JPH0173993U - - Google Patents

Description

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of this invention, FIG. 2 is a sectional view of FIG. 1, and FIG. 3 is a sectional view showing a conventional structure. 1 is a printed circuit board, 2 is an LSI, 3 is a heat sink,
4 is a ventilation duct, 5 is a blowout port, 6 is a ventilation port, 7 is an exhaust duct, and 8 is a return port. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims for Utility Model Registration] (1) In a cooling device for electronic equipment that uses forced air cooling as the main cooling means, if there are multiple objects to be cooled, a cooling device is provided for each of the multiple objects, a spout for spouting cooling air;
An annular opening is formed surrounding the jet nozzle, and a return port is configured so that air that is spouted from the jet nozzle and whose flow direction is changed to the opposite direction when it hits a corresponding object flows therein. A cooling device for electronic equipment characterized by: (2) The surface of the object to be cooled facing the corresponding jet nozzle has a convex part on the part facing the center of the jet nozzle and a part facing near the outer periphery of the annular return port, and a concave part in the middle part. A smooth curved surface is formed from the central convex part through the concave part to the convex part near the outer periphery, and the air that hits the central convex part reverses direction due to the curved surface and is suitable for returning to the return port. A cooling device for an electronic device according to claim 1, characterized in that the cooling device is configured in a shape that is similar to the above.