JP2002374082A - Cooling structure of electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling structure of an electronic apparatus in which cooling effect is not reduced even when a functional unit is not mounted but a blank is provided. SOLUTION: In the cooling structure of an electronic apparatus mounting a plurality of function units 4 being cooled forcibly by a heat sink 27, when a blank 35 is provided in place of the function unit, the blank has a flow guide plate 38 facing the heat sink to form a passage between the flow guide plate and the heat sink. The flow guide plate has starting and ending parts where the passage area decreases gradually.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for electronic equipment, and more particularly to a cooling structure for electronic equipment in which forced cooling is performed by a cooling fan.

[0002]

2. Description of the Related Art Generally, electronic equipment is unitized for each function, and has a unit configuration according to the performance required of the electronic equipment, and has a structure in which required functional units are incorporated in a chassis or a rack. . Further, since the chassis or rack is manufactured according to the expected maximum performance, generally, there is a clear portion where the unit is not mounted. A blank (a panel, a case, or the like that closes the bright portion) is mounted on the bright portion instead of the functional unit.

[0003] As a functional unit, for example, a transmission amplifier board has an amplifier circuit for transmitting to an external antenna, and a heat-generating component is mounted on the amplifier circuit. Although the heat-generating component generates heat, the heat-generating component itself has a property of being weak to heat.

Further, each module such as a transmission unit, a power supply unit and a control unit in the functional unit is shielded in order to avoid mutual interference between the components of each module, and the heat-generating components cannot directly radiate heat. To radiate heat. Further, forced air cooling by a fan is performed to increase the heat radiation efficiency.

A cooling structure of a conventional electronic device will be described with reference to FIGS.

In FIGS. 6 to 8, reference numeral 1 denotes a chassis, and one side (FIG. 1) of the chassis 1 attached to a rack (not shown).
A left side of the chassis 1 is provided with a fan unit 2, and a ventilation duct 3 is formed on the other side of the chassis 1. A functional unit can be mounted at a required stage between the fan unit 2 and the ventilation duct unit 3. In the figure, the functional units can be mounted in six stages, the transmission amplifying panel 4 is mounted in a separate stage, and the blanks 5 are mounted in other portions.

Hereinafter, a specific description will be given.

The chassis 1 is formed in a box shape by a side plate 9, a front plate 11, a back plate 12, a top plate 13, and a bottom plate 14. A pair of partition plates 15a, 15b is provided between the top plate 13 and the bottom plate 14.
And guide rails 16 are provided on opposing surfaces of the partition plates 15a and 15b. The transmission amplification board 4 is inserted through the guide rail 16. In addition, rectangular ventilation holes (not shown) are formed in the partition plates 15a and 15b in correspondence with the transmission amplification plate 4 to be mounted. The space between the partition plate 15b on the side opposite to the fan unit 2 and the side plate 9 constitutes the ventilation duct portion 3, and the back plate 12 is provided with an exhaust port 17 communicating with the ventilation duct portion 3.

At the front of the fan unit 2, an air intake 18 having a filter 6 is provided, and a fan mounting panel 19 is provided so as to face the partition plate 15. The fan mounting panel 19 has a cooling fan. 21 are provided.

A space 22 is provided between the fan mounting panel 19 and the partition plate 15a, and the space 22 has a function of distributing cooling air.

The transmission amplifier 4 will be described with reference to FIGS.

The transmission amplifier board 4 has a front panel 24 mounted on the chassis 1 and a wiring board 25 mounted on the front panel 24. Electronic components are mounted on one surface of the wiring board 25, and a shield is provided. A case 26 is attached. A heat sink 27 is provided on the other surface of the wiring board 25.
Is provided. The heat-generating component is directly attached to the heat sink 27 by excavating the wiring board 25. The heat sink 27 is provided so that the fins 28 are directed from the fan unit 2 to the ventilation duct 3.

The blank 5 will be described with reference to FIGS.

The blank 5 has a front panel 29 attached to the chassis 1, and a side panel 31 stands upright on the back of the front panel 29. The side panel 31
Has a size to close the ventilation holes (not shown) of the partition plate 15a, and a sponge plate 32 is provided on a contact surface with the partition plate 15a.

The cooling operation of the conventional example will be described below with reference to FIGS.

By driving the cooling fan 21, air is sucked from the air intake 18 and further discharged to the space 22.

The blank 5 is provided. Since the ventilation hole (not shown) is closed by the side panel 31, the cooling air flows into the space in which the transmission amplification board 4 is stored through the ventilation hole. The cooling air that has absorbed the heat radiation from the heat sink 27 is
5b flows into the ventilation duct portion 3 through a ventilation hole (not shown), and is further discharged from the ventilation port 17.

[0018]

As described above, when the blank 5 is loaded, the ventilation holes are closed, and the ventilation resistance increases. The blank 5 is only for closing the ventilation hole by the side panel 31.
The part is a space. Therefore, the cooling air flows through the portion of the blank 5 having a smaller flow resistance than the flow between the fins 28 of the heat sink 27. For this reason, only a part of the cooling air contributes to the cooling of the transmission amplifier board 4, and there is a problem that the cooling effect is reduced.

The present invention has been made in view of the above circumstances, and provides a cooling structure of an electronic device in which a cooling effect is not reduced even when a functional unit is not mounted and a blank is provided.

[0020]

SUMMARY OF THE INVENTION The present invention provides a cooling structure for electronic equipment in which a plurality of functional units are mounted and the functional units have a heat sink and are forcibly cooled. Wherein the blank has a flow conducting plate, the flow conducting plate facing the heat sink and forming a flow path with the heat sink, and the flow conductive plate has a starting end portion where the flow path area gradually decreases. The present invention relates to a cooling structure for an electronic device having the following.

[0021]

Embodiments of the present invention will be described below with reference to the drawings.

In FIGS. 1 and 2, the same components as those shown in FIGS. 6 to 8 are denoted by the same reference numerals. The structure of the chassis 1 and the mounted transmission amplifier 4 are the same.

The transmission amplification boards 4 are provided at intervals between the transmission amplification boards 4 via the guide rails 16, and a blank 35 is provided between the transmission amplification boards 4.
Is implemented.

The blank 35 will be described with reference to FIGS.

The blank 35 has a front panel 36 having the same shape as the front panel 24 of the transmission amplifier board 4 and a dummy case 37 provided perpendicular to the front panel 36.

Further, the dummy case 37 is provided on the side opposite to the flow guide plate 38 and the shield case 26 provided on the side of the transmission amplifying panel 4 facing the heat sink 27 with the blank 35 mounted on the chassis 1. The flow guide plate 38 and the replenishment plate 39 are fixed to each other at flange portions 38a, 39a formed at both ends, and the flange portions 38a, 39a are fitted to the guide rails 16 respectively. This serves as a guide for inserting and removing the blank 35.

The flow guide plate 38 has a trapezoidal shape in which both side ends are inclined and a central portion close to the heat sink 27, and the supplementary plate 39 has a flat concave shape. The shape is close to the shield case 26 of the panel 4.

Since the shield case 26 and the refill plate 39 are close to each other so as to close the space, the flow path connecting the space 22 and the ventilation duct 3 is formed between the flow guide plate 38 and the heat sink 27. It becomes space. Further, since both end portions (flow channel start end and flow channel end portion) of the flow guide plate 38 are inclined, the cross-sectional area of the flow channel gradually decreases at the flow channel start end, and the flow channel at the flow channel end portion. The cross-sectional area increases gradually. Further, since the center of the flow guide plate 38 is close to the heat sink 27, the flow path is mostly occupied by the groove of the fin 28.

Hereinafter, the cooling operation will be described.

When the cooling fan 21 is driven, air is sucked from the air intake port 18 and the space 22
Is discharged to Cooling air flows from the space 22 between the heat sink 27 and the flow guide plate 38. When the cooling air flows in, the flow path cross-sectional area is large and the resistance is small. Further, the cooling air is throttled at the start end of the flow guide plate 38, and is forced into the groove of the fin 28 at an increased flow velocity. The fin 2
In the process of flowing through the groove 8, the cooling air draws heat from the fins 28 and cools the heat-generating components attached to the heat sink 27.

Further, since the cross-sectional area of the flow passage gradually increases at the end of the flow guide plate 38, the flow passage resistance is reduced, and the cooling air is easily discharged to the ventilation duct 3. That is, the terminal end of the flow guide plate 38 has an effect of drawing the cooling air flowing through the fins 28.

The flow velocity of the cooling air flowing through the grooves of the fins 28 increases, and almost all of the cooling air discharged from the cooling fan 21 comes into contact with the fins 28 for cooling.

Therefore, the cooling effect increases. In turn,
The reliability of a functional unit having a heat-generating component such as a transmission amplifier is improved.

The blank 35 is connected to the flange 3
Since the chassis 1 is supported by the guide rails 16 at 8a and 39a, the position can be accurately and stably held even when the chassis 1 is placed horizontally or vertically and the installation posture is different.

Further, the cooling effect is improved by omitting the replenishing plate 39 and using only the flow conducting plate 38. Further, the fluidized plate may have at least a shape in which the starting end portion gradually reduces the cross-sectional area of the flow path toward the downstream side, and the starting end portion and the ending portion may be constituted by curved surfaces.

[0036]

As described above, according to the present invention, in a cooling structure of an electronic device in which a plurality of functional units are mounted, the functional units have a heat sink, and are forcibly cooled.
When a blank is provided in place of the functional unit, the blank has a flow guide plate, which faces the heat sink and forms a flow path with the heat sink, and the flow guide plate gradually becomes The cooling air is pushed into the heat sink by the starting end of the flow guide plate to increase the cooling effect because of the start end where the flow path area decreases, and the cooling effect does not decrease even when a blank is provided. Exhibits various effects.

[Brief description of the drawings]

FIG. 1 is a front sectional view showing an embodiment of the present invention.

FIG. 2 is a view taken along the line AA of FIG. 1;

FIG. 3 is a plan view of a blank used in the embodiment of the present invention.

FIG. 4 is a front view of the blank.

FIG. 5 is a rear view of the blank.

FIG. 6 is a front view of a conventional example.

FIG. 7 is a front sectional view of a conventional example.

8 is a view taken in the direction of arrows BB in FIG. 7;

FIG. 9 is a plan view of a transmission amplifier board mounted in a conventional example.

FIG. 10 is a front view of the transmission amplification board.

FIG. 11 is a side view of the transmission amplification board.

FIG. 12 is a plan view of a blank used in a conventional example.

FIG. 13 is a front view of a blank used in a conventional example.

FIG. 14 is a rear view of a blank used in a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chassis 2 Fan unit 3 Ventilation duct part 4 Transmission amplification board 15 Partition plate 21 Cooling fan 22 Space 27 Heat sink 35 Blank 38 Flow guide plate 39 Replenishment plate

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Joe Sakamoto 3-14-20 Higashinakano, Nakano-ku, Tokyo F-term in Hitachi Kokusai Electric Inc. (reference) 5E322 AA02 AA03 BA05 BB10 EA06 FA04

Claims (1)

[Claims] In a cooling structure of electronic equipment in which a plurality of functional units are mounted and the functional units have a heat sink and are forcibly cooled, when a blank is provided instead of the functional unit, the blank flows. An electronic device comprising: a conductive plate, wherein the flow conductive plate faces the heat sink and forms a flow path between the heat sink and the heat sink, and the flow conductive plate has a starting end portion in which a flow path area gradually decreases. Equipment cooling structure.