JPS58153496U - Heat dissipation device in electronic equipment - Google Patents
Heat dissipation device in electronic equipmentInfo
- Publication number
- JPS58153496U JPS58153496U JP5014182U JP5014182U JPS58153496U JP S58153496 U JPS58153496 U JP S58153496U JP 5014182 U JP5014182 U JP 5014182U JP 5014182 U JP5014182 U JP 5014182U JP S58153496 U JPS58153496 U JP S58153496U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation device
- electronic equipment
- case
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はパワーアンプの斜視図、第2図は第1図の1部
除去した側断面図、第3図は第1図の正面断面図である
。
2・・・下部ケース、3・・・上部ケース、4. 8.
8・・・切り起し部、5・・・放熱板、6. 6.
6. 7. 7゜7・・・透孔、9,9・・・空気導入
孔、10. 10゜10.10・・・空気導出孔、11
・・・発熱体。1 is a perspective view of the power amplifier, FIG. 2 is a side sectional view with a portion of FIG. 1 removed, and FIG. 3 is a front sectional view of FIG. 1. 2...Lower case, 3...Upper case, 4. 8.
8... Cut-and-raised portion, 5... Heat sink, 6. 6.
6. 7. 7゜7...Through hole, 9,9...Air introduction hole, 10. 10゜10.10...Air outlet hole, 11
...heating element.
Claims (1)
、あるいは空気導出孔が形成された切り起しを設け、該
切り起しにパワートランジスタ等の発熱体を装着した電
子機器に於ける放熱装置に於いて、放熱板とケースの当
接部に複数個の透孔を設けると共に、前記放熱板に設け
られた透孔が前記ケースに設けられた透孔より大きくか
つ包含するよう構成されたことを特徴とする電子機器に
於ける放熱装置。In a heat dissipation device for an electronic device in which a cutout with an air inlet hole or an air outlet hole is provided in the lower case or upper case of the electronic device, and a heating element such as a power transistor is attached to the cutout. A plurality of through holes are provided in the abutting portion of the heat sink and the case, and the through hole provided in the heat sink is configured to be larger than and encompass the through hole provided in the case. Heat dissipation device for electronic equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5014182U JPS58153496U (en) | 1982-04-06 | 1982-04-06 | Heat dissipation device in electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5014182U JPS58153496U (en) | 1982-04-06 | 1982-04-06 | Heat dissipation device in electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58153496U true JPS58153496U (en) | 1983-10-14 |
Family
ID=30060948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5014182U Pending JPS58153496U (en) | 1982-04-06 | 1982-04-06 | Heat dissipation device in electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58153496U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002305392A (en) * | 2001-04-06 | 2002-10-18 | Sony Corp | Radiating device and electronic apparatus with radiating device |
-
1982
- 1982-04-06 JP JP5014182U patent/JPS58153496U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002305392A (en) * | 2001-04-06 | 2002-10-18 | Sony Corp | Radiating device and electronic apparatus with radiating device |
JP4506023B2 (en) * | 2001-04-06 | 2010-07-21 | ソニー株式会社 | Heat dissipation device and electronic device having heat dissipation device |
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