JPH07336083A - Shielding cover - Google Patents
Shielding coverInfo
- Publication number
- JPH07336083A JPH07336083A JP14541294A JP14541294A JPH07336083A JP H07336083 A JPH07336083 A JP H07336083A JP 14541294 A JP14541294 A JP 14541294A JP 14541294 A JP14541294 A JP 14541294A JP H07336083 A JPH07336083 A JP H07336083A
- Authority
- JP
- Japan
- Prior art keywords
- bent
- coupling hole
- edge part
- claw
- case frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子機器の配線基板を
電気的にシールドする場合に用いられるシールドカバー
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield cover used for electrically shielding a wiring board of electronic equipment.
【0002】[0002]
【従来の技術】電子機器に於いて、外部の電気的ノイズ
により誤動作する様な回路に関しては、回路内にノイズ
が侵入しない様に電気的にシールドされている。2. Description of the Related Art In electronic equipment, circuits that malfunction due to external electrical noise are electrically shielded so that noise does not enter the circuitry.
【0003】従来の電気的シールドは、シールドの対象
となる配線基板をシールドケース内に収納し、配線基板
を収納したシールドケースを機器に組込む構造であっ
た。The conventional electric shield has a structure in which a wiring board to be shielded is housed in a shield case and the shield case housing the wiring board is incorporated in a device.
【0004】[0004]
【発明が解決しようとする課題】近年に於いて電子機器
は益々小型化、薄型化が進んでおり、配線基板等の収納
スペースも著しく狭小となっている。上記した従来のシ
ールドケースを用いた電気的シールドでは、シールドケ
ースの形状が配線基板に対して大きく、又配線基板のシ
ールドケースへの取付けは、螺子止、半田付けの手段に
よっており、作業性も悪いものであった。In recent years, electronic devices have become smaller and thinner, and the storage space for wiring boards and the like has become remarkably narrow. In the electric shield using the above-mentioned conventional shield case, the shape of the shield case is large with respect to the wiring board, and the wiring board is attached to the shield case by means of screwing and soldering, and workability is also improved. It was bad.
【0005】本発明は斯かる実情に鑑み、形状の小さい
而も取付け作業の容易なシールドカバーを提供しようと
するものである。In view of the above situation, the present invention aims to provide a shield cover having a small shape and easy to attach.
【0006】[0006]
【課題を解決するための手段】本発明は、配線基板の非
部品実装面側に設けられるシールドカバーに於いて、縁
部を折曲げ、該縁部にシールドカバーの被装着側に形成
した爪に係合可能な係合孔を穿設し、該係合孔の近傍に
基板側に傾斜する舌片を形成したことを特徴とするもの
である。SUMMARY OF THE INVENTION The present invention is a shield cover provided on the non-component mounting surface side of a wiring board, in which an edge is bent and a claw formed on the edge of the shield cover on the mounted side. Is formed with an engaging hole which is engageable with the tongue, and a tongue inclined toward the substrate side is formed in the vicinity of the engaging hole.
【0007】[0007]
【作用】シールドカバーの装着は縁部の係合孔を被装着
側の爪に係合させることで行い、舌片のバネ力が係合孔
と爪とのガタツキを抑止する。The shield cover is mounted by engaging the engaging hole at the edge with the claw on the mounted side, and the spring force of the tongue prevents the rattling between the engaging hole and the claw.
【0008】[0008]
【実施例】以下、図面を参照しつつ本発明の一実施例を
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【0009】図1、図2は本願発明に係るシールドカバ
ーを装着した基板ユニットを示している。1 and 2 show a substrate unit equipped with a shield cover according to the present invention.
【0010】電子回路が形成された配線基板1はアルミ
ダイカスト製のケースフレーム2により部品実装面を覆
われている。前記ケースフレーム2は電子機器の強度部
材を兼ねており、実装された部品に対応した凹凸が形成
され、前記ケースフレーム2の側面所要箇所、及び端面
所要箇所には後述するシールドカバー3を係着する為の
爪4を形成してある。前記配線基板1の非部品実装面に
は絶縁シート5を介在させた状態でシールドカバー3が
装着されている。A wiring board 1 on which an electronic circuit is formed has a component mounting surface covered with a case frame 2 made of aluminum die casting. The case frame 2 also serves as a strength member of an electronic device, and irregularities corresponding to mounted components are formed, and a shield cover 3 described later is attached to a required side surface and a required end surface of the case frame 2. Claws 4 for forming are formed. A shield cover 3 is attached to the non-component mounting surface of the wiring board 1 with an insulating sheet 5 interposed.
【0011】該シールドカバー3を図3〜図6に於いて
詳述する。The shield cover 3 will be described in detail with reference to FIGS.
【0012】該シールドカバー3は銅合金バネ材料の薄
板を曲げ、打抜き加工して形成する。薄板の側縁部6を
前記ケースフレーム2の幅より若干幅広の位置で直角に
折曲げ、更に内側に傾斜させ最後に下端が垂直になる
様、前記ケースフレーム2の形状に合わせて折曲げる。
対峙する垂直な下端の間隔は前記ケースフレーム2の幅
よりも若干狭幅となる様にしておく。前記側縁部6の傾
斜部に前記爪4と係合する係合孔7を穿設する。又、薄
板の端縁部8を前記ケースフレーム2の端面位置より若
干食出した位置で、前記ケースフレーム2の形状に合わ
せて直角に折曲げ、前記端縁部8にケースフレーム2の
端面に形成した爪4と係合する係合孔9を穿設する。The shield cover 3 is formed by bending and punching a thin plate of copper alloy spring material. The side edge portion 6 of the thin plate is bent at a position slightly wider than the width of the case frame 2 at a right angle, further tilted inward, and finally bent so that the lower end is vertical so as to fit the shape of the case frame 2.
The interval between the vertical lower ends facing each other is set to be slightly smaller than the width of the case frame 2. An engaging hole 7 that engages with the pawl 4 is formed in the inclined portion of the side edge portion 6. Further, at a position where the edge 8 of the thin plate slightly protrudes from the position of the end surface of the case frame 2, the edge 8 is bent at a right angle according to the shape of the case frame 2, and the edge 8 is attached to the end surface of the case frame 2. An engagement hole 9 that engages with the formed claw 4 is provided.
【0013】前記シールドカバー3の前記配線基板1と
対峙する面には逃げ孔、切欠等が適宜穿設され、前記係
合孔7、係合孔9と隣接した位置に舌片10が形成され
る。該舌片10は配線基板1側に傾斜する様基端で所要
角度に曲げられている。Escape holes, notches, etc. are appropriately formed on the surface of the shield cover 3 facing the wiring board 1, and a tongue piece 10 is formed at a position adjacent to the engaging holes 7 and 9. It The tongue piece 10 is bent at a required angle at the base end so as to incline toward the wiring board 1.
【0014】前記シールドカバー3を装着する場合は、
配線基板1とケースフレーム2とを重合させ、更に前記
配線基板1の非部品実装面に絶縁シート5を介在させた
状態で、前記シールドカバー3を前記ケースフレーム2
に嵌込む。前記側縁部6、端縁部8に穿設した前記係合
孔7、係合孔9が前記ケースフレーム2の爪4に係合
し、前記係合孔7、係合孔9と前記爪4との係合状態は
シールドカバー3自体のバネ性により保証される。When the shield cover 3 is attached,
The wiring board 1 and the case frame 2 are superposed, and the shield cover 3 is attached to the case frame 2 with the insulating sheet 5 interposed on the non-component mounting surface of the wiring board 1.
Fit in. The engaging hole 7 and the engaging hole 9 formed in the side edge portion 6 and the end edge portion 8 are engaged with the claw 4 of the case frame 2, and the engaging hole 7, the engaging hole 9 and the claw are formed. The engagement state with 4 is guaranteed by the spring property of the shield cover 3 itself.
【0015】又、前記係合孔7、係合孔9と前記爪4と
が係合した状態で、前記舌片10は前記絶縁シート5を
介して配線基板1に当接し撓んだ状態にあり、前記舌片
10のバネ力で前記係合孔7、係合孔9と前記爪4との
配線基板1に対する垂直方向のガタツキが抑止される。Further, in a state in which the engaging holes 7, 9 and the claw 4 are engaged with each other, the tongue piece 10 is in contact with the wiring board 1 via the insulating sheet 5 and is bent. Therefore, the spring force of the tongue piece 10 prevents the engagement hole 7, the engagement hole 9 and the claw 4 from rattling in the vertical direction with respect to the wiring board 1.
【0016】而して、前記シールドカバー3は螺子等使
用することなく簡単に取付けられ、而も配線基板1に対
して略密着した状態であるのでシールドカバー3の装着
に要するスペースは著しく小さくてよい。Since the shield cover 3 is easily attached without using screws or the like and is in close contact with the wiring board 1, the space required for mounting the shield cover 3 is extremely small. Good.
【0017】[0017]
【発明の効果】以上述べた如く本発明によれば、配線基
板に対して略密着して取付けられ、取付けは螺子止め、
半田付けを行うことなく簡単に取付けられるので占有空
間が小さく、取付け作業性に優れるという優れた効果を
発揮する。As described above, according to the present invention, the wiring board is mounted so as to be in close contact with the wiring board, and the mounting is performed by screwing,
Since it can be easily installed without soldering, it occupies a small space and exhibits excellent workability.
【図1】本発明の一実施例を装着した基板ユニットを示
す斜視図である。FIG. 1 is a perspective view showing a board unit to which an embodiment of the present invention is attached.
【図2】同前基板ユニットの断面図である。FIG. 2 is a cross-sectional view of the same board unit.
【図3】該実施例に係るシールドカバーの底面図であ
る。FIG. 3 is a bottom view of the shield cover according to the embodiment.
【図4】該シールドカバーの側面図である。FIG. 4 is a side view of the shield cover.
【図5】該シールドカバーの正面図である。FIG. 5 is a front view of the shield cover.
【図6】図3のA矢視図である。6 is a view on arrow A of FIG. 3. FIG.
1 配線基板 2 ケースフレーム 3 シールドカバー 4 爪 5 絶縁シート 6 側縁部 7 係合孔 8 端縁部 9 係合孔 10 舌片 1 Wiring Board 2 Case Frame 3 Shield Cover 4 Claw 5 Insulating Sheet 6 Side Edge 7 Engagement Hole 8 End Edge 9 Engagement Hole 10 Tongue Piece
フロントページの続き (72)発明者 佐藤 武志 東京都中野区東中野三丁目14番20号 国際 電気株式会社内 (72)発明者 高橋 隆一 東京都中野区東中野三丁目14番20号 国際 電気株式会社内Front page continuation (72) Inventor Takeshi Sato 3-14-20 Higashi-Nakano, Nakano-ku, Tokyo Kokusai Electric Inc. (72) Inventor Ryuichi Takahashi 3-14-20 Higashi-Nakano, Nakano-ku, Tokyo Kokusai Electric Co., Ltd.
Claims (1)
シールドカバーに於いて、縁部を折曲げ、該縁部にシー
ルドカバーの被装着側に形成した爪に係合可能な係合孔
を穿設し、該係合孔の近傍に基板側に傾斜する舌片を形
成したことを特徴とするシールドカバー。1. A shield cover provided on the non-component mounting surface side of a wiring board, wherein an edge portion is bent, and an engagement hole engageable with a claw formed on the side of the shield cover to be mounted on the edge portion. And a tongue that is inclined toward the substrate is formed in the vicinity of the engagement hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14541294A JPH07336083A (en) | 1994-06-03 | 1994-06-03 | Shielding cover |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14541294A JPH07336083A (en) | 1994-06-03 | 1994-06-03 | Shielding cover |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07336083A true JPH07336083A (en) | 1995-12-22 |
Family
ID=15384666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14541294A Pending JPH07336083A (en) | 1994-06-03 | 1994-06-03 | Shielding cover |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07336083A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008305929A (en) * | 2007-06-07 | 2008-12-18 | Kikuchiseisakusho Co Ltd | Housing of compact electronic equipment and manufacturing method thereof |
JP2010102940A (en) * | 2008-10-23 | 2010-05-06 | Jimbo Electric Co Ltd | Switch device |
-
1994
- 1994-06-03 JP JP14541294A patent/JPH07336083A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008305929A (en) * | 2007-06-07 | 2008-12-18 | Kikuchiseisakusho Co Ltd | Housing of compact electronic equipment and manufacturing method thereof |
JP2010102940A (en) * | 2008-10-23 | 2010-05-06 | Jimbo Electric Co Ltd | Switch device |
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