JPH01104038U

JPH01104038U -

Info

Publication number: JPH01104038U
Application number: JP19799687U
Authority: JP
Priority date: 1987-12-25
Filing date: 1987-12-25
Publication date: 1989-07-13

Description

[Brief explanation of the drawing]

第１図ａ，ｂは本考案の第１実施例を示す断面
図、第２図ａは第１実施例に用いるスプリングの
斜視図、第２図ｂは第２図ａのＡ―Ａ矢視図、第
３図ａ，ｂは本考案の第２実施例に用いるスプリ
ングの分解斜視図、第４図は第２実施例のスプリ
ングの断面図、第５図ａ，ｂは従来の半導体ウエ
ハ梱包用トレイの断面図、第６図ａは従来の半導
体ウエハ梱包用トレイに用いるスプリングの斜視
図、第６図ｂは第６図ａのＢ―Ｂ矢視図である。１：トレイ、２：トレイ本体、２ａ：ウエハ収
納部、３：トレイ蓋、５，５′：半導体ウエハ、
６：スプリング、６ａ，６ｂ：スプリング羽根、
６′ａ，６′ｂ：スプリング羽根。 Figures 1a and b are cross-sectional views showing the first embodiment of the present invention, Figure 2a is a perspective view of a spring used in the first embodiment, and Figure 2b is taken along arrow A--A in Figure 2a. Figures 3a and 3b are exploded perspective views of the spring used in the second embodiment of the present invention, Figure 4 is a sectional view of the spring of the second embodiment, and Figures 5a and b are conventional semiconductor wafer packaging. FIG. 6a is a perspective view of a spring used in a conventional semiconductor wafer packaging tray, and FIG. 6b is a view taken along the line B--B in FIG. 6a. 1: Tray, 2: Tray body, 2a: Wafer storage section, 3: Tray lid, 5, 5': Semiconductor wafer,
6: Spring, 6a, 6b: Spring blade,
6'a, 6'b: Spring blades.

Claims

[Scope of utility model registration request]

A tray main body having a concave wafer storage section whose central portion is gradually lowered, a tray lid that closes an opening of the wafer storage section, and a space between the semiconductor wafer placed in the wafer storage section and the tray lid. A semiconductor wafer packing tray comprising a spring interposed therebetween to press and fix the semiconductor wafer, wherein the spring is a plurality of spring blades whose spring tips press near the wafer periphery on the semiconductor wafer; The spring blades are formed by spreading out radially, and these spring blades are formed with their tips facing upward and those facing downward, and the lengths of the upward and downward spring blades are different in diameter from semiconductor wafers. A tray for packaging semiconductor wafers, characterized in that the tray is set to have at least two or more lengths according to the length of the semiconductor wafer.