JP2758317B2 - Electronic device cooling structure - Google Patents
Electronic device cooling structureInfo
- Publication number
- JP2758317B2 JP2758317B2 JP16813592A JP16813592A JP2758317B2 JP 2758317 B2 JP2758317 B2 JP 2758317B2 JP 16813592 A JP16813592 A JP 16813592A JP 16813592 A JP16813592 A JP 16813592A JP 2758317 B2 JP2758317 B2 JP 2758317B2
- Authority
- JP
- Japan
- Prior art keywords
- subrack
- ventilation
- electronic circuit
- circuit package
- ventilation port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子装置の冷却構造に関
する。無線通信装置等の電子装置においては、メンテナ
ンスの容易化、オプション機能の増設等の観点からサブ
ラック積み上げ構造が採用されている。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an electronic device. 2. Description of the Related Art In electronic devices such as wireless communication devices, a subrack stacking structure is employed from the viewpoint of facilitating maintenance and adding optional functions.
【０００２】サブラック積み上げ構造とは、複数のサブ
ラック（棚）を上下方向に配置して装置筐体を構成し、
プリント配線板上に複数の電子部品を実装してなる複数
の電子回路パッケージをコネクタによるプラグイン方式
でサブラック内のバックボードに実装して電子装置を構
成する構造である。[0002] The subrack stacking structure means that a plurality of subrack (shelf) are vertically arranged to constitute an apparatus housing,
The electronic device has a structure in which a plurality of electronic circuit packages each having a plurality of electronic components mounted on a printed wiring board are mounted on a back board in a subrack by a plug-in method using a connector.
【０００３】一般に、下側のサブラックから必要数のサ
ブラックが使用されて電子装置が構成され、上側のサブ
ラックは当初は増設用として残しておき、必要が生じた
時点で使用に供されるようになっている。In general, an electronic device is constructed by using a required number of subrack from the lower subrack, and the upper subrack is initially reserved for additional use and provided for use when needed. It has become so.
【０００４】ところで、この種の構造を採用した電子装
置においては、電子部品等の発熱により装置内温度が上
昇するため、冷却構造が採用される。一般的な冷却構造
としては、構成が簡易な自然空冷式のものや冷却能力が
高いファン等を用いた強制空冷式のものが知られてい
る。In an electronic device employing this type of structure, a cooling structure is employed because the temperature inside the device rises due to heat generated by electronic components and the like. As a general cooling structure, a natural air cooling type having a simple configuration and a forced air cooling type using a fan having a high cooling capacity are known.
【０００５】そして、当初（増設前）は自然空冷式の冷
却構造が採用されており、増設により強制空冷式の冷却
構造を採用する必要が生じた場合に有効に対処し得る冷
却構造の提供が要望されている。[0005] At first (before expansion), a natural air cooling type cooling structure is employed, and a cooling structure capable of effectively coping with the necessity of adopting a forced air cooling type cooling structure due to expansion is provided. Requested.
【０００６】[0006]
【従来の技術】図４はサブラック積み上げ構造を採用し
た電子装置の当初（増設前）の構成の一例を示す図であ
り、（Ａ）は正面図、（Ｂ）は側断面図である。2. Description of the Related Art FIGS. 4A and 4B show an example of an initial (before expansion) structure of an electronic device employing a subrack stacking structure, wherein FIG. 4A is a front view and FIG. 4B is a side sectional view.
【０００７】同図において、１は装置筐体であり、装置
筐体１は複数の支柱を有するフレーム（図示せず）に、
電子回路パッケージ２の両側縁を案内・保持するための
複数のガイド部材３を架設するとともに、表板４，５を
含む側板６及び天板７を取り付けて構成されている。相
対するガイド部材３で挟まれた部分が電子回路パッケー
ジ２を収容するサブラック８，９となる。In FIG. 1, reference numeral 1 denotes an apparatus housing, and the apparatus housing 1 is mounted on a frame (not shown) having a plurality of columns.
A plurality of guide members 3 for guiding and holding both side edges of the electronic circuit package 2 are installed, and side plates 6 including top plates 4 and 5 and a top plate 7 are attached. The portions sandwiched between the opposing guide members 3 become subracks 8 and 9 that house the electronic circuit package 2.
【０００８】表板４，５はネジ等により着脱可能に装着
されるようになっており、電子回路パッケージ２は該当
するサブラックのガイド部材３の溝に沿って挿入され、
その先端に設けられたコネクタ２ａが図示しないバック
ボードのコネクタに嵌合接続されることにより実装され
る。The front plates 4 and 5 are configured to be detachably mounted by screws or the like, and the electronic circuit package 2 is inserted along the groove of the corresponding subrack guide member 3.
The connector is mounted by fitting a connector 2a provided at the end thereof to a connector of a backboard (not shown).
【０００９】この電子装置は下側から３段のサブラック
８を用いて構成されており、上側の３段のサブラック９
は増設用として割り当てられ、当初は用いられていな
い。装置筐体１の天板７には複数の貫通穴からなる通風
口１０が設けられ、表板４，５のうち使用されているサ
ブラック８に対応する表板５のそれぞれには複数の貫通
穴からなる通風口１１が設けられ、所謂煙突効果によ
り、通風口１１から外気が吸入され通風口１０から内気
が排出され、装置内部が自然空冷されるようになってい
る。This electronic device is constructed by using three stages of subrack 8 from the lower side, and three stages of upper stage subrack 9.
Is allocated for expansion and is not used initially. The top plate 7 of the apparatus housing 1 is provided with a ventilation hole 10 having a plurality of through holes, and each of the front plates 5 corresponding to the subrack 8 used among the front plates 4 and 5 has a plurality of through holes. A ventilation port 11 composed of a hole is provided. By a so-called chimney effect, outside air is sucked in from the ventilation port 11 and inside air is exhausted from the ventilation port 10, so that the inside of the apparatus is naturally cooled.
【００１０】図４に示した自然空冷式の電子装置の増設
用のサブラック９に発熱量の大きい電子回路パッケージ
を増設したい場合、発熱量が大きいために自然空冷では
まかないきれず、強制空冷する必要が生じる場合があ
る。この場合の従来の冷却構造を図５を示す。When it is desired to add an electronic circuit package having a large calorific value to the additional subrack 9 of the electronic device of the natural air cooling type shown in FIG. 4, since the calorific value is large, it cannot be covered by the natural air cooling, and forced air cooling is performed. May be necessary. FIG. 5 shows a conventional cooling structure in this case.
【００１１】増設用サブラック９の最下段を使用して、
図６に示すような給排気ユニット１２及び図７に示すよ
うなフィルタユニット１３を設けるとともに、天板７に
内気を強制的に装置筐体１外部に排出するファン１４を
取り付けて構成している。Using the lowermost stage of the additional subrack 9,
A supply / exhaust unit 12 as shown in FIG. 6 and a filter unit 13 as shown in FIG. 7 are provided, and a fan 14 for forcibly discharging inside air to the outside of the apparatus housing 1 is attached to the top plate 7. .
【００１２】図６において、１５は複数の通気口１６を
有する前カバー、１７は側板、１８は給排気分離板、１
９は整流板である。図７において、２０はフィルタユニ
ットであり、フィルタユニット２０は装置筐体１の支柱
２１に取り付けられている。In FIG. 6, 15 is a front cover having a plurality of ventilation holes 16, 17 is a side plate, 18 is a supply / exhaust separation plate, 1
9 is a current plate. In FIG. 7, reference numeral 20 denotes a filter unit, and the filter unit 20 is attached to a column 21 of the device housing 1.
【００１３】自然空冷で十分な下側のサブラック８にお
いては、表板５の通風口１１及び給排気ユニット１２の
排気口を介して空気が自然的に流通して冷却がなされ、
強制空冷の必要な上側のサブラック９においては、ファ
ン１４の作動により、給排気ユニット１２の通気口１６
及び天板７の通気口１０を介して強制的に空気が流通し
冷却がなされる。In the lower subrack 8 which is sufficiently cooled by natural air, the air naturally flows through the ventilation port 11 of the front plate 5 and the exhaust port of the air supply / exhaust unit 12 to perform cooling.
In the upper subrack 9 that requires forced air cooling, the operation of the fan 14 causes the air vent 16
Air is forcibly circulated through the ventilation port 10 of the top plate 7 to perform cooling.
【００１４】また、従来は図８に示すような冷却構造が
採用される場合もあった。即ち、図４における装置筐体
１の下側にフィルタユニット２２及び吸気ユニット２３
を設けるとともに、天板７にファン２４を設けてなる強
制空冷式の装置筐体２５を、当初のものとは別に準備
し、電子回路パッケージ２を図４における装置筐体１か
ら取り外し、図８における装置筐体２５に実装するよう
にしたものである。Conventionally, a cooling structure as shown in FIG. 8 has been adopted in some cases. That is, the filter unit 22 and the intake unit 23 are located below the device housing 1 in FIG.
And a forced air-cooled type device housing 25 having a fan 24 provided on the top plate 7 is prepared separately from the initial one, and the electronic circuit package 2 is removed from the device housing 1 in FIG. Is mounted on the device housing 25 of the first embodiment.
【００１５】全体が強制空冷されるので放熱の観点から
は問題のない構造である。Since the entire structure is forcibly air-cooled, there is no problem in terms of heat radiation.
【００１６】[0016]
【発明が解決しようとする課題】しかし、図５の構造に
よると、サブラックの１つを給排気ユニット及びフィル
タユニットのために使用しなければならず、電子回路パ
ッケージの収容能力が低下するという問題がある。However, according to the structure of FIG. 5, one of the sub-racks must be used for the air supply / exhaust unit and the filter unit, and the capacity of the electronic circuit package is reduced. There's a problem.
【００１７】一方、図８の構造によると、電子回路パッ
ケージの収容能力は低下しないが、装置が大型化すると
ともに、当初構成における電子装置を稼動したままの状
態で増設を実施することができないという問題がある。On the other hand, according to the structure shown in FIG. 8, although the capacity for accommodating the electronic circuit package does not decrease, it is not possible to increase the size of the device and to carry out the extension while the electronic device in the original configuration is operated. There's a problem.
【００１８】本発明はこのような点に鑑みてなされたも
のであり、電子回路パッケージの収容能力を低下させ
ず、装置を大型化させず、且つ電子装置稼動状態で増設
を可能とすることを目的としている。SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and it is an object of the present invention to reduce the capacity of an electronic circuit package, to increase the size of an apparatus, and to increase the number of electronic apparatuses while the electronic apparatus is operating. The purpose is.
【００１９】[0019]
【課題を解決するための手段】上述した課題を解決する
ため、上下方向に複数の電子回路パッケージ実装用のサ
ブラックを有するとともに、その周囲を側板及び天板で
包囲した装置筐体の下側のサブラックにのみ電子回路パ
ッケージを実装し、上側のサブラックは増設用として割
り当て、該側板の電子回路パッケージが実装されている
サブラックに対応する部分に複数の貫通穴からなる第１
の通風口を、該天板に第２の通風口を設けることにより
自然空冷するようにした電子装置に採用さる増設後の冷
却構造において、以下のように構成する。In order to solve the above-mentioned problems, a subrack for mounting a plurality of electronic circuit packages in a vertical direction, and a lower side of an apparatus housing whose periphery is surrounded by a side plate and a top plate. The electronic circuit package is mounted only on the subrack, and the upper subrack is allocated for extension, and the first side plate has a plurality of through holes in a portion corresponding to the subrack on which the electronic circuit package is mounted.
In the cooling structure after expansion, which is adopted in an electronic device in which natural air cooling is performed by providing a second ventilation port on the top plate, the following ventilation port is configured as follows.
【００２０】即ち、前記電子回路パッケージが実装され
ているサブラックと増設用のサブラックとの間に複数の
貫通穴からなる第３の通風口を有する仕切板を設け、前
記側板の前記増設用のサブラックの最下段に対応する部
分に複数の貫通穴からなる第４の通風口を設け、前記天
板の第２の通風口を介して内気を外部に強制的に排出す
るファン手段を設け、前記第１の通風口の増設前の自然
空冷時の通風量をＱ1、前記第２乃至第４の通風口の増
設後の通風量をそれぞれＱ2 ，Ｑ3 ，Ｑ4 として、 Ｑ3 ＝Ｑ1 ，Ｑ4 ＞Ｑ1 ，Ｑ2 ＝Ｑ3 ＋Ｑ4 となるように、該第３及び第４の通風口の大きさを設定
するとともに、前記ファン手段(45)の性能を選定して構
成する。That is, a partition plate having a third ventilation hole formed of a plurality of through holes is provided between the subrack on which the electronic circuit package is mounted and the subrack for extension, and the partition for the extension of the side plate is provided. A fourth ventilation port comprising a plurality of through holes is provided at a portion corresponding to the lowermost stage of the subrack, and fan means for forcibly discharging inside air to the outside through a second ventilation port of the top plate is provided. , the ventilation amount in the natural cooling before addition of the first vent hole Q 1, the ventilation amount after adding of the second to fourth vent hole as Q 2, Q 3, Q 4, respectively, Q 3 = Q 1 , Q 4 > Q 1 , Q 2 = Q 3 + Q 4 The sizes of the third and fourth ventilation ports are set, and the performance of the fan means (45) is selected. It is composed.
【００２１】[0021]
【作用】本発明の冷却構造を採用すると、当初（増設
前）に電子回路パッケージが実装されているサブラック
（下側のサブラック）については、当初構成における自
然空冷によるのと同じ通風量により冷却がなされ、増設
後に電子回路パッケージが実装されるサブラック（上側
のサブラック）については、それらの発熱量に見合った
通風量とすることができる。When the cooling structure of the present invention is adopted, the subrack (lower subrack) on which the electronic circuit package is mounted at the beginning (before expansion) has the same ventilation volume as that of the original configuration by natural air cooling. As for the subrack (upper subrack) on which the cooling is performed and the electronic circuit package is mounted after the addition, the airflow amount can be adjusted to the amount of heat generated.
【００２２】そして、増設前に電子回路パッケージが実
装されているサブラックと増設後に電子回路パッケージ
が実装されるサブラックとの間には通風量を制限できる
程度の板厚の仕切板を設けるだけでよく、従来の如く給
排気ユニット又は吸気ユニットを設ける必要がなく、電
子回路パッケージの収容能力が低下したり、装置が大型
化することはない。Then, between the subrack on which the electronic circuit package is mounted before the expansion and the subrack on which the electronic circuit package is mounted after the expansion, only a partition plate having a thickness sufficient to restrict the amount of ventilation can be provided. It is not necessary to provide a supply / exhaust unit or an intake unit as in the related art, and the capacity of the electronic circuit package is not reduced and the device is not enlarged.
【００２３】さらに、装置筐体を交換することもないの
で、当初構成での運転を中止することなく増設すること
ができる。Further, since there is no need to replace the device housing, it is possible to increase the number of units without interrupting the operation in the initial configuration.
【００２４】[0024]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。図１は本発明が適用された電子装置の構成を示す
図であり、（Ａ）は正面図、（Ｂ）は側断面図である。
図２は同じく斜視図、図３は同じく一部を拡大した分解
斜視図である。Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B are diagrams showing a configuration of an electronic device to which the present invention is applied, wherein FIG. 1A is a front view, and FIG. 1B is a side sectional view.
FIG. 2 is a perspective view of the same, and FIG. 3 is an exploded perspective view of a part of the same.
【００２５】尚、電子装置の当初構成については、図４
に示したものと全く同様であり、増設用のサブラックに
発熱量の大きい電子回路パッケージを実装する必要が生
じ、自然空冷式の冷却構造ではまかないきれなくなった
ものとする。FIG. 4 shows the initial configuration of the electronic device.
In this case, it is assumed that it is necessary to mount an electronic circuit package having a large calorific value on the additional subrack, and the natural air-cooling type cooling structure cannot be used.
【００２６】図１及び図２において、電子回路パッケー
ジ２が既に実装されているサブラック（下側３段）８と
増設用のサブラック９との間の部分に、装置筐体１の内
部空間を２分する仕切板３１が設けられる。In FIG. 1 and FIG. 2, the internal space of the apparatus housing 1 is located between a subrack (lower three stages) 8 on which the electronic circuit package 2 is already mounted and a subrack 9 for extension. Is provided.
【００２７】仕切板３１は複数の貫通穴３２で構成され
る通気口（第３の通気口）を有し、装置筐体１の支柱
（フレーム）に取り付けられる。また、増設用のサブラ
ック９の最下段に対応する表板４は取り外され、代わっ
て表板ユニット３３が取り付けられる。The partition plate 31 has a ventilation hole (third ventilation hole) composed of a plurality of through holes 32 and is attached to a column (frame) of the apparatus housing 1. Further, the front plate 4 corresponding to the lowermost stage of the additional subrack 9 is removed, and a front plate unit 33 is attached instead.
【００２８】表板ユニット３３は、図３に示すように、
枠部材３４、フィルタ３５及びカバー部材３６から構成
される。枠部材３４は突出する覆い部３７及び取付穴３
８を有する一対の取付金具３９を有しており、複数のネ
ジ４０により装置筐体１に取付られる。The front plate unit 33 is, as shown in FIG.
It is composed of a frame member 34, a filter 35, and a cover member 36. The frame member 34 includes a protruding cover portion 37 and a mounting hole 3.
8 is provided, and is attached to the apparatus housing 1 by a plurality of screws 40.
【００２９】カバー部材３６は複数の貫通穴４１から構
成される通気口（第４の通気口）を有し、その内側の切
欠部４２の両端部には一対のガイドレール４３が取り付
けられている。また、カバー部材３６の両端部近傍には
左右でそれぞれ一対のナイラッチ４４が設けられてい
る。The cover member 36 has a ventilation hole (fourth ventilation hole) composed of a plurality of through holes 41, and a pair of guide rails 43 is attached to both ends of a cutout portion 42 inside the ventilation hole. . In the vicinity of both ends of the cover member 36, a pair of nip latches 44 are provided on the left and right, respectively.
【００３０】フィルタ３５はカバー部材３６の一対のガ
イドレール４３に沿って挿入・装着され、カバー部材３
６のナイラッチ４４をそれぞれ枠部材３４の取付穴３８
に係合させることにより枠部材３４に取り付けられる。
このとき枠部材３４の覆い部３７はカバー部材の切欠部
４２に入り込む。The filter 35 is inserted and mounted along a pair of guide rails 43 of the cover member 36, and the cover member 3
6 into the mounting holes 38 of the frame member 34 respectively.
Is attached to the frame member 34.
At this time, the cover portion 37 of the frame member 34 enters the cutout portion 42 of the cover member.
【００３１】カバー部材３６はナイラッチ４４の操作に
より枠部材３４に取り付け又は取り外すことができ、フ
ィルタ３５もカバー部材３６に容易に取り付け又は取り
外すことができ、従ってフィルタ３５の交換が容易であ
る。The cover member 36 can be attached to or detached from the frame member 34 by operating the nip latch 44, and the filter 35 can be easily attached to or detached from the cover member 36, so that the filter 35 can be easily replaced.
【００３２】再び、図１及び図２を参照する。装置筐体
１の天板７の内側には複数のファン４５が取り付けられ
る。このファン４５は装置内部の空気を天板７の通気口
（第２の通気口）１０を介して外部に排出するものであ
る。Referring again to FIG. 1 and FIG. A plurality of fans 45 are mounted inside the top plate 7 of the device housing 1. The fan 45 discharges the air inside the apparatus to the outside through the ventilation port (second ventilation port) 10 of the top plate 7.
【００３３】表板ユニット３３のカバー部材３６に形成
される通風口の大きさ（貫通穴４１の総面積）及び仕切
板３１に形成される通風口の大きさ（貫通穴３２の総面
積）及びファン４５の性能（出力、個数等）は以下のよ
うに設定又は選定される。The size of the ventilation holes formed in the cover member 36 of the front plate unit 33 (total area of the through holes 41), the size of the ventilation holes formed in the partition plate 31 (the total area of the through holes 32), and The performance (output, number, etc.) of the fan 45 is set or selected as follows.
【００３４】即ち、増設前の当初構成における自然空冷
時の表板５の通風口１１の通風量をＱ1 とし、増設後の
構成における強制空冷時の天板７の通風口１０の通風量
をＱ 2 とし、同じく仕切板３１の通風口の通風量をＱ3
とし、同じく表板ユニット３３のカバー部材３６の通風
口の通風量をＱ4 としたときに、 Ｑ3 ＝Ｑ1 ，Ｑ4 ＞Ｑ1 ，Ｑ2 ＝Ｑ3 ＋Ｑ4 となるように設定又は選定される。尚、ファン４５の性
能の選定に当たっては、装置内の圧力損失が考慮される
ことは言うまでもない。That is, natural air cooling in the initial configuration before the expansion
Q at the time of ventilation volume of ventilation hole 11 of front plate 51And after the expansion
Ventilation volume of the ventilation opening 10 of the top plate 7 at the time of forced air cooling in the configuration
To Q TwoIn the same manner, the ventilation amount of the ventilation hole of the partition plate 31 is QThree
Similarly, the ventilation of the cover member 36 of the top plate unit 33
Q is the amount of ventilation in the mouthFourThen, QThree= Q1, QFour> Q1, QTwo= QThree+ QFour It is set or selected so that In addition, the nature of the fan 45
When selecting the capacity, the pressure loss in the device is taken into account
Needless to say.
【００３５】表板ユニット３３の通風口及び仕切板３１
の通風口の大きさ、並びにファン４５の能力を上述の通
り設定又は選定することにより、当初から電子回路パッ
ケージ２が実装されているサブラック（下側３段）８に
ついては、増設後においても当初における自然空冷時と
同じ通風量により冷却がなされ、増設後に電子回路パッ
ケージ２が実装されているサブラック（上側３段）９に
ついては、冷却に必要な通風量を確保することができ
る。Ventilation port of front plate unit 33 and partition plate 31
By setting or selecting the size of the air vent and the capacity of the fan 45 as described above, the subrack (lower three stages) 8 on which the electronic circuit package 2 is mounted from the beginning even after expansion. Cooling is performed by the same amount of airflow as at the time of natural air cooling at the beginning, and the airflow required for cooling can be secured for the subrack (upper three stages) 9 on which the electronic circuit package 2 is mounted after the expansion.
【００３６】仕切板３１は撓まない程度に薄い板金等か
ら構成することができ、従って電子回路パッケージ２の
収容能力を低下させたり、装置を大型化させることはな
い。また、当初構成の電子装置の装置筐体１をそのまま
用いることができ、当初から電子回路パッケージ２が実
装されているサブラック８の部分には何らの変更を要し
ないから、当初構成での運転を中止することなく増設す
ることができ、顧客のニーズに柔軟に対応することがで
きる。The partition plate 31 can be made of a sheet metal or the like that is thin enough not to bend, so that the capacity for holding the electronic circuit package 2 is not reduced and the size of the device is not increased. Further, since the device housing 1 of the electronic device having the initial configuration can be used as it is, and no change is required from the beginning on the portion of the subrack 8 on which the electronic circuit package 2 is mounted, the operation in the initial configuration is not required. Can be added without stopping, and can flexibly respond to customer needs.
【００３７】さらに、表板ユニット３３のフィルタ３５
は定期的に又は必要に応じて交換する必要があるが、本
実施例によると、フィルタ３５の交換作業が非常に容易
である。Further, the filter 35 of the front plate unit 33
Although it is necessary to replace the filter periodically or as needed, according to the present embodiment, the replacement work of the filter 35 is very easy.
【００３８】[0038]
【発明の効果】本発明は以上説明したように構成したの
で、電子回路パッケージの収容能力を低下させず、装置
を大型化させず、且つ電子装置を稼動したままの状態で
増設を可能にするという効果を奏する。As described above, the present invention is constructed as described above, so that the capacity of the electronic circuit package is not reduced, the size of the device is not increased, and the electronic device can be expanded while the device is operating. This has the effect.
【図１】本発明実施例の構成を示す図であり、（Ａ）は
正面図、（Ｂ）は側断面図である。FIG. 1 is a view showing a configuration of an embodiment of the present invention, wherein (A) is a front view and (B) is a side sectional view.
【図２】本発明実施例の構成を示す斜視図である。FIG. 2 is a perspective view showing a configuration of an embodiment of the present invention.
【図３】本発明実施例の表板ユニットの構成を示す分解
斜視図である。FIG. 3 is an exploded perspective view illustrating a configuration of a front plate unit according to the embodiment of the present invention.
【図４】本発明実施例又は従来技術における電子装置の
当初構成を示す図であり、（Ａ）は正面図、（Ｂ）は側
断面図である。4A and 4B are diagrams illustrating an initial configuration of an electronic device according to an embodiment of the present invention or a conventional technology, wherein FIG. 4A is a front view and FIG.
【図５】従来技術の構成を示す図であり、（Ａ）は正面
図、（Ｂ）は側断面図である。5A and 5B are diagrams showing a configuration of a conventional technique, wherein FIG. 5A is a front view and FIG. 5B is a side sectional view.
【図６】従来技術の給排気ユニットの斜視図である。FIG. 6 is a perspective view of a conventional air supply / exhaust unit.
【図７】従来技術のフィルタユニットの斜視図である。FIG. 7 is a perspective view of a conventional filter unit.
【図８】他の従来技術の構成を示す図であり、（Ａ）は
正面図、（Ｂ）は側断面図である。FIGS. 8A and 8B are diagrams showing a configuration of another conventional technique, wherein FIG. 8A is a front view and FIG. 8B is a side sectional view.
１ 装置筐体 ２ 電子回路パッケージ ４，５ 表板 ６ 側板 ７ 天板 ８，９ サブラック １０，１１ 通風口 ３１ 仕切板 ３２ 貫通穴（通風口） ３３ 表板ユニット ３５ フィルタ ３６ カバー部材 ４１ 貫通穴（通風口） ４５ ファン DESCRIPTION OF SYMBOLS 1 Device housing 2 Electronic circuit package 4,5 Front plate 6 Side plate 7 Top plate 8,9 Subrack 10,11 Vent hole 31 Partition plate 32 Through hole (vent hole) 33 Front plate unit 35 Filter 36 Cover member 41 Through hole (Ventilation port) 45 fans
───────────────────────────────────────────────────── フロントページの続き (72)発明者 箕輪 佳明 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 平４−16000（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 7/20────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshiaki Minowa 1015 Uedanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujitsu Limited (56) References JP-A-4-16000 (JP, A) (58) Fields investigated (Int.Cl. 6 , DB name) H05K 7/20
Claims (2)
(2) 実装用のサブラック(8,9) を有するとともに、その
周囲を側板(4,5,6) 及び天板(7) で包囲した装置筐体
(1) の下側のサブラック(8) にのみ電子回路パッケージ
(2) を実装し、上側のサブラック(9) は増設用として割
り当て、該側板の電子回路パッケージ(2)が実装されて
いるサブラック(8) に対応する部分(5) に複数の貫通穴
(11)からなる第１の通風口を、該天板(7) に第２の通風
口(10)を設けることにより自然空冷するようにした電子
装置に採用さる増設後の冷却構造において、 前記電子回路パッケージ(2) が実装されているサブラッ
ク(8) と増設用のサブラック(9) との間に複数の貫通穴
(32)からなる第３の通風口を有する仕切板(31)を設け、 前記側板の前記増設用のサブラック(9) の最下段に対応
する部分(36)に複数の貫通穴(41)からなる第４の通風口
を設け、 前記天板(7) の第２の通風口(10)を介して内気を外部に
強制的に排出するファン手段(45)を設け、 前記第１の通風口の増設前の自然空冷時の通風量を
Ｑ1 、前記第２乃至第４の通風口の増設後の通風量をそ
れぞれＱ2 ，Ｑ3 ，Ｑ4 として、 Ｑ3 ＝Ｑ1 ，Ｑ4 ＞Ｑ1 ，Ｑ2 ＝Ｑ3 ＋Ｑ4 となるように、該第３及び第４の通風口の大きさを設定
するとともに、前記ファン手段(45)の性能を選定したこ
とを特徴とする電子装置の冷却構造。1. A plurality of electronic circuit packages in a vertical direction
(2) Device housing with subrack (8, 9) for mounting and surrounding the surrounding by side plates (4, 5, 6) and top plate (7)
Electronic circuit package only for subrack (8) under (1)
(2) is mounted, the upper subrack (9) is allocated for extension, and a plurality of penetrating parts (5) of the side plate corresponding to the subrack (8) on which the electronic circuit package (2) is mounted are mounted. hole
In the cooling structure after expansion, which is adopted in an electronic device in which a first ventilation port composed of (11) is cooled by natural air by providing a second ventilation port (10) in the top plate (7), Several through holes between the subrack (8) where the electronic circuit package (2) is mounted and the subrack (9) for extension
A partition plate (31) having a third ventilation port made of (32) is provided, and a plurality of through holes (41) are provided in a portion (36) of the side plate corresponding to the lowermost stage of the additional subrack (9). A fan means (45) for forcibly discharging inside air to the outside through a second ventilation port (10) of the top plate (7); and providing the first ventilation port ventilation amount during natural cooling before addition of the mouth Q 1, the ventilation amount after adding of the second to fourth vent hole as Q 2, Q 3, Q 4, respectively, Q 3 = Q 1, Q 4 The size of the third and fourth ventilation ports is set so that> Q 1 , Q 2 = Q 3 + Q 4, and the performance of the fan means (45) is selected. Equipment cooling structure.
の最下段に対応する部分(36)を前記装置本体(1) に対し
て着脱自在とし、該側板の着脱自在とした部分(36)の内
側両側部に一対のガイドレール(43)を設け、該一対のガ
イドレール(43)に着脱自在に挿入・保持される板状のフ
ィルタ(35)を設けたことを特徴とする請求項１に記載の
電子装置の冷却構造。2. A subrack (9) for the extension of the side plate.
A portion (36) corresponding to the lowermost portion of the side plate is detachable from the apparatus main body (1), and a pair of guide rails (43) are provided on both inner sides of the detachable portion (36) of the side plate, 2. The cooling structure for an electronic device according to claim 1, wherein a plate-like filter (35) removably inserted and held in said pair of guide rails (43) is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16813592A JP2758317B2 (en) | 1992-06-26 | 1992-06-26 | Electronic device cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16813592A JP2758317B2 (en) | 1992-06-26 | 1992-06-26 | Electronic device cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0613777A JPH0613777A (en) | 1994-01-21 |
| JP2758317B2 true JP2758317B2 (en) | 1998-05-28 |
Family
ID=15862487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16813592A Expired - Fee Related JP2758317B2 (en) | 1992-06-26 | 1992-06-26 | Electronic device cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2758317B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000060669A (en) * | 1999-03-18 | 2000-10-16 | 이종훈 | Arrangement and configuration of heatsinks for cooling power semiconductors |
| MX2008013255A (en) * | 2006-04-20 | 2008-10-28 | Nec Corp | Communication device and method for air-cooling communication device. |
-
1992
- 1992-06-26 JP JP16813592A patent/JP2758317B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0613777A (en) | 1994-01-21 |
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