JPS6280335U - - Google Patents
Info
- Publication number
- JPS6280335U JPS6280335U JP17177185U JP17177185U JPS6280335U JP S6280335 U JPS6280335 U JP S6280335U JP 17177185 U JP17177185 U JP 17177185U JP 17177185 U JP17177185 U JP 17177185U JP S6280335 U JPS6280335 U JP S6280335U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- support plate
- view
- semiconductor
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
Description
第１図は本考案の一実施例を示し、ａはろう付
け前の各部材、ｂはろう付後の各部材を示す断面
図、第２図は本考案の対称となる半導体装置の断
面図、第３図は従来の半導体装置の欠点を示す断
面図、第４図本考案の異なる実施例を示し、ａは
支持板の平面図、ｂはａのＡ部断面図、ｃは半導
体基板の平面図、第５図はさらに別の実施例を示
し、ａは半導体基板、ｂは支持板のそれぞれの平
面図である。
１：半導体基板、２：支持板、９：ろう材、１
０：溝。
FIG. 1 shows an embodiment of the present invention, in which a is a cross-sectional view of each member before brazing, b is a cross-sectional view of each member after brazing, and FIG. 2 is a cross-sectional view of a semiconductor device to which the present invention is applied. , FIG. 3 is a sectional view showing the drawbacks of the conventional semiconductor device, and FIG. 4 shows a different embodiment of the present invention, where a is a plan view of the support plate, b is a sectional view of section A of a, and c is a cross-sectional view of the semiconductor substrate. The plan view and FIG. 5 show still another embodiment, in which a is a plan view of a semiconductor substrate and b is a plan view of a support plate. 1: Semiconductor substrate, 2: Support plate, 9: Brazing material, 1
0: Groove.
Claims (1)
るものにおいて、支持板の半導体基板側の表面が
、固着される半導体基板の外周に近接した外側に
環状の溝を備えたことを特徴とする半導体装置。 A semiconductor in which a semiconductor substrate and a support plate are fixed together using a brazing material, wherein the surface of the support plate on the semiconductor substrate side is provided with an annular groove on the outside close to the outer periphery of the semiconductor substrate to be fixed. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17177185U JPS6280335U (en) | 1985-11-08 | 1985-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17177185U JPS6280335U (en) | 1985-11-08 | 1985-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280335U true JPS6280335U (en) | 1987-05-22 |
Family
ID=31107705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17177185U Pending JPS6280335U (en) | 1985-11-08 | 1985-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280335U (en) |
-
1985
- 1985-11-08 JP JP17177185U patent/JPS6280335U/ja active Pending