JPH041760Y2 - - Google Patents

Description

[Detailed description of the invention] [Summary] An electronic equipment rack in which attached units are arranged in parallel behind a printed board shelf in which a large number of printed wiring boards are arranged vertically is equipped with a fan that forcibly cools the printed board shelf. By providing a nozzle-shaped slit that communicates with the upper part of the housing space for the attached unit on the side plate of the air exhaust duct, the printed board shelf and the attached unit can be cooled with one fan.

[Industrial application field]

The present invention relates to improvements in cooling structures for electronic devices.

A large number of printed wiring boards are used in electronic devices, and these printed wiring boards are generally arranged side by side on a printed board shelf and housed in an electronic device rack. As components are mounted on each printed wiring board at a high density, these printed wiring boards require forced cooling.

On the other hand, many electronic devices require accessory units such as power supply units in addition to the printed circuit board shelf, and these accessory units also need to be cooled.

In such cases, there is a strong desire to reduce the cost of forced cooling devices.

[Conventional technology]

FIG. 3 is a cross-sectional view showing a conventional electronic device cooling structure, in which an electronic device rack 1 is surrounded by a bottom plate 2, a front plate 3, a rear plate 4, side plates, and a ceiling plate (none of which are shown). The front plate 3 of the electronic device rack 1 is box-shaped.
On the side, printed board shelves 5 are housed in a vertically stacked manner, and an attached unit 6 (for example, a power supply unit) is installed behind each printed board shelf 5.

Back board 5 of box-shaped printed board Shelf 5
By arranging connectors in parallel inside A and plugging printed wiring boards into the respective connectors, a large number of printed wiring boards are mounted vertically in parallel on the printed board shelf 5.

A large number of suction holes 5a are arranged in parallel on the shelf bottom plate,
The upper plate of the shelf is provided with exhaust holes 5b that are arranged in parallel and communicate with the exhaust duct 25.

Further, the front surface of the printed board shelf 5 is blocked by parallel printed board front plates attached at right angles to the front edges of the respective printed wiring boards.

Therefore, each printed board shelf 5
On the front side, between the front plate 3 of the electronic device rack 1,
A vertically long ventilation space 12 is formed. Note that a suction window 3a is provided at the bottom of the front plate 3.

Further, the shelf bottom plate of the lowermost printed board shelf 5 is mounted parallel to the bottom plate 2 of the electronic device rack 1 with a space provided therebetween.

The shelf bottom plate is extended rearward to serve as the bottom plate of the housing that accommodates the attached unit 6, and the shelf top plate is extended rearward to serve as the upper plate. A rear plate 6A is provided vertically across a space 13, and forms a box-shaped housing in which the attached unit 6 is housed. Further, a suction hole 6a is provided at a desired position on the bottom plate of the housing.

The rear upper part of the housing of the attached unit 6, that is, the rear plate 6A
A fan 11 is installed on the top of the.

Above the upper plate of the printed board shelf 5, a guide plate 7 is provided which is inclined upward from the front side to the rear and is connected to the middle of the bottom plate of another attached unit 6 installed above. As a result, on the top of the printed board shelf 5, the guide plate 7 and the bottom plate of the other attached unit 6 that is continuous with the guide plate 7 serve as the upper plate, and the upper plate of the shelf and the upper plate of the housing of the attached unit 6 serve as the lower side plate. An exhaust duct 25 is formed. A fan 10 is installed at the rear of this exhaust duct 25.

Since it is configured as described above, fan 10
The high-temperature air inside the printed board shelf 5 is sucked out through the exhaust hole 5b and discharged into the exhaust space 13. Therefore, the cold air in the ventilation space 12 flows through the suction hole 5a,
It is sucked into the printed board shelf 5 and cools the printed wiring board.

Further, the fan 11 discharges high-temperature air within the housing of the attached unit 6 to the exhaust space 13. Therefore, the cold air in the ventilation space 12 is sucked into the housing through the suction hole 6a and cools the attached unit 6.

[Problem that the invention attempts to solve]

However, the conventional cooling structure described above has a problem in that it is expensive because fans are installed in each of the printed board shelf and the attached unit.

[Means for solving problems]

In order to solve the above conventional problems, the present invention has a printed board shelf 5 as shown in FIGS. 1 and 2.
In the electronic device rack 1 in which attached units 6 are arranged in parallel at the rear, an air exhaust space 13 starts from an air exhaust hole 5b provided in the upper plate of the printed board shelf 5.
an air exhaust duct 25 provided above the printed board shelf 5 and the attached unit 6 to communicate with the
In order to forcibly cool the printed board shelf 5, a fan 10 is installed at the rear of the ventilation duct 25, and a nozzle-shaped slit 20 is opened in the lower side plate 26 of the ventilation duct 25 above the attached unit 6. The structure is designed to provide the following features.

[Effect]

According to the above means of the present invention, the high temperature air inside the printed board shelf 5 is sucked by the fan 10, flows in the exhaust duct 25 in a laminar flow state, and is discharged into the exhaust space 13. Therefore, the printed board shelf 5 is forcedly cooled.

On the other hand, the static pressure of the exhaust flow from the printed board shelf 5 flowing through the exhaust duct 25 is negative pressure. Therefore, the high-temperature air inside the housing of the attached unit 6 is sucked into the ventilation duct 25 through the nozzle-shaped slit 20 opened in the lower duct plate 26 of the ventilation duct 25, and is sucked into the ventilation duct 25 along with the exhaust flow from the printed board shelf 5. , is discharged into the exhaust air space 13.

Therefore, it becomes possible to cool the printed board shelf 5 and the attached unit 6 with one fan 10, thereby reducing the cost of the cooling structure of the electronic device.

〔Example〕

The present invention will be specifically explained below with reference to the illustrated embodiments. Note that the same reference numerals indicate the same objects throughout the figures.

FIG. 1 is a cross-sectional view of one embodiment of the present invention, and FIG. 2 is a perspective view of essential parts of one embodiment of the present invention.

In FIGS. 1 and 2, the electronic device rack 1 is
As shown in FIG. 2, there is a printed board shelf 5 inside the electronic device rack 1, which is box-shaped and surrounded by a bottom plate 2, a front plate 3, a rear plate 4, side plates, and a ceiling plate (none of which are shown).
Unitized casings in which the auxiliary unit 6 and the auxiliary unit 6 are arranged side by side are stacked vertically and housed.

The printed board shelf 5 is formed into a box shape by a shelf bottom plate 30, a pair of shelf side plates 31, a backboard 5A, and a duct lower side plate 26 which also serves as a shelf top plate. By plugging the printed wiring boards into the connector, a large number of printed wiring boards are mounted vertically in parallel on the printed board shelf 5.

A large number of suction holes 5a are arranged in parallel on the shelf bottom plate 30, and exhaust holes 5b are arranged in parallel on the shelf top plate, which communicate with the ventilation duct 25 provided at the upper part.

Further, the front surface of the printed board shelf 5 is blocked by parallel printed board front plates (not shown in FIG. 2) mounted perpendicularly to the front edge of each printed wiring board.

A shelf bottom plate 30, a shelf side plate 31, and a shelf top plate are each extended rearward, and a rear plate 33 is provided perpendicularly to the rear of the shelf to form a box-shaped housing portion in which the attached unit 6 is housed.

It should be noted that, as in the conventional example, the shelf bottom plate 30 is provided with a suction hole 6a communicating with the accommodating portion of the accessory unit 6 at a desired position.

Above the upper plate of the printed board shelf 5, there is provided a guide plate 7 that slopes upward from the front side to the rear and becomes horizontal at a desired point, and by extending the shelf side plate 31 upward, the exhaust duct 25 is installed. It has been formed. A fan 10 is installed at the rear of this exhaust duct 25.

A pair of mountain-shaped inclined plates 21 are provided on the upper part of the housing of the attached unit 6. The top of the inclined plates 21 is connected to the lower surface of the duct lower plate 26, and the exhaust flow of the fan 10 is connected to the top of the inclined plate 21. Orthogonal nozzle-shaped slits 20 are provided.

When the housings containing the printed board shelf 5 and the attached unit 6 configured as described above are stacked, a ventilation space 12 is formed between the front plate 3 of the electronic device rack 1 and the front surface of each housing. Further, an air exhaust space 13 is formed between the rear plate 4 and the rear plate 33 of the electronic device rack 1.

The shelf bottom plate of the lowermost printed board shelf 5 is mounted parallel to the bottom plate 2 of the electronic device rack 1 with a space provided therebetween.

Therefore, the fan 10 sucks out the high temperature air inside the printed board shelf 5 through the exhaust hole 5b and discharges it into the exhaust space 13. Along with this, the ventilation space 12
The cold air flows through the suction hole 5a to the printed board shelf 5.
It is sucked into the interior and cools the printed wiring board.

Further, the static pressure of the exhaust flow of the printed board shelf 5 flowing through the air exhaust duct 25 is negative pressure. Therefore, the high-temperature air inside the housing of the attached unit 6 is sucked into the ventilation duct 25 through the nozzle-shaped slit 20 opened in the lower duct plate 26 of the ventilation duct 25, and is sucked into the ventilation duct 25 along with the exhaust flow from the printed board shelf 5. , is discharged into the exhaust space 13 and cools the attached unit 6.

In this way, the printed board shelf 5 and the attached unit 6 can be cooled with one fan 10, which is not only low cost, but also allows the printed board shelf 5 and the attached unit 6 to be cooled in one small unit. Since the electronic device rack 1 is housed within the housing, the packaging density of the electronic device rack 1 is increased.

Although the illustrated example is applied to an electronic device rack in which the printed board shelves 5 are stacked vertically, the present invention can also be applied to a single stacked board.
Of course.

[Effect of idea]

As explained above, the present invention allows the printed board shelf and the attached units to be integrated into one in an electronic equipment rack in which the attached units are arranged in parallel behind the printed board shelf in which a large number of printed wiring boards are arranged vertically.
It is configured to be cooled by a base fan, and has the excellent effect of being low cost.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of one embodiment of the present invention, FIG. 2 is a perspective view of essential parts of one embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional example. In the figure, 1 is an electronic device rack, 3 is a front plate, and 4 is a
is the rear panel, 5 is the printed board shelf, 5A is the back board, 5a and 6a are the intake holes, 5b is the exhaust hole,
6 is an attached unit, 6A is a rear plate, 10 and 11 are fans, 12 is a ventilation space, 13 is an exhaust space, 20 is a nozzle-shaped slit, 21 is an inclined plate, 25 is an exhaust duct, 26 is a duct lower plate, 30 indicates a shelf bottom plate, and 31 indicates a shelf side plate.

Claims (1)

[Scope of Claim for Utility Model Registration] In an electronic device rack 1 in which an attached unit 6 is arranged in parallel at the rear of a printed board shelf 5, an air vent opening 5b of the printed board shelf 5 that starts from an exhaust hole 5b and communicates with the ventilation space 13 is provided. , an air exhaust duct 25 provided above the printed board shelf 5 and the attached unit 6, and a fan 10 installed at the rear of the air exhaust duct 25.
and above the attached unit 6, the exhaust duct 25
1. A cooling structure for an electronic device, comprising: a nozzle-shaped slit 20 opened in a lower side plate 26 of a duct.