chilling plate 13 is close to (the IC surface of contact that for example is adjacent to power supply unit 1) after coating heat-conducting glue with power supply unit 1, and the base 170 that heat-conducting glue is close to thermal component 17 is afterwards coated in the hot junction of semiconductor chilling plate 13, be provided with a plurality of parallel radiating fins 171 on the base 170 of thermal component 17, in the present embodiment, the surface of each radiating fin 171 forms some outside surface raceway grooves (shown in Fig. 2) with high thermal conduction characteristic of the certain width and the degree of depth, and employing round-corner transition, further improve radiating efficiency, then with set bolt fixedly thermal component 17 and power supply unit 1 protect frame 16, adjust the bolt degree of tightness, so that clamp power supply unit 1 and semiconductor chilling plate 13.
Same, the cold junction of semiconductor chilling plate 12 is close to power amplifier unit 2 after coating heat-conducting glue, the hot junction of semiconductor chilling plate 12 is close to the base of thermal component 10 after coating heat-conducting glue, and the structure of thermal component 10 is identical with the structure and the working method of thermal component 17, does not give unnecessary details at this.Then, with set bolt fixedly thermal component 10 and power amplifier unit 2 protect frame 15, adjust the bolt degree of tightness, so that clamp power amplifier unit 2 and semiconductor chilling plate 12.
In this preferred embodiment, heat radiation to servo unit 3 realizes by heat-conductive bridges 11, one end of heat-conductive bridges 11 is close to (surface of for example being close to the drive IC of servo unit 3) with the servo unit 3 that scribbles heat-conducting glue, and push down the end that heat-conductive bridges 11 and drive IC touch with card article 18, adopt screw that card article 18 is fixed on the mainboard 8, heat-conductive bridges 11 other ends are close to the cold junction that scribbles the semiconductor chilling plate 14 of heat-conducting glue, the hot junction that scribbles the semiconductor chilling plate 14 of heat-conducting glue then is close to radiating groove 17, adopt screw to run through radiating groove 17 then, enclose frame 9 and heat-conductive bridges 11, with radiating groove 17, enclose frame 9, heat-conductive bridges 11 and semiconductor chilling plate 14 fix to clamp.
Like this, realized heat radiation by 10,17 and three semiconductor chilling plates 12,13,14 of two thermal components to power amplifier unit 2, power supply unit 1 and servo unit 3.In addition, shown in Fig. 3, car audio system provided by the invention can also change the power supply output state of power supply unit 1 by control control module 5 control power supply units 1 according to the user mode of car audio system.Concrete, power supply unit 1 comprises primary power unit 110 and digital power unit 111, wherein 110 pairs of various elements in primary power unit (comprise and showing and push-button unit 6, semiconductor chilling plate 13, radio reception unit 4, semiconductor chilling plate 14) are powered, its output break-make is controlled by GPIO (general input/output port) interface by control module 5, simultaneously, control module 5 also passes through the power supply output current size of 111 pairs of semiconductor chilling plates 12 of digital interface control figure power supply unit.Concrete, when the user regulates volume output, the size that control module 5 is provided with according to user's volume, by the power supply output size of digital power unit 111 in the digital interface control power supply unit 1, take this to regulate the radiating efficiency of semiconductor chilling plate 12, for example, when the user transfers big volume, the thermal value of power amplifier unit 2 increases, and the bigger electric current of control module 5 control figure power supply units, 111 outputs strengthens specific heat load; Turn volume down and work as the user, the thermal value of power amplifier unit 2 reduces thereupon, therefore can diminish by the power supply output of control module 5 control figure power supply units 111, to reduce power consumption.Simultaneously, when servo unit 3 work, control module 5 is powered to semiconductor chilling plate 14 and servo unit 3 by GPIO control primary power unit 110, when servo unit 3 quits work, the corresponding GPIO interface of control module 5 controls stops semiconductor chilling plate 12 power supplies.
In conjunction with referring to shown in Fig. 4, the heat dissipating method of car audio system provided by the invention is according to the user mode of car audio system the electric current of semiconductor chilling plate to be controlled, and takes this to realize the intelligence refrigeration control to car audio system.Specific to preferred embodiment, comprise at the Current Control of the semiconductor chilling plate 12 of power amplifier unit 2 with at the Current Control of the semiconductor chilling plate 14 of servo unit 3 at the Current Control of semiconductor chilling plate, Current Control at the semiconductor chilling plate 12 of power amplifier unit 2 may further comprise the steps: detect current volume and change in step 41, volume change may be adjusted by the user and cause, also may be that entertainment systems changes self reason such as platform and causes.If volume increases (thermal value of power amplifier unit 2 also increases), then execution in step 42, by control module 5 control figure power supply units 111, increase the electric current of the semiconductor chilling plate 12 of power amplifier unit 2, the refrigeration intensity of semiconductor chilling plate 12 increases like this, makes power amplifier unit 2 to be dispelled the heat more rapidly; If current volume reduces (thermal value of power amplifier unit 2 also reduces), then execution in step 43, by control module 5 control figure power supply units 111, reduce the electric current of the semiconductor chilling plate 12 of power amplifier unit 2, the refrigeration intensity of semiconductor chilling plate 12 also reduces thereupon like this, can energy savings, in onboard system, electric energy storage is more limited, and not only environmental protection of the saving of the energy can also strengthen the flying power of car audio system.
Similarly, Current Control at the semiconductor chilling plate 14 of servo unit 3 may further comprise the steps, judge in step 44 whether servo unit 3 works, if servo unit 3 is being worked, then the electric current of the semiconductor chilling plate 14 of conducting servo unit 3 in step 46 makes it to carry out normal heat loss through conduction; If servo unit 3 is not worked, then in step 45, cut off the electric current of the semiconductor chilling plate 14 of servo unit 3, saves energy.
The above only is preferred embodiment of the present invention, in order to restriction the present invention, does not for example not necessarily comprise bluetooth communication 7 in the car audio system, and bluetooth communication 7 can dispose according to actual conditions; In addition, in the heat dissipating method of above-mentioned car audio system and not mentioned special heat dissipating method at power supply unit 1, in fact also can be according to said method, input power supply status according to power supply unit 1 is adjusted the specific heat load of power supply unit 1, and the specific heat load of servo unit 3 also can carry out the adjustment of size of current according to the kind (CD or DVD) of the servo module that it adopted.All any modifications of being done within the spirit and principles in the present invention, be equal to and replace and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a car audio system comprises power supply unit, power amplifier unit, servo unit and thermal component, it is characterized in that further comprising:
Be separately positioned on the semiconductor chilling plate between power supply unit, power amplifier unit, servo unit and the thermal component, described semiconductor chilling plate is powered by power supply unit; And
The control module that the electric current of each semiconductor chilling plate is controlled;
Described power supply unit comprises primary power unit and digital power unit, and described control module control figure power supply unit is to the power supply output current size of the semiconductor chilling plate of power amplifier unit;
Described control module control primary power unit is to the current switching of the semiconductor chilling plate of servo unit.
2. car audio system according to claim 1, it is characterized in that, described thermal component comprises base and a plurality of radiating fins that are arranged on the base, and the surface of radiating fin forms the outside surface raceway groove of high-termal conductivity, and described base is close in the hot junction of semiconductor chilling plate.
3. car audio system according to claim 1 is characterized in that, between described power supply unit and the corresponding semiconductor chilling plate heat-conductive bridges is set and carries out heat conduction.
4. the heat dissipating method of car audio system according to claim 1, it is characterized in that may further comprise the steps: the user mode according to car audio system is controlled the electric current of semiconductor chilling plate, wherein, the Current Control of semiconductor chilling plate is comprised to the Current Control of the semiconductor chilling plate of power amplifier unit with to the Current Control of the semiconductor chilling plate of servo unit, the Current Control of the semiconductor chilling plate of power amplifier unit further be may further comprise the steps:
Step a1, the current volume that detects car audio system changes;
Step a2 if volume increases, then increases the electric current of the semiconductor chilling plate of power amplifier unit; If volume reduces, then reduce the electric current of the semiconductor chilling plate of power amplifier unit.
Current Control to the semiconductor chilling plate of servo unit further may further comprise the steps:
Step b1 judges whether servo unit works;
Step b2 is if servo unit is worked the electric current of the semiconductor chilling plate of conducting servo unit then; If servo unit is not worked, then cut off the electric current of the semiconductor chilling plate of servo unit.
5. the heat dissipating method of car audio system according to claim 4 is characterized in that, described heat dissipating method further may further comprise the steps: the input power supply status according to car audio system is controlled the electric current of the semiconductor chilling plate of power supply unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910106844 CN101540187B (en) | 2009-04-22 | 2009-04-22 | On-vehicle sound system and heat dissipating method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910106844 CN101540187B (en) | 2009-04-22 | 2009-04-22 | On-vehicle sound system and heat dissipating method thereof |
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| Publication Number | Publication Date |
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| CN101540187A CN101540187A (en) | 2009-09-23 |
| CN101540187B true CN101540187B (en) | 2011-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910106844 Expired - Fee Related CN101540187B (en) | 2009-04-22 | 2009-04-22 | On-vehicle sound system and heat dissipating method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102420001B (en) * | 2010-10-21 | 2014-04-09 | 延锋伟世通汽车电子有限公司 | Heat dissipation module of compact disc read-only memory driver core in auto sound |
| CN106602967B (en) * | 2017-01-05 | 2023-11-14 | 四川埃姆克伺服科技有限公司 | Integrated motor drive unit structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273299A (en) * | 2002-03-13 | 2003-09-26 | Toshiba Corp | Semiconductor cooling device for vehicle |
| CN201039647Y (en) * | 2007-04-04 | 2008-03-19 | 杭州先行铁路工贸有限公司 | Constant temperature cabinet |
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2009
- 2009-04-22 CN CN 200910106844 patent/CN101540187B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273299A (en) * | 2002-03-13 | 2003-09-26 | Toshiba Corp | Semiconductor cooling device for vehicle |
| CN201039647Y (en) * | 2007-04-04 | 2008-03-19 | 杭州先行铁路工贸有限公司 | Constant temperature cabinet |
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| CN101540187A (en) | 2009-09-23 |
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Granted publication date: 20110608 Termination date: 20120422 |