JPS6394664U - - Google Patents
Info
- Publication number
- JPS6394664U JPS6394664U JP19088186U JP19088186U JPS6394664U JP S6394664 U JPS6394664 U JP S6394664U JP 19088186 U JP19088186 U JP 19088186U JP 19088186 U JP19088186 U JP 19088186U JP S6394664 U JPS6394664 U JP S6394664U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- blade
- dividing
- holes
- positions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第1図は、本考案の一実施例によるブレードの
平面図で、第2図はその断面図である。第3図は
本考案の他の実施例の平面図で、第4図はその断
面図である。
1,11……ブレード、2,12……貫通孔、
13……切粉収納部。
FIG. 1 is a plan view of a blade according to an embodiment of the present invention, and FIG. 2 is a sectional view thereof. FIG. 3 is a plan view of another embodiment of the present invention, and FIG. 4 is a sectional view thereof. 1, 11...Blade, 2,12...Through hole,
13...Chip storage section.
Claims (1)
ダイシングブレードにおいて、前記ブレード外周
部に外周端面と接しない位置に、複数個の貫通孔
を配置したことを特徴とする半導体ウエハダイシ
ングブレード。 1. A semiconductor wafer dicing blade for dividing a semiconductor wafer into individual elements, characterized in that a plurality of through holes are arranged on the outer circumference of the blade at positions not in contact with the outer circumferential end surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19088186U JPS6394664U (en) | 1986-12-10 | 1986-12-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19088186U JPS6394664U (en) | 1986-12-10 | 1986-12-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6394664U true JPS6394664U (en) | 1988-06-18 |
Family
ID=31144509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19088186U Pending JPS6394664U (en) | 1986-12-10 | 1986-12-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6394664U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019006112A (en) * | 2017-06-20 | 2019-01-17 | ジャーシン ワールダイア ダイアモンド ツールズ カンパニー,リミテッドJiaxing Worldia Diamond Tools, Co., Ltd. | Cutter wheel with chip exhaust hole array |
-
1986
- 1986-12-10 JP JP19088186U patent/JPS6394664U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019006112A (en) * | 2017-06-20 | 2019-01-17 | ジャーシン ワールダイア ダイアモンド ツールズ カンパニー,リミテッドJiaxing Worldia Diamond Tools, Co., Ltd. | Cutter wheel with chip exhaust hole array |