JPS58180691U - housing - Google Patents
housingInfo
- Publication number
- JPS58180691U JPS58180691U JP7742282U JP7742282U JPS58180691U JP S58180691 U JPS58180691 U JP S58180691U JP 7742282 U JP7742282 U JP 7742282U JP 7742282 U JP7742282 U JP 7742282U JP S58180691 U JPS58180691 U JP S58180691U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- chassis
- circuit board
- motherboard
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来装置の構成を示す斜視図、第2は本考案の
一実施例を示す斜視図である。
21・・・筐体フレーム、22・・・前面扉、23・・
・背面扉、24・・・排気口、25・・・電源モジュー
ル、26・・・シャシ、−27・・・プリント基板、2
8・・・送風装置、29・・・ダクト。FIG. 1 is a perspective view showing the configuration of a conventional device, and FIG. 2 is a perspective view showing an embodiment of the present invention. 21... Housing frame, 22... Front door, 23...
・Rear door, 24...Exhaust port, 25...Power supply module, 26...Chassis, -27...Printed circuit board, 2
8...Blower device, 29...Duct.
Claims (1)
したシャシを収納した筐体において、前記シャシにはプ
リント基板挿抜方向面を除く一対の対向側面にそれぞれ
配線用のマザーボードを設けると共にこのマザーボード
にはそれぞれ前記プリント基板の七装着位置に対応して
プリント基板の側部を保持して電気的に接続する横挿入
型のゼロ・インサージョン・フォースΦコネクタを取り
付け、また、筐体フレームには前記シャシのプリント基
板挿抜方向に外気を送風する送風機構を設けて前記扉又
は背面扉に取付けられたエアーダクトを通して冷却通風
を行う構造とすることを特徴とする筐体。In a box-shaped housing frame that houses a chassis in which a plurality of printed circuit boards are mounted and held, the chassis is provided with a motherboard for wiring on a pair of opposing sides, excluding the surface in the direction of insertion and removal of the printed circuit boards, and a motherboard for wiring. A horizontal insertion type zero insertion force Φ connector that holds the side of the printed circuit board and connects it electrically is attached to each of the seven mounting positions of the printed circuit board. A casing characterized by having a structure in which a blowing mechanism is provided for blowing outside air in the direction of insertion and removal of a printed circuit board of the chassis, and cooling ventilation is carried out through an air duct attached to the door or the rear door.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7742282U JPS58180691U (en) | 1982-05-26 | 1982-05-26 | housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7742282U JPS58180691U (en) | 1982-05-26 | 1982-05-26 | housing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58180691U true JPS58180691U (en) | 1983-12-02 |
Family
ID=30086681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7742282U Pending JPS58180691U (en) | 1982-05-26 | 1982-05-26 | housing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58180691U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677680A (en) * | 1992-06-25 | 1994-03-18 | Iwatsu Electric Co Ltd | Electronic equipment structure |
JP2014187229A (en) * | 2013-03-25 | 2014-10-02 | Nec Corp | Rack |
JP2018536963A (en) * | 2015-09-11 | 2018-12-13 | ユニコス・インコーポレイテッドYounicos, Inc. | Modular storage system |
JP2019197080A (en) * | 2018-05-07 | 2019-11-14 | コニカミノルタ株式会社 | Image forming apparatus and method for cooling components to be cooled |
JP2021076090A (en) * | 2019-11-12 | 2021-05-20 | 株式会社東芝 | Air blower and electronic device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53105319A (en) * | 1977-02-25 | 1978-09-13 | Hitachi Ltd | Highly density mounting frame for electronic components |
JPS547530A (en) * | 1977-06-20 | 1979-01-20 | Toshiba Corp | Communication failure detector |
JPS5626499A (en) * | 1979-06-13 | 1981-03-14 | Babcock & Wilcox Co | Machine for inserting and tripping circuit board of rack mount type |
JPS56122200A (en) * | 1980-02-29 | 1981-09-25 | Nippon Electric Co | Electronic circuit package mounting system |
-
1982
- 1982-05-26 JP JP7742282U patent/JPS58180691U/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53105319A (en) * | 1977-02-25 | 1978-09-13 | Hitachi Ltd | Highly density mounting frame for electronic components |
JPS547530A (en) * | 1977-06-20 | 1979-01-20 | Toshiba Corp | Communication failure detector |
JPS5626499A (en) * | 1979-06-13 | 1981-03-14 | Babcock & Wilcox Co | Machine for inserting and tripping circuit board of rack mount type |
JPS56122200A (en) * | 1980-02-29 | 1981-09-25 | Nippon Electric Co | Electronic circuit package mounting system |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677680A (en) * | 1992-06-25 | 1994-03-18 | Iwatsu Electric Co Ltd | Electronic equipment structure |
JP2014187229A (en) * | 2013-03-25 | 2014-10-02 | Nec Corp | Rack |
JP2018536963A (en) * | 2015-09-11 | 2018-12-13 | ユニコス・インコーポレイテッドYounicos, Inc. | Modular storage system |
JP2019197080A (en) * | 2018-05-07 | 2019-11-14 | コニカミノルタ株式会社 | Image forming apparatus and method for cooling components to be cooled |
JP2021076090A (en) * | 2019-11-12 | 2021-05-20 | 株式会社東芝 | Air blower and electronic device |
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