JP4118530B2 - Cooling device in the electronic equipment casing - Google Patents

Cooling device in the electronic equipment casing Download PDF

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Publication number
JP4118530B2
JP4118530B2 JP2001135791A JP2001135791A JP4118530B2 JP 4118530 B2 JP4118530 B2 JP 4118530B2 JP 2001135791 A JP2001135791 A JP 2001135791A JP 2001135791 A JP2001135791 A JP 2001135791A JP 4118530 B2 JP4118530 B2 JP 4118530B2
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Prior art keywords
fans
electronic device
fan
cooling
electronic
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JP2001135791A
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JP2002329992A (en
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哲夫 平井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Description

【０００１】
【発明の属する技術分野】
本発明は、電子機器筐体内の空冷構造に関し、特に電子部品が実装されたプリント配線基盤（以下、ＰＫＧ）をブックシェルフ状に収納するサブラックを複数段積み重ねて実装する電子機器筐体を、ファンを複数個使用して冷却する冷却装置におけるファンの運転方法に関する。
【０００２】
【従来の技術】
図４は従来の電子機器筐体内の冷却装置を示す断面図である。図において、電子部品５が実装されたＰＫＧ４と、ＰＫＧ４をブックシェルフ状に収納するサブラック３と、サブラック３を複数段積み重ねて実装する電子機器筐体１と、電子機器筐体１内を強制的に空冷するファンユニット２とから構成されている。
【０００３】
次に動作について説明する。電子部品５が実装されたＰＫＧ４を、ブックシェルフ状に収納するサブラック３を、複数段積み重ねて実装する電子機器筐体１内を、ファンユニット２内にある同一形状、同一回転数のファン２ａ、２ｂ、２ｃ、２ｄで下部から上部への空気流を起こし、電子部品５を強制冷却する。
【０００４】
【発明が解決しようとする課題】
従来の電子機器筐体内の冷却装置は以上のように構成されているので、壁近傍では空気流路の断面積が小さく，中央付近では空気流路の断面積が大きいので、ＰＫＧ部分の空気流れが速く中央部分の空気流れが遅いという問題点があった。その結果、壁近傍のファンを駆動する動力が無駄になり、騒音が大きくなるという問題点があった。
【０００５】
この発明は、上記のような問題点を解決するためになされたもので、電子機器筐体内の空気流れを均一にして、装置の電力消費量を低減し、騒音を低くすることを目的とする。
【０００６】
【課題を解決するための手段】
この発明に係る電子機器筐体内の冷却装置は、電子部品が実装されたプリント配線基盤をブックシェルフ状に収納するサブラックを複数段積み重ねて実装する電子機器筐体内を強制的に空冷する複数個のファンを有する電子機器筐体内の冷却装置において、複数個のファンの中で電子機器筐体の中央部分に位置するファンの風量を大きくし、電子機器筐体の側壁近傍に位置するファンの風量を小さくしたものである。
【０００７】
また、複数個のファンの中で電子機器筐体の中央部分に位置するファンの容量を大きくし、電子機器筐体の側壁近傍に位置するファンの容量を小さくしたものである。
【０００８】
また、複数個の同一形状のファンを有し、複数個の同一形状のファンの中で電子機器筐体の中央部に位置するファンの回転数を高くし、電子機器筐体の側壁近傍のファンの回転数を低くしたものである。
【０００９】
また、電子部品が実装されたプリント配線基盤をブックシェルフ状に収納するサブラックを複数段積み重ねて実装する電子機器筐体内を強制的に空冷する複数個のファンを有する電子機器筐体内の冷却装置において、複数個のファンの中でプリント配線基盤の密集する部分に位置するファンの風量を大きくし、他のファンの風量を小さくしたものである。
【００１０】
また、複数個の同一形状のファンを有し、複数個の同一形状のファンの中でプリント配線基盤の密集する部分に位置するファンの回転数を高くし、他のファンの回転数を低くしたものである。
【００１１】
また、プリント配線基盤の実装密度は電子機器筐体の中央部分が高く、複数個の同一形状のファンの中で電子機器筐体の中央部分に位置するファンの回転数を高くしたものである。
【００１２】
【発明の実施の形態】
以下、この発明の実施の形態を図面に基づいて説明する。
参考例１．
図１は参考例１を示す図で、電子機器筐体内の冷却装置を示す正面断面図である。図において、電子部品５が実装されたＰＫＧ４と、ＰＫＧ４をブックシェルフ状に収納するサブラック３と、サブラック３を複数段積み重ねて実装する電子機器筐体１と、電子機器筐体１内を強制的に空冷するファンユニット２と、その中に形状が大きく風量の大きいファン２ｂ，２ｃ、形状が小さく風量の小さいファン２ａ，２ｄから構成されている。
【００１３】
次に動作について説明する。電子部品５が実装されたＰＫＧ４を、ブックシェルフ状に収納するサブラック３を、複数段積み重ねて実装する電子機器筐体１内を、ファンユニット２内にある同一寸法のファン２ａ，２ｂ，２ｃ，２ｄで下部から上部への空気流を起こし、電子部品５を強制冷却する。通常ファンの流れ分布は扇状になるので、中央部分のファン２ｂ，２ｃはより多くの領域の空気を吸い込むことになり、壁側にあるファン２ａ，２ｄは、片側のみ扇状に空気を吸い込むことになるので、ファン２ａ，２ｄを小型にし、ファン２ｂ，２ｃを大型にすることによって装置内の流れを均一にする。
【００１４】
ファン２ａ，２ｄを小型にし、ファン２ｂ，２ｃを大型にすることによって装置内の流れが均一になり、装置の電力消費量が低減し、騒音が低くなる。
【００１５】
参考例２．
図２は参考例２を示す図で、電子機器筐体内の冷却装置を示す正面断面図である。図において、電子部品５が実装されたＰＫＧ４と、ＰＫＧ４をブックシェルフ状に収納するサブラック３と、サブラック３を複数段積み重ねて実装する電子機器筐体１と、電子機器筐体１内を強制的に空冷するファンユニット２と、その中に形状が同じでファン羽根の回転数の低いファン２ａ，２ｄ、形状が同じでファン羽根の回転数の高い２ｂ，２ｃから構成されている。
【００１６】
次に動作について説明する。電子部品５が実装されたＰＫＧ４を、ブックシェルフ状に収納するサブラック３を、複数段積み重ねて実装する電子機器筐体１内を、ファンユニット２内にある同一寸法のファン２ａ，２ｂ，２ｃ，２ｄで下部から上部への空気流を起こし、電子部品５を強制冷却する。通常ファンの流れ分布は扇状になるので、中央部分のファン２ｂ，２ｃはより多くの領域の空気を吸い込むことになり、壁側にあるファン２ａ，２ｄは、片側のみ扇状に空気を吸い込むことになるので、ファン２ａ，２ｄのファン羽根の回転数を低くし、ファン２ｂ，２ｃのファン羽根の回転数を高くすることによって装置内の流れを均一にする。
【００１７】
ファン２ａ，２ｄのファン羽根の回転数を低くし、ファン２ｂ，２ｃのファン羽根の回転数を高くすることによって装置内の流れが均一になり、装置の電力消費量が低減し、騒音が低くなる。
【００１８】
実施の形態１．
図３は実施の形態１を示す図で、電子機器筐体内の冷却装置を示す正面断面図である。図において、電子部品５が実装されたＰＫＧ４と、ＰＫＧ４をブックシェルフ状に収納するサブラック３と、サブラック３を複数段積み重ねて実装する電子機器筐体１と、電子機器筐体１内を強制的に空冷するファンユニット２と、その中に形状が同じでファン羽根の回転数の低いファン２ａ，２ｄ、形状が同じでファン羽根の回転数の高い２ｂ，２ｃから構成されている。そして、ＰＫＧ４の実装密度は電子機器筐体１の中央部分が高くなっている。
【００１９】
次に動作について説明する。電子部品５が実装されたＰＫＧ４を、ブックシェルフ状に収納するサブラック３を、複数段積み重ねて実装する電子機器筐体１内を、ファンユニット２内にある同一寸法のファン２ａ，２ｂ，２ｃ，２ｄで下部から上部への空気流を起こし、電子部品５を強制冷却する。ＰＫＧ４の実装密度が高い部分の空気流量を多くすることで効率的にＰＫＧ４を冷却するために、ファン２ａ，２ｄのファン羽根の回転数を低くし、ファン２ｂ，２ｃのファン羽根の回転数を高くする。
【００２０】
ＰＫＧ４の実装密度が高い部分を冷却するファン２ｂ，２ｃのファン羽根の回転数を高くし、ＰＫＧ４の実装密度が低い部分を冷却するファン２ａ，２ｄのファン羽根の回転数を低くすることにより、装置内の流れが均一になり、装置の電力消費量が低減し、騒音が低くなる。
【００２１】
上述の実施の形態では、ＰＫＧ４の実装密度が高い部分を冷却するファン２ｂ，２ｃのファン羽根の回転数を高くし、ＰＫＧ４の実装密度が低い部分を冷却するファン２ａ，２ｄのファン羽根の回転数を低くするものを示したが、要はＰＫＧ４の実装密度が高い部分を冷却するファンの風量を大きくし、ＰＫＧ４の実装密度が低い部分を冷却するファンの風量を小さくすることである。
【００２２】
【発明の効果】
以上のように、この発明に係る電子機器筐体内の冷却装置によれば、電子機器筐体内の空気流れを均一にするように構成したので、装置の電力消費量を低減でき、騒音を低くする効果がある。
【図面の簡単な説明】
【図１】 参考例１を示す図で、電子機器筐体内の冷却装置を示す正面断面図である。
【図２】 参考例２を示す図で、電子機器筐体内の冷却装置を示す正面断面図である。
【図３】 実施の形態１を示す図で、電子機器筐体内の冷却装置を示す正面断面図である。
【図４】 従来の電子機器筐体内の冷却装置を示す正面断面図である。
【符号の説明】
１ 電子機器筐体、２ ファンユニット、２ａ，２ｂ，２ｃ，２ｄ ファン、３ サブラック、４ ＰＫＧ、５ 電子部品。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an air-cooling structure in an electronic device casing, and in particular, an electronic device casing in which a plurality of subracks in which printed wiring boards (hereinafter referred to as PKG) on which electronic components are mounted are stored in a book shelf shape are stacked and mounted. The present invention relates to a method of operating a fan in a cooling device that cools by using a plurality of fans.
[0002]
[Prior art]
FIG. 4 is a cross-sectional view showing a cooling device in a conventional electronic device casing. In the figure, a PKG 4 on which an electronic component 5 is mounted, a subrack 3 for storing the PKG 4 in a bookshelf shape, an electronic device case 1 in which the subrack 3 is stacked and mounted, and an inside of the electronic device case 1 The fan unit 2 is forcibly air-cooled.
[0003]
Next, the operation will be described. A fan 2a having the same shape and the same number of revolutions as that in the fan unit 2 is provided in the electronic device housing 1 in which the sub-rack 3 for storing the PKG 4 on which the electronic components 5 are mounted in a book shelf shape is stacked and mounted. 2b, 2c and 2d cause an air flow from the lower part to the upper part, and the electronic component 5 is forcibly cooled.
[0004]
[Problems to be solved by the invention]
Since the conventional cooling device in the electronic device casing is configured as described above, since the cross-sectional area of the air flow path is small near the wall and the cross-sectional area of the air flow path is large near the center, the air flow in the PKG portion However, there was a problem that the air flow in the central part was slow. As a result, there is a problem that the power for driving the fan near the wall is wasted and the noise is increased.
[0005]
The present invention has been made to solve the above-described problems, and aims to make the air flow in the electronic device casing uniform, reduce the power consumption of the apparatus, and reduce the noise. .
[0006]
[Means for Solving the Problems]
A cooling device in an electronic device casing according to the present invention includes a plurality of devices for forcibly air-cooling an electronic device casing in which a plurality of subracks that house printed wiring boards on which electronic components are mounted are stacked and mounted. In a cooling device in an electronic device casing having multiple fans, among the plurality of fans, the airflow of the fan located in the central portion of the electronic device casing is increased, and the airflow of the fan located in the vicinity of the side wall of the electronic device casing Is made smaller.
[0007]
Further, among the plurality of fans, the capacity of the fan located in the central portion of the electronic device casing is increased, and the capacity of the fan positioned near the side wall of the electronic equipment casing is decreased.
[0008]
In addition, a plurality of fans having the same shape, and among the plurality of fans having the same shape, the number of rotations of the fan located at the center of the electronic device casing is increased so that the fans near the side walls of the electronic device casing The number of revolutions is reduced.
[0009]
In addition, a cooling device in an electronic equipment casing having a plurality of fans for forcibly cooling the inside of the electronic equipment casing, in which a plurality of subracks for storing printed wiring boards on which electronic components are mounted are stored in a book shelf shape. In this example, the air volume of the fans located in the densely packed portion of the printed wiring board among the plurality of fans is increased and the air volume of the other fans is decreased.
[0010]
In addition, it has a plurality of fans of the same shape, and among the plurality of fans of the same shape, the number of rotations of the fans located in the densely packed portion of the printed wiring board is increased, and the number of rotations of other fans is decreased. Is.
[0011]
Further, the mounting density of the printed wiring board is high in the central portion of the electronic device casing, and among the plurality of fans having the same shape, the rotational speed of the fan located in the central portion of the electronic device casing is increased.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
Reference Example 1
FIG. 1 is a diagram showing a reference example 1, and is a front sectional view showing a cooling device in an electronic device casing. In the figure, a PKG 4 on which an electronic component 5 is mounted, a subrack 3 for storing the PKG 4 in a bookshelf shape, an electronic device case 1 in which the subrack 3 is stacked and mounted, and an inside of the electronic device case 1 The fan unit 2 is forcibly cooled by air, the fans 2b and 2c have a large shape and a large air volume, and the fans 2a and 2d have a small shape and a small air volume.
[0013]
Next, the operation will be described. Fans 2a, 2b, and 2c of the same size in the fan unit 2 are mounted in the electronic device housing 1 in which the sub-rack 3 that stores the PKG 4 on which the electronic components 5 are mounted is stacked in a plurality of stages. , 2d causes an air flow from the lower part to the upper part to forcibly cool the electronic component 5. Since the fan flow distribution is generally fan-shaped, the fans 2b and 2c in the central portion suck air in a larger area, and the fans 2a and 2d on the wall side suck air in only one side. Therefore, the fans 2a and 2d are reduced in size, and the fans 2b and 2c are increased in size to make the flow in the apparatus uniform.
[0014]
By making the fans 2a and 2d small and making the fans 2b and 2c large, the flow in the apparatus becomes uniform, the power consumption of the apparatus is reduced, and the noise is reduced.
[0015]
Reference Example 2
FIG. 2 is a diagram showing a reference example 2, and is a front sectional view showing a cooling device in the electronic device casing. In the figure, a PKG 4 on which an electronic component 5 is mounted, a subrack 3 for storing the PKG 4 in a bookshelf shape, an electronic device case 1 in which the subrack 3 is stacked and mounted, and an inside of the electronic device case 1 The fan unit 2 is forcibly cooled by air, the fans 2a and 2d having the same shape and the low fan blade rotation speed, and the fan blades 2b and 2c having the same shape and the high fan blade rotation speed.
[0016]
Next, the operation will be described. Fans 2a, 2b, and 2c of the same size in the fan unit 2 are mounted in the electronic device housing 1 in which the sub-rack 3 that stores the PKG 4 on which the electronic components 5 are mounted is stacked in a plurality of stages. , 2d causes an air flow from the lower part to the upper part to forcibly cool the electronic component 5. Since the fan flow distribution is generally fan-shaped, the fans 2b and 2c in the central portion suck air in a larger area, and the fans 2a and 2d on the wall side suck air in only one side. Therefore, the fan blades of the fans 2a and 2d are reduced in rotation speed, and the fan blades of the fans 2b and 2c are increased in rotation speed to make the flow in the apparatus uniform.
[0017]
By reducing the rotation speed of the fan blades of the fans 2a and 2d and increasing the rotation speed of the fan blades of the fans 2b and 2c, the flow in the device becomes uniform, the power consumption of the device is reduced, and the noise is low. Become.
[0018]
Embodiment 1 FIG .
FIG. 3 shows the first embodiment and is a front sectional view showing the cooling device in the electronic device casing. In the figure, a PKG 4 on which an electronic component 5 is mounted, a subrack 3 for storing the PKG 4 in a bookshelf shape, an electronic device case 1 in which the subrack 3 is stacked and mounted, and an inside of the electronic device case 1 The fan unit 2 is forcibly cooled by air, the fans 2a and 2d having the same shape and the low fan blade rotation speed, and the fan blades 2b and 2c having the same shape and the high fan blade rotation speed. The mounting density of the PKG 4 is high in the central portion of the electronic device casing 1.
[0019]
Next, the operation will be described. Fans 2a, 2b, and 2c of the same size in the fan unit 2 are mounted in the electronic device housing 1 in which the sub-rack 3 that stores the PKG 4 on which the electronic components 5 are mounted is stacked in a plurality of stages. , 2d causes an air flow from the lower part to the upper part to forcibly cool the electronic component 5. In order to efficiently cool the PKG4 by increasing the air flow rate in the portion where the mounting density of the PKG4 is high, the rotation speed of the fan blades of the fans 2a and 2d is lowered, and the rotation speed of the fan blades of the fans 2b and 2c is reduced. Make it high.
[0020]
By increasing the rotation speed of the fan blades of the fans 2b and 2c for cooling the portion where the mounting density of the PKG4 is high, and decreasing the rotation speed of the fan blades of the fans 2a and 2d for cooling the portion where the mounting density of the PKG4 is low, The flow in the device is uniform, the power consumption of the device is reduced, and the noise is reduced.
[0021]
In the above-described embodiment, the rotation speed of the fan blades of the fans 2b and 2c that cool the portion where the mounting density of the PKG4 is high is increased, and the rotation of the fan blades of the fans 2a and 2d that cool the portion where the mounting density of the PKG4 is low. Although the number is reduced, the point is to increase the air volume of the fan that cools the portion where the mounting density of PKG4 is high, and to decrease the air volume of the fan that cools the portion where the mounting density of PKG4 is low.
[0022]
【The invention's effect】
As described above, according to the cooling device in the electronic device casing according to the present invention, since the air flow in the electronic device casing is configured to be uniform, the power consumption of the device can be reduced and the noise can be reduced. effective.
[Brief description of the drawings]
FIG. 1 is a front sectional view showing a cooling device in an electronic device casing, showing a reference example 1;
FIG. 2 is a front cross-sectional view showing a cooling device in an electronic device casing, showing a reference example 2;
FIG. 3 shows the first embodiment and is a front cross-sectional view showing a cooling device in the electronic device casing;
FIG. 4 is a front sectional view showing a cooling device in a conventional electronic device casing.
[Explanation of symbols]
1 Electronic equipment housing, 2 fan units, 2a, 2b, 2c, 2d fan, 3 subrack, 4 PKG, 5 electronic components.

Claims (1)

電子部品が実装されたプリント配線基盤をブックシェルフ状に収納するサブラックを複数段積み重ねて実装する電子機器筐体内を強制的に空冷する複数個のファンを有する電子機器筐体内の冷却装置において、
前記プリント配線基盤の実装密度は前記電子機器筐体の中央部分が高く、
前記複数個のファンは同一寸法であり、
前記複数個の同一寸法のファンの中で前記電子機器筐体の中央部分に位置し、前記プリント配線基盤の実装密度の高い部分を冷却するファンの羽根の回転数を、前記複数個の同一寸法のファンの中で前記電子機器筐体の壁側に位置し、前記プリント配線基盤の実装密度の低い部分を冷却するファンの羽根の回転数よりも高くしたことを特徴とする電子機器筐体内の冷却装置。In a cooling device in an electronic device housing having a plurality of fans for forcibly cooling the inside of the electronic device housing in which a plurality of stages of subrack storing a printed wiring board on which electronic components are mounted is stored in a book shelf shape.
The mounting density of the printed wiring board is high in the central portion of the electronic device casing,
The plurality of fans have the same dimensions ;
Located in the central portion of the electronic apparatus housing in fan of the plurality of the same size, the rotational speed of the blades of the fan for cooling the portion with high mounting density of the printed wiring board, the plurality of same size In the electronic device casing, the number of rotations of the fan blades for cooling the low-density portion of the printed wiring board that is located on the wall side of the electronic device casing among the fans is Cooling system.
JP2001135791A 2001-05-07 2001-05-07 Cooling device in the electronic equipment casing Expired - Fee Related JP4118530B2 (en)

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JP2001135791A JP4118530B2 (en) 2001-05-07 2001-05-07 Cooling device in the electronic equipment casing

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JP2001135791A JP4118530B2 (en) 2001-05-07 2001-05-07 Cooling device in the electronic equipment casing

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JP4118530B2 true JP4118530B2 (en) 2008-07-16

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JP5606236B2 (en) * 2010-09-15 2014-10-15 株式会社東芝 Case equipment for electronic equipment
JP6051886B2 (en) * 2013-01-22 2016-12-27 富士通株式会社 Container type data center and control method of container type data center

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