JPH01113394U - - Google Patents
Info
- Publication number
- JPH01113394U JPH01113394U JP801888U JP801888U JPH01113394U JP H01113394 U JPH01113394 U JP H01113394U JP 801888 U JP801888 U JP 801888U JP 801888 U JP801888 U JP 801888U JP H01113394 U JPH01113394 U JP H01113394U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- ventilation
- circuit board
- dummy
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009423 ventilation Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の原理説明図、第２図は本考案
による一実施例の説明図で、ａは斜視図、ｂはダ
ミープリント基板の斜視図、第３図は従来の説明
図で、ａは斜視図、ｂは要部斜視図を示す。
図において、１はプリント基板、２は半導体素
子、３は筺体、４はダミープリント基板、５は通
風口、６は通風、７はダクト、４Ａは基板を示す
。
Fig. 1 is an explanatory diagram of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment according to the present invention, a is a perspective view, b is a perspective view of a dummy printed circuit board, and Fig. 3 is a conventional explanatory diagram. A shows a perspective view, and b shows a perspective view of main parts. In the figure, 1 is a printed circuit board, 2 is a semiconductor element, 3 is a housing, 4 is a dummy printed circuit board, 5 is a ventilation hole, 6 is a ventilation, 7 is a duct, and 4A is a board.
Claims (1)
ダミープリント基板４のそれぞれが所定間隔Ｐで
配列され、それぞれが挿脱可能に収納された筺体
３を備え、該間隔Ｐのそれぞれに通風６を行うこ
とで該半導体素子２の冷却を行う冷却構造におい
て、 前記ダミープリント基板４側の通風が隣接した
前記プリント基板１の実装面１Ａに案内されるよ
う前記ダミープリント基板４の基板４Ａに通風口
５を設けると共に、該通風口５に前記通風６を案
内するダクト７が該ダミープリント基板４に係止
されて成ることを特徴とする冷却構造。[Claims for Utility Model Registration] Printed circuit boards 1 or dummy printed circuit boards 4 on which semiconductor elements 2 are mounted are arranged at a predetermined interval P, and each is provided with a housing 3 in which it is removably housed, In the cooling structure in which the semiconductor element 2 is cooled by providing ventilation 6 to each of the dummy printed circuit boards 4, the dummy printed circuit board 4 is arranged such that the ventilation on the dummy printed circuit board 4 side is guided to the mounting surface 1A of the adjacent printed circuit board 1. A cooling structure characterized in that a ventilation hole 5 is provided on the board 4A, and a duct 7 for guiding the ventilation 6 to the ventilation hole 5 is locked to the dummy printed circuit board 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP801888U JPH01113394U (en) | 1988-01-25 | 1988-01-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP801888U JPH01113394U (en) | 1988-01-25 | 1988-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113394U true JPH01113394U (en) | 1989-07-31 |
Family
ID=31213523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP801888U Pending JPH01113394U (en) | 1988-01-25 | 1988-01-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113394U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374082A (en) * | 2001-06-13 | 2002-12-26 | Hitachi Kokusai Electric Inc | Cooling structure of electronic apparatus |
| JP2013138130A (en) * | 2011-12-28 | 2013-07-11 | Fujitsu Ltd | Cooling unit, housing of cooling unit, and electronic apparatus |
-
1988
- 1988-01-25 JP JP801888U patent/JPH01113394U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374082A (en) * | 2001-06-13 | 2002-12-26 | Hitachi Kokusai Electric Inc | Cooling structure of electronic apparatus |
| JP4562317B2 (en) * | 2001-06-13 | 2010-10-13 | 株式会社日立国際電気 | Electronic equipment cooling structure |
| JP2013138130A (en) * | 2011-12-28 | 2013-07-11 | Fujitsu Ltd | Cooling unit, housing of cooling unit, and electronic apparatus |
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