JPH0440590U - - Google Patents
Info
- Publication number
- JPH0440590U JPH0440590U JP8114890U JP8114890U JPH0440590U JP H0440590 U JPH0440590 U JP H0440590U JP 8114890 U JP8114890 U JP 8114890U JP 8114890 U JP8114890 U JP 8114890U JP H0440590 U JPH0440590 U JP H0440590U
- Authority
- JP
- Japan
- Prior art keywords
- partition plate
- semiconductor stack
- semiconductor device
- box body
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000005192 partition Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims 1
- 238000009423 ventilation Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は、本考案の半導体装置の一実施例を示
す右側面図、第2図は本考案の半導体装置の他の
実施例を示す右側面図、第3図は本考案の半導体
装置の異なる他の実施例を示す右側面図、第4図
は、従来の半導体装置を示す右側面図である。
1……箱体、2……変圧器、3……半導体スタ
ツク、4……ヒートシンク、5……フアン、6…
…正面扉、6a……吸気口、7a……排気口、8
……仕切板。
1 is a right side view showing one embodiment of the semiconductor device of the present invention, FIG. 2 is a right side view showing another embodiment of the semiconductor device of the present invention, and FIG. 3 is a right side view of the semiconductor device of the present invention. A right side view showing another different embodiment, FIG. 4 is a right side view showing a conventional semiconductor device. 1...Box body, 2...Transformer, 3...Semiconductor stack, 4...Heat sink, 5...Fan, 6...
...Front door, 6a...Intake port, 7a...Exhaust port, 8
...Partition board.
Claims (1)
箱体内を前後に仕切る仕切板の上部前面に、この
仕切板の後方にヒートシンクを突き出して半導体
スタツクが取付けられ、前記仕切板の後部床面に
電気機器が収納された半導体装置において、前記
半導体スタツクの上方の前記仕切板に冷却フアン
を設けたことを特徴とする半導体装置。 A ventilation hole is provided at the lower part of the front and rear surfaces of the box body, and a semiconductor stack is attached to the upper front surface of a partition plate that partitions the inside of the box body into front and back parts, with a heat sink protruding from the rear of this partition plate, and a semiconductor stack is attached to the rear floor of the partition plate. 1. A semiconductor device in which electrical equipment is housed on a surface of the semiconductor device, characterized in that a cooling fan is provided on the partition plate above the semiconductor stack.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8114890U JPH0440590U (en) | 1990-08-01 | 1990-08-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8114890U JPH0440590U (en) | 1990-08-01 | 1990-08-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0440590U true JPH0440590U (en) | 1992-04-07 |
Family
ID=31626829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8114890U Pending JPH0440590U (en) | 1990-08-01 | 1990-08-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0440590U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010129629A (en) * | 2008-11-26 | 2010-06-10 | Panasonic Corp | Heat generating element housing apparatus |
JP2013065913A (en) * | 2013-01-18 | 2013-04-11 | Panasonic Corp | Heating element housing device |
JP2013143809A (en) * | 2012-01-10 | 2013-07-22 | Shindengen Electric Mfg Co Ltd | Power conditioner device and photovoltaic power generation system |
-
1990
- 1990-08-01 JP JP8114890U patent/JPH0440590U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010129629A (en) * | 2008-11-26 | 2010-06-10 | Panasonic Corp | Heat generating element housing apparatus |
JP2013143809A (en) * | 2012-01-10 | 2013-07-22 | Shindengen Electric Mfg Co Ltd | Power conditioner device and photovoltaic power generation system |
JP2013065913A (en) * | 2013-01-18 | 2013-04-11 | Panasonic Corp | Heating element housing device |
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