JPS63112329U - - Google Patents
Info
- Publication number
- JPS63112329U JPS63112329U JP242587U JP242587U JPS63112329U JP S63112329 U JPS63112329 U JP S63112329U JP 242587 U JP242587 U JP 242587U JP 242587 U JP242587 U JP 242587U JP S63112329 U JPS63112329 U JP S63112329U
- Authority
- JP
- Japan
- Prior art keywords
- back surface
- edge portion
- semiconductor wafer
- view
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Description
第１図はこの考案の半導体ウエハの一実施例を
示し、ａは裏面図、ｂは断面図、第２図はポリイ
ミドを塗布した上記一実施例のウエハ端部拡大断
面図、第３図は従来の半導体ウエハを示し、ａは
平面図、ｂは断面図、第４図ａ，ｂ，ｃは従来の
半導体ウエハの各エツヂ形状を示す断面図、第５
図は高粘度液体の塗布を行つた従来の半導体ウエ
ハの端部拡大断面図である。
１１…ウエハ、１１ａ…エツヂ部。
Fig. 1 shows an embodiment of the semiconductor wafer of this invention, in which a is a back view, b is a sectional view, Fig. 2 is an enlarged sectional view of the end of the wafer of the above embodiment coated with polyimide, and Fig. 3 is a 4 shows a conventional semiconductor wafer, a is a plan view, b is a sectional view, FIG. 4 a, b, and c are sectional views showing each edge shape of the conventional semiconductor wafer, and FIG.
The figure is an enlarged cross-sectional view of the end of a conventional semiconductor wafer coated with a high viscosity liquid. 11... Wafer, 11a... Edge part.
Claims (1)
を階段状に形成したことを特徴とする半導体ウエ
ハ。 1. A semiconductor wafer, characterized in that the back surface of the edge portion is partially removed to form a step-like shape on the back surface of the edge portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP242587U JPS63112329U (en) | 1987-01-13 | 1987-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP242587U JPS63112329U (en) | 1987-01-13 | 1987-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63112329U true JPS63112329U (en) | 1988-07-19 |
Family
ID=30781254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP242587U Pending JPS63112329U (en) | 1987-01-13 | 1987-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63112329U (en) |
-
1987
- 1987-01-13 JP JP242587U patent/JPS63112329U/ja active Pending