JPH0323991U - - Google Patents
Info
- Publication number
- JPH0323991U JPH0323991U JP8520189U JP8520189U JPH0323991U JP H0323991 U JPH0323991 U JP H0323991U JP 8520189 U JP8520189 U JP 8520189U JP 8520189 U JP8520189 U JP 8520189U JP H0323991 U JPH0323991 U JP H0323991U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling plate
- duct
- liquid refrigerant
- rectangular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims 3
- 239000003507 refrigerant Substances 0.000 claims 3
- 230000003746 surface roughness Effects 0.000 claims 1
- 238000011144 upstream manufacturing Methods 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は、本考案の一実施例を示す冷却板とエ
レクトロニクスモジユールの位置関係を抜き出し
た透視図、第２図は第１図の断面ＡＡを示す断面
図、第３図は第２図のＣ部の拡大図、第４図は第
１図の断面ＢＢを示す断面図、第５図は第４図の
Ｄ部の拡大図、第６図は本考案及び従来案に共通
の電子機器の外観図、第７図は従来の冷却板とエ
レクトロニクスモジユールの位置関係を抜き出し
た透視図、第８図は第７図の断面ＥＥを示す断面
図、第９図は第８図のＦ部の拡大図である。
図に於いて、１……エレクトロニクスモジユー
ル、２……冷却板、２ａ……流路、２ｂ……ダク
ト、３……電子機器本体を示す。尚、各図中同一
符号は同一又は相当部分を示す。
FIG. 1 is a perspective view showing the positional relationship between a cooling plate and an electronics module showing an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along section AA in FIG. 1, and FIG. FIG. 4 is an enlarged view of section C in FIG. 1, FIG. 5 is an enlarged view of section D in FIG. 4, and FIG. 6 is an electronic device common to the present invention and the conventional method. , FIG. 7 is a perspective view showing the positional relationship between the conventional cooling plate and the electronics module, FIG. 8 is a sectional view showing section EE in FIG. 7, and FIG. 9 is section F in FIG. 8. It is an enlarged view of. In the figure, 1...electronics module, 2...cooling plate, 2a...channel, 2b...duct, 3...electronic device main body. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
いた電子機器に於いて、電子回路を高密度で実装
し冷却を必要とする直方体形状をなす複数個のエ
レクトロニクスモジユールと、内部に矩形の液冷
媒の流路と上記矩形の流路に対し全周薄肉をなす
ダクトを有する冷却板と、上記冷却板のダクトと
上記エレクトロニクスモジユールとを微少すき間
を持たせて配置する電子機器本体とで構成され、
上記冷却板のダクトの上記エレクトロニクスモジ
ユールとの接触面の面粗さを液冷媒の上流側で粗
くした間接冷却用冷却板を用いたことを特徴とす
る電子機器。 In electronic equipment that uses an indirect cooling method using liquid refrigerant as a cooling method, there are multiple electronics modules in the shape of a rectangular parallelepiped in which electronic circuits are densely mounted and require cooling, and a rectangular liquid refrigerant inside. Consisting of a cooling plate having a flow path and a duct having a thin wall all around the rectangular flow path, and an electronic device main body in which the duct of the cooling plate and the electronics module are arranged with a slight gap,
An electronic device characterized in that an indirect cooling cooling plate is used in which the surface roughness of the contact surface of the cooling plate duct with the electronics module is made rough on the upstream side of the liquid refrigerant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8520189U JPH0323991U (en) | 1989-07-20 | 1989-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8520189U JPH0323991U (en) | 1989-07-20 | 1989-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323991U true JPH0323991U (en) | 1991-03-12 |
Family
ID=31634197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8520189U Pending JPH0323991U (en) | 1989-07-20 | 1989-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323991U (en) |
-
1989
- 1989-07-20 JP JP8520189U patent/JPH0323991U/ja active Pending
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