JPH071829Y2 - Self-cooled inverter device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to the structure of a self-cooling type inverter device.

[Conventional technology]

Generally, a self-cooling type inverter device is shown in FIGS. 6 (a) and 6 (b).
As shown in FIG. 3, heat dissipation fins 2a and 2b are provided on the back surface to dissipate the heat loss of the semiconductor 1.

The structure of the mounting legs of this inverter device is shown in FIG. 6 (a).
As shown in FIG. 6, a method of providing the mounting leg 2a 'on the heat dissipation fin 2a, and as shown in FIG. 6 (b), the tip of the heat dissipation fin 2b.
Mounting legs 4a, 4b are provided by bending the left and right side covers 15a, 15b into an L-shape at a position substantially flush with 2b 'or more.

When using such a self-cooling type inverter device in a fully closed box, the heat dissipation fins 2a, 2b are stored inside the fully closed box, and due to the heat loss of the semiconductor emitted from the inverter device, the inside of the fully closed box Will become overheated and the capacity and life of the inverter device will decrease. Therefore, as shown in Fig. 7, by installing heat exchangers 8a, 8b, 8c such as heat dissipation fins around the fully closed box 5, A method of dissipating the heat inside the box to the outside is used.

[Problems to be solved by the device]

However, when the conventional self-cooling type inverter device 6 is housed in the fully closed box 5, the heat released from the heat radiation fins 2a, 2b of the self cooling type inverter device 6 uses the air inside the fully closed box 5 as a medium. Since the heat exchangers 8a, 8b, 8c such as heat radiation fins provided around the fully closed box 5 are indirectly radiated to the outside, the cooling efficiency is low and the heat generated by the heat radiation fins around the fully closed box 5 is reduced. Since it is necessary to mount a large number of exchangers 8a, 8b, 8c, the structure of the totally closed box 5 is complicated, the size is large, and the manufacturing cost is high. Also in FIGS. 7 (a) and 7 (b),
Since the attachment to the box is limited to the attachment holes 9 and 9a of the heat radiation fins 2a and 2b, it cannot be attached anywhere.

The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide a self-cooling type inverter device which is not limited to the shape of the box and is not limited to the mounting hole of the heat radiation fin. .

[Means for Solving the Problems]

That is, as shown in FIGS. 2 (a), (b), and FIG. 3, the means for achieving the purpose is to mount the self-cooling inverter device 11 on the mounting surface 14a of the self-cooling inverter device 11 when it is stored in a general box 20. , 14b
Is the same surface as the tip 12a of the heat dissipation fin 12 or the mounting surface 14a, 1
The mounting legs 13a, 13b having an L-shaped cross section are mounted on the left and right side covers 15a, 15b of the self-cooling inverter device 11 so that the 4b is located above the tip 12a of the heat dissipation fin 12, and the box 20
It is stored via the internal beam 7 and the like.

When housing in the fully closed box 10, the mounting legs 14a and 14b should be on the same plane as the base 12b of the heat dissipation fin 12 so that the mounting legs 13
Move a and 13b to the left and right sides of the self-cooling inverter unit 11 to attach them, and install the holes 16 so that the heat dissipation fins 12 protrude from the holes 16 formed on the back of the fully closed box 10. It is a self-cooling type inverter device which is structured to be attached via packing 17 around the.

[Action]

As shown in FIG. 2A, when the self-cooling type inverter device 11 is housed in the fully closed box 10 and used,
By mounting the mounting surfaces 14a and 14b with the base portion 12b of the heat radiating fin 12 almost flush with the packing 7, the heat radiating fin 12 of the self-cooling type inverter device 11 becomes the outside of the totally closed box 10 and therefore the semiconductor 1 The heat loss is efficiently dissipated directly from the heat dissipation fin 12 to the outside of the totally closed box 10.

An embodiment of the present invention will be described below with reference to the drawings.

〔Example〕

1 (a) and 1 (b) show an embodiment of the present invention.
Figure (a) is a perspective view of storing in a general box, Figure 1 (b) is a perspective view of storing in a fully closed box, and Figure 2 (a) is Figure 1 (a).
FIG. 2 (b) is a horizontal sectional view of FIG. 1 (b), and FIG. 3 is a partially enlarged view of the mounting leg portion of FIG. 2 (b).

1 (a), (b), 2 (a), (b), and FIG. 3, covers for the left and right side surfaces of the self-cooling inverter device 11.
A row of tap holes 21 is provided in the vertical direction of 15a, 15b, and tap holes 21 are provided for L metal fittings, that is, mounting legs 13a, 13b having an L-shaped cross section.
Self-cooling inverter device 1 with tightening holes 22a and 22b with the same pitch as
Two rows are provided on the coupling surfaces 18a and 18b with which 1 is joined. Then, as shown in FIGS. 1 (a) and 2 (a), the mounting leg 13a is fixed by fixing it to the self-cooling type inverter device 11 with a screw 23 or the like using the front side tightening hole 22b. , 13b mounting surface 14a, 1
4b is housed in a general box 20 on the same plane as the tip 12a of the heat dissipation fin 12 or as a projecting position. Further, as shown in FIG. 1 (b) and FIG. 2 (b), the mounting legs 13a, 13b are mounted by fixing them with screws 23 etc. using the tightening holes 22a on the mounting surfaces 14a, 14b side. The surfaces 14a and 14b are housed in the totally closed box 10 as substantially the same surface as the base portion 12b of the heat dissipation fin 12.

4 (a) and 4 (b) show the tightening holes 22 of the mounting legs 13a and 14a.
It is a perspective view which shows the modification of this invention which made the pair of a and 22b the front-back direction a long hole 24, and FIG. 5 (a), (b) shows the tap holes 21a in two rows in the covers 15a and 15b on the right and left sides. FIG. 11 is a perspective view showing a modified example in which 21b are provided.

In the device having such a configuration, the heat dissipation efficiency of the heat dissipation fin 12 is improved as compared with the conventional one. Moreover, the L metal fittings are not limited to the mounting holes of the heat dissipation fin.

[Effect of device]

As described above, according to the present invention, when the self-cooling type inverter device is housed in the fully closed box, the heat loss of the semiconductor of the inverter device is directly radiated to the outside of the fully closed box from the heat dissipation fin on the back of the inverter device. Therefore, the cooling efficiency is high, a heat exchanger using a heat dissipation fin or a heat pipe is not required around the fully closed box, the structure of the fully closed box is simple and the size is small, and the manufacturing cost is low.

[Brief description of drawings]

1 (a), (b), 2 (a), (b) and 3 show a self-cooling type inverter device according to the present invention, and Fig. 1 (a) is stored in a general box. In this case, FIG. 1 (b) is a perspective view when the product is stored in a fully closed box, FIG. 2 (a) is a horizontal sectional view of FIG. 1 (a), and FIG. 2 (b) is FIG. 1 (b). ) Is a horizontal sectional view, and FIG. 3 is a partially enlarged view showing the mounting leg portion of FIG. 1 (b). 4 (a), (b), FIG. 5 (a), and (b) show a modification of another self-cooling type inverter device according to the present invention, and FIG. 4 (a), FIG. FIG. 4 (b) and FIG. 5 (b) are a perspective view of the case where a) is stored in a fully closed box, and FIG. 6 (a) and 6 (b) are perspective views showing an example of a conventional self-cooling type inverter device, and FIG. 7 is a perspective view showing an example of storing a fully closed box of a conventional self-cooling type inverter device. 1 ... Semiconductor, 2,2a, 2b, 12 ... Radiation fins, 2a ', 4a, 4
b, 13a, 13b, 13c, 13d, 13e, 13f …… Mounting legs, 5,10 …… Fully closed box, 6,11,11 ′ …… Self-cooling inverter device, 7,7a, 7b ……
Beam, 8a, 8b, 8c …… Heat exchanger, 9, 9a, 19, 19a, 19b ……
Mounting hole, 2b ', 12a ...... Radiation fin tip, 12b ... Radiation fin base, 14a, 14b, 14c, 14d, 14e, 14f …… Mounting surface, 1
5a, 15b, 15c, 15d …… side cover, 16 …… hole, 17 …… packing, 18a, 18b, 18c, 18d, 18e, 18f …… connecting surface, 20 ……
Box, 21,21a, 21b …… Tap hole, 22,22a, 22b …… Tightening hole,
23 …… screw, 24 …… oblong hole.

Claims (1)

[Scope of utility model registration request] 1. A self-cooling type inverter device having a heat radiation fin on the rear surface thereof, wherein the L metal fitting is provided so that the tip of the heat radiation fin projects from the box surface or is flush with the base portion of the heat radiation fin. A self-cooling inverter device characterized by being attached to both sides of a cold inverter.