JPH042050U - - Google Patents

Info

Publication number
JPH042050U
JPH042050U JP4243290U JP4243290U JPH042050U JP H042050 U JPH042050 U JP H042050U JP 4243290 U JP4243290 U JP 4243290U JP 4243290 U JP4243290 U JP 4243290U JP H042050 U JPH042050 U JP H042050U
Authority
JP
Japan
Prior art keywords
heat
generating component
cooling air
heat generating
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4243290U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4243290U priority Critical patent/JPH042050U/ja
Publication of JPH042050U publication Critical patent/JPH042050U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第3図は本考案の電子機器の冷却
構造の一実施例を説明する図で、第1図はカバー
を取外した状態を示す電子機器の斜視図、第2図
はカバーを取外した状態を示す電子機器の正面図
、第3図はカバーを示す斜視図である。 1……パワーIC(発熱部品)、2,3,4…
…ヒートシンク、6……冷却風通路、7……フア
ン。
Figures 1 to 3 are diagrams illustrating an embodiment of the cooling structure for an electronic device according to the present invention. Figure 1 is a perspective view of the electronic device with the cover removed, and Figure 2 is a perspective view of the electronic device with the cover removed. FIG. 3 is a front view of the electronic device showing the electronic device in a closed state, and FIG. 3 is a perspective view showing the cover. 1...Power IC (heat generating component), 2, 3, 4...
...Heat sink, 6...Cooling air passage, 7...Fan.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 熱を発する発熱部品が内蔵される電子機器の冷
却構造において、上記発熱部品が取付けられ、該
発熱部品から発せられる熱を吸収する一対のヒー
トシンクと、これらのヒートシンクにより側壁の
少なくとも一部が形成され、一端が外部に開放さ
れる冷却風通路と、この冷却風通路の他端より外
部からの冷却風を送り込む1つのフアンとを有す
ることを特徴とする電子機器の冷却構造。
In a cooling structure for an electronic device having a built-in heat generating component that generates heat, the heat generating component is attached, a pair of heat sinks absorbing heat emitted from the heat generating component, and at least a part of a side wall is formed by these heat sinks. 1. A cooling structure for electronic equipment, comprising a cooling air passage whose one end is open to the outside, and one fan that sends cooling air from the outside from the other end of the cooling air passage.
JP4243290U 1990-04-23 1990-04-23 Pending JPH042050U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4243290U JPH042050U (en) 1990-04-23 1990-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4243290U JPH042050U (en) 1990-04-23 1990-04-23

Publications (1)

Publication Number Publication Date
JPH042050U true JPH042050U (en) 1992-01-09

Family

ID=31553974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4243290U Pending JPH042050U (en) 1990-04-23 1990-04-23

Country Status (1)

Country Link
JP (1) JPH042050U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008029636A1 (en) * 2006-09-04 2008-03-13 Kabushiki Kaisha Yaskawa Denki Motor control device
KR100867916B1 (en) * 2006-04-19 2008-11-10 가부시키가이샤 도요다 지도숏키 Power supply
JP2015216155A (en) * 2014-05-08 2015-12-03 株式会社三社電機製作所 Electronic apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118656A (en) * 1981-01-16 1982-07-23 Nec Corp Mounting structure of large scale integrated circuit (lsi)

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118656A (en) * 1981-01-16 1982-07-23 Nec Corp Mounting structure of large scale integrated circuit (lsi)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100867916B1 (en) * 2006-04-19 2008-11-10 가부시키가이샤 도요다 지도숏키 Power supply
WO2008029636A1 (en) * 2006-09-04 2008-03-13 Kabushiki Kaisha Yaskawa Denki Motor control device
US7898806B2 (en) 2006-09-04 2011-03-01 Kabushiki Kaisha Yaskawa Denki Motor controller
JP2015216155A (en) * 2014-05-08 2015-12-03 株式会社三社電機製作所 Electronic apparatus

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