JPS624137U - - Google Patents
Info
- Publication number
- JPS624137U JPS624137U JP9513985U JP9513985U JPS624137U JP S624137 U JPS624137 U JP S624137U JP 9513985 U JP9513985 U JP 9513985U JP 9513985 U JP9513985 U JP 9513985U JP S624137 U JPS624137 U JP S624137U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- semiconductor element
- printed wiring
- metal plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims 1
Description
第１図乃至第９図は本考案の実施例を示し、第
１図は本考案に係る半導体素子の放熱構造の分解
斜視図、第２図は第１図の平面図、第３図は第１
図の断面図、第４図乃至第７図は放熱板４と金属
板３の接続に関する他の実施例を示す断面図、第
８図及び第９図は放熱板形状の他の実施例を示す
斜視図、第１０図は従来例を示す側面図。
１……半導体素子、２……印刷配線基板、３…
…金属板、４……放熱板、５……金属ビス、３ｂ
，３ｃ，４ｄ……接続部、８……金属バンド。
1 to 9 show embodiments of the present invention; FIG. 1 is an exploded perspective view of a heat dissipation structure for a semiconductor device according to the present invention; FIG. 2 is a plan view of FIG. 1; and FIG. 1
4 to 7 are cross-sectional views showing other embodiments of the connection between the heat sink 4 and the metal plate 3, and FIGS. 8 and 9 show other embodiments of the heat sink shape. FIG. 10 is a perspective view, and FIG. 10 is a side view showing a conventional example. 1... Semiconductor element, 2... Printed wiring board, 3...
...Metal plate, 4... Heat sink, 5... Metal screw, 3b
, 3c, 4d... Connection portion, 8... Metal band.
Claims (1)
ると共に、上記印刷配線基板の表面に配設した半
導体素子に放熱板を面接合して上記半導体素子及
び印刷配線基板を上記金属板と上記放熱板とによ
り挾持させ、かつ上記放熱板と上記金属板とを接
続部を介して接続させてなる半導体素子の放熱機
構。 A metal plate is brought into contact with the back surface of a non-metallic printed wiring board, and a heat sink is face-to-face bonded to the semiconductor element disposed on the front surface of the printed wiring board, so that the semiconductor element and the printed wiring board are connected to the metal plate and the heat radiation plate. A heat dissipation mechanism for a semiconductor element, which is sandwiched between the heat dissipation plate and the metal plate through a connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9513985U JPS624137U (en) | 1985-06-25 | 1985-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9513985U JPS624137U (en) | 1985-06-25 | 1985-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS624137U true JPS624137U (en) | 1987-01-12 |
Family
ID=30654119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9513985U Pending JPS624137U (en) | 1985-06-25 | 1985-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS624137U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07331912A (en) * | 1994-06-04 | 1995-12-19 | Yokohama Tokushu Senpaku Kk | Wheel stopper for bicycle parking device |
-
1985
- 1985-06-25 JP JP9513985U patent/JPS624137U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07331912A (en) * | 1994-06-04 | 1995-12-19 | Yokohama Tokushu Senpaku Kk | Wheel stopper for bicycle parking device |
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