JPS6320450U - - Google Patents
Info
- Publication number
- JPS6320450U JPS6320450U JP11396886U JP11396886U JPS6320450U JP S6320450 U JPS6320450 U JP S6320450U JP 11396886 U JP11396886 U JP 11396886U JP 11396886 U JP11396886 U JP 11396886U JP S6320450 U JPS6320450 U JP S6320450U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- heat dissipation
- support member
- heat sink
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 3
- 238000005452 bending Methods 0.000 description 2
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本案の一実施例における使用状態の断
面図で、第５図のＡ―Ａ部断面図である。但し、
第５図はプリント板と放熱板支持部材は示されて
いない。第２図は放熱板支持部材の折り曲げ形成
前の平面図、第３図は第２図の正面図、第４図は
放熱板支持部材の折り曲げ形成後の正面図、第５
図は放熱板に半導体を取付けた状態の正面図、第
６図は第５図の右側面図である。
１３はプリント板、１２は半導体、１１は放熱
板、１８は端部である下面、２８はコ状部、２２
，２２は凹部、２３，２３は凸部、３０は中央底
部、３６，３５は取付け孔、２９は足部を示す。
FIG. 1 is a sectional view of an embodiment of the present invention in a state of use, and is a sectional view taken along the line AA in FIG. however,
In FIG. 5, the printed board and the heat sink support member are not shown. FIG. 2 is a plan view of the heat sink support member before bending, FIG. 3 is a front view of FIG. 2, FIG. 4 is a front view of the heat sink support member after bending, and FIG.
The figure is a front view of the semiconductor mounted on the heat sink, and FIG. 6 is a right side view of FIG. 5. 13 is a printed board, 12 is a semiconductor, 11 is a heat sink, 18 is a bottom surface which is an end, 28 is a U-shaped part, 22
, 22 are concave portions, 23 and 23 are convex portions, 30 is a central bottom portion, 36 and 35 are attachment holes, and 29 is a foot portion.
Claims (1)
取付けられ、前記半導体の放熱作用を有する放熱
板の支持部材であつて、前記放熱板における前記
プリント板に衝合する端部から挿入される弾性コ
状部と、前記放熱板に設けられた凹部又は凸部に
弾性コ状部内に対応して設けられた凸部又は凹部
と、前記弾性コ状部の中央底部から延出され、前
記プリント板に穿設された取付け孔を通り、前記
プリント板の反対面へ挿通されて弾性係合される
足部とから成る放熱板支持部材。 A support member for a heat sink that is attached in contact with a semiconductor soldered to a printed board and has a heat dissipation effect for the semiconductor, and is an elastic core that is inserted from an end of the heat sink that abuts against the printed board. a convex portion or a concave portion provided in the elastic U-shaped portion corresponding to a concave portion or convex portion provided on the heat dissipation plate; A heat dissipation plate support member comprising a foot portion which passes through a drilled mounting hole and is inserted into the opposite surface of the printed board and elastically engaged with the foot portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11396886U JPS6320450U (en) | 1986-07-24 | 1986-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11396886U JPS6320450U (en) | 1986-07-24 | 1986-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320450U true JPS6320450U (en) | 1988-02-10 |
Family
ID=30996269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11396886U Pending JPS6320450U (en) | 1986-07-24 | 1986-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320450U (en) |
-
1986
- 1986-07-24 JP JP11396886U patent/JPS6320450U/ja active Pending