JP4562317B2 - Electronic equipment cooling structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling structure for an electronic device, and more particularly to a cooling structure for an electronic device in which forced cooling is performed by a cooling fan.
[0002]
[Prior art]
In general, an electronic device is unitized for each function, has a unit configuration corresponding to the performance required of the electronic device, and has a structure in which required functional units are incorporated in a chassis or a rack. Further, since the chassis or rack is manufactured in accordance with the maximum expected performance, generally there is a bright part where the unit is not mounted. Blanks (panels, cases, etc. for closing the bright parts) are mounted in the bright parts instead of the functional units.
[0003]
As a functional unit, for example, a transmission amplifier board has an amplifier circuit for transmitting to an external antenna, and a heat-generating component is mounted on the amplifier circuit. Although the heat-generating component self-heats, the heat-generating component itself has a property of being vulnerable to heat.
[0004]
In addition, each module such as the transmitter, power supply, and controller in the functional unit is shielded to avoid mutual interference between the components of each module, and since the heat generating component cannot directly radiate heat, it radiates heat via a heat sink. It is like. Furthermore, forced air cooling with a fan is performed to increase the heat dissipation efficiency.
[0005]
A conventional electronic device cooling structure will be described with reference to FIGS.
[0006]
6 to 8, reference numeral 1 denotes a chassis. A fan unit 2 is provided on one side (left side in FIG. 1) of the chassis 1 attached to a rack (not shown), and the other side of the chassis 1 is ventilated. A duct portion 3 is formed. A functional unit can be mounted between the fan unit 2 and the ventilation duct portion 3 at a required stage. In the figure, functional units can be mounted in six stages, a transmission amplifier board 4 is mounted in a separate stage, and blanks 5 are mounted in other parts.
[0007]
This will be specifically described below.
[0008]
The chassis 1 is formed in a box shape by a side plate 9, a front plate 11, a back plate 12, a top plate 13 and a bottom plate 14, and a pair of partition plates 15 a and 15 b are provided between the top plate 13 and the bottom plate 14. Guide rails 16 are provided on the opposing surfaces of the plates 15a and 15b. The transmission amplifying board 4 is inserted through the guide rail 16. The partition plates 15a and 15b are formed with rectangular ventilation holes (not shown) corresponding to the transmission amplifier 4 to be attached. The space between the partition plate 15 b on the side opposite to the fan unit 2 and the side plate 9 is the ventilation duct portion 3, and the back plate 12 is provided with an exhaust port 17 communicating with the ventilation duct portion 3.
[0009]
An air intake 18 having a filter 6 is provided in front of the fan unit 2, a fan mounting panel 19 is provided so as to face the partition plate 15, and a cooling fan 21 is provided in the fan mounting panel 19. It has been.
[0010]
A space 22 is provided between the fan mounting panel 19 and the partition plate 15a, and the space 22 has a cooling air distribution function.
[0011]
The transmission amplification board 4 will be described with reference to FIGS.
[0012]
The transmission amplifying panel 4 includes a front panel 24 attached to the chassis 1 and a wiring board 25 attached to the front panel 24. An electronic component is mounted on one surface of the wiring board 25, and a shield case 26 is further provided. Installed. A heat sink 27 is provided on the other surface of the wiring board 25. The heat generating component is directly attached to the heat sink 27 through the wiring board 25. The heat sink 27 is provided such that the fins 28 are directed from the fan unit 2 toward the ventilation duct portion 3.
[0013]
The blank 5 will be described with reference to FIGS.
[0014]
The blank 5 has a front panel 29 attached to the chassis 1, and a side panel 31 is erected vertically on the back surface of the front panel 29. The side panel 31 is sized to block the ventilation holes (not shown) of the partition plate 15a, and a sponge plate 32 is provided on the contact surface with the partition plate 15a.
[0015]
The cooling action in the conventional example will be described below with reference to FIGS.
[0016]
By driving the cooling fan 21, air is sucked from the air intake port 18 and further discharged into the space 22.
[0017]
The blank 5 is provided. Since the ventilation hole (not shown) is closed by the side panel 31, the cooling air flows into the space in which the transmission amplifier board 4 is accommodated through the ventilation hole. The cooling air that has absorbed the heat released from the heat sink 27 flows into the ventilation duct portion 3 through a ventilation hole (not shown) of the partition plate 15 b and is further discharged from the ventilation port 17.
[0018]
[Problems to be solved by the invention]
As described above, when the blank 5 is loaded, the ventilation hole is closed, and the ventilation resistance increases. Moreover, the blank 5 only closes the ventilation hole by the side panel 31, and the blank 5 part is a space. Accordingly, the cooling air flows in the blank 5 portion having a smaller flow path resistance than flowing between the fins 28 of the heat sink 27. For this reason, only a part of the cooling air contributes to the cooling of the transmission amplifying board 4, and there is a problem that the cooling effect is lowered.
[0019]
In view of such a situation, the present invention provides a cooling structure for an electronic device in which a cooling effect is not reduced even when a functional unit is not mounted and a blank is provided.
[0020]
[Means for Solving the Problems]
The present invention provides a cooling structure for an electronic device in which a plurality of functional units are mounted and the functional units have a heat sink and are forcedly cooled. The flow guide plate is opposed to the heat sink and forms a flow path with the heat sink, and the flow guide plate relates to a cooling structure for an electronic device having a start end portion in which a flow path area gradually decreases. Is.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0022]
In FIG. 1 and FIG. 2, the same components as those shown in FIG. 6 to FIG. The structure of the chassis 1 and the mounted transmission amplifying board 4 are the same.
[0023]
The transmission amplifier boards 4 are provided in stages through the guide rails 16, and blanks 35 are mounted between the transmission amplifier boards 4.
[0024]
The blank 35 will be described with reference to FIGS.
[0025]
The blank 35 has a front panel 36 having the same shape as the front panel 24 of the transmission amplifier board 4 and a dummy case 37 provided perpendicularly to the front panel 36.
[0026]
Further, the dummy case 37 is a replenishment provided on the side facing the shield case 26 and the flow guide plate 38 provided on the side of the transmission amplifier 4 facing the heat sink 27 with the blank 35 mounted on the chassis 1. The flow guide plate 38 and the replenishment plate 39 are fixed to each other by flange portions 38a and 39a formed at both ends, and the flange portions 38a and 39a are fitted to the guide rail 16 to form the blank. 35 is a guide for insertion and removal.
[0027]
The flow guide plate 38 has a trapezoidal shape in which both side end portions are inclined and the central portion is close to the heat sink 27, and the supplementary plate 39 has a flat concave shape. The shape is close to the shield case 26.
[0028]
Since the shield case 26 and the replenishment plate 39 are close to a state of closing the space, the flow path that connects the space 22 and the ventilation duct portion 3 is a space between the flow guide plate 38 and the heat sink 27. . In addition, since both end portions (the flow path start end portion and the flow path end portion) of the flow guide plate 38 are inclined, the flow path cross-sectional area gradually decreases at the flow path start end portion, and the flow path end portion at the flow path end portion. The cross-sectional area gradually increases. Further, since the central portion of the flow guide plate 38 is close to the heat sink 27, the groove of the fin 28 occupies most of the flow path.
[0029]
Hereinafter, the cooling action will be described.
[0030]
When the cooling fan 21 is driven, air is sucked from the air intake 18 and further discharged to the space 22. Cooling air flows from the space 22 between the heat sink 27 and the flow guide plate 38. When cooling air flows in, the flow path cross-sectional area is large and the resistance is low. Further, the cooling air is squeezed at the start end of the flow guide plate 38 to increase the flow velocity and is pushed into the groove of the fin 28. In the process of flowing through the groove of the fin 28, the cooling air takes heat from the fin 28 and cools the heat generating component attached to the heat sink 27.
[0031]
Further, since the flow passage cross-sectional area gradually increases at the end portion of the flow guide plate 38, the flow passage resistance is reduced, and the cooling air is easily discharged to the ventilation duct portion 3. That is, the terminal portion of the flow guide plate 38 has an effect of drawing out cooling air flowing through the fins 28.
[0032]
The flow rate of the cooling air flowing through the groove of the fin 28 increases, and substantially all of the cooling air discharged from the cooling fan 21 comes into contact with the fin 28 and is used for cooling.
[0033]
Therefore, the cooling effect is increased. As a result, the reliability of the functional unit having a heat generating component such as a transmission amplifier board is improved.
[0034]
The blank 35 is supported by the guide rail 16 by the flange portions 38a and 39a, so that the position of the blank 1 can be accurately and stably maintained even when the chassis 1 is installed in a horizontal or vertical position.
[0035]
Further, the replenishment plate 39 is omitted, and the cooling effect is improved only by the flow guide plate 38.
In addition, the flow plate may have at least a shape in which the start end portion gradually decreases the flow path cross-sectional area toward the downstream side, and the start end portion and the end end portion may be configured by curved surfaces.
[0036]
【The invention's effect】
As described above, according to the present invention, when a plurality of functional units are mounted and the functional unit has a heat sink and is forcedly cooled, a blank is provided instead of the functional unit. Since the blank has a flow guide plate, the flow guide plate faces the heat sink and forms a flow path with the heat sink, and the flow guide plate has a starting end portion where the flow path area gradually decreases. The cooling air is pushed into the heat sink by the starting end portion of the flow guide plate to increase the cooling effect, and exhibits various effects such as that the cooling effect does not decrease even when a blank is provided.
[Brief description of the drawings]
FIG. 1 is a front sectional view showing an embodiment of the present invention.
FIG. 2 is a view taken in the direction of arrows AA in FIG.
FIG. 3 is a plan view of a blank used in the embodiment of the present invention.
FIG. 4 is a front view of the blank.
FIG. 5 is a rear view of the blank.
FIG. 6 is a front view of a conventional example.
FIG. 7 is a front sectional view of a conventional example.
FIG. 8 is a view taken along arrow BB in FIG.
FIG. 9 is a plan view of a transmission amplifier board mounted in a conventional example.
FIG. 10 is a front view of the transmission amplifier board.
FIG. 11 is a side view of the transmission amplifier board.
FIG. 12 is a plan view of a blank used in a conventional example.
FIG. 13 is a front view of a blank used in a conventional example.
FIG. 14 is a rear view of a blank used in a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Chassis 2 Fan unit 3 Ventilation duct part 4 Transmission amplifier board 15 Partition plate 21 Cooling fan 22 Space 27 Heat sink 35 Blank 38 Flow guide plate 39 Supplementary plate

Claims (1)

In a cooling structure of an electronic device in which a plurality of functional units are mounted and the functional units have a heat sink and are forcibly cooled, when blanks are provided instead of the functional units, the blanks serve as empty portions of the functional units. a dummy case occupies the portion facing to the heat sink of the dummy case is constituted by Nagareshirube plate, flow conductive plate forms a flow path between the heat sink, wherein the flow conductive plate flow path A cooling structure for an electronic device, comprising: a start end portion in which a cross-sectional area gradually decreases and a terminal end portion in which a flow path cross-sectional area gradually increases .

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