JPS5843836Y2 - printed circuit board - Google Patents
printed circuit boardInfo
- Publication number
- JPS5843836Y2 JPS5843836Y2 JP1978136407U JP13640778U JPS5843836Y2 JP S5843836 Y2 JPS5843836 Y2 JP S5843836Y2 JP 1978136407 U JP1978136407 U JP 1978136407U JP 13640778 U JP13640778 U JP 13640778U JP S5843836 Y2 JPS5843836 Y2 JP S5843836Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- horizontally
- horizontal
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
本考案は、筐体へ水平に取り付けるプリント回路基板に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed circuit board that is mounted horizontally in a housing.
従来ラックに実装する筐体へ水平に取り付けるプリント
回路基板の基板上に取り付けられた半導体抵抗等の電子
部品より発生する熱の放熱構造として、第１図のように
、前面側に空気流入口を設け、筐体上部より排出する構
造、あるいは第２図のように、左右の側面より空気を流
入させ筐体上部より排出する構造（前面側に操作スイッ
チ、ツマミ等が設けられ空気流入口が設けられない場合
）等がった。Conventionally, as shown in Figure 1, an air inlet is provided on the front side as a heat dissipation structure for the heat generated by electronic components such as semiconductor resistors mounted on the board of a printed circuit board that is mounted horizontally on a chassis mounted on a rack. A structure in which air is provided and discharged from the top of the case, or a structure in which air flows in from the left and right sides and is discharged from the top of the case as shown in Figure 2 (operation switches, knobs, etc. are provided on the front side, and an air inlet is provided. (if not) etc.
このような構造であると、筐体内にプリント回路基板を
水平に複数枚取り付ける場合、あるいは水平に１枚のみ
取り付けた筐体を何段も重ねてラック等に実装するには
、個々の筐体にファンを設は強制的に熱を排出するか、
各筐体間に空間を設けなければならない。With this structure, if multiple printed circuit boards are installed horizontally in the case, or if only one board is installed horizontally and stacked in multiple tiers and mounted on a rack, etc., it is difficult to install each case individually. Install a fan to force the heat out, or
Space must be provided between each housing.
また、第３図のように、水平のプリント回路基板に垂直
にサブプリント回路基板をコネクタあるいは接続端子等
でとりつけた場合は放熱効果が一層劣る。Furthermore, as shown in FIG. 3, when a sub-printed circuit board is attached vertically to a horizontal printed circuit board using a connector or connection terminal, the heat dissipation effect is even worse.
本考案は、水平に取り付けたプリント回路基板に通風孔
を設けることによって上記欠点を除去し、より高密度実
装で信頼性のある装置を提供するものである。The present invention eliminates the above drawbacks by providing ventilation holes in horizontally mounted printed circuit boards, thereby providing a more densely packed and reliable device.
本考案の一実施例を第４図を参照して説明する。An embodiment of the present invention will be described with reference to FIG.
第４図は本考案の一実施例の筐体の斜視図で、１は水平
に実装した水平プリント回路基板、２は垂直に実装して
水平プリント回路基板１と接続するサブプリント回路基
板、３はサブプリント回路基板接続用のコネクタ、４は
発熱量の大きい部品、５は水平プリント回路基板１に設
けた本考案に係る通風孔である。FIG. 4 is a perspective view of a housing of an embodiment of the present invention, in which 1 is a horizontal printed circuit board mounted horizontally, 2 is a sub-printed circuit board mounted vertically and connected to the horizontal printed circuit board 1, and 3 Reference numeral 4 indicates a connector for connecting a sub-printed circuit board, 4 indicates a component that generates a large amount of heat, and 5 indicates a ventilation hole according to the present invention provided in the horizontal printed circuit board 1.
第４図の如く水平に実装したプリント回路基板に通風孔
を明けることによって、筐体の上下方向への通風が良好
となり理にかなった自然空冷状態を生ヒさせる効果があ
る。By providing ventilation holes in the horizontally mounted printed circuit board as shown in FIG. 4, ventilation in the vertical direction of the casing is improved, which has the effect of creating a reasonable natural air cooling condition.
この通風孔は、発熱量の大きい電子部品４の部分に集中
的に設けたり、サブプリント回路基板接続用コネクタに
沿って多数明けたり臨機に穴の数、大きさを変えること
ができる。The number and size of the ventilation holes can be changed as needed, such as by providing the ventilation holes in a concentrated manner in the electronic component 4 that generates a large amount of heat, or by providing a large number of holes along the connector for connecting the sub-printed circuit board.
以上のように穴明すると、何段も同じ筐体を重ねてラッ
クに収容した場合には、最下部に空気流入口あるいはフ
ァンを設けて筐体の下から上へ通しで強制空冷をするこ
とによって経済的に冷却効果を上げることができる。With the holes drilled above, if multiple tiers of the same chassis are stacked and stored in a rack, an air inlet or fan should be provided at the bottom to force air cooling from the bottom to the top of the chassis. The cooling effect can be improved economically.
本考案は筐体内へ水平にプリント回路基板を何枚も取り
付けた場合にも適用できることはいうまでもない。It goes without saying that the present invention can also be applied to cases where a number of printed circuit boards are installed horizontally within the housing.
また、ラックに実装する筐体にかぎらず、卓上型、据置
型等各種装置において水平にプリント回路基板を取り付
ける際の放熱通風に応用することができる。In addition, the present invention can be applied not only to a case mounted on a rack, but also to heat dissipation and ventilation when horizontally mounting a printed circuit board in various devices such as a tabletop type and a stationary type.
第１図、第２図は従来の水平に取り付けるプリント回路
基板を有する筐体と通風状況を示す斜視図、第３図は水
平プリント回路基板に垂直のプリント回路基板を接続す
る装置の斜視図、第４図は本考案の一実施例を示す筐体
の斜視図である。
なお図において、１・・・・・・水平に実装したプリン
ト回路基板、２・・・・・・垂直に実装して１と接続す
るサブプリント回路基板、３・・・・・・サブプリント
回路基板接続用コネクタ、４・・・・・・発熱量の大き
い部品、５・・・・・・１に設けた本考案に係る通風孔
である。Figures 1 and 2 are perspective views showing a conventional case with a horizontally mounted printed circuit board and the ventilation situation; Figure 3 is a perspective view of a device for connecting a vertical printed circuit board to a horizontal printed circuit board; FIG. 4 is a perspective view of a casing showing an embodiment of the present invention. In the figure, 1... printed circuit board mounted horizontally, 2... sub printed circuit board mounted vertically and connected to 1, 3... sub printed circuit A ventilation hole according to the present invention provided in a connector for connecting a board, 4...a component that generates a large amount of heat, and 5...1.
Claims (1)
前記水平プリント回路基板に垂直に接続される垂直プリ
ント回路基板とを具備し、前記水平プリント回路基板で
前記垂直プリント回路基板の実装部分周辺に冷却用通風
孔を設けたことを特徴とするプリント回路基板。a horizontal printed circuit board that is mounted horizontally to the housing;
A printed circuit comprising: a vertical printed circuit board vertically connected to the horizontal printed circuit board, wherein the horizontal printed circuit board is provided with cooling ventilation holes around a mounting portion of the vertical printed circuit board. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978136407U JPS5843836Y2 (en) | 1978-10-03 | 1978-10-03 | printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978136407U JPS5843836Y2 (en) | 1978-10-03 | 1978-10-03 | printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5552896U JPS5552896U (en) | 1980-04-09 |
| JPS5843836Y2 true JPS5843836Y2 (en) | 1983-10-04 |
Family
ID=29107603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978136407U Expired JPS5843836Y2 (en) | 1978-10-03 | 1978-10-03 | printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5843836Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0544205U (en) * | 1991-11-21 | 1993-06-15 | 京三電機株式会社 | Fuel filter |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4720198U (en) * | 1971-08-19 | 1972-11-07 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4838343U (en) * | 1971-09-10 | 1973-05-11 |
-
1978
- 1978-10-03 JP JP1978136407U patent/JPS5843836Y2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4720198U (en) * | 1971-08-19 | 1972-11-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5552896U (en) | 1980-04-09 |
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