JPS61144642U - - Google Patents
Info
- Publication number
- JPS61144642U JPS61144642U JP2784185U JP2784185U JPS61144642U JP S61144642 U JPS61144642 U JP S61144642U JP 2784185 U JP2784185 U JP 2784185U JP 2784185 U JP2784185 U JP 2784185U JP S61144642 U JPS61144642 U JP S61144642U
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- uniform
- thickness
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Description
第１図ａ，ｂは従来のロウ材テープを示す平面
図、Ａ―Ａ断面図、第２図ａ，ｂは従来のロウ材
片を示す平面図、Ｂ―Ｂ断面図である。第３図ａ
，ｂは本考案のロウ材テープの実施例を示す平面
図、Ｃ―Ｃ断面図、第４図ａ，ｂは本考案のロウ
材片の実施例を示す平面図、Ｄ―Ｄ断面図である
。
1A and 1B are a plan view and a sectional view taken along the line AA of a conventional brazing material tape, and FIGS. 2A and 2B are a plan view and a sectional view taken along the BB line showing a conventional brazing material piece. Figure 3a
, b are a plan view showing an embodiment of the brazing material tape of the present invention, and a sectional view taken along the line C-C. Figures 4a and b are a plan view and a sectional view showing an embodiment of the brazing material tape of the present invention, and a sectional view taken along the line DD. be.
Claims (1)
、厚みが一様でないことを特徴とする半導体素子
ダイボンデイング用ロウ材。 A brazing material for die bonding semiconductor devices, which is characterized in that its thickness is not uniform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2784185U JPS61144642U (en) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2784185U JPS61144642U (en) | 1985-02-27 | 1985-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144642U true JPS61144642U (en) | 1986-09-06 |
Family
ID=30525167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2784185U Pending JPS61144642U (en) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144642U (en) |
-
1985
- 1985-02-27 JP JP2784185U patent/JPS61144642U/ja active Pending