JPS61203596U - - Google Patents

Info

Publication number
JPS61203596U
JPS61203596U JP8693585U JP8693585U JPS61203596U JP S61203596 U JPS61203596 U JP S61203596U JP 8693585 U JP8693585 U JP 8693585U JP 8693585 U JP8693585 U JP 8693585U JP S61203596 U JPS61203596 U JP S61203596U
Authority
JP
Japan
Prior art keywords
electronic device
high heat
housing cover
generating unit
close contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8693585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8693585U priority Critical patent/JPS61203596U/ja
Publication of JPS61203596U publication Critical patent/JPS61203596U/ja
Pending legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例を示す電子機器の概略
構成図、第2図は従来の実施例を示す電子機器の
概略構成図である。 1……筐体ケース、4……高発熱ユニツト、5
……筐体カバー、9……熱伝導プレート。
FIG. 1 is a schematic configuration diagram of an electronic device showing an embodiment of the present invention, and FIG. 2 is a schematic configuration diagram of an electronic device showing a conventional embodiment. 1...Housing case, 4...High heat generation unit, 5
...Housing cover, 9...Heat conduction plate.

Claims (1)

【実用新案登録請求の範囲】 高熱を発する高発熱ユニツトを備えた電子機器
において、 前記電子機器の筐体カバー内側に熱伝導性プレ
ートを密着させて設け、 この熱伝導性プレートが高発熱ユニツト上方部
では筐体カバーと密着しない構成としたことを特
徴とする電子機器の放熱構造。
[Scope of Claim for Utility Model Registration] In an electronic device equipped with a high heat generating unit that generates high heat, a thermally conductive plate is provided in close contact with the inside of the housing cover of the electronic device, and this thermally conductive plate is placed above the high heat generating unit. A heat dissipation structure for an electronic device characterized by having a structure that does not come into close contact with a housing cover.
JP8693585U 1985-06-11 1985-06-11 Pending JPS61203596U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8693585U JPS61203596U (en) 1985-06-11 1985-06-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8693585U JPS61203596U (en) 1985-06-11 1985-06-11

Publications (1)

Publication Number Publication Date
JPS61203596U true JPS61203596U (en) 1986-12-22

Family

ID=30638693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8693585U Pending JPS61203596U (en) 1985-06-11 1985-06-11

Country Status (1)

Country Link
JP (1) JPS61203596U (en)

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